KR20090053215A - Flexible light emitting module - Google Patents

Flexible light emitting module Download PDF

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Publication number
KR20090053215A
KR20090053215A KR1020070119925A KR20070119925A KR20090053215A KR 20090053215 A KR20090053215 A KR 20090053215A KR 1020070119925 A KR1020070119925 A KR 1020070119925A KR 20070119925 A KR20070119925 A KR 20070119925A KR 20090053215 A KR20090053215 A KR 20090053215A
Authority
KR
South Korea
Prior art keywords
light emitting
flexible
circuit board
emitting diode
flexible circuit
Prior art date
Application number
KR1020070119925A
Other languages
Korean (ko)
Inventor
송양근
Original Assignee
디테크(주)
송양근
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 디테크(주), 송양근 filed Critical 디테크(주)
Priority to KR1020070119925A priority Critical patent/KR20090053215A/en
Publication of KR20090053215A publication Critical patent/KR20090053215A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

The present invention relates to a flexible flexible light emitting module for decoration, which is formed of a flexible material which is formed in a sheet shape and can be bent in the front and rear directions, and is formed to be interconnected through a cable, the front of the flexible circuit board or A light emitting device is mounted to be connected through a connection terminal exposed to a rear surface thereof, and the light emitting direction is mounted in a direction parallel to the front or rear surface of the flexible circuit board. According to the decorative flexible light emitting module, the light emitting diodes are mounted in a direction parallel to the flexible substrate, so that the light output direction is interlocked and adjusted along the bending direction of the flexible substrate so that light can be emitted along the contour of the curved facility. To provide.

Figure P1020070119925

Flexible Circuit Board, Light Emitting Diode, Optical Axis, Contour

Description

Flexible light emitting module for decoration

The present invention relates to a decorative flexible light emitting module, and more particularly, to a decorative flexible light emitting module that can be easily installed along the contour of the curved structure.

Recently, a light emitting module in which a plurality of light emitting diodes are arranged on a circuit board is interconnected through a cable, and thus, a light emitting device is used as a lighting device for decorating signs or facilities. Such a lighting device has a structure in which the light emitting module is installed in a housing formed in a rectangular box shape, and electrically connected to each other through a cable. In addition, the light emitting module has a structure in which a light emitting diode and an element for driving the light emitting diode are mounted on a plate-shaped circuit board. By the way, such a light emitting module for a conventional lighting device is mounted so that the light of the light emitting diode is emitted in a direction perpendicular to the upper surface of the circuit board, when the sign or facility is formed to be curved, the light output axis along the outline of the sign or facility It is impossible to be installed to be bent to interlock, or there is an inconvenience to design the mounting position of the circuit board and the light emitting diode independently to correspond to the shape of the bent portion.

The present invention was devised to improve the above problems, and to provide a flexible light emitting module for decoration that can be installed to correspond to the curved portion by allowing the optical axis to be interlocked along the contour of the curved portion. have.

In order to achieve the above object, the decorative flexible light emitting module according to the present invention is formed of a flexible material which is formed in a sheet shape and can be bent in the front and rear directions and is formed to be interconnected through a cable; And a light emitting device connected to the front or rear surface of the flexible circuit board and mounted so that the light output direction is parallel to the front or rear surface of the flexible circuit board.

Preferably, the light emitting device and the first and second lead pins; A light emitting diode chip mounted on the first lead pin; A wire connecting the light emitting diode chip to the second lead pin; And a cap enclosing a portion of the light emitting diode chip and the first and second lead pins, and connecting the terminal of the flexible circuit board to which the ends of the first and second lead pins respectively correspond. The bonded but exposed lead pins are coated with an insulating material.

According to the decorative flexible light emitting module according to the present invention, the light emitting diodes are mounted in a direction parallel to the flexible substrate so that the light output direction is interlocked and adjusted along the bending direction of the flexible substrate to emit light along the contour of the curved facility. It offers the advantage of being installed.

Hereinafter, with reference to the accompanying drawings will be described in more detail the flexible flexible light emitting module according to an embodiment of the present invention.

1 is a front view illustrating a lighting apparatus in which a plurality of decorative flexible light emitting modules according to the present invention are arrayed, FIG. 2 is an enlarged perspective view of the light emitting module of FIG. 1, and FIG. 3 is a cross-sectional view of the light emitting diode of FIG. 1.

1 to 3, the lighting apparatus 100 includes a driving unit 110 and a plurality of flexible light emitting modules 200.

The flexible light emitting module 200 includes a flexible circuit board 200 and a light emitting device 220.

The flexible circuit board 210 is formed in a sheet form but is formed of a flexible material that can be bent in the front and rear directions and is formed to be connected in series with each other via the cable 230.

The flexible circuit board 210 has an insulating base film 211 and a wiring pattern.

The insulating base film 211 has insulation and is formed of a flexible material in the form of a sheet.

Examples of the film that can be applied as the insulating base film 211 include a polyimide film, a polyimideamide film, a polyester film, a polyphenylene sulfide film, a polyether imide film, a fluororesin film and a liquid crystal polymer film.

The insulating base film 211 has an acid resistance and alkali resistance to such an extent that it is not eroded by an etching solution used for etching for forming a wiring pattern or an alkaline solution used for cleaning, and the like. A material having heat resistance that is not thermally deformed is applied and preferably a polyimide film of the above-listed films is applied.

It is preferable to apply the insulating base film 211 having a thickness of 5 to 150 µm.

The wiring pattern is formed on the insulating base film 211.

The wiring pattern is a pattern wired to drive the light emitting diode 220 as a driving element, and a conductive metal such as copper, copper alloy, aluminum, or aluminum alloy is formed on the surface of the insulating base film 211 by vapor deposition or plating. It is formed by etching the circuit corresponding to the driving method of the light emitting diode 220 to be applied.

The wiring pattern is formed to correspond to the driving circuit to be applied. In the drawings of this embodiment, in order to avoid the complexity of the drawing, the connection terminal 213 for mounting the light emitting diode 220 and the connection terminal for mounting the resistor 240 for current limiting ( Only the connection terminal 217 for connecting the cable 230 for connecting to the light emitting module 215 and other light emitting modules is shown, and the wiring pattern for connecting the connection terminals 213, 215, and 217 to each other is omitted. Meanwhile, the driving elements mounted on the light emitting module 200 other than the light emitting diode 220 may be omitted or further added.

In addition, in the illustrated example, the structure in which the wiring pattern is formed only on the front surface of the flexible circuit board 210 is illustrated, and the structure in which the wiring pattern is formed on the rear surface may be applied.

The light emitting diode 220 is applied as a preferred example of a light emitting device, and is connected through a connection terminal 213 exposed on the front surface of the flexible circuit board 210, and the light output direction is opposite to the front surface 210a of the flexible circuit board 210. It is mounted side by side.

The light emitting diode 220 has a conventional structure having first and second lead pins 221 and 222, a light emitting diode chip 224, a wire 225, and a cap 226 as shown in FIG. It is.

The light emitting diode chip 224 is mounted in a mounting groove formed at an upper end of the first lead pin 221 and is connected to the second lead pin 222 by a conductive wire 226.

The cap 226 is formed in a convex cylindrical shape to enclose a portion of the light emitting diode chip 224 and the first and second lead pins 221 and 222. The cap 226 may be a transparent resin, for example, epoxy material.

The light emitting diode 220 having the structure of the light emitting diode chip 224 of the first and second lead pins 221, 222 so that the light output axis of the light emitting diode chip 224 is located parallel to the front surface (210a) of the flexible circuit board (210). The side surface may be mounted with solder or other conductive bonding material in parallel with the corresponding connection terminal 213. Alternatively, the lead pins 221 and 222 may be bent, and in this case, the connection terminals of the light emitting diode chip 224 are positioned parallel to the front surface 210a of the flexible circuit board 210. What is necessary is just to join to (213).

Preferably, ends of the first and second lead pins 221 and 222 of the light emitting diode 220 are joined through the connection terminals 213 of the corresponding flexible circuit boards 210, respectively, and then exposed portions of the leads. The pins 221 and 222 are coated by an insulating material.

In the illustrated example, a structure in which the insulating film 228 is coated on the outer circumferential surface of the lead pins 221 and 222 by using an epoxy, for example, epoxy, is applied. 222 may be inserted.

On the other hand, after the light emitting diode 220 and the driving element, for example, the resistance element 240 is mounted on the corresponding connection terminals 213 and 215, the insulating flexible as shown in FIG. 4 to increase the insulation from the outside The cover insulating film 260 may be bonded to the film of the material by using an adhesive.

In this case, the bonding agent may be an epoxy resin adhesive, a polyimide resin adhesive, an acrylic resin adhesive, or the like, and the cover insulating film 260 may be a material of the insulating base film 211.

The cable 230 is electrically connected to each of the light emitting modules 200, and a plurality of conductive wires are formed to be insulated from each other and bent.

The cable 230 may be bonded to the cable connection terminal 217 of the light emitting module 200 by thermocompression bonding or mutually bonded by a conductive bonding material. In addition, the cable 200 may be integrally formed with the light emitting module 200.

The light emitting module 200 is formed in a predetermined size and length is connected in series with each other via a cable 230, as shown in Figure 1, once connected to the driving unit 110 is applied by the driving of the driving unit 110 The light emission of the light emitting diode 220 can be controlled by the power applied.

In addition, as shown in FIG. 5, the rear surface of the light emitting module 200 connected in series along the inner surface of the curved structure 300 may be installed to be in close contact with the inner surface of the structure 300. In this case, since the flexible circuit board 210 may be bent in the front-rear direction, the flexible circuit board 210 may be naturally attached along the outline of the structure '300'. In this case, when the optical axes of the light emitted from the light emitting diodes 220 are connected to each other, the light emitting diodes 220 may form a shape to provide a display pattern corresponding to the outline of the structure 300.

1 is a front view illustrating a form in which a plurality of decorative flexible light emitting modules according to the present invention are arrayed;

2 is an enlarged perspective view of the light emitting module of FIG. 1;

3 is a cross-sectional view of the light emitting diode of FIG.

4 is a cross-sectional view illustrating a state in which a cover insulating film is bonded to the light emitting module of FIG. 1;

5 is a plan view illustrating a state in which a plurality of light emitting modules of FIG. 2 are mounted along a contour of a curved structure.

Claims (2)

A flexible circuit board formed in a sheet form and formed of a flexible material that can be bent in front and rear directions and formed to be interconnected through a cable; And a light emitting device connected to the front or rear surface of the flexible circuit board, the light emitting device being mounted so that the light output direction is parallel to the front or rear surface of the flexible circuit board. . The method of claim 1, wherein the light emitting device First and second lead pins; A light emitting diode chip mounted on the first lead pin; A wire connecting the light emitting diode chip to the second lead pin; And a cap enclosing a portion of the light emitting diode chip and the first and second lead pins. The flexible light emitting module for decoration of claim 1, wherein the ends of the first and second lead pins are joined to each other through a connection terminal of the flexible circuit board, and the exposed lead pins are coated with an insulating material.
KR1020070119925A 2007-11-22 2007-11-22 Flexible light emitting module KR20090053215A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070119925A KR20090053215A (en) 2007-11-22 2007-11-22 Flexible light emitting module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070119925A KR20090053215A (en) 2007-11-22 2007-11-22 Flexible light emitting module

Publications (1)

Publication Number Publication Date
KR20090053215A true KR20090053215A (en) 2009-05-27

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013115005A (en) * 2011-11-30 2013-06-10 Toshiba Lighting & Technology Corp Lighting apparatus
KR101710324B1 (en) * 2015-11-13 2017-02-27 주식회사 리움 Charge measurable emitting cable

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013115005A (en) * 2011-11-30 2013-06-10 Toshiba Lighting & Technology Corp Lighting apparatus
KR101710324B1 (en) * 2015-11-13 2017-02-27 주식회사 리움 Charge measurable emitting cable
WO2017082455A1 (en) * 2015-11-13 2017-05-18 주식회사 리움 Light emitting cable with charge indication

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