KR20090052488A - Apparatus and method of fabricating substrate - Google Patents

Abstract

The substrate manufacturing apparatus includes an imaging unit for inspecting a bonding state between the substrate and the signal transmission member and an application unit disposed on the application unit to form a protective film. In this way, since the coating unit is disposed above the imaging unit, the substrate manufacturing apparatus can improve the space utilization rate, reduce the manufacturing cost, and improve the productivity.

Description

Substrate manufacturing apparatus and its method {APPARATUS AND METHOD OF FABRICATING SUBSTRATE}

The present invention relates to an apparatus and method for manufacturing a flat panel display, and more particularly, to a substrate manufacturing apparatus and method for performing indentation inspection and silicon coating of a substrate for an image processing apparatus.

Recently, information processing devices have been rapidly developed to have various types of functions and faster information processing speeds. Such an information processing apparatus has a display panel which displays predetermined information. Until now, a cathode ray tube monitor has been mainly used as a display panel. However, in recent years, with the rapid development of technology, the use of flat panel display devices such as liquid crystal displays (LCDs), which are light and occupy small space, is rapidly increasing.

In general, a liquid crystal display includes a liquid crystal display panel that receives a gate signal and a data signal to display an image. A plurality of gate tape carrier packages (TCPs) are attached to the gate side of the liquid crystal display panel, and a plurality of data TCPs are attached to the source side. The gate TCPs output a gate signal to the liquid crystal display panel, and the data TCPs output a data signal to the liquid crystal display panel.

The manufacturing process of the liquid crystal display includes an indentation inspection process for inspecting a coupling error between the gate and data TCPs and the liquid crystal display panel, and a protective film coating process for forming a protective film on each output lead of the gate TCP and data TCP.

In general, the device for the indentation inspection process and the device for the protective film coating process is installed in a separate space, respectively, the space utilization rate is lowered. In addition, the indentation inspection process and the protective film coating process is made sequentially, it takes a lot of time for the indentation inspection. For this reason, process time increases and productivity falls.

An object of the present invention is to provide a substrate manufacturing apparatus capable of improving the space utilization.

Another object of the present invention is to provide a method of manufacturing a substrate using the substrate manufacturing apparatus described above.

According to one aspect of the present invention, there is provided a substrate manufacturing apparatus comprising: a substrate having a signal transmission member for outputting a signal to the substrate; It is made of wealth.

Specifically, the workbench is seated on the substrate. The applicator is disposed on the substrate placed on the workbench, and coats the protective film for protecting the lead wire of the signal transmission member and the substrate. The imaging unit is disposed under the workbench and inspects a coupling state between the substrate and the signal transmission member.

Here, the applicator and the imaging unit are driven at the same time.

In addition, the substrate manufacturing method according to one feature for realizing the above object of the present invention is as follows. First, the substrate is placed on the workbench. Then, the bonding state between the substrate and the signal transmission member is inspected, and at the same time, a protective film for protecting the lead wire of the signal transmission member is coated on the substrate and the signal transmission member.

Here, the bonding state inspection of the substrate and the signal transmission member is performed by using at least one imaging unit disposed under the substrate, and the coating of the protective layer is performed by using at least one coating unit disposed on the substrate. Is done.

In addition, the signal transmission member is attached to the substrate via an anisotropic conductive member having conductive particles.

Looking at the bonding state of the substrate and the signal transmission member and the process of coating the protective film as follows. The indentation formed on the substrate by the conductive particles is imaged on the rear surface of the substrate while the imaging unit is moved along the bonding region of the substrate to which the signal transmission member is attached. At the same time, the protective layer is formed on the signal transmission member and the substrate by discharging silicon while moving the coating unit along the bonding region.

According to the present invention described above, since the indentation inspection and the coating of the protective film are simultaneously performed, the process time is shortened and the productivity is improved. In addition, since the imaging unit for indentation inspection is disposed under the coating unit for coating the protective film, it is possible to improve the space utilization rate and reduce the manufacturing cost.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.

1 is a plan view illustrating a display device manufacturing system according to an exemplary embodiment, and FIG. 2 is a plan view illustrating a liquid crystal display device provided in the display device manufacturing system of FIG. 1.

1 and 2, the display device manufacturing system 500 of the present invention manufactures a liquid crystal display device 100 displaying an image. Hereinafter, the liquid crystal display device 100 will be described with reference to FIGS. 2 to 4, and then the configuration of the display device manufacturing system 500 will be described in detail.

3 is a cross-sectional view taken along the line II ′ of FIG. 2, and FIG. 4 is a cross-sectional view taken along the line II-II ′ of FIG. 2.

2 to 4, the liquid crystal display device 100 includes a liquid crystal display panel 110 displaying the image, a plurality of gate tape carrier packages (hereinafter, TCP) outputting a gate signal, And a plurality of data TCPs for outputting data signals.

The liquid crystal display panel 110 receives the gate signal from the gate TCPs and the data signal from the data TCPs to display the image. Specifically, the liquid crystal display panel 110 includes an array substrate 111, an opposing substrate 112 facing the array substrate 111, and the array substrate 111 and the opposing substrate 112. The interposed liquid crystal layer 113 is provided.

The array substrate 111 includes a first base substrate 111a, a plurality of gate lines for transmitting the gate signal, and a plurality of data lines for transmitting the data signal.

Each gate line 111b is formed on an upper surface of the first base substrate 111a, and a pad portion of the gate line 111b is electrically connected to the gate TCP 120 to receive the gate signal.

A gate insulating layer 111c is formed on an upper surface of the first base substrate 111a on which the gate lines are formed, and the data lines are formed on an upper surface of the gate insulating layer 111c. Each of the data lines 111d extends in a direction orthogonal to the longitudinal direction of the gate line 111b and is disposed in the longitudinal direction of the gate line 111b. The pad part of the data line 111d is electrically connected to the data TCP 130 to receive the data signal.

Although not shown in the drawing, the array substrate 111 includes a plurality of thin film transistors connected to the gate lines and the data lines. The thin film transistors are arranged in an array on the first base substrate 111a and switch pixel voltages.

At least one insulating layer 111e is formed on an upper surface of the gate insulating layer 111c on which the data lines are formed. A plurality of pixel electrodes are formed on the insulating layer 111e, and each pixel electrode 111f receives the pixel voltage from the thin film transistor.

The opposing substrate 112 is provided on the array substrate 111. The opposing substrate 112 is formed on the second base substrate 112a, the second base substrate 112a, the color filter 112b expressing a predetermined color using light, and the color filter 112b. It is formed on the common electrode 112c is applied to the common voltage.

The liquid crystal layer 113 adjusts light transmittance according to an electric field formed between the pixel electrodes and the common electrode 112c, and provides the adjusted light to the color filter 112b. Thus, the image is displayed.

The gate TCPs and the data TCPs are attached to an end portion of the array substrate 111.

In detail, the gate TCPs are attached to gate regions GA1 and GA2 of the array substrate 111, and pad portions of the gate lines are formed in the gate regions GA1 and GA2. In this embodiment, the array substrate 111 has two gate regions GA1 and GA2, and the gate TCPs are located at both ends of the gate line 111b. However, the array substrate 111 may also include one gate region GA1. In this case, the gate TCPs are located only at one end of the gate line 111b.

Each gate TCP 120 includes a first base film 121, a plurality of gate lead lines formed on the first base film 121, and a gate chip 123. Each gate lead line 122 receives the gate signal from the gate chip 123 and outputs the gate signal.

An anisotropic conductive film (ACF) 140 is interposed between the gate TCP 120 and the array substrate 111 to electrically conduct the gate TCP 120 and the gate line 111b. A gate pad electrode GPE is formed between the pad portion of the gate line 111b and the anisotropic conductive film 140. The gate pad electrode GPE is made of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO). The gate signal output from the gate lead line 122 is applied to the pad portion of the gate line 111b through the anisotropic conductive film 140 and the gate pad electrode GPE.

The data TCPs are attached to the source area SA of the array substrate 111. The data TCP 130 includes a second base film 131, a plurality of data leads formed on the second base film 131, and a data chip 133. Each data lead line 132 receives the data signal from the data chip 133 and outputs the data signal.

The anisotropic conductive film 140 is interposed between the data TCP 130 and the array substrate 111 to electrically conduct the data TCP 130 and the data line 111d. The data pad electrode DPE is formed between the pad portion of the data line 111d and the anisotropic conductive film 140. The data pad electrode DPE is made of the same material as the gate pad electrode GPE. The data signal output from the data lead line 132 is applied to the pad portion of the data line 111d through the anisotropic conductive film 140 and the data pad electrode DPE.

Referring back to FIGS. 1 and 2, the display device manufacturing system 500 includes a workbench 200, an application module 300, and an inspection module.

In detail, the work bench 200 has a rectangular ring shape with a portion thereof open in plan view, and supports the liquid crystal display device 100. In FIG. 1, reference numeral PA denotes a region in which the liquid crystal display panel 110 of the liquid crystal display device 100 is seated.

The coating module 300 and the inspection module are installed outside the work bench 200. Hereinafter, the configuration of the application module 300 and the inspection module will be described in detail with reference to FIGS. 5 and 6.

5 is a perspective view illustrating an application module and an inspection module illustrated in FIG. 1, and FIG. 6 is a cross-sectional view illustrating a display device manufacturing system illustrated in FIG. 1.

1 and 5, the application module 300 includes first, second and third application units 310, 320, and 330, and the gate TCP 120 (see FIG. 2) and the A protective film for protecting the data TCP 130 (see Fig. 2) is formed.

In this embodiment, the coating module 300 includes three coating units 310, 320, 330, but the number of the coating units 310, 320, 330 is the liquid crystal display device 100 (Fig. 2) may increase or decrease depending on the size and the area where the gate and data TCPs 120, 130 (see FIG. 2) are attached.

When viewed in a plan view, the first and second coating units 310 and 320 face each other with the work bench 200 therebetween, respectively, on both short sides 210 and 220 of the work bench 200. Is placed. The third coating unit 330 is disposed on the long side 230 side of the workbench 300, and both ends thereof are adjacent to the first and second coating units 310 and 320, respectively.

The first coating unit 310 may include a guide frame 311, a moving part 312, and an coating part 313.

In detail, the guide frame 311 is positioned adjacent to the first short side 220 of the work bench 200 and has an upper surface extending in the same direction as the first short side 220 of the work bench 200. A guide rail 311a is formed at a side surface of the guide frame 311, and the guide rail 311a extends along the length direction of the guide frame 311.

The moving part 312 is coupled to the guide frame 311 and moves along the guide rail 311a. The moving part 312 includes a connection part 31, a vertical bar 32, and a horizontal bar 33. The connection portion 31 has a ring shape, and both ends thereof are coupled to the guide rail 311a to move along the guide rail 311a. The vertical bar 32 extends vertically from the top surface of the connecting portion 31 to have a rod shape, and the horizontal bar 33 extends from one side of the vertical bar 32 to the workbench 200. Face to face The horizontal bar 33 moves up and down to change its position relative to the vertical bar 32.

5 and 6, the application part 312 is provided at one end of the horizontal bar 33. The applicator 312 may be disposed to face the work bench 200 at an upper portion of the work bench 200, and may be disposed at an upper portion of the liquid crystal display panel 110 seated on the work bench 200.

In this embodiment, the applicator 312 is disposed above the work bench 200, but may be disposed below the work bench 200.

The coating part 312 moves along the bonding area BA of the liquid crystal display panel 110 to which the gate TCP 120 is attached and discharges silicon 30 to the protective layer 100 on the liquid crystal display device 100. To form.

That is, when the silicon 30 is coated, the moving part 312 moves along the guide rail 311a of the guide frame 311, and thus, the coating part 312 connected to the moving part 312. Moves along the bonding area BA of the liquid crystal display panel 110. Therefore, the silicon 30 is coated on the liquid crystal display panel 100 and the gate TCP 120. In addition, the applicator 312 may adjust the distance from the liquid crystal display panel 110 by vertically moving the horizontal bar 33.

In the present exemplary embodiment, the first coating unit 310 includes one moving part 312 and one coating part 313, but the coating part has a size and a process efficiency of the liquid crystal display panel 110. It may increase accordingly.

In addition, in this embodiment, since the second and third coating unit 320, 330 has the same configuration as the first coating unit 310, the duplicated description thereof will be omitted. However, unlike the first coating unit 310, the third coating unit 330 includes two moving parts 332a and 332b and two coating parts 333a and 333b to reduce process efficiency and process time. do. The source side of the liquid crystal display panel 110 is longer than the gate side, and the third coating unit 330 is disposed on the source side of the liquid crystal display panel 110 so that the source of the liquid crystal display panel 110 can be provided. This is because the protective film is formed on the side. Hereinafter, for convenience of description, the coating parts 313 and 323 of the first and second coating units 310 and 320 are referred to as gate coating parts 313 and 323, and the third coating unit 330 The application parts 333a and 333b are referred to as source application parts 333a and 333b.

Referring again to FIGS. 1 and 5, the inspection module is located below the moving parts 312, 322, 332a, and 332b of the application modules 310, 320, and 330, and two gate imaging units 410. , And 420 and a source imaging unit 430. Hereinafter, for convenience of description, the gate imaging units 410 and 420 are referred to as a first gate imaging unit 410 and a second gate imaging unit 420.

In this embodiment, the inspection module includes three imaging units 410, 420, and 430, but the number of the imaging units 410, 420, and 430 is the size of the liquid crystal display panel 110 and the TCP. It may increase or decrease depending on the area to which the fields 120 and 130 are attached.

In a plan view, the first gate imaging unit 410 is positioned between the guide frame 311 of the first coating unit 310 and the work bench 200, and the second gate imaging unit 420. Is positioned between the guide frame 321 of the second coating unit 320 and the work bench 200, and the source imaging unit 430 is a guide frame 331 of the third coating unit 330. Located between and the workbench 200.

1 and 6, the first and second gate image capturing units 410 and 420 and the source image capturing unit 430 are disposed under the liquid crystal display panel 110 mounted on the work bench 200. Is placed on. In a plan view, the bonding area BA is positioned outside the work bench 200 in the liquid crystal display panel 110 mounted on the work bench 200.

 The imaging units 410 ˜ 430 move along the gate and source regions GA and SA (see FIG. 2) of the liquid crystal display panel 110, and the TCPs 120 and 130 and the liquid crystal display panel (see FIG. 2). It captures the state of coupling between the 110.

Specifically, the anisotropic conductive film 140 attaching the TCPs 120 and 130 to the liquid crystal display panel 110 includes conductive particles 141 (see FIGS. 3 and 4), and the conductive particles. Fields 141 (see FIGS. 3 and 4) conduct the gate and data TCPs 120 and 130 and the liquid crystal display panel 110. When the gate and data TCPs 120 and 130 are attached to the liquid crystal display panel 110, appropriate pressure and heat are provided to the gate and data TCPs 120 and 130. Accordingly, the indentation is formed on the gate pad electrode GPE (see FIG. 3) and the data pad electrode DPE (see FIG. 4) by the conductive particles 141 of the anisotropic conductive film 140. do.

The imaging units 410 to 430 image the indentations formed by the conductive particles 141 on the rear surface of the liquid crystal display panel 110. That is, the first and second gate image capturing units 410 and 420 image the gate regions GA of the liquid crystal display panel 110, and the source image capturing unit 430 is the liquid crystal display panel 110. The source area SA of the image is captured.

The coupling error between the gate and data TCPs 120 and 130 and the liquid crystal display panel 110 is determined based on the location and number of the indentations recognized through the images captured by the imaging units 410 to 430. .

First to third guide lines 441 to 443 are formed below the imaging units 410 to 430 in one-to-one correspondence with the imaging units 410 to 430. When viewed in plan view, the first guide line 441 is positioned between the guide frame 311 of the first coating unit 310 and the work bench 200, and the second guide line 442 may be Located between the guide frame 321 of the second coating unit 320 and the work bench 200, the third guide line 443 is the guide frame 331 of the third coating unit 330 and Located between the workbench 200 and.

The first and second gate imaging units 410 and 420 move along the first and second guide lines 441 and 442, respectively, and the bonding area BA of the gate side is formed on the rear surface of the liquid crystal display panel 110. ), And the source imaging unit 430 moves along the third guide line 443 to capture the bonding area BA on the source side from the back of the liquid crystal display panel 110.

As such, since the display device manufacturing system 500 performs the indentation inspection of the liquid crystal display device 100 and the application of the protective film in one space, the display device manufacturing system 500 can improve the space utilization rate and reduce the manufacturing cost.

Hereinafter, an indentation inspection and a protective film applying process of the liquid crystal display device 100 will be described in detail with reference to the drawings.

FIG. 7 is a plan view illustrating a manufacturing process of a liquid crystal display device in the display device manufacturing system shown in FIG. 1, and FIG. 8 is a cross-sectional view illustrating a protective film formed on the liquid crystal display device shown in FIG. 7.

6 and 7, first, the liquid crystal display 100 is mounted on the work bench 200.

The first and second gate imaging units 410 and 420 and the source imaging unit 430 are disposed under the liquid crystal display panel 110. At the same time, the coating parts 313, 323, 333a and 333b are moved by the moving parts 312, 322, 332a and 332b of the first to third coating units 310 to 330. It is placed at the top of the. In this case, the first and second gate applicators 313 and 323 are disposed on the gate side of the liquid crystal display panel 110, and the source applicators 333a and 333b are arranged on the source of the liquid crystal display panel 110. Is placed on the side.

The first and second gate imaging units 410 and 420 and the source imaging unit 430 move along the first to third guide lines 441 to 443, respectively, by the anisotropic conductive film 140. The indentation formed in the liquid crystal display panel 110 is imaged.

At the same time, the moving parts 312, 322, 332a, and 332b of the first to third application units 310 to 330 respectively move the guide rails 311a, 321a, and 331a of the corresponding frames 311, 321, and 331. The coating parts 313, 323, 333a, and 333b coupled to the moving parts 312, 322, 332a, and 332b discharge the silicon 10 to the liquid crystal display 100. That is, the first and second gate coating parts 313 and 323 apply the silicon 10 to the gate areas GA1 and GA2 of the liquid crystal display panel 110, and the source coating parts 333a, 333b applies the silicon 10 to the source area SA of the liquid crystal display panel 110. Accordingly, as shown in FIG. 8, the passivation layer 150 is formed on the liquid crystal display device 100. The passivation layer 150 covers the top and side surfaces of the gate TCP 120 to coat the gate lead line 122 exposed on the side surface of the gate TCP 120. Accordingly, the passivation layer 150 prevents oxidation of the gate lead line 122.

Although not shown, the passivation layer 150 is formed on the data TCP 130 of the liquid crystal display device 100 in the same manner as the gate TCP 120 to oxidize the data lead line 132 (see FIG. 4). prevent.

As such, in the display device manufacturing system 500, the indentation test and the protective film 150 are simultaneously coated. Accordingly, the display device manufacturing system 500 shortens the process time and improves productivity.

Although described with reference to the embodiments above, those skilled in the art will understand that the present invention can be variously modified and changed without departing from the spirit and scope of the invention as set forth in the claims below. Could be.

1 is a plan view illustrating a display device manufacturing system according to an exemplary embodiment of the present invention.

FIG. 2 is a plan view illustrating a liquid crystal display device provided in the display device manufacturing system illustrated in FIG. 1.

3 is a cross-sectional view taken along the line II ′ of FIG. 2.

4 is a cross-sectional view taken along the line II-II ′ of FIG. 2.

5 is a perspective view showing the inspection module and the application module shown in FIG.

6 is a cross-sectional view illustrating the display device manufacturing system illustrated in FIG. 1.

FIG. 7 is a plan view illustrating a manufacturing process of a liquid crystal display device in the display device manufacturing system shown in FIG. 1.

FIG. 8 is a cross-sectional view illustrating a protective film formed on the liquid crystal display shown in FIG. 7.

Explanation of symbols on the main parts of the drawings

100 liquid crystal display device 110 liquid crystal display panel

120, 130: tape carrier package 140: anisotropic conductive film

200: workbench 300: coating module

410, 420, 440: imaging unit

Claims (11)

An apparatus for manufacturing a substrate having a signal transmission member for outputting a signal to the substrate, A workbench on which the substrate is seated; At least one coating part disposed on an upper portion or a lower portion of the substrate placed on the workbench and coating a protective layer on the signal transmission member and the substrate to protect a lead wire of the signal transmission member; And And at least one imaging unit disposed under the work bench and inspecting a coupling state between the substrate and the signal transmission member. The substrate manufacturing apparatus according to claim 1, wherein the applicator and the imaging unit are driven at the same time. The apparatus of claim 1, wherein the applicator forms the passivation layer by discharging silicon while moving along a bonding area of the substrate to which the signal transmission member is attached. The method of claim 1, The signal transmission member is attached to the substrate via an anisotropic conductive member having conductive particles, And the imaging unit picks up an indentation formed in the substrate by the conductive particles on the rear surface of the substrate. The method of claim 4, wherein The imaging unit is provided with a plurality, And the plurality of imaging units includes at least one source imaging unit disposed on a source side of the substrate and at least one gate imaging unit disposed on a gate side of the substrate. The method of claim 1, The applicator is provided with a plurality, And the plurality of applicators comprises at least one source applicator disposed on a source side of the substrate and at least one gate applicator disposed on a gate side of the substrate. In the method of manufacturing a substrate with a signal transmission member for outputting a signal to the substrate, Mounting the substrate on a workbench; And Inspecting a bonding state between the substrate and the signal transmission member, and at the same time, coating a protective film on the substrate and the signal transmission member to protect a lead wire of the signal transmission member. . The method of claim 7, wherein Inspection of the bonding state of the substrate and the signal transmission member is performed by using at least one imaging unit disposed under the substrate, Coating of the protective film is a substrate manufacturing method, characterized in that using at least one coating disposed on the upper portion of the substrate. The method of claim 8, The signal transmission member is attached to the substrate via an anisotropic conductive member having conductive particles, Examining the bonding state of the substrate and the signal transmission member and coating the protective film, The indentation formed on the substrate by the conductive particles is imaged on the back surface of the substrate while the imaging unit is moved along the bonding region of the substrate to which the signal transmission member is attached, and at the same time, the coating unit is along the bonding region. And discharging silicon while moving to form the protective film on the signal transmission member and the substrate. The method of claim 7, wherein The bonding state inspection of the substrate and the signal transmission member is performed by using at least one source imaging unit disposed on the source side of the substrate and at least one gate imaging unit disposed on the gate side of the substrate, The coating of the protective film is a substrate manufacturing method characterized in that using the at least one source coating portion disposed on the source side of the substrate on the top of the substrate and at least one gate coating portion disposed on the gate side of the substrate. The method of claim 10, The signal transmission member is attached to the substrate via an anisotropic conductive member having conductive particles, Examining the bonding state of the substrate and the signal transmission member and coating the protective film, The indentation formed on the substrate by the conductive particles is imaged on the rear surface of the substrate while the gate imaging unit is moved along the gate side bonding region of the substrate and the source imaging unit is moved along the source side bonding region of the substrate. And at the same time, discharging silicon while moving the gate coating part along the gate side bonding area and moving the source coating part along the source side bonding area to form the protective film on the signal transmission member and the substrate. A substrate manufacturing method characterized by the above-mentioned.

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