KR20090049730A

KR20090049730A - Dummy for cleaning of semiconductor mold

Info

Publication number: KR20090049730A
Application number: KR1020070115972A
Authority: KR
Inventors: 서경성
Original assignee: 서경성
Priority date: 2007-11-14
Filing date: 2007-11-14
Publication date: 2009-05-19
Also published as: KR100903942B1

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dummy for cleaning a semiconductor mold mold, and more particularly, a dummy used for cleaning a molding mold used when molding with a molding resin such as EMC to prevent the semiconductor chip from being damaged from the external environment. It's about the dummy.

The dummy for cleaning a semiconductor mold mold according to the present invention is a dummy used for cleaning a molding mold used for molding with a molding resin in order to prevent the semiconductor chip from being damaged from an external environment during the manufacture of a semiconductor package.

Epoxy core made of epoxy-based resin, but the bumps and convexities are formed on the top / bottom surface of the epoxy core, filling hole penetrating the top and bottom of the epoxy core to fill the molding resin to the bottom of the epoxy core It is characterized in that it is formed in a number of longitudinal and horizontal.

Semiconductor, Mold, Cleaning Dummy, Epoxy Core

Description

Dummy for Cleaning of Semiconductor Mold

In the semiconductor device fabricated in the wafer manufacturing process, the wafer is cut into unit semiconductor chips through a sawing process in an assembly process.

The cut unit semiconductor chip is mounted on a base frame (hereinafter, referred to as "PCB") such as a leadframe or a printed circuit board through a die attach process.

The semiconductor chip mounted on the PCB is connected to the bond pad of the semiconductor chip and the connection terminal of the base frame through a wire bonding process.

The base frame and the semiconductor chip connected to each other are protected from the external environment such as physical shock, moisture, and contamination, and at the same time, molding resin such as EMC (Epoxy Mold Compound) through a molding process in order to keep the bonding state of each component stably. Molded into.

The molding process is a process of sealing the wire-bonded semiconductor chip with an epoxy-based molding resin to protect it from the external environment.

The molding resin is supplied to the molding mold in a tablet form of a solid, melted under high temperature and high pressure, and injected into the mold mold in a liquid state.

When the molding resin is injected and then cured, a semiconductor package body having a predetermined shape is formed.

As shown in FIG. 1, the BGA semiconductor package includes a PCB 2 having a circuit pattern formed thereon and a solder mask coated thereon to protect the circuit pattern, and a center of one surface of the PCB 2. A semiconductor chip 1 mounted on the wire, a wire 3 electrically connecting the semiconductor chip 1 and the PCB 2 to transmit a signal, and connected to the PCB 2 to transmit a signal to the outside. It is composed of a solder ball (5) fused to one side of the PCB (2), and a molding layer (4) wrapped around the outside to protect the semiconductor chip (1) and the peripheral components from external oxidation and corrosion.

EMC, which is used as a resin in the molding layer 4, must satisfy various properties such as moldability, heat resistance, moisture resistance, corrosion resistance, adhesion, electrical insulation, high tensile and bending properties, and marking properties, such as resins, curing agents, and binders. And a mixture of various materials such as colorants.

The EMC requires adhesiveness only when the adhesion to the silicon die or the metal lead frame is good to ensure the stability of the package. For this purpose, low molecular weight resins having good flowability or low amount of wax should be used. In this case, releasability with the mold mold surface is degraded, so that the EMC sticks to the mold mold, or the mold mold is contaminated by residual EMC, and the surface of the molding mold should be periodically cleaned.

When the PCB equipped with the semiconductor chip 1 is actually used to clean the molding mold, the cost increases a lot. Therefore, the cleaning process is performed in the same environment as the actual sealing process by using a dummy for cleaning the molding mold. This removes foreign matter or EMC on the surface of the molding mold.

In other words, the mold for cleaning the semiconductor chip, the wire bonding, the plating, or the like is placed in the molding die of semiconductor package manufacture, and then the EMC is injected to clean the molding die.

The prior art of the cleaning dummy comprises an epoxy core made of an epoxy resin and a copper foil layer coated with copper on the upper and lower parts of the epoxy core.

Since the above-described conventional cleaning dummy has a thickness variation in the manufacturing of the dummy and the surface of the copper foil layer is very smooth, the position of EMC is determined when the EMC is injected after placing the cleaning dummy in a molding mold. There was a problem of leaking out of the molding layer without curing at.

The present invention has been made in order to solve the above problems, the upper and lower surfaces are fine when the EMC filled during molding mold cleaning by forming a dummy for cleaning with epoxy core finely formed on the upper and lower surfaces. It is an object of the present invention to provide a dummy for cleaning a semiconductor mold mold, which can prevent the leakage of EMC and reduce the cost by removing the copper foil layer.

The cleaning dummy of the semiconductor mold mold according to the present invention for achieving the above-mentioned object is used to clean the molding mold to be used when molding with a molding resin in order to prevent the semiconductor chip from damage from the external environment during semiconductor package manufacturing As the dummy used,

According to the problem solving means described above, the upper and lower surfaces of the epoxy core can be minutely bumped to prevent leakage of the EMC and the manufacturing cost can be reduced by eliminating the copper foil layer.

Hereinafter, the configuration and operation of the present invention will be described with reference to the accompanying drawings.

2 is a plan view of a washing dummy according to the present invention, Figure 3 is a cross-sectional view taken along the line A-A of FIG.

As shown in FIG. 2, the cleaning dummy 10 according to the present invention is formed of an epoxy core 12 made of an epoxy resin.

The top surface of the epoxy core 12 is made of uneven bottoms unevenly, and thus the irregularities 18 formed on the upper and lower surfaces of the epoxy core are partially formed to prevent leakage of the EMC. Rather, the copper foil coated on the upper and lower portions of the epoxy core 12 is naturally formed.

In addition, in order to obtain the effect of the state in which the semiconductor chip 1 is mounted on the PCB 2 in the actual molding process in the cleaning dummy 10 in the cleaning process, the semiconductor chip 1 of the PCB 2 is mounted. Filling hole 14 penetrating up and down at the position of the cleaning dummy 10 corresponding to the position is formed vertically and horizontally at a predetermined interval.

That is, as shown in FIG. 1, a molding process is performed while the semiconductor chip 1 is mounted on the PCB 2, and the semiconductor chip 1 is mounted in a hole formed in the center of the PCB 2. The lower end of the semiconductor chip 1 is slightly protruded to the bottom of the PCB (2).

At this time, a separation distance (D) is formed between the left and right sides of the semiconductor chip (1) and the inside of the hole so that EMC can be supplied to the lower portion of the PCB (2), the upper portion of the PCB (2) through this separation distance (D) EMC supplied to the bottom is supplied to the bottom to flow into the molding layer 4 surrounding the lower end of the semiconductor chip 1 protruding to the bottom of the PCB (2).

The filling hole 14 is formed to supply the EMC to the lower portion of the dummy 10 in order to obtain the effect of the actual molding process.

The shape of the filling hole 14 is rounded to reduce the processing time and processing cost (the shape of the filling hole formed in the conventional PCB 2 shown in Figure 1 is made of a long hole), the filling in consideration of the pressure during EMC molding The size or spacing of the holes 14 is determined.

In order to reliably prevent leakage of the EMC, it is preferable to form the thickness of the cleaning dummy 10 to be 0.01 mm to 0.07 mm thicker than the thickness of the PCB 2 actually used for manufacturing the semiconductor package shown in FIG. 1.

When the thickness of the PCB 2 is made thin or thick, the EMC leaks when the dummy dummy 10 for cleaning is placed on the molding mold and the EMC is injected.

The effect of the cleaning dummy having the above structure will be described below.

If the molding mold is contaminated and the surface of the molding mold needs to be cleaned while repeating the molding process several times using the molding mold, the molding resin 10 having the above-described structure is placed on the molding mold. Phosphorus EMC is supplied to the molding mold in the form of a solid tablet, melted under high temperature and high pressure, and injected into the mold mold as a liquid.

When the EMC is injected and cured, a dummy package 20 having a molding layer 16 as shown in FIG. 4 is formed, and the dummy package 20 is then disposed of.

As shown in FIG. 5, the molding layer 16 formed on the upper and lower surfaces of the bumpy epoxy core 12 is supplied to the lower portion of the dummy 10 along the filling hole 14, and thus, below the dummy 10. Is formed.

Concave-convex concavities and convexities 18 are formed on the upper and lower surfaces of the epoxy cores 12 on which the molding layer 16 is to be formed, thereby preventing the EMC from leaking out according to the thickness variation of the cleaning dummy 10.

By forming the filling hole 14 penetrating the upper and lower sides of the washing dummy 10, and forming the molding layer 16 in the lower part of the washing dummy 10 through the filling hole 14, the actual molding In the process, the same effect as the semiconductor chip 1 is mounted on the PCB 2 can be obtained in the cleaning dummy 10, thereby improving the cleaning effect of the molding mold.

1 is a structural diagram of a general semiconductor package,

2 is a plan view of a washing dummy according to the present invention;

3 is a cross-sectional view taken along the line A-A of FIG.

4 is a cross-sectional view in the state of molding the washing dummy according to the present invention.

1: semiconductor chip 2: PCB

3: wire 4: molding layer

5: solder ball 10: pile

12: epoxy core 14: filling hole

16: molding layer 18: irregularities

20: dummy package

Claims

A dummy used for cleaning a molding mold used when molding a molding resin in order to prevent the semiconductor chip from damage from the external environment during the manufacture of a semiconductor package,

Filled with an epoxy core made of an epoxy-based resin, a concavo-convex irregularities are formed on the upper / lower surface of the epoxy core, and filling holes penetrating the upper and lower sides of the epoxy core to fill the molding resin to the lower portion of the epoxy core A pile for cleaning a semiconductor mold mold, characterized in that a large number is formed laterally and horizontally.

The method of claim 1,

The cleaning dummy of the semiconductor mold mold, characterized in that the thickness of the cleaning dummy is 0.01mm ~ 0.07mm thicker than the thickness of the PCB used in the actual manufacture of the semiconductor package.