KR20090046539A - Controll system of manufacturing device - Google Patents

Abstract

A management system of a manufacturing facility is provided. The management system of a manufacturing facility includes a manufacturing facility including a plurality of manufacturing modules and a monitoring device indicating whether each manufacturing module is abnormal, and includes a layout of the manufacturing facility and a monitoring device indicating whether or not each manufacturing module is abnormal on the layout. .

Manufacturing equipment, management system

Description

Control system of manufacturing equipment

TECHNICAL FIELD The present invention relates to a management system for a manufacturing facility, and more particularly, to a management system for a manufacturing facility that accurately and clearly indicates the abnormality of a manufacturing facility.

The general semiconductor equipment management system monitors the abnormality of the equipment during the run of the semiconductor manufacturing equipment and controls the semiconductor manufacturing equipment according to the monitoring result. In other words, this series of processes is first operated. During operation of the semiconductor manufacturing facility, the semiconductor manufacturing facility is monitored to determine whether an abnormality occurs. As a result of the determination, if the semiconductor manufacturing equipment is normal, the semiconductor manufacturing equipment is continuously operated. When one process is completed, event information is stored accordingly. As a result of the discrimination, when an abnormality occurs in the semiconductor manufacturing equipment, an alarm is generated and the semiconductor manufacturing equipment is shut down. At the same time, alarm information about abnormality is saved. Event information about the progress of the process is then stored.

As such, the general semiconductor equipment management system monitors in real time after operating the semiconductor manufacturing equipment. If an error occurs in the semiconductor manufacturing equipment, an alarm is generated and alarm information and event information are stored. As a result, the operator analyzes the cause of the failure of the semiconductor manufacturing equipment by using the alarm information and the event information, and operates the semiconductor manufacturing equipment again in normal operation.

The monitoring unit indicating the abnormality of the semiconductor manufacturing equipment lists a part or each process step of the semiconductor manufacturing equipment and displays the abnormality. For example, since the monitoring unit simply lists and displays only the names and abnormalities of parts of each facility or each process step, it is difficult for an operator to know exactly which part of the semiconductor manufacturing facility is abnormal or which of the process steps is abnormal. . It is therefore an object of the present invention to provide a management system for a manufacturing facility that displays easily and accurately a semiconductor manufacturing facility and / or a semiconductor manufacturing process.

The technical problems of the present invention are not limited to the above-mentioned technical problems, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

In order to achieve the above technical problem, a management system for a manufacturing facility according to an aspect of the present invention is a manufacturing facility including a plurality of manufacturing modules and a monitoring device indicating whether or not each of the manufacturing module is abnormal, the layout of the manufacturing facility And a monitoring device indicating whether the respective manufacturing modules are abnormal on the layout.

Here, the monitoring device may indicate whether the respective manufacturing module is abnormal in a pop-up manner.

In addition, the monitoring device may distinguish a manufacturing module from an operation from a normal manufacturing module by using a color and / or an alarm.

Specific details of other embodiments are included in the detailed description and the drawings.

According to the management system of the manufacturing facility of the present invention as described above, since the monitoring device shows the layout of the manufacturing facility and the state of each manufacturing module on the layout, the operator can easily and accurately grasp the state of each manufacturing module.

The effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the present embodiments are intended to complete the disclosure of the present invention, and the general knowledge in the art to which the present invention pertains. It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

When an element is referred to as being "connected to" or "coupled to" with another element, it may be directly connected or coupled to another element or through another element in between. This includes all cases. On the other hand, when one device is referred to as "directly connected to" or "directly coupled to" with another device indicates that no other device is intervened. Like reference numerals refer to like elements throughout. “And / or” includes each and all combinations of one or more of the items mentioned.

Although the first, second, etc. are used to describe various elements, components and / or sections, these elements, components and / or sections are of course not limited by these terms. These terms are only used to distinguish one element, component or section from another element, component or section. Therefore, the first device, the first component, or the first section mentioned below may be a second device, a second component, or a second section within the technical spirit of the present invention.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In this specification, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, “comprises” and / or “comprising” refers to the presence of one or more other components, steps, operations and / or elements. Or does not exclude additions.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. In addition, the terms defined in the commonly used dictionaries are not ideally or excessively interpreted unless they are specifically defined clearly.

Hereinafter, a management system of a manufacturing facility according to an embodiment of the present invention will be described with reference to FIGS. 1 to 3. 1 is a block diagram illustrating a management system of a manufacturing facility according to an embodiment of the present invention, Figure 2 is a plan view showing an example of the manufacturing facility of Figure 1, Figure 3 is an operation of the monitoring device of Figure 1 It is a conceptual diagram for illustration. For convenience of explanation, a case where a manufacturing facility is a wafer processing apparatus will be described as an example, but the present invention is not limited thereto.

First, referring to FIG. 1, the management system 10 of the manufacturing facility 100 includes a manufacturing facility 100 and a monitoring device 500.

The manufacturing facility 100, for example a wafer processing apparatus, includes a plurality of manufacturing modules 101, 102, 103. 104, and the monitoring apparatus 500 checks whether the plurality of manufacturing modules 101, 102, 103. 104 are abnormal. Indicates. Here, the monitoring apparatus 500 is a layout of the manufacturing facility 100 and shows whether or not each manufacturing module 101, 102, 103. 104 is abnormal on the layout. Therefore, the operator can accurately determine the state of each manufacturing module (101, 102, 103. 104) of the manufacturing facility 100 and the position of the manufacturing module (101, 102, 103. 104) in which an abnormality occurs through the monitoring device 500. It is easy to see. Hereinafter, a detailed example will be described in detail with reference to FIGS. 2 and 3.

First, referring to FIG. 2, the manufacturing facility 100 of FIG. 1 may be a wafer processing apparatus. The wafer processing apparatus 100 includes a plurality of manufacturing modules, such as a load port 110, a door part 120, a transfer module 300, a transfer robot 310a and 310b, an alignment module 320, and at least one wafer processing. Chambers 400a to 400f. In addition, the wafer storage module 250a or 250b may further include a wafer W temporarily transferred from the load port 110 to the transfer module 300. Next, each manufacturing module of the wafer processing apparatus 100 will be described in more detail.

The load port 110 is a portion for loading and unlaoding the wafer (W). The load port 110 is exposed to the outside of the wafer processing apparatus 100, and may be loaded in a state where the wafer W is stacked on a single carrier or a carrier. The wafer W placed in the load port 110 may be a wafer W to be carried into the wafer processing apparatus 100, or a wafer to be taken out of the wafer processing apparatus 100 and transferred to another place. (W) may be. In the drawing, it is shown that three wafers W can be loaded or that the wafers W can be loaded in three places, but this is exemplary. The wafer W may be loaded in one wafer W or in one place, and more wafers W may be loaded.

The door part 120 may isolate the inside and the outside of the wafer processing apparatus 100. For example, when the wafer W is brought into the wafer processing apparatus 100, a door (not shown) provided in the door part 120 is opened and the wafer W is transferred to the wafer storage module ( 250a, 250b) or into the transfer module 300. In addition, even when the wafer W is taken out from the inside of the wafer processing apparatus 100, the door provided in the door part 120 is opened and the wafer W is transferred to the transfer module 300 or the wafer storage modules 250a and 250b. May be taken out from the load port 110. In addition, in order to maintain the vacuum state inside the transfer module 300, the door part 120 may perform a function of isolating the transfer module 300 from the outside.

The wafer storage modules 250a and 250b are spaces in which the wafers W transferred from the load port 110 to the load module 110 or the transfer module 300 to the load port 110 may be temporarily stored. This space may be provided to reduce the evacuation time of the transfer module 300 immediately after opening and closing.

Specifically, instead of evacuating the transfer module 300 having a large volume, only the wafer storage modules 250a and 250b having a small volume are subjected to a process to alternate between the atmospheric pressure and the vacuum state, thereby evacuating or evacuating the interior. Since the time required for shortening is short, the process time can be greatly shortened in all cases where the wafer W is carried in or out of the wafer processing apparatus 100.

The transfer module 300 imports the wafer W from the outside, and temporarily stores the wafer W before distributing the wafer W into the respective wafer processing chambers 400a to 400f, and aligns the wafer W. The wafers W can be transferred to the respective wafer processing chambers 400a to 400f or the processed wafers W from the respective wafer chambers 400a to 400f.

More specifically, the transfer module 300 may be provided with at least one transfer robot 310a, 310b and the alignment module 320.

The transfer robots 310a and 310b may rotate to transfer the wafers W from the wafer storage modules 250a and 250b into the transfer module 300. For example, the transfer robots 310a and 310b may transfer the wafer W to the alignment module 320. Alternatively, the transfer robots 310a and 310b may transfer the wafers W from the alignment module 320 to the respective wafer processing chambers 400a to 400f.

Alignment module 320 aligns a plurality of wafers (W). In addition, the alignment module 320 may temporarily store the wafer W before the wafer W is transferred to the respective wafer processing chambers 400a to 400f. The structure, number, and installation position of the alignment module 320 may be various.

The wafer processing chambers 400a to 400f are spaces for carrying in the wafer W, mounting them on the stages Sa to Sf, and then processing the wafer W. In the present embodiment, the wafer processing chambers 400a to 400f representatively exemplify a case in which the wafers W are loaded and processed one by one.

Referring further to FIG. 3, the monitoring apparatus 500 shows the layout of the wafer processing apparatus 100 described above, and each manufacturing module, for example, the load port 110, the door part 120, and the transfer module ( 300, the transfer robots 310a and 310b, the alignment module 320, and the wafer processing chambers 400a to 400f indicate whether or not they are abnormal.

The monitoring device 500 may indicate whether or not an abnormality of each manufacturing module in a pop-up manner. This example is illustrated in FIG. 3, that is, the monitoring device 500 indicates that the fourth chamber 400d and the door part 120 are in an abnormal operation state in a pop-up manner on the layout of the wafer processing apparatus 100. Here, when the manufacturing module is in an abnormal state, a window for notifying of this may be automatically popped up, or may be popped up when the operator confirms each manufacturing module using a mouse. Therefore, the operator can easily and accurately know whether or not each manufacturing module of the wafer processing apparatus 100 is abnormal.

Alternatively, the monitoring device 500 may display the manufacturing module that is abnormal in operation by using color to distinguish it from the normal manufacturing module. In addition, when the operation is abnormal, different alarms may be sounded for each manufacturing module.

In summary, according to the management system of the manufacturing facility according to the present invention, since the monitoring device shows the layout of the manufacturing facility and the state of each manufacturing module on the layout, the operator can easily and accurately grasp the state of each manufacturing module. .

Those skilled in the art will appreciate that the present invention can be embodied in other specific forms without changing the technical spirit or essential features of the present invention. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. The scope of the present invention is indicated by the scope of the following claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and the equivalent concept are included in the scope of the present invention. Should be interpreted.

1 is a block diagram illustrating a management system of a manufacturing facility in an embodiment of the present invention.

2 is a plan view illustrating an example of the manufacturing facility of FIG. 1.

3 is a conceptual diagram illustrating an operation of the monitoring apparatus of FIG. 1.

<Explanation of symbols for the main parts of the drawings>

10: management system 100: wafer processing apparatus

101, 102, 103, 104: manufacturing module 500: monitoring device

Claims (2)

A manufacturing facility comprising a plurality of manufacturing modules; And A monitoring device for indicating whether or not each manufacturing module is abnormal, comprising a layout of the manufacturing equipment and a monitoring device for indicating whether or not each manufacturing module is abnormal on the layout. The method of claim 1, The monitoring device indicates whether or not an abnormality of each of the manufacturing module in a pop-up manner, and manufacturing equipment that distinguishes the abnormal manufacturing module from the normal manufacturing module by using color and / or alarm. Management system.

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