KR20090029052A

KR20090029052A - Apparatus for molding semiconductor package

Info

Publication number: KR20090029052A
Application number: KR1020070094304A
Authority: KR
Inventors: 박성열
Original assignee: 미크론정공 주식회사
Priority date: 2007-09-17
Filing date: 2007-09-17
Publication date: 2009-03-20
Also published as: KR100907326B1

Abstract

A semiconductor package molding apparatus is provided. The semiconductor package molding apparatus according to the embodiment of the present invention is provided with an upper mold and a lower mold forming a cavity, and a supply hole for supplying a molding compound to the cavity, which is located between the upper mold and the lower mold when combined. And a port connected to the supply hole, the port for supplying the molding compound to the cavity, and a plunger moving along the inner surface of the port and pressurizing the molding compound to flow into the supply hole.

Description

Apparatus for molding semiconductor package

The present invention relates to a semiconductor package molding apparatus, and more particularly, to a semiconductor package molding apparatus for improving the supply efficiency of a molding compound supplied to a semiconductor package by supplying a molding compound directly through a substrate using only one substrate. It is about.

In general, a semiconductor that can control, amplify, and store an electrical signal by using a property that is intermediate between a conductor and a non-conductor protects a surface from external moisture and impurities, and effectively dissipates heat generated at a junction. In order to be embedded in a container made of metal, ceramic, plastic, etc. in a COB (Chip On Board) type, this is commonly referred to as a semiconductor package (package).

The semiconductor package is manufactured in various structures with members such as lead frames, printed circuit boards (PCBs), and circuit films. The semiconductor package is manufactured by a bonding process, a wire process, a molding process, and the like.

First, in a bonding process, a semiconductor chip having a high integrated circuit such as a transistor and a capacitor is formed in a lead frame, which is a chip mounting region. In the wire process, a wire is connected between the bonding pad of the semiconductor chip and the bonding area of the member so that the external connection terminal is electrically energized. Next, in the molding process, the exterior of the semiconductor package is molded using a molding resin (hereinafter, referred to as a compound) such as an epoxy molding compound (EMC) to protect the semiconductor chip, wire, and the like from the outside.

1 is a perspective view illustrating a general semiconductor package molding apparatus.

The semiconductor package molding apparatus 1 fixes a substrate 30 to be molded between the upper mold 10 and the lower mold 20, and a cavity made when the upper mold 10 and the lower mold 20 are clamped to each other. The molding compound is sent to the upper mold 10 or the lower mold 20 through the molding. The supply of the molding compound is made in the compound dispensing block 40.

2 is a perspective view illustrating a method of supplying molding compound to substrates disposed on both sides of a conventional compound distribution block.

As shown in FIG. 2, two substrates 30a and 30b on which molding is performed are disposed side by side, and the compound distribution block 40 is disposed at regular intervals between the two substrates 30a and 30b. Each compound distribution block 40 is connected to a circular port 50 (circular shape of the plunger 60, curl 42) is supplied with the compound (70a, 70b) in the port 50 and then the plunger ( By pressurization of 60, the compound 70a, 70b flows into both board | substrates 30a, 30b through the curl 42 and the runner 44, and molding is performed. When molding is carried out using a molding apparatus 1 of a conventional size (more precisely, the size of the cross-sectional area of the surface on which the substrates 30a and 30b are placed in the molding apparatus 1), the molding apparatus 1 of the same size If it is possible to improve the area of the semiconductor package to be molded by using it can improve the production yield. That is, in the related art, the compounds 70a and 70b were supplied by using the compound distribution block 40 between the substrates 30a and 30b. However, the handling was inconvenient as the two substrates 30a and 30b were used. The use of the distribution block 40 caused problems in the supply, such as voids.

3 is a view showing that the molding compound pressed by the plunger in the conventional compound distribution block is supplied to the substrate through which the molding is performed through the curl.

A compound distribution block 40 is provided between the two substrates 30a and 30b, and molding compounds 70a and 70b are curled by a port 50 formed below or above the compound distribution block 40. ) And the molding compound 70a, 70b is formed along the runner 44, which is a moving passage of the compounds 70a, 70b formed between the curl 42 and the gate 46 by pressing the plunger 60. It flows into the cavity and then solidifies to mold the molding region of the member.

FIG. 4 is a view illustrating a hole in which a fixing pin for fixing a substrate is inserted in a conventional semiconductor package molding apparatus is formed over an edge of the substrate.

While molding is performed on the substrate 30 between the upper mold 10 and the lower mold 20, the substrate 30 may be deformed by the heat and pressure applied to the compound 70, and the compound 70 may be precisely formed. It may not be molded at the desired position of 30. When the position of the substrate 30 is fixed by a fixing pin (not shown) as shown in FIG. 4, the position can be precisely corrected, but as the substrate 30 is warped due to the deformation of the substrate 30, Problems such as breaking of the substrate 30 may occur.

The present invention is devised to improve the above problems, and an object of the present invention is to supply a compound for molding directly through the substrate using only one substrate without using a conventional compound distribution block is supplied to the semiconductor package It is to improve the supply efficiency of the molding compound.

Another object of the present invention is to form a slot at the edge of the substrate to prevent damage to the substrate by deformation of the substrate.

Technical problem of the present invention is not limited to those mentioned above, another technical problem that is not mentioned will be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, the semiconductor package molding apparatus according to an embodiment of the present invention is located between the upper mold and the lower mold, and the upper mold and the lower mold to form a cavity when combined, the compound for molding in the cavity A substrate having a supply hole for supplying a metal, and a port connected to the supply hole to supply the molding compound to the cavity, and moving along an inner surface of the port to press the molding compound to the supply hole. Includes a flowing plunger.

According to the semiconductor package molding apparatus of the present invention as described above has one or more of the following effects.

First, the supply efficiency of the molding compound supplied to the semiconductor package can be improved by supplying the molding compound directly through the substrate using only one substrate without using the conventional compound distribution block.

Secondly, there is an advantage that the handling is easy using only one substrate.

Third, there is an advantage that the substrate can be prevented from breaking when deformation occurs in the substrate by heat or pressure during the molding process.

The effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, and only the embodiments make the disclosure of the present invention complete, and the general knowledge in the art to which the present invention belongs. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

Hereinafter, the present invention will be described with reference to the drawings for describing a semiconductor package molding apparatus according to embodiments of the present invention.

5 is a perspective view illustrating a substrate on which a supply hole for supplying molding compound is formed in a semiconductor package molding apparatus according to an exemplary embodiment of the present invention.

The semiconductor package molding apparatus according to the exemplary embodiment of the present invention includes an upper mold 10, a lower mold 20, a substrate 110, a port 120, and a plunger 130.

As shown in FIG. 1, the upper mold 10 and the lower mold 20 have a substrate 110 to be molded therein, and then the upper mold 10 or the lower mold 20 moves to move the upper mold 10. The lower mold 20 is clamped after the coupling. At this time, a cavity in which the molding compound 140 is injected is formed between the upper mold 10 and the lower mold 20. In general, the upper mold 10 is fixed and the lower mold 20 moves so that the upper mold 10 and the lower mold 20 are coupled to each other.

As shown in FIG. 1, the substrate 110 on which the semiconductor chip is mounted is disposed between the upper mold 10 and the lower mold 20. The semiconductor package is mounted on the substrate 110 after the bonding process and the wire process. Preferably, as shown in FIG. 5, the rectangular substrate 110 is disposed.

The substrate 110 is provided with a supply hole 112 for supplying the molding compound 140 to the cavity. Preferably, at least two supply holes may be disposed along the central portion of the substrate in the longitudinal direction of the substrate.

As shown in FIG. 2, conventionally, two substrates 30a and 30b on which molding is performed are disposed side by side, and the compound distribution block 40 is disposed at regular intervals between the two substrates 30a and 30b. Compounds 70a and 70b were supplied to the substrates 30a and 30b through the compound distribution block 40. However, handling of the two substrates 30a and 30b was inconvenient to handle, and the use of the compound distribution block 40 caused a problem in supply such as voids.

However, as shown in FIG. 5, a supply hole 112 for supplying a molding compound 140 is formed in the substrate 110 of the semiconductor package molding apparatus 1 according to an embodiment of the present invention. Of the molding compound 140 to be supplied to the semiconductor package by supplying the molding compound 140 directly through the substrate 110 using only one substrate 110, without using the conventional compound distribution block 40 Supply efficiency can be improved.

The port 120 is connected to the supply hole 112 of the substrate 110 to supply the molding compound 140 to the cavity. That is, the port 120 serves to supply the molding compound 140 pressurized through the plunger 130 above or below the substrate 110 to the cavity of the substrate 110. The shape of the port 120 may correspond to the shape of the supply hole 112.

The plunger 130 guides and moves along the inner surface of the port 120 and presses the molding compound 140 in the port 120 to serve to flow into the cavity of the substrate 110. The shape of the plunger 130 may also be formed to correspond to the shape of the supply hole 112.

6 is a longitudinal cross-sectional view illustrating a method of supplying a molding compound to a substrate on which a supply hole is formed in a semiconductor package molding apparatus according to an exemplary embodiment of the present invention.

As shown in FIG. 6, the port 120 and the plunger 130 are connected to the supply hole 112 of the substrate 110.

FIG. 7 is a perspective view illustrating a substrate on which circular supply holes are formed in a semiconductor package molding apparatus according to an embodiment. FIG. 8 illustrates a plunger and a port corresponding to the substrate on which the circular supply holes are formed. Perspective view.

According to an embodiment of the present invention, as shown in FIG. 7, the substrate 110 may have a supply hole 112 of a circular shape (more precisely, a shape close to a circular shape). In addition, the shapes of the plunger 130 and the port 120 may also have a cylindrical shape (more precisely, a shape close to the cylindrical shape) to correspond to the shape of the supply hole 112.

FIG. 9 is a perspective view illustrating a substrate on which a rectangular supply hole is formed in a semiconductor package molding apparatus according to another exemplary embodiment. FIG. 10 is a plunger and a port corresponding to a substrate on which a rectangular supply hole is formed in FIG. 9. Is a perspective view.

According to another embodiment of the present invention, as shown in FIG. 9, the substrate 110 may have a supply hole 112 having a rectangular shape (more precisely, a shape closer to a rectangle). In addition, the shapes of the plunger 130 and the port 120 may also have a rectangular parallelepiped shape (more accurately, a shape closer to the rectangular parallelepiped) to correspond to the shape of the supply hole 112.

9 and 10, rounded corners of the rectangular plunger 130 may be formed so that the plunger 130 may be smoothly raised along the port 120. At this time, a round may be formed in the corner of the inner surface of the port 120 for guiding the plunger 130 according to the shape of the plunger 130. The shape of the supply hole 112 of the substrate 110 may also be rounded.

The number, shape, or position of the supply holes 112 formed in the substrate 110 may be changed by those skilled in the art in addition to those described above.

11A and 11B are perspective views illustrating another embodiment of the plunger and the port corresponding to the substrate on which the rectangular shaped supply hole of FIG. 10 is formed.

As shown in FIG. 11A, the plunger 130 may have protrusions 132 formed on a long surface of a rectangle as shown in FIG. 10. In addition, a groove 122 may be formed on an inner side surface of the port 120 that guides the vertical movement of the plunger 130 to correspond to the shape of the protrusion 132 of the plunger 130 in which the protrusion 132 is formed. Thus, the plunger 130 can move along the port 120.

FIG. 11B illustrates an embodiment in which the protrusion 124 is formed on the inner surface of the port 120 and the groove 134 is formed in the plunger 130, in contrast to FIG. 11A. That is, the plunger 130 has a groove 134 formed in a rectangular long surface, and the inner surface of the port 120 has a protrusion 124 formed to correspond to the shape of the plunger 130 in which the groove 134 is formed. Can be.

As such, by forming the grooves 122 and 134 or the projections 124 and 132 between the plunger 130 and the port 120, the plunger 130 is guided and moved along the port 120. Tolerance between the ports 120 may prevent the plunger 130 from tilting and limiting the movement of the plunger 130. Accordingly, the plunger 130 may move in the port 120 while being horizontal. Preferably, as shown in FIGS. 11A and 11B, the grooves or the protrusions may be formed two spaced apart from each other in a position that can divide the long side of the rectangle into three parts.

12 is a view showing a slot formed substrate according to an embodiment of the present invention, Figure 13 is a perspective view showing the insertion of the fixing pin in the slot in the slot formed substrate according to an embodiment of the present invention.

The slot 114 is formed at the edge of the substrate 110 so that the fixing pin 150 is inserted into the upper mold 10 or the lower mold 20 to fix the substrate 110. Preferably, a plurality of slots 114 may be formed along edges of both sides of the substrate 110. Alternatively, a plurality of fixing holes (not shown) may be formed along the edge of one side of the substrate 110, and a plurality of slots 114 may be formed along the edge of the opposite side.

As shown in FIG. 4, in the related art, the substrate 30 may be deformed due to heat and pressure applied to the compound 70 while molding is performed on the substrate 30, as shown in FIG. 4. When the position of the substrate 30 is fixed by using the substrate 30, the substrate 30 may be broken around the hole 32 as the substrate 30 is warped due to the deformation of the substrate 30.

However, a slot 114 is formed in the substrate 110 of the semiconductor package molding apparatus according to an embodiment of the present invention, in which a fixing pin 150 is inserted to fix the substrate 110 along an edge of the substrate 110. Therefore, when the deformation occurs in the substrate 110 by heat or pressure, the substrate 110 is broken by securing a space through which the substrate 110 can move based on the fixing pin 150 through the slot 114. It can prevent.

Referring to the operation of the semiconductor package molding apparatus according to an embodiment of the present invention configured as described above are as follows.

First, the upper mold 10 and the lower mold 20 place the substrate 110 to be molded therein, and then the upper mold 10 or the lower mold 20 moves to move the upper mold 10 and the lower mold ( 20) is clamped after coupling. At this time, a cavity in which the molding compound 140 is injected is formed between the upper mold 10 and the lower mold 20.

Next, as shown in FIGS. 5 to 10, the plunger 130 is guided by the port 120 connected to the supply hole 120 of the substrate 110 so that the plunger 130 is supplied to the supply hole 112 of the substrate 110. The molding compound 140 in the port 120 is supplied to the supply hole 112 of the substrate 110 while moving toward), and the molding compound 140 is pressed by the plunger 130, thereby molding the compound. 140 flows and finally molding is performed on the substrate 110 through the cavity between the upper mold 10 and the lower mold 20.

As described above, according to the semiconductor package molding apparatus according to an embodiment of the present invention, the molding is supplied to the semiconductor package by supplying the molding compound directly through the substrate using only one substrate without using the conventional compound distribution block The supply efficiency of the compound may be improved, and handling is easy using only one substrate. In addition, it is also possible to prevent the substrate from breaking when deformation occurs in the substrate due to heat or pressure during the molding process.

Those skilled in the art will appreciate that the present invention can be embodied in other specific forms without changing the technical spirit or essential features of the present invention. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. The scope of the present invention is indicated by the scope of the following claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and equivalent concepts are included in the scope of the present invention. Should be interpreted as

7 is a perspective view illustrating a substrate on which circular supply holes are formed in a semiconductor package molding apparatus according to an embodiment of the present invention.

FIG. 8 is a perspective view illustrating a plunger and a port corresponding to the substrate on which the circular supply hole of FIG. 7 is formed.

9 is a perspective view illustrating a substrate on which a rectangular supply hole is formed in a semiconductor package molding apparatus according to another exemplary embodiment.

FIG. 10 is a perspective view illustrating a plunger and a port corresponding to a substrate on which a rectangular supply hole of FIG. 9 is formed.

12 is a view illustrating a substrate on which a slot is formed according to an embodiment of the present invention.

FIG. 13 is a perspective view illustrating a fixing pin inserted into a slot in a slot formed substrate according to an embodiment of the present invention. FIG.

1: semiconductor package molding device

110: substrate

112: supply hole

114: slot

120: port

130: plunger

140: molding compound

Claims

An upper mold and a lower mold forming a cavity when joined;

A substrate positioned between the upper mold and the lower mold and having a supply hole for supplying a molding compound to the cavity;

A port connected to the supply hole to supply the molding compound to the cavity; And

And a plunger moving along the inner surface of the port and pressurizing the molding compound to flow into the supply hole.

The method of claim 1,

The supply hole is a semiconductor package molding device having a circular shape.

The method of claim 1,

The supply hole is a semiconductor package molding apparatus having a rectangular shape formed long in the longitudinal direction of the substrate.

The method of claim 2 or 3,

And at least two supply holes in a longitudinal direction of the substrate along a central portion of the substrate.

The method of claim 2,

And the plunger has a cylindrical shape to correspond to the shape of the supply hole.

The method of claim 3, wherein

The plunger has a shape of a rectangular parallelepiped long in the longitudinal direction of the substrate to correspond to the shape of the supply hole.

The method of claim 6,

The plunger is a semiconductor package molding apparatus in which a projection is formed on a long side of the rectangle, the inner surface of the port is formed so as to correspond to the shape of the plunger on which the projection is formed to move the plunger along the port.

The method of claim 6,

The plunger has a groove formed in a rectangular long surface, the inner surface of the port is formed so as to correspond to the shape of the grooved plunger is a semiconductor package molding apparatus for moving the plunger along the port.

The method according to claim 7 or 8,

The protrusions or grooves are formed in the semiconductor package molding apparatus spaced apart from each other two long sides.

The method of claim 1,

And a slot formed at an edge of the substrate such that a fixing pin for fixing the substrate is inserted into the upper mold or the lower mold.