KR20090027035A - Method of fabricating substrate loading device - Google Patents

Abstract

A method of manufacturing the substrate loading device is provided to form one sidewall member and substrate supports in one body and to reduce the assembly time and assembly cost of side walls. The substrate loading device(100) comprises the upper plate(110), the lower plate(120), and the first lateral wall(130) and the second side wall(140). The substrate-receiving space(180) is formed inside the substrate loading device. To manufacture the substrate loading device, Firstly, a plurality of substrate supports(135) is formed in one sidewall member. Subsequently, the sidewall member is cut and a plurality of side walls is manufactured. The sidewall member and substrate support can be integrately manufactured.

Description

Manufacturing Method of Substrate Storage Device {METHOD OF FABRICATING SUBSTRATE LOADING DEVICE}

The present invention relates to a method for manufacturing a substrate storage device.

In general, the manufacturing process of the wafer on which the semiconductor element is formed includes a plurality of unit processes. These unit processes mostly consist of automated systems to increase the productivity of wafer fabrication. As a result, the wafer processed in a specific unit process in a specific facility is temporarily stored in a storage device such as a cassette. The wafers stored in the storage device are transferred to a facility where a subsequent unit process is performed by a transfer robot.

On the other hand, in the receiving device for storing the wafer, in order to increase the transfer efficiency of the substrate, many wafers must be received at the same time. To this end, a plurality of supports are formed on both side walls constituting the storage device, and wafers are accommodated between each support. Typically, the manufacturing process of the receiving apparatus includes a manufacturing process of the side wall, a manufacturing process of the support and the assembly process of fastening the side wall and the support.

However, in the assembling process of fastening the sidewalls and the supports, a step exceeding a tolerance range between the supports formed on both side walls may occur, causing the wafer to be incorrectly seated on the support.

It is therefore an object of the present invention to provide a method for manufacturing a substrate storage device in which a substrate is accurately seated.

In order to achieve the above object, a method of manufacturing a substrate storage device according to the present invention includes forming a plurality of substrate supports on one sidewall member, and cutting the sidewall member to manufacture the plurality of sidewalls. Here, the side wall member and the substrate support is characterized in that it is manufactured in one piece.

According to the manufacturing method of the substrate storage device of the present invention, one side wall member and the substrate supports formed on the side wall member are integrally formed, and the side wall members are cut to manufacture a plurality of side walls.

Therefore, the assembly process of the side walls and the substrate support is eliminated, thereby reducing manufacturing cost and manufacturing time.

In addition, the step between the substrate supports provided on both sidewalls generated during the assembly process is removed so that the substrate is accurately seated on the substrate supports.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the accompanying drawings. In understanding the drawings, it should be noted that like parts are intended to be represented by the same reference numerals as much as possible. Incidentally, detailed descriptions of well-known functions and configurations that are determined to unnecessarily obscure the subject matter of the present invention will be omitted.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view of a substrate storage device 100 according to an embodiment of the present invention.

Referring to FIG. 1, the substrate accommodating device 100 according to the present invention includes an upper plate 110, a lower plate 120, a first side wall 130, and a second side wall 140. ), An accommodation space 180 for accommodating the substrates W is formed.

As illustrated in FIG. 1, the substrate accommodating device 100 has a hexahedral shape in which front and rear surfaces are opened with the first and second sidewalls 130 and 140 interposed therebetween. The substrates W are received into the storage space 180 by a first transfer robot (not shown), and are opposite to the first transfer robot (not shown) with the substrate storage device 100 interposed therebetween. Shipped by a second transfer robot (not shown) disposed.

The upper plate 110 and the lower plate 120 are disposed to face each other. The first side wall 130 connects one end of the upper plate 110 and one end of the lower plate 120, and the second side wall 140 has the other end facing the one end of the upper plate 110. And the other end opposite to one end of the lower plate 120. Accordingly, the first side wall 130 and the second side wall 140 connect the upper plate 110 and the lower plate 120 to form the storage space 180.

A plurality of substrate support 135 is formed on the first side wall 130 extending into the accommodation space 180. As an example, FIG. 1 shows a first sidewall 130 having seven substrate supports 135.

Specifically, the substrate supports 135 extend in a vertical direction from the inner side surface S of the first side wall 130, and cross the inner side surface S of the first side wall 130 side by side. In this case, the substrate support 135 and the first side wall 130 is formed integrally processed. Here, unlike the prior art in which the sidewalls and the substrate support are manufactured separately from each other and completed through a subsequent assembly process, the present invention provides a subsequent assembly in which the first sidewall 130 and the substrate support 113A are integrally formed to fasten them. The process is excluded.

Thus, by eliminating the subsequent assembly process, manufacturing cost and manufacturing time is shortened.

On the other hand, the lower surface of one end of the upper plate 110 is seated on the upper surface of the substrate support 131 formed on the top of the seven substrate support 135, the upper surface of one end of the lower plate 120 The lower surface of the substrate support 139 formed at the bottom of the substrate supports 135 is seated. One end of each of the substrates W is seated on the upper surface of the remaining substrate supports. In the same structure, seven substrate supports 145 are formed on the second sidewall 140 at an interval equal to the interval between the substrate supports 135 formed on the first sidewall 130. The other end is seated.

In this embodiment, a total of six substrates are accommodated, and three substrates W are simultaneously transported and received from a facility in which a previous unit process is performed by a first transfer robot (not shown), and a second transfer robot (not shown). 3 substrates W are simultaneously shipped to the facility where the next unit process proceeds.

As described above, the lower surfaces of both ends of the substrate W are seated on the upper surfaces of the substrate supports 135 and 145 formed on the first and second sidewalls 130 and 140 to accommodate the substrates W.

2 to 5 are views for explaining the manufacturing method of the substrate accommodating device shown in FIG.

2 through 5, sidewall members 200 are shown for manufacturing the first and second sidewalls 113, 114 shown in FIG. 1. The side wall member 200 has a hexahedron shape having a front surface, a rear surface, and a plurality of side surfaces connecting the front surface and the rear surface. The material of the sidewall member 200 is preferably a material having low water absorption, good chemical resistance, high stability at high temperature, and low molding shrinkage. For example, polyphenylene sulfide (PPS), polybutylene telephthalate (PBT), poly carbonate (PC), and the like are preferable, and in particular, as the material of the sidewall member 200, the PPS Material is preferable.

 Thereafter, as shown in FIG. 3, the side wall member 200 includes seven supports 215 extending from the side wall 210 and the side wall 210 through any one of high precision cutting and injection molding. ) Are processed simultaneously. That is, the side wall 210 and the support 215 are integrally formed.

Each support 215 extends vertically from the front surface of the side wall 210 and is formed to cross the front surface of the side wall 210 in a direction parallel to each other. Here, the plurality of through-holes 20 to which the fastening member is coupled are formed in the support members 211 and 219 formed at the top and the bottom thereof at regular intervals. In this embodiment, six through holes 20 are formed. The supports 215 have the same thickness except for the support 219 formed at the bottom thereof.

The processed side wall member 200 is cut based on the center line 10 shown in FIG. 3 through a predetermined cutting process. This completes the first and second sidewalls 130 and 140 on which the plurality of substrate supports 135 shown in FIG. 1 are formed.

As described above, in the present invention, one sidewall member 200 is processed to form the sidewall 210 and a plurality of supporters 215 integrally formed with the sidewall 210. In addition, the first and second sidewalls 130 and 140 are completed by cutting the processed sidewall member 200 into two parts. Therefore, in the substrate storage device of the present invention, since the side wall and the substrate support formed on the side wall are manufactured separately, a subsequent assembly process of fastening them is excluded, so that the overall manufacturing time is shortened.

In addition, in the substrate accommodating device of the present invention, the first sidewall 130 and the second sidewall 140 are integrally formed by processing one sidewall member 200, and then, the sidewall member 200 of the processed sidewall member 200 is formed. The first sidewall 130 and the second sidewall 140 are formed through the cutting process. Therefore, a step between the substrate supports generated in the process of assembling the substrate supports separately on both side walls is prevented.

Referring to FIG. 5, an upper plate member (not shown) and a lower plate member (not shown) are respectively provided. The upper plate member and the lower plate member is made of the same material, for example, it is preferable that the upper plate member is composed of an aluminum-based metal material excellent in chemical resistance.

The upper plate member and the lower plate member are processed to an appropriate size in consideration of the substrate size to be accommodated to form the upper plate 110 and the lower plate 120 shown in FIG.

The top plate 110 is formed with first and second openings 112 and 114 having a rectangular shape. The weight of the upper plate 110 is reduced by the first and second openings 112 and 114, and is applied to the first and second sidewalls 130 and 140 by the load of the upper plate 110. Minimize stress In addition, three through holes 23 are formed at both ends of the upper plate 110 with the first and second openings 112 and 114 interposed therebetween.

The lower surface of one end of the upper plate 110 is seated on the upper surface of the substrate support 131 of the first side wall 130. At this time, one end of the upper plate 110 is formed by a fastening member 26 penetrating through the through hole 23 formed at one end of the upper plate 110 and the through hole 20 formed at the substrate support 131. It is fixed to the upper surface of the substrate support 131 of the first side wall 130. It is fixed to the other end of the upper plate 110 and the upper surface of the substrate support 141 of the second side wall 140 by the same connection structure. Similarly, the first and second sidewalls 130 and 140 are fixed to the lower plate 120 to complete the substrate accommodating device 100 according to the present invention.

Meanwhile, the substrate accommodating apparatus 100 manufactured according to the manufacturing method of the present invention may be applied to a carrier accommodating the substrate for transporting the substrates. In addition, the substrate accommodating apparatus 100 may be applied to a buffer unit for taking over the substrate between the transfer apparatuses.

As described above, the present invention has been described with reference to one embodiment shown in the drawings, which is merely exemplary, and various modifications and equivalent other embodiments are possible to those skilled in the art. I will understand the point. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

1 is a perspective view of a substrate storage device according to an embodiment of the present invention.

2 to 5 are views for explaining the manufacturing method of the substrate accommodating device shown in FIG.

Claims (8)

In the manufacturing method of the substrate storage device provided with a plurality of substrate support on which the substrate is seated on each of the plurality of side walls, Forming the substrate support on one sidewall member, and cutting the sidewall member to manufacture the plurality of sidewalls. The method of claim 1, And the sidewall member and the substrate support are integrally manufactured. The method of claim 2, And the side wall member and the substrate support are manufactured by any one of cutting and injection molding. The method of claim 1, The plurality of sidewalls comprises a first sidewall and a second sidewall, The substrate accommodating device manufacturing method of the substrate accommodating device, characterized in that the front and the back is opened with the first side wall and the second side wall between. In the manufacturing method of the substrate storage device provided with a plurality of substrate supports on which the substrate is supported on a plurality of side walls, Simultaneously manufacturing one sidewall member and the substrate support extending in a vertical direction from the surface of the sidewall member through one process; And And cutting the sidewall members to form the plurality of sidewalls. The method of claim 5, wherein The one step is a manufacturing method of the substrate storage device, characterized in that any one of cutting and injection molding processing. The method of claim 5, wherein The substrate accommodating device manufacturing method of the substrate accommodating device, characterized in that the front and rear open. The method of claim 5, wherein The side wall member is a manufacturing method of a substrate storage device, characterized in that the polyphenylene sulfide (Polyphenylene Sulfide) material.

Images