KR20090023079A - Lapping apparatus and lapping method - Google Patents

Abstract

A lapping apparatus is provided to perform a lapping process of a combined head with high precision by adjusting a slope of an adapter about a lapping surface. A lapping apparatus comprises the followings: a surface plate(10) having a lapping surface in which a side of a work piece contacts; a wrap base(11) having a holding surface which is contacted with the lapping surface and supported; a first supporting unit supported by the wrap base; a second supporting unit attaching the work piece; an adapter(12a) including an arm unit extended between the second supporting unit and the first supporting unit; a height adjusting unit; and a slope detector detecting a slope of the adapter.

Description

Lapping Device and Lapping Method {LAPPING APPARATUS AND LAPPING METHOD}

TECHNICAL FIELD The present invention relates to a lapping apparatus and a lapping method, and more particularly, to a lapping apparatus and a lapping method used for processing a workpiece requiring high precision, such as a magnetic head element.

Hard disk drive devices are used as storage devices for personal computers and video equipment. The hard disk drive device has a larger recording area than other recording devices and is suitable as a storage device for video equipment and the like, but a larger capacity is required.

In the current hard disk drive apparatus, a recording technique called a horizontal recording method is used, but there is a limit to the large capacity in the horizontal recording method, and development of a hard disk drive by another recording method is required.

Therefore, in order to further increase the capacity of the hard disk, a recording technology called a vertical recording method is proposed instead of the horizontal recording method. When the vertical recording method is adopted in the hard disk drive device, a magnetic path is formed in the depth direction of the disk rather than in the horizontal direction of the recording surface of the hard disk, so that recording is performed, so that the magnetic domain can be narrowed more. A lot of information can be recorded by one hard disk.

In a hard disk drive apparatus employing a conventional horizontal recording method, a hybrid magnetic head having both a write element (for recording) and a lead element (for reading) is used. In the hybrid magnetic head, when mounted on the hard disk drive device, the writing surface of the hard element and the recording surface of the hard disk can be written so that information can be written to and written from the recording surface of the hard disk. The distance between them and the distance between the tip of the lead element and the recording surface of the hard disk should be maintained with high accuracy. For this reason, in the conventional hybrid magnetic head, the dimension of the head with high desired precision is achieved by finishing with a lapping apparatus.

Here, the manufacturing process of the hybrid magnetic head will be briefly described. In the first step of the manufacturing process of the hybrid magnetic head, a wafer process generates a plurality of hybrid magnetic heads having both a light element and a lead element on the wafer in two dimensions. At this time, the light element resistor element and the lead element resistance element called ELG are respectively embedded in the light element and lead element vicinity of each composite magnetic head. These resistance elements change in resistance value in accordance with the polishing amount when the composite magnetic head is wrapped. Therefore, by monitoring the resistance values of these resistance elements, it is possible to accurately grasp the amount of polishing during lapping. As a result, proper lapping can be performed on the composite magnetic head.

Next, in the second step, the wafer is cut into strips, and elongate row bars are formed in which a plurality of complex magnetic heads are arranged in a row. Next, in the third step, the row bar is attached to the lapping apparatus so that lapping of the plurality of magnetic heads arranged in the row bar as finishing is performed at once. At this time, the resistance value of each of the lead element resistance element and the light element resistance element generated on the wafer in the first step is detected by the wrapping apparatus. When the detected resistance value reaches a predetermined value, it is determined that the desired finish dimension is reached, and lapping is stopped. Thereafter, the row bar is cut in the fourth step, and the plurality of compound magnetic heads in the row bar are separated to obtain a plurality of compound magnetic heads.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the row bar by which lapping process as mentioned above is performed. The row bar 100 shown in Fig. 1 is a row by which a vertical recording type magnetic head is formed, and a state after lapping is performed is shown. A read part RD including a lead element is formed inside the row bar 100, and a write part WR including a write element is formed in the vicinity of the row bar 100. In the vertical recording type magnetic head, the distance D between the lead element and the light element is very small, for example, 6 m. In addition, high precision is required for the height dimension (MR-h: lead element height) of the lead element and the height dimension (NH: neck height) of the light element. In order to obtain the height dimension with such high precision, the processed surface 100a of the row bar 100 is polished by lapping as described above.

In the horizontal recording type magnetic head, high dimensional accuracy is required for the lead element height MR-h, but dimensional precision as high as the lead element height MR-h is not required for the neck height NH of the light element. Therefore, if polishing is finished at the time when the lead element height MR-h reaches a predetermined dimension while polishing the surface 100a by lapping, the neck height NH of the light element is also a predetermined dimension range. Was supposed to enter.

By the way, in the vertical recording type magnetic head, the neck height (NH) of the light element must also be high precision similarly to the dimensional accuracy of the lido element height (MR-h). When polishing is terminated when the lead element height MR-h becomes a predetermined dimension as in the conventional lapping method, the alignment direction of the lead element and the light element of the row bar 1 is inclined with respect to the wrapping half surface. If the lead element height MR-h is a predetermined dimension, the problem may arise that the neck height NH of the light element becomes longer or shorter by the inclination and does not become a predetermined dimension. The inclination of the row bar 100 at this time is the inclination (left-right direction in FIG. 1) of the short side direction of the row bar 100. As shown in FIG.

Therefore, in the case of processing a vertical recording type magnetic head, the inclination of the row bar should be adjusted. However, in the conventional lapping apparatus for the processing of the magnetic head, the inclination of the row bar is not a problem. There is no mechanism to adjust the tilt.

Here, in a grinding apparatus similar to a lapping apparatus, it is proposed to provide a detection means for detecting the inclination of a column that supports the grinding head movably in the column, and to detect and adjust the inclination of the column before processing (for example, a patent). See Document 1.). Moreover, in the polishing apparatus which grinds a free curved surface, it is proposed to vary polishing pressure according to the detection value of the inclination sensor provided in the polishing head (for example, refer patent document 2).

[Patent Document 1] Japanese Patent Application Laid-Open No. 11-207615

[Patent Document 2] Japanese Patent Application Laid-Open No. 2001-260020

The lapping apparatus for magnetic head processing employs a special mechanism and structure in order to raise the machining precision, and differs from the structure of a general lapping apparatus and a grinding apparatus. In particular, a swing mechanism or the like is provided in the mechanism for holding the low bar and pressing the lapping surface plate, which is very different from the structure of a general polishing apparatus. Therefore, the inclination adjustment mechanism and inclination sensor disclosed in patent documents 1 and 2 cannot be applied to the lapping apparatus for magnetic head processing as it is.

This invention is made | formed in view of the above-mentioned problem, and an object of this invention is to provide the lapping apparatus and the lapping method which can grind | work a workpiece with high precision.

In order to achieve the above object, according to the present invention, as a lapping method for lapping a workpiece, the workpiece is attached to the second support of the adapter such that the workpiece is in contact with the lapping surface of the lapping surface. And adjusting the inclination of the workpiece surface of the workpiece surface by adjusting the height of the first support portion of the adapter supported on the wrap base sliding the wrapping surface, and detecting the inclination of the adapter during the lapping process. A lapping method is provided, wherein the inclination of the surface to be processed is adjusted during lapping processing based on the detection result of the inclination.

In addition, according to the present invention, as a lapping method for lapping a workpiece, the workpiece is attached to the second support of the adapter so that the workpiece is in contact with the lapping surface of the lapping surface, and the lapping surface is attached. Adjusting the inclination of the workpiece surface of the workpiece by adjusting the height of the first support portion of the adapter supported on the sliding wrap base, detecting the inclination of the adapter during lapping, and based on the detection result of the inclination Thereby, a lapping method is provided, wherein the inclination of the surface to be processed is adjusted during lapping.

According to the present invention, it is possible to realize a lapping apparatus and a lapping method using the lapping apparatus, which can perform lapping processing of a complex head employed in a hard disk drive apparatus employing a vertical recording method with high accuracy.

First, a wrapping apparatus to which an embodiment of the present invention is applied will be described. 2 is a perspective view of the wrapping apparatus 1 to which an embodiment of the present invention is applied. 3 is a side view of the adapter 12 shown in FIG. 1. 4 is a perspective view of the adapter 12 shown in FIG. 3. 5 is a front view of the right and left correction mechanism 14 shown in FIG. 2. FIG. 6 is a side view of the bend correction mechanism provided in the lapping apparatus 1 shown in FIG. 2. FIG. 7 is an enlarged perspective view of the holder 1201 shown in FIG. 6.

The lapping apparatus 1 is a processing apparatus which wraps on the low bar 100 which is a to-be-processed object as final finishing of the low bar mentioned above. The lapping apparatus 1 includes a wrap base having a lapping surface 10 having a lapping surface on a top surface that is relatively moved with respect to the row bar 100, and a bottom surface member 111 having a support surface in contact with the lapping surface. 11 and an adapter 12 supported by the wrap base 11 at a predetermined support point 1210 (see FIG. 4). The adapter 12 has an arm portion 120 extending horizontally from the support point 1210 and extending downward from its tip, and a support portion 121 for rotatably supporting the arm portion 120 at the support point 1210 ( 1st support part). As shown in FIGS. 3 and 4, the holder 1201 is configured to be attachable to the arm portion 120 of the adapter 12. The holder 1201 is a member for supporting the row bar 100, and the row bar 100 is fixed to the holder 1201 by adhesion.

The portion to which the holder 1201 (that is, the row bar 100) is attached to the tip portion of the arm portion 120 corresponds to the second support portion of the adapter 12. Thus, in the adapter 12, the arm portion 120 is a portion extending between the first support portion 121 having the support point 1210 and the second support portion to which the holder 1210 is attached.

In addition, the support part 121 can move the row bar 100 close to the lapping table 10 or move the row bar 100 away from the lapping table 10 by rotating the arm unit 120. Rotation exercise equipment is installed. The arm portion 120 is rotated before the lapping is performed, the row bar 100 is attached to the holder 1201, and the arm portion 120 is rotated so that the row bar 100 is wrapped. ) Is set on the wrapping surface. Although not shown, the arm unit 120 is provided with a resistance detection probe for detecting the resistance value of the above-described resistance element for the light element and the resistance value of the resistance element for the lead element.

In the lapping apparatus 1, the wrap base 11 is supported by the wrap base support 13 (refer FIG. 2) so that rotational movement and oscillation are possible. Even if the axis of rotation is slightly changed while the lapping table 10 is rotating, the processed surface (grinded surface) 100a of the row bar 100 supported by the adapter 12 is the lapping surface of the lapping table 10. The parallelism between the surface 100a to be processed and the wrapping surface of the wrapping plate is always maintained.

Moreover, the lapping apparatus 1 is provided with the load adjustment mechanism 14 which adjusts the lapping load of the row bar 100 by pressing the arm part 120 from the top. When the lapping load is applied to the row bar 100 via the adapter 12 by the load adjusting mechanism 14, the workpiece surface 100a of the row bar 100 is securely attached to the wrapping surface of the lapping surface 10. In contact, stable lapping is performed. As shown in FIG. 5, the load adjusting mechanism 14 includes three actuators 141 to 143 arranged in a direction orthogonal to the direction in which the arm portion 120 extends, whereby the row bar being wrapped ( It is possible to correct the inclination, that is, the right and left difference in the long side direction of 100).

In addition, in the lapping apparatus 1, when the row bar 100 is bent or warped in consideration of the fact that the row bar 100 has a long shape as shown in FIG. 4, the bending or warpage can be corrected. The bend correction mechanism shown in FIG. 6 is provided. 7 is an enlarged perspective view of the holder 1201 shown in FIG.

The bend correction mechanism 15 shown in FIG. 6 inserts the link members 36 and 38 into the plurality of holes 1201h provided in the holder 1201, and inserts the link members 36 and 38 into the holes 1201. By pressing the inner surface of the holder 1201 to deform, the partial warpage and the bend at the surface 100a of the row bar 100 are corrected.

In the wrapping apparatus 1 having the above configuration, the holder 1201 with the row bar 100 is attached to the tip of the arm portion 120 of the adapter 12. The arm part 120 is rotated about the support part 121 (refer FIG. 3), and the to-be-processed surface 100a of the row bar 100 is arrange | positioned in the position which opposes the lapping surface of the lapping surface 10. FIG. .

When the lapping load is applied from the arm portion 120 by the above-described load adjusting mechanism 14, the workpiece surface 100a of the row bar 100 contacts the lapping surface of the lapping surface plate 10, and a suitable pressing force is applied. The wrapping can be performed while adding.

While the lapping table 10 is rotated and lapping is performed on the row bar 100, the above-described load adjusting mechanism 14 plays the role of the right and left correction mechanism, and the long side direction of the row bar 100 always remains. It is adjusted to be parallel to the wrapping surface of the lapping surface 10 so that the bend or warp of the row bar 100 is corrected by the above-described bend correction mechanism.

In addition, as described above, the wrap base 11 is rotatable and supported by the wrap base support 13 of the wrapping apparatus 1 to be swingable, and the workpiece surface 100a of the row bar 100 is supported. Is always configured to follow the lapping surface of the lapping surface 10. Thereby, even if lapping progresses and the cross-sectional shape of the row bar 100 changes, the processing surface 100a of the row bar 110 is adjusted so that it will always be parallel with the wrapping surface of the lapping surface 10. The lapping is performed with high accuracy.

Here, as described above with reference to FIG. 1, in the head of the vertical recording method, the height of the magnetic domain is reduced, so that not only the dimension called MR-h, which is the element dimension of the lead element, but also the neck height, which is the element dimension of the light element. Strict dimensional accuracy is also imposed on the dimension called. For this reason, the short side direction (the direction in which the lead element and the light element are arranged) of the processed surface 100a of the row bar 100 (composite magnetic head) shown in FIG. 1 is wrapped in the lapping surface 10. Since it is not allowed to tilt the surface, it becomes difficult to wrap the composite magnetic head used in the hard disk drive apparatus employing the vertical recording method in the above-mentioned lapping apparatus 1.

Therefore, according to one Embodiment of this invention, the height adjustment mechanism and the inclination detector are provided in the adapter 12 shown in FIG. 8 is a cross-sectional view of the adapter 12a provided with a tilt mechanism 16 serving as a height adjusting mechanism and a tilt sensor 18 serving as a tilt detector.

As shown in FIG. 8, the tilt mechanism 16 has a linear actuator 130 and a pivot PB. The pivot PB is provided on the wrap base 11 and supports the support point 1210a (point on the direct actuator 130) of the adapter 12a. The linear actuator 130 is an actuator having a body and a rod in which an extending amount from the body is adjusted in accordance with a control signal. The body of the linear actuator 130 is fixed to the arm portion 120a, and the rod tip of the linear actuator 130 is in contact with the pivot PB so that the height of the support point 1210a is finely adjusted according to the feeding amount of the rod. In addition, in this example, the linear actuator 130 of Chiba Precision Co., Ltd. MSD-23D23H10 (resolution 1 micrometer, stroke 10 mm) is used.

Before the lapping starts, the stroke amount of the linear actuator 130 is determined and fixed so that the processed surface 100a of the row bar 100 and the lapping surface of the lapping surface 10 are parallel to each other by a method using an optical flat. . When the linear actuator 130 is operated from this fixed state and the rod is extended to raise the height of the support point 1201a by 200 μm, the lead element RD and the light element WR arranged in the short side direction in the row bar 100 are arranged. The difference in height can be within 10 nm. Since the linear actuator 130 can adjust 1 µm as the minimum resolution, the parallelism between the lead element RD and the light element WR can be increased up to a difference of a height of at least 0.05 nm.

Thus, the tilt mechanism 16 is a height adjustment mechanism which adjusts the height of the 2nd support part of the adapter 12a, and adjusts the height (distance from the wrapping surface) of the 1st support part 121a which has the support point 1201a. By adjusting, the inclination of the adapter 12a with respect to the wrapping surface can be adjusted. By adjusting the inclination of the adapter 12a, the inclination in the short side direction of the row bar 100 attached to the second support portion of the adapter can be adjusted.

The inclination sensor 18 is provided in the vicinity of the part which attaches the holder 1201a of the arm part 120a (namely, the 2nd support part of the adapter 12a). The inclination sensor 18 is a sensor which detects the inclination of the adapter 12a (the direction shown by an arrow in the figure), ie, the inclination of the short side direction of the row bar 100 fixed to the holder 1201. The inclination of the adapter 12a can be adjusted during lapping by using the inclination detection value output from the inclination sensor 18.

That is, even if the tilt of the row bar 100 is adjusted by the tilt mechanism 16 before the lapping starts, when the lapping proceeds, the row bar 100 is shortened, but the row bar 100 is inclined slightly. Throw it away. Based on the inclination detection value of the inclination sensor 18, the linear actuator 130 is driven during lapping to adjust the inclination of the arm portion 120a, whereby the inclination of the row bar 100 can be adjusted more precisely. Therefore, with the configuration shown in Fig. 8, the inclination of the short side direction shown in Fig. 1 is precisely adjusted by the linear actuator 130, so that the height dimension can be adjusted with high accuracy in both the lead element and the light element. .

Here, the inclination sensor 18 is demonstrated. Since the inclination sensor 18 needs to be small and have high resolution, it is preferable to use a magnetoresistive element type inclination angle sensor. The magnetoresistive element type tilt angle sensor has a structure in which a weight made of a magnet is supported by a leaf spring in damper oil. When the sensor itself is inclined, the magnet is displaced by gravity, and the magnet displacement can be detected by the magnetoresistive element. Since this displacement amount is proportional to the inclination angle of the sensor itself, the inclination angle can be detected with good accuracy.

By the way, when the inclination sensor 18 is attached to the vicinity of the tip of the arm part 120a, the rocking motion of the arm part 120a acts on the inclination sensor 18, and the inclination cannot be detected with good precision. That is, since the inertia force acts on the weight of the magnetoresistive element tilt angle sensor by the swinging motion of the arm part 120a, the displacement is included in the displacement amount due to the original inclination.

Here, the rocking motion of the arm part 120a is demonstrated, referring FIG. 9 and FIG. 9 is a plan view of the adapter 12a viewed from above. In lapping by the lapping apparatus, since the workpiece surface 100a of the row bar 100 is uniformly wrapped, the adapter 12a is configured to perform two rocking motions of simple rocking and swing rocking. The adapter 12a is moved to a substantially eight-shape by combining two swinging motions while rotating the lapping table 10, thereby uniformly wrapping the entire work surface 100a of the row bar 100.

Simple swinging is a reciprocating swinging movement with a relatively large radius of rotation, the swinging center of which is located on an extension of the long side axis of the adapter 12a. Therefore, the inertial force due to the simple rocking motion acts on the tilt sensor 18. The swing swing is a reciprocating swing movement using the center of the row bar 100 as the swing swing center, and is a reciprocating swing movement of a cycle shorter than a simple swing. Therefore, the inertial force due to the swinging swing acts on the tilt sensor 18. The direction of this inertial force becomes a direction which displaces the weight of the inclination sensor 18. A rocking motion that combines simple rocking and swing rocking is called compound rocking.

FIG. 10 is a diagram illustrating a compound swing of the row bar 100 during lapping. The arrows in FIG. 10 respectively show the directions of rotation of the lapping table, the direction of simple rocking, and the direction of swing rocking. The swing oscillation makes two round trips while the simple swing makes one round trip.

In order to eliminate the influence of the inertial force acting on the tilt sensor 18 by the above-described compound rocking, as shown in FIG. 9, two tilt sensors 18 are provided at positions symmetrically. By providing the two inclination sensors 18 in this way, the influence of the compound rocking motion is caused by the inclination in the opposite direction from the left and right inclination sensors 18, so that the sum of the outputs of the two inclination sensors 18 is obtained. As a result, the inclination due to the complex fluctuation can be offset.

Fig. 11 shows the variation in the output (detection angle) due to swing swing when two tilt sensors 18 (referred to as sensor 1 and sensor 2) are disposed at positions symmetrical with respect to the center of swing swing. This is a waveform diagram. Since inertial forces in the opposite directions act on the sensor 1 and the sensor 2, as shown in FIG. Therefore, when the sum of these outputs is taken, the fluctuation in the output (detection angle) due to the swing fluctuation can be completely canceled. Although it is preferable to arrange | position two inclination sensors 18 on the stop shaft of turning oscillation, when such arrangement is difficult, what is necessary is just to arrange two inclination sensors 18 in the position which is point symmetric with respect to the center of a turning oscillation. . In this case, the correct angle detection value can be obtained by adding an offset amount to the angle detection value obtained from the sum of the two outputs.

12 is a waveform diagram obtained by plotting the outputs from the two tilt sensors 18 during the actual lapping process. The inclination sensor 18 of one left and right was made into the sensor 1, and the other was made into the sensor 2, and the output (tilt angle) from each of the sensors 1 and 2 was measured. The measurement interval was 0.1 second. In addition, the rotational swing was about 1.35 seconds, and the simple swing was about 2.7 seconds.

In the figure, the compound rocking motion is rocking when both simple rocking and swing rocking are performed, and the rocking motion shown in FIG. While performing the compound rocking, the output (tilt angle) from the sensor 1 and the sensor 2 was largely about +/- 0.1 degree, and if it was only simple rocking, the output from the sensor 1 and the sensor 2 was about +/- 0.02 degree small. This indicates that the influence of the swinging motion is larger than the simple swing.

In FIG. 11, the indicated value is a value when the influence of the swinging motion is canceled among the outputs from the sensors 1 and 2, and can be said to represent a true slope. As the lapping progresses, the height of the row bar 100 decreases and the inclination of the arm portion 120a increases, so that the indicated value gradually increases in the negative direction. The negative direction is the direction in which the right side (namely, the second support part) of the arm part 120a descends, and shows the direction in which the row bar 100 is inclined to the right side when seen in FIG. In the present embodiment, by taking the average value of the sum of the outputs of the two inclination sensors and further filtering by software, the inclination can be detected with an accuracy of ± 0.01 °.

FIG. 13 is a waveform diagram showing an enlarged time axis of a waveform during complex fluctuation of the waveform diagram in FIG. 12. During the combined motion, the outputs of the sensor 1 and the sensor 2 are shaken alternately on the plus side and the minus side, and shaken on the opposite sides. Therefore, one peak of the sensor 1 in the waveform is canceled from the mountain shaking to the opposite side of the sensor 2, and approximately the center of the outputs of the sensor 1 and the sensor 2 become the indicated value. In this example, the sum of the output of the sensor 1 and the output of the sensor 2 is obtained, the average value (the value of 1/2) is obtained, and the value obtained by averaging the value along the time axis is used as the indicated value.

FIG. 14 is a waveform diagram showing an enlarged time axis of a waveform during simple fluctuation of the waveform diagram in FIG. 12. In the case of only simple fluctuations, the sensor 1 is slightly shaken to the negative side, and the output of the sensor 2 is slightly shaken to the positive side. Also in this case, the sum of the output of the sensor 1 and the output of the sensor 2 is obtained, the average value (the value of 1/2) is obtained, and the value obtained by averaging the value along the time axis is used as the indicated value.

As described above, the inclination of the row bar 100 can be easily obtained by providing two inclination sensors 18 at positions left and right symmetrically and obtaining the inclination angle from these outputs, and the inclination detected during the lapping process. By feeding back to the tilt control, the inclination of the workpiece surface 100a of the row bar 100 can be adjusted more precisely.

In addition, in the automatic processing of the row bar 100, when the row bar 100 is automatically in contact with the wrapping surface of the lapping surface 10, the inclination sensor 18 detects the inclination, and the inclination is 0 ° ±. Operate the linear actuator 130 to be 0.01 °. Thereby, the to-be-processed surface 100a of the row bar 100 becomes parallel with high accuracy with respect to the lapping surface. Thereafter, the rotation of the lapping table 10 and the oscillating motion of the adapter 12 are eliminated, thereby eliminating the problem of scratching the lapping table 10 by the edge of the row bar 100, so that a stable lapping process can be started. have.

Next, the whole structure of an example of the lapping processing apparatus containing the lapping apparatus 1 is demonstrated, referring FIG. 15 is a schematic perspective view of an entire lapping apparatus including a lapping apparatus.

The lapping processing apparatus 200 shown in FIG. 15 includes a control unit 210 including a control computer, a lapping machine 220, and two mechanism parts 240-1 and 240-2. The lapping machine 220 has a lapping surface 222 (corresponding to the lapping surface 10 in FIG. 2) having a lapping surface. Mechanism parts 240-1 and 240-2 are disposed on both sides of the lapping surface plate 222. Each of the mechanism parts 240-1 and 240-2 corresponds to the mechanism part shown in FIG. 2, and each has an adapter 12a shown in FIG. 8. Each of the mechanism portions 240-1 and 240-2 can be disposed on the wrapping plate 222 by turning the adapter 12a with the row bar 100 attached thereto. The two mechanism parts are provided in order to improve productivity by lapping two row bars 100 simultaneously. The wrapping device is configured by the mechanisms 240-1 and 240-2 and the lapping machine 220, respectively.

FIG. 16 is a functional block diagram of the wrapping apparatus shown in FIG. 15. The control device 1000a provided in the control unit 210 includes a CPU 1001a, and the CPU 1001a executes processing in accordance with a processing sequence of a program stored in the memory 1002a, and controls each control unit. A command is sent and each control part drives each adjustment mechanism.

In the control apparatus 1000a, the common mechanism control part for controlling the drive of the motor which rotates the lapping table 222 of the lapping machine 220, and flowing the slurry liquid which is a polishing liquid on the lapping table 222 ( 1003a) is provided. The common mechanism control unit 1003a is provided with a driver for driving a motor in the surface rotating mechanism 170, a drive unit for driving a solenoid valve in the slurry switching mechanism 160, and the like. When a command is given to the driver or the drive of the common mechanism control unit 1003a from the CPU 1001a, the motor of the surface rotating mechanism 170 rotates, the wrapping surface 222 rotates, and the solenoid valve of the slurry switching mechanism 160 is rotated. Is opened to allow the slurry liquid to flow onto the lapping table 222 to start lapping.

In this way, if the lapping surface plate 222 starts to rotate and lapping of the row bar 100 is started, under the control of the CPU 1001a, the ELG resistance meter 1003a and the resistance element for the lead element in the row bar 100 are used. Detection of the resistance values of both the resistance elements for the write elements is started.

The CPU 1001a in the control apparatus 1000a causes the noise abnormal value removing unit 1004a in the wrapping apparatus to remove noise or the like at the time of detection. The correct resistance value of each resistance element provided in each of the plurality of hybrid magnetic heads arranged in the row bar 100 is sequentially detected, and the bar shape is formed by image processing based on a program in the memory 1002a. Generation begins. Based on the result of the generation of the bar shape, the CPU 1001a sends a command to the left and right correction control unit 1005a and adjusts the left and right difference in the long side direction of the row bar 100 to the left and right correction mechanism 14. Let's do it. In addition, the CPU 1001a sends a command to the bend control unit 1007a to cause the bend mechanism (see FIG. 6) to adjust the bending, warping, or bending of the row bar 100. Further, the CPU 1001a instructs the tilt control unit 1006a to cause the tilt mechanism 16 to adjust the inclination angle in the short side direction of the row bar.

Tilt measurement values from two tilt sensors 18 are input to the tilt control unit 1006a. The tilt control unit 1006a performs feedback control based on the inclination measurement value from the inclination sensor, drives the tilt mechanism 16 to adjust the inclination of the row bar 100.

Next, the lapping processing performed using the lapping processing apparatus mentioned above is demonstrated. Before automatically processing the row bar 100, the tilt sensor 18 is calibrated in advance. First, the master bar serving as the height reference of the row bar 100 is attached to the holder 1201, and the linear actuator 130 is driven while watching the interference pattern on the optical flat to increase the height of the support part 121a of the adapter 12a. Adjust Specifically, on the calibration screen of the control unit 210, the linear actuator 130 is jog-operated to make the position where the interference fringe is maximized as the origin of the actuator position.

Next, the tilt sensor 18 is calibrated in the procedure shown in the flowchart shown in FIG. Calibration is done for each of the tilt sensors 18.

First, in step S110, the operation screen of the lapping processing apparatus is switched to the manual mode. Next, in step 111, the master bar is attached to the adapter 12a of the mechanism portion 240-1 (240-2), and then the mechanism portion 240-1 (240-2) is placed on the wrapping plate 222. Thus, the master bar is brought into contact with (lapping) the lapping surface plate 222.

If the loading of the master bar is finished, in step S112, the load adjusting mechanism 14 is driven to set the wrapping load as the load to be applied during the actual processing. Next, in step S113, the tilt angle calibration button is pressed. Then, in step S114, the controller waits for 2 seconds to elapse while pressing the calibration button. Subsequently, in step S115, the output from the tilt sensor 18 is acquired at intervals of 0.1 seconds. Subsequently, in step S116, the moving average is calculated from the 10 consecutive output data. In addition, in step S117, 100 moving average values are calculated, and this value is set as an offset value. In step S118, the measured value of the tilt sensor 18 is set to the value obtained by subtracting the offset value obtained as described above, and the calibration process ends.

The above calibration process is performed separately for each of the two inclination sensors 18. The inclination angle after calibration becomes the average value of the measured values by the two inclination sensors 18.

If the calibration of the tilt sensor 18 is finished, the process moves to the automatic processing of the row bar 100. As a preparation step of automatic processing, a row bar number is input to the control unit 210 through a dedicated screen of the control unit 210. 18 is a diagram illustrating an example of the dedicated screen. When the wafer number and row bar address are input, information about the row bar is obtained from the data server, and a series of processing sequences and set inclination angles are immediately reflected. "Tilt Angle" on the screen of FIG. 18 is a value input from a database, but manual input is also possible on this screen. The minimum set value of the inclination angle is 0.01 °.

In the above-described example, manual input by an operator is used. However, in consideration of prevention of input mistake and reduction of the number of steps, the input of wafer number and row bar number by barcode may be performed.

The row bar to be processed is actually a block in which a plurality of row bars are overlapped. For example, in a femto slider, one block is formed by up to eight row bars. For this reason, it is necessary to adjust the height according to the number of row bars included in one block. 19 is a diagram illustrating an offset value of a height corresponding to the number of row bars included in one block. In FIG. 19, the thickness of the block Stack 8 which consists of eight row bars used as the maximum thickness (height) is taken as the reference | standard.

The number of stacks (the number of row bars in a block) is also included in the information (stack information) about row bars acquired from the data server, and stack information is automatically obtained from the data server when a row bar number is input.

Next, the lapping processing of the row bar in the automatic machining will be described with reference to FIG. 20. 20 is a flowchart of lapping processing.

When carrying out the lapping process of the row bar 100, an operator attaches the row bar 100 which performs lapping process to the mechanism part 240-1 (240-2). Then, after the operator performs a preparation operation such as the calibration of the tilt sensor 18 described above, the operator presses the auto start button to start the automatic processing.

When automatic machining is started, first, height adjustment in accordance with the number of stacks is performed in step S200. Specifically, the linear actuator 130 which is a tilt actuator is operated by the offset amount shown in FIG. Next, the mechanism portion 240-1 (240-2) is moved onto the lapping surface plate 222 in step S201, and the mechanism portion 240-1 (240-2) is loaded onto the lapping surface plate 222 in step S202. . Thereafter, the adapter 12a to which the row bar 100 is attached is gently placed on the lapping surface 222 (soft landing).

FIG. 21 is a diagram illustrating an operation of soft landing the row bar 100 on the lapping surface 222. The arm portion 121A side of the adapter 12a is lifted up by rotating upward with the support portion 121a as the point by driving the air cylinder 30, and the mechanism portion 240-1 (240-2) is wrapped. After being loaded in 222, the air cylinder 30 is driven to lower the arm portion 121a of the adapter 12a and the row bar 100 is quietly placed on the lapping surface 222. FIG. 22 shows a row bar 100 resting on the wrapping plate 222.

If the mechanism portion 240-1 (240-2) is loaded in step S202, it is subsequently determined whether or not the loading is correctly performed in step S203. The determination of the loading is performed by whether the lower limit sensor is ON or OFF. If the lower limit sensor is OFF, the determination is repeated until it is turned ON. If the lower limit sensor is turned on, in step S204, the process of measuring the tilt sensor 18 is started after applying the processing pressure to the row bar 100. At this time, in step S205, the elapse of the predetermined time is waited until the output of the tilt sensor 18 is stabilized. In this example, the predetermined time is 2 seconds.

Subsequently, in step S206, the angle measurement by the tilt sensor 18 is performed, and it is determined whether the angle is in the range of 0 ± 0.01 °. If it is out of the range, the process proceeds to step S207, in which the tilt actuator (direct actuator 130) is operated to fine-tune the angle. If the angle is in the range of 0 ± 0.01 °, the process proceeds to step S208 and waits for a predetermined time to elapse. In this example, the predetermined time is 0.5 seconds.

The above process is a loading process, and the process then proceeds to the present process. If 0.5 second has elapsed in step S208, the polishing liquid is supplied in step S209, and the lapping surface plate 222 is rotated at low speed in step S210. Then, in step S211, the compound swing (see Fig. 10) of the row bar 100 (adapter 12a) is started. As a result, the compound rocking is performed while the low bar 100 is pressed against the wrapping plate 222 that rotates at low speed, and the processed surface 100a of the low bar 100 is polished. This processing is referred to as processing 1.

In step S222, it is determined whether the machining process 1 has ended. If the machining process 1 has ended, the process proceeds to step S223 to increase the rotational speed of the lapping table. In step S224, the processing pressure applied to the row bar 100 is increased to continue processing. This processing is referred to as processing 2.

Subsequently, in step S225, it is determined whether or not the machining process 2 is finished. If the processing 2 has ended, the processing proceeds to step S226, in which the polishing liquid is switched to the finishing polishing liquid to continue the processing. This processing is referred to as processing 3. Subsequently, in step S227, it is determined whether or not the machining process 3 is finished. If the machining process 3 is complete | finished, a process progresses to step S228 and makes the rotational speed of the lapping surface plate 222 medium speed. In step S229, the processing pressure is reduced to continue the processing. This processing is referred to as processing 4.

Subsequently, in step S230, it is determined whether or not the machining process 4 is finished. If the machining process 4 is complete | finished, a process progresses to step S231 and makes the rotational speed of the lapping base plate 222 low speed. In step S232, the swing swing is stopped, and only a simple swing is obtained.

Subsequently, in step S233, it is determined whether or not the average value of the lead element height MR-h in the row bar 100 has become the target dimension. If the average value of the lead element height MR-h is not the target dimension, the processing is continued as it is. When the average value of the lead element height MR-h reaches the target dimension, the process proceeds to step 234 to start the unloading process.

In the unloading process, the rotation of the lapping surface plate 222 is stopped at step 235, and the swinging of the row bar 100 is stopped. Subsequently, in step S236, the supply of the polishing liquid is stopped. Then, in step 237, the adapter 12a is lifted so that the row bar 100 is spaced apart from the lapping surface plate 222, and then the mechanism portion 240-1 (240-2) is moved to the retracted position, and the processing is Quit.

Next, the processing control of the row bar in the above-mentioned processing process is demonstrated. During the processing of the row bar 100, the resistances of the plurality of ELG elements embedded in the row bar 100 are measured. The left-right difference correction, the bending correction, and the slope correction are performed so that the shape of the processed surface 100a of the row bar 100 obtained by converting this measured value into the element height is straightened.

FIG. 23 is a diagram showing a transition of a shape change state when the row bar 100 is wrapped by each control unit provided in the control unit 1001a shown in FIG. 16.

On the right side of FIG. 23, before adjustment is performed by the right and left correction mechanism 14, the bend correction mechanism 15, and the tilt mechanism 16 under the control of each control unit, and after the correction is performed by any one mechanism, Side views in the short side direction of the row bar 100 are respectively shown.

As shown by the curve on the upper left, the shape of the long side direction of the row bar 100 before the lapping is not straight but is a curved surface protruding from the center. At the end of the lapping process, it is straight in the long side direction and inclined so as to obtain a desired height in the short side direction.

First, the CPU 1001a of the control device 1000a detects the shape of the workpiece surface 100a of the row bar 100 from the resistance value for the lead element detected by the ELG resistance measuring instrument 150 when the lapping process is started. The bar-shaped image of the uppermost part of FIG. 23 is created. On the right side of the upper bar shape in FIG. 23, the shape of the processed surface 100a of the row bar 100 before wrapping is shown.

The control apparatus 1000a first sends a command to the right and left correction controller 1005a to cause the left and right correction mechanism 14 to adjust the inclination of the long side direction of the row bar 100. This eliminates the inclination of the row bar 100 in the long side direction and results in a second bar shape from the top of FIG. 23. Subsequently, the control device 1000a sends a command to the bend control unit 1007a to cause the bend correction mechanism 15 to adjust the bending and warping. As a result, as shown in the third bar shape from above, the bending and the warping of the processed surface 100a of the row bar 100 are corrected. Simultaneously with this, the control apparatus 1000a also sends a command to the tilt control part 1006a, and makes the tilt mechanism 16 adjust the inclination angle. At this time, the inclination angle is adjusted based on the output from the inclination sensor 18 described above.

After the bar shape in the long side direction is straightened like the third shape from above, left and right tilt control, bend control, and tilt control are performed until the lead element WR height MR-h becomes the target dimension. As the lapping process proceeds, as shown in the bottom of FIG. 23, the surface to be processed 100a becomes flat and is inclined appropriately in the short side direction so that the height dimension of both the lead element RD and the light element WR is increased. Is finished to the adjusted shape.

Here, the tilt control will be described with reference to FIG. 24 is a flowchart of the tilt control process.

The tilt control is independent of the left and right control and the bend control, and the tilt angle is finely adjusted in units of 0.001 ° every 3 seconds. When the tilt control is started, first, in step S300, it is determined whether the row bar is being wrapped. If it is not during the lapping process, the process is terminated as it is. In the case of lapping, the process proceeds to step S301.

In step 301, it is determined whether the inclination angle detected by the inclination sensor 18 is equal to the designated angle. If the detected inclination angle is equal to the designated angle, the lapping processing is continued as it is, and the flow returns to step S300. If the detected inclination angle is not equal to the designated angle, the process proceeds to step S302, and the tilt mechanism 16 is driven to adjust the inclination of the row bar such that the inclination angle is close to the specified angle. Next, in step S303, elapse of a predetermined time is waited. In this example, the predetermined time is 3 seconds. In step S304, the tilt amount at that point is maintained and the tilt control ends.

In this example, the specific angle is increased by a constant minute angle. However, in order to suppress the effect of the lapping rate variation, it may be increased by a constant minute angle for each constant polishing amount.

In addition, according to the progress data (machining time or conversion element height), whether or not the tilt control is performed, the amount of adjustment of the tilt angle, and the update timing (time or amount of machining) of the tilt angle are included in the sequence data that can be selected or set. The tilt control may be performed based on this.

In addition, when an abnormal value such as the average value of the detected values by the two inclination sensors becomes overrange continues for a predetermined time, it is determined that the supply of the polishing liquid is insufficient or that the mechanisms 240-1 and 240-2 are abnormal. It is also possible to immediately stop the operation of the lapping table 222 and the mechanisms 240-1 and 240-2 to finish the lapping process. This is because, if such a state continues, an obstacle may occur in the lapping surface plate 222 or the mechanism portions 240-1 and 240-2.

In addition, in this embodiment, the contact angle with respect to the lapping surface of the wrapping surface of the row bar 100 is set by the linear actuator 130 which comprises the tilt mechanism 16 every 3 second. The following adjustment amount adjusts step by step. By making it possible to adjust to a fine resolution in this way, lapping can be performed so that both the lead element RD and the light element WR in the to-be-processed surface 100a may be parallel to the lapping surface of a lapping surface without limit. . Further, if the tilt angle can be adjusted by the tilt mechanism 16 in this manner, stable lapping can be performed without damaging the lapping surface.

In addition, in order not to damage the lapping surface plate 222, the working pressure applied to the row bar 100 by the load adjustment mechanism 14 is once reduced, and then the tilt mechanism 16 is operated to incline the inclination angle. It is desirable to adjust. In order not to further damage the lapping surface plate 222, when adjusting the contact angle by the tilt mechanism 16, the driver in the common mechanism control unit 1003a is instructed to lower the rotational speed of the motor in the surface rotation mechanism. The rotation of the motor may be stopped.

In the present embodiment, the magnetoresistive element type inclination angle sensor is used as the inclination sensor 18, but in addition, a laser goniometer, a compass sensor, a potentiometer, a linear scale (the difference in height between two points, etc.) may be used.

As explained above, according to this embodiment, the lapping apparatus and lapping apparatus which can perform lapping processing of the composite head employ | adopted to the hard disk drive apparatus which employ | adopted the vertical recording system with high precision, adjusting the inclination of a grinding | polishing surface The wrapping method used can be realized.

This specification discloses the following invention.

(Book 1)

A lapping apparatus for lapping a workpiece,

A lapping surface having a lapping surface to which the workpiece surface of the workpiece is in contact with,

A wrap base having a support surface supported in contact with the lapping surface,

A first support portion supported by the wrap base, a second support portion to which the workpiece is attached so that the workpiece surface is in contact with the wrapping surface, and an extension between the first support portion and the second support portion Adapter including arm part becoming,

A height adjustment mechanism for changing a height from the wrapping surface to the first support portion of the adapter;

Tilt detector installed in the adapter and detecting the tilt of the adapter

Including;

And the inclination of the adapter with respect to the wrapping surface is adjusted by adjusting the height of the first supporting portion by the height adjusting mechanism.

(Supplementary Note 2)

A lapping apparatus according to Appendix 1, wherein the inclination detector comprises two inclination sensors disposed at positions symmetrical with respect to the center of the pivotal swing of the workpiece.

(Supplementary Note 3)

The wrapping apparatus according to Appendix 2, wherein each of the inclination sensors is a magnetoresistive element type inclination sensor.

(Appendix 4)

The wrapping apparatus according to Appendix 3, wherein the inclination sensor is provided near the position where the workpiece is attached to the second supporting portion.

(Supplementary Note 5)

A wrapping apparatus according to Appendix 1, wherein the workpiece is attached to the adapter such that the short side direction of the shape of the workpiece surface corresponds to the extension direction of the arm portion of the adapter,

The inclination of the short side direction of the to-be-processed object is adjusted by height adjustment by the said height adjustment mechanism, The lapping apparatus characterized by the above-mentioned.

(Supplementary Note 6)

A wrapping apparatus according to Appendix 1, wherein the height adjustment mechanism includes a pivot provided on the wrap base and a linear actuator provided on the first support portion of the adapter, wherein the linear actuator is in contact with and supported by the pivot. Lapping apparatus characterized by the above.

(Appendix 7)

A wrapping apparatus according to Appendix 1, further comprising: a right and left correction mechanism for correcting the inclination of the long side direction of the workpiece attached to the second support portion;

The right and left correction mechanism is composed of a plurality of actuators arranged in the long side direction of the workpiece, which presses the arm portion from above, and by partially pressing the portion to which the workpiece is attached, the long side direction of the workpiece Lapping apparatus, characterized in that to correct the slope of.

(Appendix 8)

A wrapping apparatus according to Appendix 1, comprising a holder to which the workpiece is fixed, the holder being attached to the second support portion such that the workpiece is in contact with the wrapping surface while being supported by the second support portion. ,

And a bend correction mechanism for correcting bending in the long side direction of the workpiece by partially pressing the holder along the long side direction of the workpiece.

(Appendix 9)

A lapping method for lapping a workpiece, the workpiece being attached to the second support of the adapter such that the workpiece surface contacts the lapping surface of the lapping surface,

Adjusting the inclination of the work surface of the workpiece by adjusting the height of the first support portion of the adapter supported on the wrap base that slides the wrapping surface,

The inclination of the said adapter is detected during a lapping process, and the inclination of the to-be-processed surface is adjusted during a lapping process based on the detection result of the inclination.

(Book 10)

A lapping method according to Appendix 9, wherein the inclination of the surface to be processed is adjusted during lapping by adjusting the height of the first support part based on a detection result of the inclination of the adapter.

(Appendix 11)

A wrapping method according to note 9, wherein the inclination of the adapter is detected at the second support of the adapter.

(Appendix 12)

A lapping method according to Appendix 9, wherein lapping is performed while rocking the workpiece by rocking the adapter,

And inclination at the two points symmetrical with respect to the center of the swing at the second support, and obtaining the inclination of the adapter based on the inclination detection values of the two points.

(Appendix 13)

A wrapping method according to Appendix 12, wherein the slope of the adapter is obtained by averaging the sum of the slope detection values of the two points.

(Book 14)

A wrapping method according to Appendix 9, wherein the height of the first support portion is adjusted by a height corresponding to an inclination angle of 0.001 ° or less of the adapter.

(Supplementary Note 15)

A lapping method according to Appendix 9, wherein during lapping, after correcting the inclination of the long side of the workpiece, the bend of the long side of the workpiece is corrected and the inclination of the workpiece is corrected. Lapping method characterized in that the modification.

(Appendix 16)

The lapping method according to Appendix 9, wherein the lapping load is reduced once when the inclination of the workpiece surface is corrected.

(Appendix 17)

The lapping method according to Appendix 9, wherein the rotational speed of the lapping surface is reduced once or stopped once when the inclination of the workpiece surface is corrected.

(Supplementary Note 18)

A magnetic head processing method comprising lapping a magnetic head having a reading element and a recording element by the lapping method according to Appendix 9.

BRIEF DESCRIPTION OF THE DRAWINGS The figure which shows the row bar by which lapping process is performed.

Figure 2 is a perspective view of the wrapping apparatus to which the present invention is applied.

3 is a side view of the adapter shown in FIG.

4 is a perspective view of the adapter shown in FIG.

5 is a front view of the right and left correction mechanism shown in FIG.

FIG. 6 is a side view of the bend correction mechanism installed in the wrapping device shown in FIG. 2. FIG.

FIG. 7 is an enlarged perspective view of the holder shown in FIG. 6. FIG.

Fig. 8 is a sectional view of the adapter in which the tilt mechanism and the tilt sensor are installed.

9 is a plan view from above of the adapter shown in FIG. 8;

10 is a diagram illustrating a motion of a row bar during lapping.

FIG. 11 is a waveform diagram showing variation in output (detection angle) due to swing fluctuations when two tilt sensors are disposed at positions symmetrical with respect to the center of swing fluctuations. FIG.

Fig. 12 is a waveform diagram obtained by plotting outputs from two tilt sensors during actual lapping.

FIG. 13 is a waveform diagram showing an enlarged time axis of a waveform during complex fluctuation of the waveform diagram in FIG. 12. FIG.

FIG. 14 is a waveform diagram showing enlarged time axes of waveforms during simple fluctuations of the waveform diagram in FIG. 12; FIG.

15 is a schematic perspective view of an entire lapping apparatus including a lapping apparatus.

FIG. 16 is a functional block diagram of the lapping processing apparatus shown in FIG. 15. FIG.

Fig. 17 is a flowchart of the calibration process of the tilt sensor.

18 is a diagram illustrating an example of a dedicated screen;

19 is a diagram illustrating an offset value of a height corresponding to the number of row bars included in one block.

20 is a flowchart of a lapping machining process.

FIG. 21 is a view showing an operation of soft landing a row bar onto a wrapping plate; FIG.

FIG. 22 shows a row bar lying on a wrapping plate; FIG.

FIG. 23 is a diagram showing a transition of a shape change state when a row bar is wrapped by each control unit provided in the control unit shown in FIG. 16; FIG.

24 is a flowchart of the tilt control process.

<Description of the code>

10, 222 lapping surface plate

11: wrap base

12, 12a: adapter

13: base support

14: load adjustment mechanism

15: Bend Correction Mechanism

16: tilt mechanism

18: tilt sensor

100: low bar

100a: surface to be processed

120, 120a: arm part

121, 121a: support portion

1201: holder

1201, 1201a: Support Point

Claims (10)

A lapping apparatus for lapping a workpiece, A lapping surface having a lapping surface to which the workpiece surface of the workpiece is in contact with; A wrap base having a support surface in contact with and supported by the wrapping surface; A first support portion supported by the wrap base, a second support portion to which the workpiece is attached so that the workpiece surface is in contact with the wrapping surface, and an extension between the first support portion and the second support portion Adapter including arm part becoming, A height adjustment mechanism for changing a height from the wrapping surface to the first support portion of the adapter; Tilt detector installed in the adapter and detecting the tilt of the adapter Including; And the inclination of the adapter with respect to the wrapping surface is adjusted by adjusting the height of the first supporting portion by the height adjusting mechanism. 2. The wrapping apparatus as claimed in claim 1, wherein the inclination detector comprises two inclination sensors disposed at positions symmetrical with respect to the center of pivotal swing of the workpiece. The wrapping apparatus according to claim 2, wherein each of the inclination sensors is a magnetoresistive element type inclination sensor. The lapping apparatus according to claim 3, wherein the inclination sensor is installed near a position where the workpiece is attached to the second support portion. The work piece is configured so that the work piece is attached to the adapter so that the short side direction of the shape of the work surface of the work piece coincides with the extending direction of the arm portion of the adapter. The inclination of the short side direction of the to-be-processed object is adjusted by height adjustment by the said height adjustment mechanism, The lapping apparatus characterized by the above-mentioned. The said height adjustment mechanism is a pivot provided in the said lap base, and the linear actuator provided in the said 1st support part of the said adapter, The said linear actuator is contacted and supported by the said pivot, It is characterized by the above-mentioned. Wrapping device. As a lapping method for lapping a workpiece, Attaching the workpiece to the second support of the adapter such that the workpiece surface is in contact with the wrapping surface of the wrapping plate; Adjusting the inclination of the workpiece surface of the workpiece by adjusting the height of the first support portion of the adapter supported on the wrap base that slides the wrapping surface, The inclination of the said adapter is detected during a lapping process, and the inclination of the to-be-processed surface is adjusted during a lapping process based on the detection result of the inclination. The lapping method according to claim 7, wherein the inclination of the surface to be processed is adjusted during lapping by adjusting the height of the first support based on the detection result of the inclination of the adapter. The method of claim 7, wherein the wrapping is performed while rocking the workpiece by rocking the adapter, And the second support portion detects an inclination at two points symmetrical with respect to the center of the swing and obtains an inclination of the adapter based on the inclination detection values of the two points. A magnetic head processing method comprising lapping a magnetic head including a read element and a write element by the lapping method according to claim 7.

Images