KR20090018468A - Ceramic substrate and method thereof and light emitting diode package having the same - Google Patents

Abstract

A ceramic substrate, a manufacturing method thereof, and a light emitting diode package are provided to improve productivity by forming a via pattern in two unit modules at the same time. A ceramic substrate(100) includes a ceramic plate(110), a plurality of bonding pads(120), a plurality of soldering pads and a plurality of via patterns(140). Bonding pads are formed on the single-side of the ceramic plate. Bonding pads are used as an electrode. An LED(Light Emitting Diode) chip(200) is mounted on the bonding pads. The LED chip includes a red chip(200a), a green chip(200b) and a blue chip(200c). Soldering pads are formed in other surface of the ceramic plate. Via patterns electrically connect the bonding pads and the soldering pads by penetrating through the ceramic plate. The via patterns are formed in the one side end of the ceramic plate.

Description

CERAMIC SUBSTRATE AND METHOD THEREOF AND LIGHT EMITTING DIODE PACKAGE HAVING THE SAME

The present invention relates to a light emitting diode package, and more particularly, to a light emitting diode package capable of emitting light from the side, a ceramic substrate used in the light emitting diode package, and a manufacturing method thereof.

The development of compound semiconductor technology together with the development of information and communication foretells a new light revolution.

Light emitting diodes, also known as light emitting diodes (LEDs), are used to display letters, numbers, etc. in electronic products, and refer to intermetallic compound junction diodes that emit light when a current flows through a p-n junction of a semiconductor.

The LED package can be classified into a top view method and a side view method according to its use. In the case of the top view method, the light is directly irradiated to the screen, and the side view method In this case, it refers to a method of reflecting light from the light guide plate to the screen by irradiating light to the light guide plate from the side of the screen.

The side view method has been suggested as a means for reducing the thickness of electronic products or for securing space, and is currently used for backlights of mobile phones, navigation, notebooks, and the like.

In the conventional LED package, a lead frame and a housing are provided to open a part of the lead frame through an injection process by a polymer resin, and an LED chip on the open part of the lead frame. This is mounted.

When the light emitting diode package is operated, heat is generated together with light from the LED chip, and the polymer resin, which is a material of the housing, is degraded by heat generated from the LED chip as the frequency of light emission from the LED chip increases. .

The deterioration phenomenon is a phenomenon caused by the polymer resin is weak in heat, there is a problem of reducing the amount of light emitted from the light emitting diode package and shorten the life while causing discoloration of the housing.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a light emitting diode package which can prevent a decrease in the amount of light due to a deterioration phenomenon and improve a lifespan.

The present invention for achieving the above object can use a ceramic substrate excellent in heat resistance in order to mount the LED chip.

The ceramic substrate has a plurality of bonding pads provided on one surface of the ceramic plate, a plurality of soldering pads provided on the other surface, and a via pattern for electrically connecting the plurality of bonding pads and the plurality of soldering pads to one side of the ceramic plate. It may be provided at the end.

The ceramic substrate is a unit module, and the ceramic plate is provided with a plurality of unit modules in a plurality of rows and columns. The even pad bonding pad pattern may be designed to be rotated 180 degrees with the odd pad bonding pad pattern.

The via patterns may be provided over both ends of the odd row and the top of the even row to separate ceramic modules of the same shape when the unit modules are separated.

As described above, according to the present invention, since the substrate on which the LED chip is mounted is made of a ceramic having good heat resistance, the decrease in the amount of light due to the deterioration phenomenon can be reduced.

In addition, when manufacturing unit modules of a plurality of ceramic substrates, the unit modules of even rows and odd rows are designed to be point symmetrical with each other, and via patterns are formed at the boundaries thereof to form a via pattern in two unit modules. Can be formed to improve the productivity.

In addition, by mounting the LED chip close to each other in a triangular structure can provide an effect that can improve the color mixing.

1 is a plan view illustrating a ceramic substrate of a unit module according to an embodiment of the present invention, and FIGS. 2A and 2B are cross-sectional views taken along lines II ′ and II-II ′ of FIG. 1.

1 and 2A and 2B, a ceramic substrate 100 used in a light emitting diode package includes a ceramic plate 110, a plurality of bonding pads 120, and a plurality of solderings. It may include a pad (soldering pad) 130 and a plurality of via patterns (140).

The end of the ceramic plate 110 may be provided with a reflector 111 having a central opening, the reflector 111 may be made of the same material as the ceramic plate 110.

The ceramic plate 110 has a good heat resistance and excellent resistance to discoloration due to heat.

The plurality of bonding pads 120 may be provided on one surface of the ceramic plate 110 by using a conductive material such as Ag, and may provide a function as an electrode and a heat dissipation path to the outside.

The LED chip 200 is mounted on the plurality of bonding pads 120, the LED chip 200 is electrically connected to the bonding pad 120, and heat generated when the LED chip 200 is driven is an LED chip. The heat dissipation to the outside may be performed through the bonding pads 120 in which the 200 is mounted.

LED chip 200 includes a red (hereinafter referred to as R; 200a), green (hereinafter referred to as G; 200b), blue (hereinafter referred to as B; 200c) chip, and the R, G, The B chip 200 may be mounted on the bonding pad 120.

The R, G, and B chips 200 may be disposed to be closest to each other in order to maximize the color mixture of the light generated from each chip 200 during light emission.

The closest arrangement of the R, G, and B chips 200 may be a triangular arrangement. For this purpose, the bonding pads of the portions where the LED chips 200 are mounted may be designed to correspond thereto.

That is, the bonding pads 110 may be designed such that each point of the bonding pads 110 on which the chips 200 are mounted is connected by a virtual line to have an equilateral triangle structure.

The plurality of soldering pads 130 are provided on the other surface of the ceramic plate 110 with a conductive material, and are printed when the ceramic substrate 100 is mounted on a printed circuit board (not shown) or another device (not shown). It can be connected to circuit boards or other devices.

The plurality of via patterns 140 may be provided at one end of the ceramic plate 110 to electrically connect the bonding pads 120 and the soldering pads 130.

The via patterns 140 may be filled with a conductive material such as Ag in a via hole (not shown) formed through the ceramic plate 110 between the bonding pads 120 and the soldering pads 130. The conductive material may be coated on the inner surface of the via hole.

3 is a plan view illustrating a plurality of unit module ceramic substrates formed on a ceramic plate.

Referring to FIG. 3, a unit module of a plurality of ceramic substrates 100 may be formed by dividing the ceramic plate 110 into rows and columns.

The unit module 100b pattern of the even rows of the plurality of rows may be designed to be rotated 180 degrees with the unit module 100a pattern of the odd rows.

Specifically, the pattern of even-row bonding pads 120b and the odd-row bonding pads 120a on which the LED chip 200 is mounted are centered on the center of the boundary lines of the unit modules 120a and 120b of even and odd rows. It can be designed to have a point-symmetrical form.

Via patterns 140 connecting the bonding pads 120 and soldering pads (not shown) provided on opposite surfaces of the bonding pads 120 may have an interface between an odd row and an even row, that is, a lower end and an even row of odd rows. It can be provided over both ends of the upper end of.

The via pattern 140 may have a cylindrical or polygonal column shape and may be provided to be symmetrical with respect to the boundary surface.

The reason why the bonding pads 120 patterns of the even rows and the odd rows are point symmetrical as described above, and the via patterns 140 are provided on both the lower ends of the odd rows and the upper ends of the even rows is provided in a plurality of unit modules. This is to have the same shape when separated into each unit module.

4 is a flowchart sequentially illustrating a method of manufacturing the plurality of unit module ceramic substrates of FIG. 3.

Referring to FIG. 4, the ceramic substrate may be manufactured through the following steps.

First, the bonding pad forming step (S1).

A plurality of bonding pads may be provided using a conductive material such as Ag to form a plurality of unit modules on one surface of the ceramic plate.

As described above, the plurality of bonding pads may allow the even and odd rows of the bonding pads to be rotated 180 degrees with each other.

Next, the soldering pad forming step (S2).

A plurality of soldering pads may be provided on the other surface of the ceramic plate using a conductive material such as Ag.

The bonding pad forming step and the soldering pad forming step may be reversed in order.

Next, the via pattern forming step (S3).

A via pattern may be formed by forming a via hole between the bonding pads and the soldering pads, filling a conductive material such as Ag in the via hole, or applying a conductive material to the inner circumferential surface of the via hole.

As described above, the via pattern may be provided at both ends of the lower end of the odd row unit module and the upper end of the even row unit module so as to be face symmetrical with respect to the interface between the odd and even row unit modules.

Finally, the plurality of unit module ceramic substrates may be separated into individual unit module ceramic substrates by cutting or the like (S4).

According to the method as described above, two ceramic substrates having the same shape can be manufactured by forming a single via pattern, thereby improving productivity.

5 is a plan view illustrating a light emitting diode package.

Referring to FIG. 5, the light emitting diode 400 package may include a ceramic substrate 100, an LED chip 200, and a wire 300.

The ceramic substrate 100 may include a ceramic plate 110 having excellent heat resistance, a plurality of bonding pads 120, a plurality of soldering pads (not shown), and a plurality of via patterns 140.

The plurality of bonding pads 120 may be provided on one surface of the ceramic plate 110 by using a conductive material such as Ag, and may provide a function as an electrode and a heat dissipation path to the outside.

The plurality of soldering pads may be provided on the other surface of the ceramic plate 110 with a conductive material.

The plurality of via patterns 140 may be provided at one end of the ceramic plate 110 to electrically connect the bonding pads 120 and the soldering pads.

The via patterns 140 may be provided by filling a conductive material such as Ag in a via hole (not shown) formed between the bonding pads 120 and the soldering pads, or by applying a conductive material to the inner circumferential surface of the via hole.

The LED chip 200 may be mounted on the plurality of bonding pads 120, and the LED chip 200 may be electrically connected to the bonding pads 120 by a wire 300.

The LED chip 200 may include R, G, and B chips 200a, 200b, and 200c, and may be mounted on the bonding pads 120.

When the R, G, and B chips 200a, 200b, and 200c are mounted, each chip 200 may be mounted in a triangular shape on different bonding pads 120, which is a distance between each chip 200. In order to improve the color reproducibility of the light by increasing the mixing ratio of the light closer.

The bonding pads 120 need 6, which is twice the R, G, and B chips so that each chip can be used as a (+) and (-) electrode. This is because the voltage supplied to each chip is different. It is for.

That is, the number of bonding pads 120 may be twice the number of chips 200 to be mounted.

When the ceramic substrate 100 having the above heat resistance is used in the light emitting diode 400 package, deterioration due to heat generated when the LED chip 200 is operated may be reduced, and thus the light efficiency of the light emitting diode 400 may be reduced. Can be increased and its life can be extended.

1 is a plan view showing a unit module ceramic substrate.

2A is a cross-sectional view taken along line II ′ of FIG. 1.

2b is a sectional view taken along the line II-II ′ of FIG. 1;

3 is a plan view showing a state in which a plurality of unit module ceramic substrates are formed on a ceramic plate.

4 is a flowchart sequentially illustrating a method of manufacturing a plurality of unit module ceramic substrates of FIG. 3.

FIG. 5 is a plan view illustrating a light emitting diode having the ceramic substrate of FIG. 1. FIG.

<Description of the symbols for the main parts of the drawings>

100 ... ceramic substrate 110 ... ceramic plate

120 ... bonding pads 130 ... soldering pads

140 ... via pattern 200 ... LED chip

300 ... wire 400 ... light emitting diode package

Claims (10)

Ceramic plates; A plurality of bonding pads designed on one surface of the ceramic plate and used as mounting and electrodes of the LED chip; A plurality of soldering pads provided on the other surface of the ceramic plate; And A plurality of via patterns penetrating the ceramic plate to electrically connect the bonding pads and the soldering pads, The plurality of via patterns are formed on one side end of the ceramic plate. The method of claim 1, The via pattern is a ceramic substrate, characterized in that the conductive material is filled in a plurality of via holes formed in one side end. The method of claim 1, The via pattern is a ceramic substrate, characterized in that the conductive material is applied to the inner surface of the plurality of via holes formed in one side end portion is provided. Forming a bonding pad on one surface of the ceramic plate; Forming a soldering pad on the other surface of the ceramic plate; And And forming a via pattern connecting the bonding pad and the soldering pad to penetrate through the ceramic plate. The method of claim 4, wherein Partitioning the plurality of unit module regions in rows and columns on the ceramic plate; And And cutting the partitioned ceramic plate to separate a plurality of unit modules. The method of claim 5, The bonding pad of the unit module area of the odd row of the bonding pads and the bonding pad of the unit module area of the even row of the bonding pads are designed in a point symmetrical structure with respect to the midpoint of the boundary line of the odd and even rows. The method of claim 5, The via pattern is formed on the boundary of the unit module region, characterized in that formed on both sides of the adjacent unit module region. The method of claim 7, wherein The via pattern is a ceramic substrate manufacturing method, characterized in that the via pattern of the odd row and the via pattern of the even row are symmetric with respect to the interface. A ceramic substrate having a plurality of bonding pads provided on one side thereof, a plurality of soldering pads provided on the other side thereof, and via patterns connecting the bonding pads and the soldering pads to one end thereof; And And a LED chip mounted on the bonding pad and electrically connected to the bonding pad. The method of claim 9, The LED chip includes a red chip, a green chip, and a blue chip, wherein the red, green, and blue chips are mounted and connected to the bonding pads in a triangular form.

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