KR20090014277A - Multilayer antenna having a planar design - Google Patents

Abstract

A multilayer antenna having a planar design comprises the following features: an electrically conductive earth surface (3) is provided, a conductive radiation surface (7) is provided, which is arranged at a lateral distance from the earth surface (3) and runs substantially parallel thereto, a dielectric carrier (5) is provided, which is arranged between the earth surface (3) and the radiation surface (7), a bearing device (19) is provided above the radiation surface (7), an electrically conductive patch element (13) is provided above the bearing device (19), and the bearing device (19) has a thickness or height which is smaller than the thickness or height (114) of the patch element (13).

Description

Multi-layered Antenna with Planar Structure {MULTILAYER ANTENNA HAVING A PLANAR DESIGN}

The present invention relates to a multilayer antenna having a flat structure according to the preamble of claim 1.

Patch antennas or so-called microstrip-antennas are well known. The antennas typically include a conductive base face, a dielectric carrier material disposed over the base face, and a conductive radiating face provided on an upper face of the dielectric carrier material. The upper radiation face is generally excited by a power supply line running transversely with respect to the planes and layers described above. Coaxial cable is used among other things as the connection cable, and the outer conductor of the coaxial cable is electrically connected to the ground conductor at one connection portion, while the inner conductor of the coaxial cable is electrically connected to the radiating surface above.

Planar multilayer antennas are known, for example, as so-called "stack" -patch antennas. By this type of antenna, it is possible to increase the bandwidth of the above-described antenna or to ensure resonance in two or more frequency domains. By antennas in this manner, antenna yield can also be improved.

Publications IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, VOL. AP-27, NO. 2, MARCH 1979, pages 270-273, describe a multilayer patch antenna that enables resonance in two frequency domains. The patch antenna in the publication is for example a patch plane which is laterally displaced with respect to the radiation plane above the radiation plane, in addition to the underlying ground plane and the radiation plane which is displaced with respect to the ground plane and excited via the power supply line. Has The carrier material between the ground plane and the radiation plane and the carrier material between the radiation plane and the patch plane overlying it each consist of a substrate having the same dielectric constant.

Patch antennas with carrier layers having different dielectric constants are described, for example, in the publication IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, VOL. 47, NO. 12, DECEMBER 1999, pages 1780-1784. Foam is used as the upper carrier layer for the upper metal face (patch face). The spacing between the upper patch face and the radiating face underlying it corresponds to the spacing between the radiating face and the lower ground plane.

The fact that antenna yield can be increased by a multi-layer patch antenna is, among other things, preliminary publication IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, VOL. 47, NO. 12, DECEMBER 1999, pages 1767-1771.

Finally, homogeneous antennas having a multilayer structure are known, for example, from US Pat. No. 5,880,694 A. The antenna includes a lower ground plane and a dielectric carrier body overlying the radiant plane on the upper surface of the dielectric carrier body. An additional dielectric body is disposed above the radiating face, and a conductive patch face is provided on the side of the additional dielectric body that is away from the lower ground plane.

A disadvantage in all such antenna arrays known in the prior art is a relatively complex structure. When using a conventional patch antenna having a ground plane, an electrical carrier body (substrate) on the ground plane, and a radiation plane on the substrate, it is always complicated to supplement such an antenna with one multilayer antenna. . In the case of using a conventional patch antenna comprising at least one lower ground plane, for example a substrate made of a dielectric material such as ceramic, and a radiation plane on the substrate, the conductive patch face is later on the upper face of the additional dielectric support layer. In some cases, a dielectric carrier layer having a different thickness may be made to arrange the dielectric carrier layer, and the dielectric carrier layer may be positioned and fixed on, for example, a radiation surface of a conventional patch antenna. An additional conductive patch face may be installed in a structure different from that described above but in a very complex structure, for example an antenna housing, in which a conventional patch antenna is provided below the antenna housing. It requires structural measures.

The object of the present invention is an improved multilayer antenna, in particular a patch antenna, of a planar structure having a patch radiator provided on the radiating face in order to achieve known electrical properties, which is constructed more simply and / or has improved electrical properties. To prepare.

The problem is solved correspondingly to the features set forth in claim 1 according to the invention. Preferred embodiments of the invention are set forth in the dependent claims.

A number of advantages can be realized by the solution according to the invention.

An important advantage-very surprisingly-is that the antenna according to the invention has much improved antenna properties compared to a simple ordinary patch antenna. More surprisingly, the radiation structures provided on top of the patch antenna are arranged at extremely small intervals above the radiating face of the patch antenna, and in one preferred embodiment even greater longitudinal and transverse-extension than the radiating face which is even below it. It can have wealth. In other words, in the above case, it can be expected that the patch surface at the top has a disadvantageous effect on the radiation diagram.

A further important advantage of the antenna according to the invention is that it is equipped with a ground plane and a radiation plane and a dielectric between the ground plane and the radiation plane, for example a so-called ceramic-patch antenna, which does not need to be structurally altered. The conventional patch antenna can be used without any problem. However, what is needed is to fix the three-dimensional conductive structure according to the invention of the patch face at the top on a conventional patch antenna by means of a suitable adhesive layer and / or fixing layer.

In other words, no additional carrier structure or hood is needed to secure the patch face.

In a preferred embodiment of the present invention, between a conventional patch antenna and a conductive three-dimensional patch element at the top, an adhesive layer in the form of an adhesive band to which both sides are bonded, or an equivalent adhesive device or adhesive device, Used as an adhesive structure, the patch element placed on top can thus be fixed without any problem on a conventional patch antenna.

In a particularly preferred embodiment of the invention the spacing between the radiating surface of the patch antenna and the three-dimensional patch element has a spacing greater than 0.5 mm, in particular greater than 1 mm, for example by 1.5 mm. This spacing may be larger, but basically a small dimensioned spacing between the three-dimensional patch element and the radiating face of the multilayer patch antenna is completely sufficient.

The three-dimensional structure of the patch element can be embodied by a so-called bulky bulk body, for example, in addition to its flat extension (e.g., equivalent to a conventional small metal plate or metal layer). Additionally have a much larger height or thickness of 1 mm or several mm.

Alternatively, however, a structure similar to a three-dimensional structure may be realized, for example, by installing a peripheral or protruding edge in whole or in part on such a three-dimensional patch element disposed on the radiation surface. This opens up the possibility that a patch element with a three-dimensional structure can be formed by a sheet or perforation, in which the edge section surrounding the periphery from a flat element is erected upwards. The edge section is aligned horizontally and preferably vertically with respect to the patch element. At the edge, individual flange sections or edge sections do not need to be electrically or galvanically connected to each other. The electrical connection provided from the erect edge element to the neighboring edge element is actually through the central section of the patch element aligned parallel with the radiating and ground planes below it.

The three-dimensional structure (called a “three-dimensional” structure because the structure has a much larger material thickness or material height compared to the small metal plate or metal thin film used in accordance with the prior art) is that the entire body is necessarily a so-called bulk body. It does not require that it be formed or that the aforementioned edges surrounding it must be formed to surround it in the entire edge region of the patch structure. Sectional edge elements or protruding elements are also sufficient. Likewise, within the patch face itself may be provided a recess or even a concave shape of the patch face which is arranged, for example, facing towards the radiating face below it. However, a recess may be formed in the patch face, which for example protrudes into the patch face from the surrounding edge.

It is also possible to use dielectric bodies, for example coated with a conductive layer and made of plastic. For example, when using such a "bulk body" having a thickness or height of preferably at least 0.5 mm or 1 mm, in particular at least 1.5 mm, the bulk body is preferably at least on the side parallel to the radiation plane, preferably spinning It must be provided with a conductive layer on its side and neighboring sides and in its wall section or edge section surrounding it. If desired, a conductive layer may also be provided on the upper side of the non-conductive body that is deformed into the radiation face of the patch antenna.

Further advantages, details and features of the invention are described in detail below with reference to the embodiments shown in the drawings.

1 is a schematic axial cross-sectional view of a conventional patch antenna according to the prior art,

2 is a schematic plan view of a patch antenna according to FIG. 1 as known in the prior art,

3 is a schematic horizontal or side view of a stack-patch antenna according to the present invention;

4 is a schematic plan view of the embodiment according to FIG. 3;

5 is a plan view corresponding to FIG. 4 of a patch antenna according to the invention with a different embodiment for the patch element on it,

FIG. 6 is a side or cross sectional view corresponding to FIG. 3 of a patch antenna according to the invention, reproducing a support device used for an upper patch element, FIG.

FIG. 7 is a schematic side and / or cross-sectional view of an embodiment different from FIG. 6;

8 is a schematic plan view of a patch element as applied in further processing in the embodiment according to FIG. 7, FIG.

9A is a different embodiment from FIG. 7,

9b is a plan view of the embodiment according to FIG. 9a,

FIG. 10 is again an embodiment different from FIGS. 7, 9A, and 9B,

FIG. 11 is again an embodiment different from FIGS. 7, 9A, 9B and 10, and

12 is a variant embodiment with a patch element of even greater height or thickness.

The basic structure of a conventional patch radiator A (patch antenna) is shown in a schematic side view in FIG. 1, and the basic structure is shown in a schematic plan view in FIG. 2, the structure of which is referred to below in FIG. 4.3. It extends to one multilayer patch antenna (stack-patch-antenna).

The patch antenna shown in FIGS. 1 and 2 comprises a number of faces and layers stacked along an axial axis Z, which faces and layers are described below.

From the schematic cross-sectional view according to FIG. 1 it can be seen that the patch antenna A has a conductive ground plane 3 on its so-called lower side or installation side 1. A dielectric carrier 5 having an outer contour 5 ′, which typically corresponds to the outer contour 3 ′ of the ground plane 3, in plan view, is laterally displaced on or against the ground plane 3. It is arranged in the state. However, the dielectric carrier 5 may be designed to be larger or smaller in size and / or have an outer contour 5 ′ different from the outer contour 3 ′ of the ground plane 3. In general, the outer contour 3 'of the ground plane may be n-polygonal and / or may even be curved or formed with sections that are not conventional.

The dielectric carrier 5 generally has a sufficient height or thickness that corresponds to several times the thickness of the ground plane 3, that is to say that unlike the ground plane 3 which consists almost of two-dimensional planes, the dielectric carrier 5 It was formed into a three-dimensional body with sufficient height and thickness.

On the upper side 5a facing the lower side 5b (which may be placed next to the grounding surface 3), a conductive radiation surface 7 is formed, and as for the conductive radiation shaving, almost 2 again It can be understood as a dimension. The radiation face 7 is excited by being supplied with power via a power supply line 9, which power supply line is preferably from below, in the transverse direction, in particular perpendicular to the radiation face 7. Extends into the corresponding bore or corresponding channel 5c.

By means of a connection 11 which is generally laid down and to which a coaxial cable, not shown in detail in the drawing, can be connected, the inner conductor of the coaxial cable, not shown in the drawing, is galvanically electrically connected to the power supply line 9. In addition, it is connected to the radiation surface 7. The outer conductor of the coaxial cable, not shown in the figure, is galvanically connected to the underlying ground plane 3.

In the embodiment according to FIG. 1, a patch antenna having a square shape when viewed in the dielectric 5 and in plan view is described. However, the shape or corresponding contour or border line 5 ′ may deviate from the shape of a square and generally have the shape of an n-polygon. Although not common, even the outer limits of the curve may be provided.

Radiating face 7 which is mounted on dielectric 5 may have the same contour or border line 7 'as dielectric 5 underlying it. In the illustrated embodiment, the basic shape is also squarely adapted to the edge 5 'of the dielectric 5, but has a flat portion 7 "at two opposite ends, the flat portion being made of the same arm. Formed by removing a right triangle, that is to say, in general, the border line 7 'can also be an n-polygonal border line or contour or even have an outer limit 7' of the curve.

However, the above-described ground plane 3 and radiation plane 7 are also partly denoted as "two-dimensional" planes, since the planes are so thin that they cannot be described as "bulk bodies". Because. The thicknesses of the ground plane and the radiation plane 3, 7 typically vary below 1 mm, that is to say generally below 0.5 mm, in particular below 0.25 mm, below 0.20 mm, below 0.10 mm.

On the patch antenna A formed as above, which may for example consist of a conventional patch antenna A, preferably a so-called ceramic-patch antenna, in which the dielectric carrier layer 5 is made of ceramic material, FIG. In the case of the stack-patch antenna according to the invention corresponding to FIGS. 3 and 4, additional patch elements 13 are arranged in the state of being laterally displaced or height displaced relative to the upper radiating face 7 (FIG. 3). The patch element comprises a three-dimensional structure with distinctly different, ie significantly greater height or thickness, relative to the ground plane 3 and the radiation plane 7 described above.

The stack-patch antenna thus formed is positioned on, for example, a chassis B, which is shown only in lines in FIG. 3, which chassis can be, for example, a base-chassis for a car-antenna, Within the base-chassis the antenna according to the invention may optionally be installed next to additional antennas for other services. The stack-patch antenna according to the invention can be used, for example, in particular for geostationary positioning and / or for reception of satellite- or ground-services, for example for the reception of so-called SDARS-services. . However, use for other services is not limited.

The patch element 13 can for example consist of a conductive metal body, ie a rectangular parallelepiped with a corresponding longitudinal and transverse extension and of sufficient height or thickness.

However, as can be seen in the plan view according to FIG. 4, the patch element 13 may also have an edge 13 ′ which deviates from the rectangular or square structure. In other words, some adaptation of the patch antenna can be carried out by machining the edge region, for example the edge region 13a as seen in FIG. 4, as is known.

In the illustrated embodiment the patch element 13 has a longitudinal extension and a transverse extension, which are on the one hand larger and / or larger than the longitudinal and transverse extensions of the radiating face 7. On the other hand, it is larger than the longitudinal and transverse extensions of the dielectric carrier 5 and / or the longitudinal and transverse extensions of the ground plane 3 beneath it.

Very generally the patch element 13 has, in whole or in part, a convex or concave and / or other curved border line or n-polygonal border or is shown only schematically in a plan view of a variant embodiment according to FIG. 5. As can be seen, the two forms may have a mixed form, in which case the patch element 13 has an irregular outer contour or irregular border 13 ′.

The thickness of the patch element 13 not only has a dimension such as 2 times, 3 times, 4 times or 5 times the thickness of the ground plane 3 and / or the thickness of the radiating face 7, but also 10 times, among other things, It may have dimensions of 20, 30, 40, 50, 60, 70, 80, 90, and / or 100 times or more.

In the illustrated embodiment, the thickness or height 114 of the patch element 13 is equal to the spacing 17 formed by the lower surface 13b of the patch element 13 and the upper surface 7a of the radiating surface 7. Equal to or greater than the interval.

On the other hand the spacing 17 should also not be smaller than 0.5 mm, preferably equal to or greater than 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm or 1 mm. A value of as much as 1.5 mm, that is to say generally 1 mm to 2 mm or 1 mm to 3 mm, 1 mm to 4 mm or 1 mm to 5 mm is completely sufficient.

On the other hand it can also be seen that the height or thickness of the three-dimensional patch element 13 is preferably smaller than the height or thickness 15 of the dielectric carrier 15. Preferably the thickness or height 114 of the patch element 13 lying on top is less than 90%, in particular 80%, 70%, 60%, less than 50% or even less than the height or thickness 15 of the carrier element 5. Less than 40% and in some cases less than 30% or less than 20%.

On the other hand, a preliminary restriction on the above mentioned height is not necessary. As such, the height or thickness 114 of the three-dimensional patch element 13 may also have a height or thickness that is greater than the thickness of the dielectric carrier 5 and in particular much greater. In other words, the height or thickness 15 of the carrier element 5 is for example 1.5 times, 2 times, 4 times, 5 times, 6 times, 7 times the height or thickness 15 of the carrier element 5. It may also have dimensions corresponding to at least 10 times, 8 times, 9 times and / or 10 times.

On the other hand the thickness or height 114 of the patch element 13 should preferably be larger than the spacing dimension 17 of the radiating face 7 and the lower face 13b of the patch element 13.

Preferably, a support device 19, in particular a dielectric support device 19, is used, through which the patch element 13 is fixed and supported. The dielectric support device 19 preferably consists of an adhesion-or assembly layer 19 '(FIG. 6), which can be formed, for example, of a so-called adhesive layer and an assembly layer 19' to which both sides are bonded. For this purpose, conventional double sided adhesive bands or double sided adhesive foam bands, adhesive pads and the like having the corresponding thicknesses described above can be used. Such a band or pad opens up the simple possibility that the patch element 13 described above can be fixed and assembled on the upper face of a conventional patch antenna, in particular a conventional ceramic-patch antenna.

However, instead of using a fully conductive metal body as the patch element 13, a plastic body provided with a conductive lower surface 13b and a conductive side limiting portion 13c surrounding the periphery by, for example, a stack of conductive outer layers is also provided. Can be used. Although a conductive layer surrounding the periphery may be provided on the entire surface of the non-conductive patch element 13 formed as described above, the upper surface 13d does not necessarily need to be conductive.

In the modification with reference to FIG. 7, the three-dimensional patch element 13 is not formed as a bulk body, but rather as a plate-shaped patch element 13 having side- or edge ridges 14 surrounding the periphery.

Patch elements 13 of this type can be produced by perforation and edge treatment from metal sheets, for example, as shown in the plan view of FIG. 8.

8 shows, for example, a border line of an almost square metal part, in which case the corner 25 is punched in the corner area. An edge region or edge ridge 14 thus formed along the edge line 27 is then provided with respect to the base face 113 of the patch element 13, whereby the edge region or edge ridge 14 is patched. It runs transversely with respect to the base face of the element 13 and preferably perpendicular to the base face. The cut lines between the two edge ridges 14 thus formed which are next to each other in the circumferential direction and which run in the perpendicular direction in the illustrated embodiment are galvanically-electrically connected to one another by soldering at their own cut lines and / or contact lines. Need not be connected. Electrical connection through the flat central section 113 of the patch element 13 is sufficient.

Also in this case, the lower surface 13b of the patch element 13 formed as above is preferably supported by a support device, for example by a layered dielectric support device 19, preferably by a sticky- or assembly carrier 19 '. Is fixed to the upper surface of, for example, a conventional patch antenna A, in which case the upper surface of the self-radiating surface 7 of the conventional patch antenna A can still be coated with a dielectric layer, but not necessarily It does not need to be coated.

From the schematic cross-sectional view shown with reference to FIG. 9A and the schematic plan view shown with reference to FIG. 9B, for example, the flat lower surface 13b of the patch element 13 described with reference to FIGS. It will be appreciated that a recess or hole 29 may be provided. The recess or the hole 29 is preferably provided in all areas in which the power supply line 9 is connected to the radiation face 7 by soldering in general. The reason for this is that a solder ridge 31 is formed in the place, which typically protrudes above the surface of the radiation face 7. Even if only one very thin support device 19 is preferably used in the form of an adhesive- or assembly carrier 91 ′, it is thereby possible to place the patch element 13 and the underlying underneath on the one hand at that location. By means of a support device 19, preferably in the form of a sticking-and-assembly layer 19 ′ between conventional patch antennas, an excellent mechanical cohesive bond can be made, on the other hand with the solder ridge 31. Electrical contact between the patch elements 13 can be reliably avoided. For the sake of clarity, the support device 19 is preferably shown in the form of a cohesive-and / or assembly layer 19 'in FIG. 9A (but also in FIGS. 10 and 11, discussed further below). not. For clarity, the upper patch 13 is shown almost " transparent " in FIG. 9B so that the aforementioned recess or hole 29 is only indicated by the corresponding border line.

Similar advantages can also be achieved by one embodiment corresponding to FIG. 10. In FIG. 10, a molding part 33 is formed on the conductive lower plane 13b of the patch element 13, which protrudes convexly upward, preferably between the power supply line 9 and the power supply surface 7. It can be placed on the conductive connection of, specifically speaking, in the place where the solder ridge 31 is formed.

Finally, referring to FIG. 11, in the illustrated embodiment, the above-described edge section 14 provided at the outer edge 113 ′ surrounding the periphery of the patch face of the patch element 13 is provided with the base of the patch element 13. It is described that it does not need to be aligned vertically with respect to the face 113, but rather can be provided in an angle setting direction deviating from the vertical line as shown, for example, with reference to FIG. In the embodiment according to FIG. 11, the edge side limiting portions 14 are mutually distributed in a distributed manner along the installation direction A (FIG. 1) of the axis, in particular in the direction of radiation from the base- or central plane 113. It is aligned to move away. But to be precise, the edge side sections may also be aligned facing each other. To be precise, the side restriction 14 on one side can be bent more towards the central section 113 of the patch 13, for example in the other direction A, and on the other side aligned so as to be far from the central face 113. Can be. Finally, the ridge or edge section 14 need not necessarily be provided at the outermost edge edge 113 ′, but rather, for example, of ridges or other forms running transversely relative to the base face 113 in FIG. 11. As shown by the broken line for the ridge 14 ', it may be formed so as to be displaced further inward with respect to the outermost edge edge, wherein the other type of ridge is provided with respect to the outer limiting portion 113'. It is arranged to lie on the patch element in a further displaced state. However, the ridges or ridges 14 ′ shown in FIG. 11 can also be aligned to again run away from the vertical and rather inclined outwardly or rather inwardly. In addition, the ridges or ridges also need not be formed in the shape of a ridge or band in view of the cross section, but rather may have a bulky cross section or an arbitrarily formed cross section shape in the triangular cross section.

Finally, even in the case of using a bulk body equivalent to the embodiment according to FIG. 3 or FIG. 6, the limiting surface 13 ′ (side limiting portion 13c) surrounding the periphery of the patch element 13 is provided. It does not need to be aligned vertically with respect to the lower face 13b or the upper face 13d, but rather to be formed in the same obliquely extending side as in the edge or ridge 14 proceeding in an inclined state in FIG. It can also be seen that.

The stack-patch antenna according to the invention may be used next to additional antennas for other services, preferably as antennas within the scope of a car-antenna. However, there are no restrictions in this regard. The conventional patch antenna A used within the scope of the stack-patch antenna according to the invention preferably consists of a dielectric carrier 5-as described above, wherein the upper or lower surface of the carrier is made of metal or It is formed from the conductive layer 7 or 3 and is fixed on the carrier 5.

Finally, reference is made to FIG. 12, where a further embodiment is shown. In this embodiment an overlying patch element 13 is used, which patch element-as can be seen in the figure-has a thickness or height 14 even greater than the thickness or height of the dielectric carrier 5. Despite this relatively high height or larger extension parallel to the substrate plane, the patch antenna thus formed also has improved electrical properties.

With reference to the embodiments described above, it becomes clear that the patch element 13 is greater than or equal to the dielectric carrier 5. In the illustrated embodiment, the patch element 13 is larger than the ground plane 3 and larger than the radiation plane 7.

In the following, data relating to the size of the patch element 13 which is proportional to the dielectric carrier 5, the ground plane 3 or the radiation plane 7 is presented, in which case the size data and the size ratios below are respectively applied to the patch element ( 13), the longitudinal direction of the carrier 5, the ground plane 3 and the radiation plane 7 in the longitudinal and / or transverse directions (particularly parallel to the two edge lengths standing perpendicular to each other) In other words, the linear size ratio is given, not the flat size ratio.

Preferably the arrangement is such that the patch element 13 is 13 to 100% larger than the dielectric carrier 5 and / or is 200% larger than the ground plane 3 and / or the radiation surface 7. It must be chosen to be larger up to 200%.

Said sizes may alternatively or complementarily be in a further preferred variant a patch element which should have a minimum size (generally larger than the dielectric carrier 5) 20% more than the dielectric carrier 5. It may be chosen to be small and / or to be 5% smaller than the ground plane 3 and / or to be 5% smaller than the radiation plane 7. Typically, however, corresponding magnitudes are larger than the lowest values described above.

Preferred values are for example such that the patch element 13 is 4% to 16% larger than the dielectric carrier 5, in particular 6% to 12% and in particular 8% larger and / or the patch element 13 is grounded. 8% to 34% more than cotton 3 and in particular 12% to 28%, i.e. 17% larger and / or 21% to 84% more than radiating face 7, in particular 30% to 60% As much as, 42% more than anything else is set.

Claims (22)

As a multi-layer antenna, in particular a patch antenna, having a planar structure, with a plurality of faces and / or layers disposed laterally displaced or not laterally displaced along the axial axis Z, A conductive ground plane (3) is provided, A conductive radiation face 7 is provided, the radiation face being arranged laterally with respect to the ground plane 3 and running substantially parallel to the ground plane, A dielectric carrier 5 is provided, which carrier is arranged between the ground plane 3 and the radiation plane 7, The radiating face 7 is electrically connected to a conductive power supply line 9, A support device 19 provided either directly or indirectly on the side of the radiation face 7 opposite the ground plane 3, A conductive patch element 13 provided on the side of the support device 19 opposite the radiation face 7, The support device (19) is characterized in that it has a thickness or height smaller than the thickness or height (114) of the patch element (13). The method of claim 1, The thickness or height (114) of the patch element (13) is characterized in that it is smaller than the thickness or height (15) of the dielectric carrier (5) between the ground plane (3) and the radiation plane (7). The method of claim 1, The thickness or height 114 of the patch element 13 is greater than the thickness or height 15 of the dielectric carrier 5 between the ground plane 3 and the radiation plane 7, in which case the patch element ( 13) the thickness or height 114 is one, two, three, four, five, six, seven, eight or nine times the thickness or height 15 of the dielectric carrier 5. Or 10 times and more. The method of claim 1, wherein The patch element 13 has at least substantially the longitudinal and / or transverse extensions of the radiation face 7, the longitudinal and / or transverse extensions of the radiation face 7 and the longitudinal and / or transverse extensions of the dielectric carrier 5. Or greater than or equal to the transverse extension and / or larger than the longitudinal- and / or transverse extension of the ground plane (3). The method according to any one of claims 1 to 4, The thickness or height 114 of the patch element 13 is at least two times, three times, four times or five times, in particular six times the thickness of the ground plane 3 and / or the thickness of the radiation face 7. , At least 7 times, 8 times, 9 times or 10 times and especially 20 times, 30 times, 40 times, 50 times, 60 times, 70 times, 80 times, 90 times or 100 times. The method according to any one of claims 1 to 5, The antenna, characterized in that the thickness or height of the dielectric support device 19 is larger than 0.5 mm, preferably larger than 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm or preferably larger than 1 mm. . The method of claim 6, The thickness or height of the dielectric support device (19) is characterized in that it is less than 5 mm, in particular less than 4 mm, less than 3 mm or less than 2 mm. The method according to any one of claims 1 to 7, The dielectric support device (19) is characterized in that it consists of a sticky- or assembly layer (19 '). The method according to claim 7 or 8, Said dielectric support device (19) is characterized in that it consists of an adhesive- or assembly device (19 ') on which both sides are bonded, in particular an adhesive band, a foam band, an acrylic-adhesive band or an adhesive pad on which both sides are bonded. The method according to any one of claims 1 to 9, The patch element (13) is characterized in that consisting of a three-dimensional bulk body, antenna. The method according to any one of claims 1 to 10, The patch element 13 comprises a metal sheet-like, thin-film or layered base section 113, in which case a fusion projecting transversely with respect to the face of the section on the base- or central section 113. Antenna, characterized in that the base, edge and / or ridges (14) are formed. The method of claim 11, The ridge, edge and / or ridge (14) is characterized in that it is formed at an edge (113 ') surrounding the periphery of the center- or base section (113) of the patch element (13). The method of claim 11, Characterized in that the ridges, edges and / or ridges 14 are provided so as to lie further inwardly displaced at the outer edge 113 ′ of the center- or base section 113 of the patch element 13, antenna. The method according to any one of claims 11 to 13, The patch element (13) consists of a metal plate, characterized in that the ridges or edges (14) of the metal plate are formed by cutting or perforating and subsequent edge treatment. The method according to any one of claims 11 to 14, The edge or ridge (14) is characterized in that it is vertically aligned with respect to the face of the center- or base section (113) of the patch element (13). The method according to any one of claims 11 to 14, Said edge or ridge (14) is characterized in that it is aligned at an angle deviating perpendicular to the plane of the center- or base section (113) of the patch element (13). The method according to any one of claims 1 to 16, A recess or hole 29 or groove 33 is provided in the patch element 13, the recess or hole or groove being a radial surface above and below the lower plane 13b of the patch element 13. An antenna, characterized in that extending in a direction away from (7). The method of claim 17, The hole or recess (29) or groove (33) is characterized in that it is provided in an area in which the power supply line (9) is in contact with the radiation surface (7) in plan view. The method according to any one of claims 1 to 18, The patch element (13) is characterized in that it consists of a conductive material, in particular a metal. The method according to any one of claims 1 to 18, The patch element 13 is made of a non-conductive material and is wholly or partly coated by a conductive layer, in which case at least the center- or base section 113 and the lateral restriction 13 'surrounding the periphery or formed Antenna, characterized in that the conductive layer is provided on the edge or ridge (14). The method according to any one of claims 1 to 20, The patch element 13 is up to 100% longer and / or wider than the dielectric carrier 5, up to 200% longer and / or wider than the ground plane 3 and 200 than the radiating plane 7. An antenna, characterized in that it is longer and / or wider by%. The method according to any one of claims 1 to 21, The patch element 13 has a length and / or width equal to or greater than the minimum value, in which case the minimum value is based on the length and / or width of the patch element 13 when the dielectric carrier 5 Corresponding to 80% of the length and / or width of, corresponding to 95% of the length and / or width of the ground plane 3, and corresponding to 95% of the length and / or width of the radiation surface 7 Antenna.

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