KR20090009973U - Equipment of transfering frame for fabricating semiconductor package - Google Patents

Equipment of transfering frame for fabricating semiconductor package

Info

Publication number
KR20090009973U
KR20090009973U KR2020080004119U KR20080004119U KR20090009973U KR 20090009973 U KR20090009973 U KR 20090009973U KR 2020080004119 U KR2020080004119 U KR 2020080004119U KR 20080004119 U KR20080004119 U KR 20080004119U KR 20090009973 U KR20090009973 U KR 20090009973U
Authority
KR
South Korea
Prior art keywords
frame
picker
semiconductor package
unit
manufacturing
Prior art date
Application number
KR2020080004119U
Other languages
Korean (ko)
Inventor
이승연
김현일
Original Assignee
주식회사 하이닉스반도체
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 주식회사 하이닉스반도체 filed Critical 주식회사 하이닉스반도체
Priority to KR2020080004119U priority Critical patent/KR20090009973U/en
Publication of KR20090009973U publication Critical patent/KR20090009973U/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/41815—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

Abstract

본 고안에 따른 반도체 패키지 제조용 프레임 이송 장치는, 반도체 제조 공정을 위해 웨이퍼가 배치되는 프레임들이 스택되어 저장되도록 역할하는 다수의 몸체부; 상기 지지부들 내에 저장된 상기 프레임을 상승시키는 픽커(Picker)부; 상기 픽커부에 의해 상승되는 상기 프레임을 정렬(Align)시키도록 역할하는 프레임 홀더부; 상기 홀더부의 측면에 부착되어 상기 픽커부에 의해 상승되는 상기 프레임의 수를 감지하는 제1센서부를 포함한다.Frame transfer apparatus for manufacturing a semiconductor package according to the present invention, a plurality of body portion that serves to stack and store the frame on which the wafer is disposed for the semiconductor manufacturing process; A picker unit for raising the frame stored in the support units; A frame holder portion which serves to align the frame lifted by the picker portion; It is attached to the side of the holder portion includes a first sensor unit for detecting the number of the frame lifted by the picker unit.

Description

반도체 패키지 제조용 프레임 이송 장치{Equipment of transfering frame for fabricating semiconductor package}Equipment of transfering frame for fabricating semiconductor package

본 고안은 반도체 패키지 제조용 프레임 이송 장치에 관한 것으로서, 보다 상세하게는, 공정 안정성을 확보되도록 두 장 이상이 부착되어 이송되는 웨이퍼 배치용 프레임을 감지할 수 있는 반도체 패키지 제조용 프레임 이송 장치에 관한 것이다.The present invention relates to a frame transfer apparatus for manufacturing a semiconductor package, and more particularly, to a frame transfer apparatus for manufacturing a semiconductor package that can detect a frame for wafer placement to which two or more sheets are attached and transported to ensure process stability.

오늘날 전자 산업의 추세는 경량화, 소형화, 고속화, 다기능화, 고성능화되고 높은 신뢰성을 갖는 제품을 저렴하게 제조하는 것이다. 이와 같은 제품 설계의 목표 달성을 가능하게 하는 중요한 기술 중의 하나가 바로 반도체 패키지 공정이다. The trend in today's electronics industry is to make products that are lighter, smaller, faster, more versatile, more powerful and more reliable. One of the key technologies that enables this product design goal is the semiconductor packaging process.

상기 반도체 패키지 공정은 집적회로가 형성된 반도체 칩을 외부 환경으로부터 보호하고, 기판 상에 용이하게 실장되도록 하여 반도체 칩의 동작 신뢰성 확보하기 위한 기술로서, 칩 부착, 와이어 본딩, 몰딩, 트림/포밍 등의 공정들을 포함 하여 이루어진다.The semiconductor package process is a technology for securing operation reliability of a semiconductor chip by protecting a semiconductor chip on which an integrated circuit is formed from an external environment and being easily mounted on a substrate, and includes chip attachment, wire bonding, molding, trim / forming, and the like. Including the processes.

한편, 상기 반도체 패키지 공정은 반도체 패키지의 소형화에 따라 반도체 패키지를 구성하는 반도체 칩의 두께 감소도 필수적으로 이루어져야 하며, 이에 위해, 상기 웨이퍼의 두께를 줄이는 웨이퍼 백그라인딩 공정이 수행되고 있다. Meanwhile, in the semiconductor package process, as the semiconductor package is downsized, the thickness of the semiconductor chip constituting the semiconductor package must also be reduced. To this end, a wafer backgrinding process is performed to reduce the thickness of the wafer.

상기 백그라인딩 공정이 완료된 웨이퍼는 리드프레임 또는 인쇄회로기판 상에 반도체 칩을 부착시키는 다이 어태치 공정을 위하여 쏘잉 공정을 거치게 된다. 상기 웨이퍼에 대한 쏘잉 공정은 둥근 고리 형태를 갖는 프레임에 WBL(Water backside lamination) 테이프 또는 UV(Ultra violet) 테이프를 배치시킨 후, 상기 테이프 상에 백그라인딩된 웨이퍼를 부착시킨 상태로 수행된다. After the backgrinding process is completed, the wafer is subjected to a sawing process for a die attach process for attaching a semiconductor chip onto a lead frame or a printed circuit board. The sawing process for the wafer is performed by placing a water backside lamination (WBL) tape or ultra violet (UV) tape on a frame having a round ring shape, and then attaching the backgrinded wafer onto the tape.

상기 쏘잉 공정 및 다이 어태치 공정이 완료되면 상기 프레임은 표면에 부착된 테이프가 제거된 상태로 상기 프레임들이 보관되는 프레임 이송 장치 내로 이동되어 저장되며, 다시 쏘잉 공정이 수행되는 웨이퍼를 부착시키기 위하여 프레임 이송 장치에 구비된 픽커(Picker)부에 의해 이송된다.When the sawing process and the die attach process are completed, the frame is moved to and stored in the frame transfer device in which the frames are stored with the tape attached to the surface removed, and the frame is attached to attach the wafer on which the sawing process is performed again. It is conveyed by the picker part provided in the conveying apparatus.

그러나, 상기 프레임의 이송되는 과정에서 상기 프레임의 표면에 부착되었던 테이프의 접착제가 완전히 제거되지 못하여 두 장 이상의 프레임이 부착된 상태로 함께 이송되는 경우가 발생하게 된다.However, in the process of conveying the frame, the adhesive of the tape attached to the surface of the frame may not be completely removed, and thus the case may be conveyed together with two or more frames attached thereto.

종래 프레임 이송 장치에는 픽커에 의해 상기 프레임이 이송되는 경로에 센서를 배치하여 두 장 이상의 프레임이 함께 이송되는지 여부를 감지하고 있으나, 여러가지 외부 요인 및 상기 잔류된 테이프의 위치에 의하여 많은 경우 상기 센서가 프레임들이 부착되어 함께 이송되는 것을 감지하지 못하고 있다.Conventional frame transfer apparatus detects whether two or more frames are conveyed together by arranging a sensor in a path in which the frame is transferred by a picker. However, in many cases, the sensor may be located due to various external factors and the position of the remaining tape. The frames are attached and do not detect being transported together.

이와 같이, 상기 센서에 의해 감지되지 못하고 이송되는 하부에 부착된 프레임은 이송 중 웨이퍼가 놓여져 있는 마운트 테이블에 떨어져 웨이퍼를 파손시키거나 두 장 이상의 프레임이 공정 장비에 투입되는 등의 공정 불량을 유발시켜 공정 안정성을 저하시킨다. As such, the frame attached to the lower part which is not detected by the sensor is transferred to the mounting table on which the wafer is placed during the transfer, causing the wafer to be broken, or causing two or more frames to enter the processing equipment. Decreases process stability.

본 고안은 공정 안정성을 확보되도록 두 장 이상이 부착되어 이송되는 웨이퍼 배치용 프레임을 감지할 수 있는 반도체 패키지 제조 장치를 제공한다.The present invention provides a semiconductor package manufacturing apparatus capable of detecting a frame for wafer placement in which two or more sheets are attached and transported to ensure process stability.

본 고안에 따른 반도체 패키지 제조용 프레임 이송 장치는, 반도체 제조 공정을 위해 웨이퍼가 배치되는 프레임들이 스택되어 저장되도록 역할하는 다수의 몸체부; 상기 지지부들 내에 저장된 상기 프레임을 상승시키는 픽커(Picker)부; 상기 픽커부에 의해 상승되는 상기 프레임을 정렬(Align)시키도록 역할하는 프레임 홀더부; 상기 홀더부의 측면에 부착되어 상기 픽커부에 의해 상승되는 상기 프레임의 수를 감지하는 제1센서부를 포함한다.Frame transfer apparatus for manufacturing a semiconductor package according to the present invention, a plurality of body portion that serves to stack and store the frame on which the wafer is disposed for the semiconductor manufacturing process; A picker unit for raising the frame stored in the support units; A frame holder portion which serves to align the frame lifted by the picker portion; It is attached to the side of the holder portion includes a first sensor unit for detecting the number of the frame lifted by the picker unit.

상기 제1센서부는 적어도 하나 이상 배치된다.At least one first sensor unit is disposed.

상기 몸체부의 측면에 배치된 제2센서부를 더 포함한다.It further comprises a second sensor unit disposed on the side of the body portion.

상기 제2센서부는 적어도 하나 이상 배치된다.At least one second sensor unit is disposed.

상기 픽커부는 승하강되도록 구동된다.The picker unit is driven to move up and down.

상기 프레임을 진공으로 흡착하여 상승시키도록 상기 픽커부에 형성된 진공홀을 더 포함한다.The apparatus may further include a vacuum hole formed in the picker unit to lift the frame by vacuum.

상기 픽커부 및 프레임 홀더부가 부착되는 픽커 지지부를 더 포함한다.It further comprises a picker support portion to which the picker portion and the frame holder portion are attached.

상기 픽커 지지부가 고정되며, 상기 픽커부에 의해 상승된 상기 프레임을 이동시키는 프레임 이송부를 더 포함한다.The picker support part is fixed and further includes a frame transfer part for moving the frame lifted by the picker part.

상기 픽커 지지부에 배치되며, 상기 프레임을 정렬시키는 정렬부를 더 포함한다.It is disposed on the picker support, and further comprises an alignment for aligning the frame.

본 고안은 반도체 패키지 제조용 프레임 이송 장치 내에 이송되는 프레임의 수를 감지할 수 있는 다수의 센서를 배치시킴으로써 두 장 이상의 프레임이 이송 중 웨이퍼가 놓여져 있는 마운트 테이블에 떨어져 웨이퍼를 파손시키거나 두 장 이상의 프레임이 공정 장비에 투입되는 등의 공정 불량을 방지할 수 있어 공정 안정성을 향상시킬 수 있다.According to the present invention, by placing a plurality of sensors capable of detecting the number of frames to be transported in a frame transfer device for manufacturing a semiconductor package, two or more frames may fall on the mounting table on which the wafer is placed during transportation, thereby destroying the wafers or two or more frames. Process defects, such as being injected into the process equipment, can be prevented and process stability can be improved.

도 1은 본 고안의 실시예에 따른 반도체 패키지 제조용 프레임 이송 장치 및 이를 이용한 프레임의 이송 과정을 설명하기 위하여 도시한 도면.1 is a view illustrating a frame transfer apparatus for manufacturing a semiconductor package and a frame transfer process using the same according to an embodiment of the present invention;

도 2는 본 고안의 실시예에 따른 반도체 패키지 제조용 프레임 이송 장치의 센서부를 설명하기 위하여 도시한 도면.Figure 2 is a view showing for explaining a sensor unit of the frame transfer device for manufacturing a semiconductor package according to an embodiment of the present invention.

이하에서는, 본 고안의 실시예에 따른 반도체 패키지 제조용 프레임 이송 장치를 도면을 참조하여 상세히 설명하도록 한다.Hereinafter, a frame transfer apparatus for manufacturing a semiconductor package according to an embodiment of the present invention will be described in detail with reference to the drawings.

도 1은 본 고안의 실시예에 따른 반도체 패키지 제조용 프레임 이송 장치 및 이를 이용한 프레임의 이송 과정을 설명하기 위하여 도시한 도면이며, 도 2는 본 고안의 실시예에 따른 반도체 패키지 제조용 프레임 이송 장치의 센서부를 설명하기 위하여 도시한 도면이다.1 is a view illustrating a frame transfer apparatus for manufacturing a semiconductor package and a frame transfer process using the same according to an embodiment of the present invention, Figure 2 is a sensor of the frame transfer apparatus for manufacturing a semiconductor package according to an embodiment of the present invention It is a figure shown in order to demonstrate a part.

도 1 및 도 2를 참조하면, 본 고안에 따른 반도체 패키지 제조용 프레임 이송 장치(100)는 몸체부(110), 픽커(Picker)부(120), 프레임 홀더부(130), 제1센서부(140), 픽커 지지대(150) 및 프레임 이송부(170)를 포함하여 이루어진다.1 and 2, the frame transfer apparatus 100 for manufacturing a semiconductor package according to the present invention includes a body part 110, a picker part 120, a frame holder part 130, and a first sensor part ( 140, the picker support 150, and the frame transfer unit 170.

상기 몸체부(110)는 기둥 형태를 가지며, 내부에 반도체 제조 공정을 위해 웨이퍼가 배치되고 중앙부가 비어 있는 둥근 고리 형태를 가지고 다이 어태치 공정이 완료되고 표면에 부착되어 WBL 테이프 또는 UV 테이프가 제거된 프레임(180)들이 내부에 스택되어 저장되도록 다수개 배치된다.The body 110 has a columnar shape, a wafer is disposed therein for the semiconductor manufacturing process, and has a round ring shape with a hollow central portion. The die attach process is completed and attached to the surface to remove WBL tape or UV tape. The plurality of frames 180 are arranged to be stacked and stored therein.

상기 픽커부(120)는 상승 및 하강 가능하도록 구동되며, 반도체 제조 공정을 위해 상기 몸체부(110)들 내에 저장된 상기 프레임(180)을 상승시켜 외부로 반출시키도록 역할한다. 상기 프레임(180)은 상기 픽커부(120)에 구비된 진공홀(122)을 통한 진공으로 상기 픽커부(120)에 흡착되어 상승된다.The picker unit 120 is driven to ascend and descend, and serves to lift the frame 180 stored in the body parts 110 to be carried out to the outside for the semiconductor manufacturing process. The frame 180 is lifted up by being sucked by the picker unit 120 by a vacuum through the vacuum hole 122 provided in the picker unit 120.

상기 프레임 홀더부(130)는 상기 픽커부(120)에 의해 상승된 프레임(180)을 정렬(130)시키도록 역할하며, 상기 프레임(180)의 정렬을 위하여 다양한 형태를 가질 수 있다.The frame holder part 130 serves to align the frame 180 raised by the picker part 120, and may have various shapes for the alignment of the frame 180.

상기 제1센서부(140)는 상기 픽커부(120)에 의한 한번의 상승으로 이송되는 프레임(180)의 수를 감지하는 부분으로서, 상기 프레임 홀더부(130)로부터 돌출되지 않거나 또는 돌출된 형태로 배치된다. 상기 제1센서부(140)는 상기 상승되는 상기 프레임(180)에 광을 조사하여 반사되는 광량으로 상기 상승되는 프레임(180)의 수를 감지한다. 상기 제1센서부(140)는 정확하게 상기 상승되는 프레임(180)의 수를 감지하기 위하여 상기 프레임 홀더부(130)에 적어도 하나 이상 배치된다. The first sensor unit 140 detects the number of frames 180 transferred by the picker unit 120 in one lift, and does not protrude or protrude from the frame holder unit 130. Is placed. The first sensor unit 140 detects the number of the frame 180 to be raised by the amount of light reflected by irradiating light to the frame 180 to be raised. At least one first sensor unit 140 is disposed on the frame holder unit 130 in order to accurately detect the number of the frame 180 to be raised.

상기 각 몸체부(110)의 상부에는 상기 제1센서부(140)와 더불어 상승되는 프레임의 수를 감지할 수 있는 적어도 하나 이상의 제2센서부(170)가 배치되며, 상기 제2센서부(170)는 상기 상승되는 상기 프레임(180)에 광을 조사하여 반사되는 광량으로 상기 상승되는 프레임(180)의 수를 감지한다.At least one second sensor unit 170 that detects the number of frames that are raised together with the first sensor unit 140 is disposed on each of the body units 110, and the second sensor unit ( 170 detects the number of the frame 180 to be raised by the amount of light reflected by the light is irradiated to the frame 180 to be raised.

상기 픽커부(120) 및 프레임 홀더부(130)는 상기 몸체부(110)의 상부에 배치되는 픽커 지지부(150)에 부착되어 고정된다. 상기 픽커 지지부(150)에는 상기 프레임 홀더부(130)와 더불어 상기 프레임(180)을 정렬시키기 위한 정렬부(190)가 배치된다.The picker unit 120 and the frame holder unit 130 are attached to and fixed to the picker support unit 150 disposed above the body unit 110. The picker support part 150 is provided with an alignment part 190 for aligning the frame 180 together with the frame holder part 130.

상기 픽커 지지부(150)는 상기 픽커부(120)에 의해 상승된 상기 프레임(180)을 외부로 이송시키도록 역할하는 프레임 이송부(160)에 부착되어 고정된다. The picker support unit 150 is attached to and fixed to a frame transfer unit 160 which serves to transfer the frame 180 lifted by the picker unit 120 to the outside.

이상에서와 같이, 본 고안은 반도체 패키지 제조 공정을 위하여 웨이퍼가 부착되는 프레임의 이송시 상기 프레임이 두 장 이상 부착되어 이송되는 것이 방지되도록 반도체 패키지 제조용 프레임 이송 장치 내에 이송되는 프레임의 수를 감지할 수 있는 다수의 센서를 배치시킨다. As described above, the present invention can detect the number of frames to be transported in the frame transport apparatus for manufacturing a semiconductor package to prevent the at least two frames are attached and transported during the transport of the frame to which the wafer is attached for the semiconductor package manufacturing process. Deploy as many sensors as possible.

이에 따라, 종래 다이 어태치 공정이 완료되어 표면에 부착된 테이프가 제거된 상태로 스택되어 저장되는 프레임의 재사용을 위한 이송시, 상기 프레임에 부착되었던 테이프의 접착제가 완전히 제거되지 못하여 두 장 이상의 프레임이 이송되는 것을 방지할 수 있다. Accordingly, when the conventional die attach process is completed and the transfer for reuse of the frame that is stacked and stored with the tape attached to the surface removed, the adhesive of the tape attached to the frame may not be completely removed and thus two or more frames may be removed. This can be prevented from being transferred.

따라서, 상호 부착된 두 장 이상의 프레임이 이송 중 웨이퍼가 놓여져 있는 마운트 테이블에 떨어져 웨이퍼를 파손시키거나 두 장 이상의 프레임이 공정 장비에 투입되는 등의 공정 불량을 방지할 수 있어 공정 안정성을 향상시킬 수 있다.Therefore, it is possible to prevent process defects such that two or more frames attached to each other fall on the mounting table on which the wafers are placed during transfer and to prevent process defects such as two or more frames being introduced into the process equipment, thereby improving process stability. have.

이상, 여기에서는 본 고안을 특정 실시예에 관련하여 도시하고 설명하였지만, 본 고안이 그에 한정되는 것은 아니며, 이하의 특허청구의 범위는 본 고안의 정신과 분야를 이탈하지 않는 한도 내에서 본 고안이 다양하게 개조 및 변형될 수 있다는 것을 당업계에서 통상의 지식을 가진 자가 용이하게 알 수 있다.Hereinbefore, the present invention has been illustrated and described with reference to specific embodiments, but the present invention is not limited thereto, and the scope of the following claims may vary without departing from the spirit and field of the present invention. It can be easily understood by those skilled in the art that can be modified and modified.

Claims (9)

반도체 제조 공정을 위해 웨이퍼가 배치되는 프레임들이 스택되어 저장되도록 역할하는 다수의 몸체부;A plurality of body parts configured to stack and store frames in which wafers are disposed for a semiconductor manufacturing process; 상기 지지부들 내에 저장된 상기 프레임을 상승시키는 픽커(Picker)부;A picker unit for raising the frame stored in the support units; 상기 픽커부에 의해 상승되는 상기 프레임을 정렬(Align)시키도록 역할하는 프레임 홀더부;A frame holder portion which serves to align the frame lifted by the picker portion; 상기 홀더부의 측면에 부착되어 상기 픽커부에 의해 상승되는 상기 프레임의 수를 감지하는 제1센서부;A first sensor part attached to a side of the holder part to sense the number of frames lifted by the picker part; 를 포함하는 반도체 패키지 제조용 프레임 이송 장치.Frame transfer apparatus for manufacturing a semiconductor package comprising a. 제 1 항에 있어서,The method of claim 1, 상기 제1센서부는 적어도 하나 이상 배치된 것을 특징으로 하는 반도체 패키지 제조용 프레임 이송 장치.Frame transfer apparatus for manufacturing a semiconductor package, characterized in that at least one first sensor unit is disposed. 제 1 항에 있어서,The method of claim 1, 상기 몸체부의 측면에 배치된 제2센서부를 더 포함하는 것을 특징으로 하는 반도체 패키지 제조용 프레임 이송 장치.Frame transport apparatus for manufacturing a semiconductor package, further comprising a second sensor unit disposed on the side of the body portion. 제 1 항에 있어서,The method of claim 1, 상기 제2센서부는 적어도 하나 이상 배치된 것을 특징으로 하는 반도체 패키지 제조용 프레임 이송 장치.Frame transfer apparatus for manufacturing a semiconductor package, characterized in that at least one second sensor unit is disposed. 제 1 항에 있어서,The method of claim 1, 상기 픽커부는 승하강되도록 구동되는 것을 특징으로 하는 반도체 패키지 제조용 프레임 이송 장치.Frame picker for manufacturing a semiconductor package, characterized in that the picker is driven to move up and down. 제 1 항에 있어서,The method of claim 1, 상기 프레임을 진공으로 흡착하여 상승시키도록 상기 픽커부에 형성된 진공홀을 더 포함하는 것을 특징으로 하는 반도체 패키지 제조용 프레임 이송 장치.And a vacuum hole formed in the picker unit to lift and lift the frame by vacuum. 제 1 항에 있어서,The method of claim 1, 상기 픽커부 및 프레임 홀더부가 부착되는 픽커 지지부를 더 포함하는 것을 특징으로 하는 반도체 패키지 제조용 프레임 이송 장치.And a picker support part to which the picker part and the frame holder part are attached. 제 7 항에 있어서,The method of claim 7, wherein 상기 픽커 지지부가 고정되며, 상기 픽커부에 의해 상승된 상기 프레임을 이동시키는 프레임 이송부를 더 포함하는 것을 특징으로 하는 반도체 패키지 제조용 프레임 이송 장치.And a frame transfer unit fixed to the picker support unit and moving the frame lifted by the picker unit. 제 7 항에 있어서,The method of claim 7, wherein 상기 픽커 지지부에 배치되며, 상기 프레임을 정렬시키는 정렬부를 더 포함하는 것을 특징으로 하는 반도체 패키지 제조용 프레임 이송 장치.The frame transfer apparatus for manufacturing a semiconductor package, which is disposed on the picker support and further comprises an alignment unit for aligning the frame.
KR2020080004119U 2008-03-28 2008-03-28 Equipment of transfering frame for fabricating semiconductor package KR20090009973U (en)

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