KR20090005736A - 기판 가열 장치 - Google Patents
기판 가열 장치 Download PDFInfo
- Publication number
- KR20090005736A KR20090005736A KR1020070069018A KR20070069018A KR20090005736A KR 20090005736 A KR20090005736 A KR 20090005736A KR 1020070069018 A KR1020070069018 A KR 1020070069018A KR 20070069018 A KR20070069018 A KR 20070069018A KR 20090005736 A KR20090005736 A KR 20090005736A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- chamber
- reflector
- short wavelength
- lamp heater
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 195
- 238000010438 heat treatment Methods 0.000 title claims abstract description 51
- 239000010409 thin film Substances 0.000 claims abstract description 19
- 230000000903 blocking effect Effects 0.000 claims description 33
- 239000010408 film Substances 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 26
- 239000011261 inert gas Substances 0.000 claims description 8
- 238000001771 vacuum deposition Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 abstract description 3
- 230000006866 deterioration Effects 0.000 abstract description 2
- 239000011521 glass Substances 0.000 description 8
- 238000012986 modification Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- 230000031700 light absorption Effects 0.000 description 2
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070069018A KR20090005736A (ko) | 2007-07-10 | 2007-07-10 | 기판 가열 장치 |
PCT/KR2008/004060 WO2009008673A2 (en) | 2007-07-10 | 2008-07-10 | Substrate heating apparatus |
TW97126203A TWI433249B (zh) | 2007-07-10 | 2008-07-10 | 基板加熱裝置 |
CN200880023470A CN101689505A (zh) | 2007-07-10 | 2008-07-10 | 衬底加热装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070069018A KR20090005736A (ko) | 2007-07-10 | 2007-07-10 | 기판 가열 장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20090005736A true KR20090005736A (ko) | 2009-01-14 |
Family
ID=40229280
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070069018A KR20090005736A (ko) | 2007-07-10 | 2007-07-10 | 기판 가열 장치 |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR20090005736A (zh) |
CN (1) | CN101689505A (zh) |
TW (1) | TWI433249B (zh) |
WO (1) | WO2009008673A2 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103839854A (zh) * | 2012-11-23 | 2014-06-04 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 半导体加工设备及其去气腔室和加热组件 |
KR101796626B1 (ko) * | 2014-05-29 | 2017-11-13 | 에이피시스템 주식회사 | 기판 열처리 장치 |
US10711348B2 (en) * | 2015-03-07 | 2020-07-14 | Applied Materials, Inc. | Apparatus to improve substrate temperature uniformity |
JP6554328B2 (ja) | 2015-05-29 | 2019-07-31 | 株式会社Screenホールディングス | 熱処理装置 |
US10932323B2 (en) | 2015-08-03 | 2021-02-23 | Alta Devices, Inc. | Reflector and susceptor assembly for chemical vapor deposition reactor |
KR102407266B1 (ko) * | 2019-10-02 | 2022-06-13 | 세메스 주식회사 | 지지 유닛, 이를 포함하는 기판 처리 장치 및 기판 처리 방법 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR920009371B1 (ko) * | 1990-05-21 | 1992-10-15 | 재단법인 한국전자통신연구소 | 양면 가열형 급속열처리 장치 |
JP3224508B2 (ja) * | 1996-05-23 | 2001-10-29 | シャープ株式会社 | 加熱制御装置 |
JP2006279008A (ja) * | 2005-03-02 | 2006-10-12 | Ushio Inc | ヒータ及びヒータを備えた加熱装置 |
-
2007
- 2007-07-10 KR KR1020070069018A patent/KR20090005736A/ko not_active Application Discontinuation
-
2008
- 2008-07-10 WO PCT/KR2008/004060 patent/WO2009008673A2/en active Application Filing
- 2008-07-10 TW TW97126203A patent/TWI433249B/zh active
- 2008-07-10 CN CN200880023470A patent/CN101689505A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2009008673A3 (en) | 2009-03-05 |
CN101689505A (zh) | 2010-03-31 |
WO2009008673A2 (en) | 2009-01-15 |
TW200933778A (en) | 2009-08-01 |
TWI433249B (zh) | 2014-04-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |