KR20080112266A - 플라즈마 공정을 모니터 및 제어하기 위한 기술 - Google Patents
플라즈마 공정을 모니터 및 제어하기 위한 기술 Download PDFInfo
- Publication number
- KR20080112266A KR20080112266A KR1020087024313A KR20087024313A KR20080112266A KR 20080112266 A KR20080112266 A KR 20080112266A KR 1020087024313 A KR1020087024313 A KR 1020087024313A KR 20087024313 A KR20087024313 A KR 20087024313A KR 20080112266 A KR20080112266 A KR 20080112266A
- Authority
- KR
- South Korea
- Prior art keywords
- ions
- ion sensor
- drift tube
- plasma
- ion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000000034 method Methods 0.000 title claims description 39
- 238000012544 monitoring process Methods 0.000 title abstract description 8
- 230000008569 process Effects 0.000 title description 21
- 150000002500 ions Chemical class 0.000 claims abstract description 225
- 238000005259 measurement Methods 0.000 claims description 14
- 238000001514 detection method Methods 0.000 claims description 7
- 230000000737 periodic effect Effects 0.000 claims description 7
- 230000000903 blocking effect Effects 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 4
- 230000007547 defect Effects 0.000 claims description 2
- 230000003111 delayed effect Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 claims description 2
- 238000003795 desorption Methods 0.000 claims 1
- 210000002381 plasma Anatomy 0.000 description 83
- 235000012431 wafers Nutrition 0.000 description 24
- 238000009434 installation Methods 0.000 description 13
- 238000000605 extraction Methods 0.000 description 8
- 238000011065 in-situ storage Methods 0.000 description 8
- 238000009826 distribution Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000005070 sampling Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000005468 ion implantation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000004886 process control Methods 0.000 description 4
- 238000012937 correction Methods 0.000 description 3
- 239000007943 implant Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000007935 neutral effect Effects 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 230000005686 electrostatic field Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000001819 mass spectrum Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- BSYNRYMUTXBXSQ-UHFFFAOYSA-N Aspirin Chemical compound CC(=O)OC1=CC=CC=C1C(O)=O BSYNRYMUTXBXSQ-UHFFFAOYSA-N 0.000 description 1
- 101710121996 Hexon protein p72 Proteins 0.000 description 1
- 101710125418 Major capsid protein Proteins 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000013481 data capture Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000010249 in-situ analysis Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004949 mass spectrometry Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J49/00—Particle spectrometers or separator tubes
- H01J49/26—Mass spectrometers or separator tubes
- H01J49/34—Dynamic spectrometers
- H01J49/40—Time-of-flight spectrometers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32422—Arrangement for selecting ions or species in the plasma
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/244—Detectors; Associated components or circuits therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Biochemistry (AREA)
- Pathology (AREA)
- General Physics & Mathematics (AREA)
- Molecular Biology (AREA)
- Food Science & Technology (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Plasma Technology (AREA)
- Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
- Chemical Vapour Deposition (AREA)
- Electron Tubes For Measurement (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/371,907 | 2006-03-10 | ||
| US11/371,907 US7476849B2 (en) | 2006-03-10 | 2006-03-10 | Technique for monitoring and controlling a plasma process |
| US11/678,524 US7453059B2 (en) | 2006-03-10 | 2007-02-23 | Technique for monitoring and controlling a plasma process |
| US11/678,524 | 2007-02-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20080112266A true KR20080112266A (ko) | 2008-12-24 |
Family
ID=38319233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020087024313A Ceased KR20080112266A (ko) | 2006-03-10 | 2007-03-09 | 플라즈마 공정을 모니터 및 제어하기 위한 기술 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US7453059B2 (https=) |
| JP (1) | JP2009529765A (https=) |
| KR (1) | KR20080112266A (https=) |
| TW (1) | TW200739781A (https=) |
| WO (1) | WO2007106449A2 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9721768B2 (en) | 2015-04-07 | 2017-08-01 | Samsung Electronics Co., Ltd. | Apparatus for optical emission spectroscopy and plasma treatment apparatus |
| KR20210096310A (ko) * | 2019-03-25 | 2021-08-04 | 아토나프 가부시키가이샤 | 가스 분석 장치 |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7453059B2 (en) * | 2006-03-10 | 2008-11-18 | Varian Semiconductor Equipment Associates, Inc. | Technique for monitoring and controlling a plasma process |
| US7476849B2 (en) * | 2006-03-10 | 2009-01-13 | Varian Semiconductor Equipment Associates, Inc. | Technique for monitoring and controlling a plasma process |
| US7675730B2 (en) * | 2007-06-25 | 2010-03-09 | Varian Semiconductor Equipment Associates, Inc. | Techniques for detecting wafer charging in a plasma processing system |
| US9123509B2 (en) | 2007-06-29 | 2015-09-01 | Varian Semiconductor Equipment Associates, Inc. | Techniques for plasma processing a substrate |
| US20090004836A1 (en) * | 2007-06-29 | 2009-01-01 | Varian Semiconductor Equipment Associates, Inc. | Plasma doping with enhanced charge neutralization |
| US20090017229A1 (en) * | 2007-07-10 | 2009-01-15 | Varian Semiconductor Equipment Associates, Inc. | Processing System Platen having a Variable Thermal Conductivity Profile |
| US20090104761A1 (en) * | 2007-10-19 | 2009-04-23 | Varian Semiconductor Equipment Associates, Inc. | Plasma Doping System With Charge Control |
| US20090104719A1 (en) * | 2007-10-23 | 2009-04-23 | Varian Semiconductor Equipment Associates, Inc. | Plasma Doping System with In-Situ Chamber Condition Monitoring |
| US7888636B2 (en) * | 2007-11-01 | 2011-02-15 | Varian Semiconductor Equipment Associates, Inc. | Measuring energy contamination using time-of-flight techniques |
| US7586100B2 (en) * | 2008-02-12 | 2009-09-08 | Varian Semiconductor Equipment Associates, Inc. | Closed loop control and process optimization in plasma doping processes using a time of flight ion detector |
| US20090227096A1 (en) * | 2008-03-07 | 2009-09-10 | Varian Semiconductor Equipment Associates, Inc. | Method Of Forming A Retrograde Material Profile Using Ion Implantation |
| US7927986B2 (en) * | 2008-07-22 | 2011-04-19 | Varian Semiconductor Equipment Associates, Inc. | Ion implantation with heavy halogenide compounds |
| US20100019141A1 (en) * | 2008-07-25 | 2010-01-28 | Varian Semiconductor Equipment Associates, Inc. | Energy contamination monitor with neutral current detection |
| US20100048018A1 (en) * | 2008-08-25 | 2010-02-25 | Varian Semiconductor Equipment Associates, Inc. | Doped Layers for Reducing Electromigration |
| US20100155600A1 (en) * | 2008-12-23 | 2010-06-24 | Varian Semiconductor Equipment Associates, Inc. | Method and apparatus for plasma dose measurement |
| FR2942071B1 (fr) * | 2009-02-11 | 2011-04-08 | Horiba Jobin Yvon Sas | Lampe a decharge pour gds a champ magnetique axial |
| US8650002B2 (en) * | 2009-06-30 | 2014-02-11 | Lam Research Corporation | Determining plasma processing system readiness without generating plasma |
| US8698107B2 (en) * | 2011-01-10 | 2014-04-15 | Varian Semiconductor Equipment Associates, Inc. | Technique and apparatus for monitoring ion mass, energy, and angle in processing systems |
| DE102011004725A1 (de) * | 2011-02-25 | 2012-08-30 | Helmholtz-Zentrum Potsdam Deutsches GeoForschungsZentrum - GFZ Stiftung des Öffentlichen Rechts des Landes Brandenburg | Verfahren und Vorrichtung zur Erhöhung des Durchsatzes bei Flugzeitmassenspektrometern |
| JP5722125B2 (ja) * | 2011-06-03 | 2015-05-20 | 株式会社日立ハイテクノロジーズ | 質量分析装置 |
| DE102012200211A1 (de) * | 2012-01-09 | 2013-07-11 | Carl Zeiss Nts Gmbh | Vorrichtung und Verfahren zur Oberflächenbearbeitung eines Substrates |
| CN102623287B (zh) * | 2012-02-22 | 2015-03-11 | 北京交通大学 | 一种真空放电等离子体的离子流检测装置及方法 |
| US10128090B2 (en) * | 2012-02-22 | 2018-11-13 | Lam Research Corporation | RF impedance model based fault detection |
| US9029763B2 (en) * | 2013-08-30 | 2015-05-12 | Agilent Technologies, Inc. | Ion deflection in time-of-flight mass spectrometry |
| KR101406696B1 (ko) * | 2013-12-27 | 2014-06-11 | (주)제이오션 | 원격 플라즈마 소스를 위한 플라즈마 블록 |
| US9230773B1 (en) * | 2014-10-16 | 2016-01-05 | Varian Semiconductor Equipment Associates, Inc. | Ion beam uniformity control |
| US9627190B2 (en) | 2015-03-27 | 2017-04-18 | Agilent Technologies, Inc. | Energy resolved time-of-flight mass spectrometry |
| US10553411B2 (en) | 2015-09-10 | 2020-02-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Ion collector for use in plasma systems |
| TWI897405B (zh) * | 2019-03-25 | 2025-09-11 | 日商亞多納富有限公司 | 半導體製造系統、其控制方法及控制該系統的電腦程式 |
| US11521832B2 (en) * | 2020-01-10 | 2022-12-06 | COMET Technologies USA, Inc. | Uniformity control for radio frequency plasma processing systems |
| JP7050139B2 (ja) * | 2020-12-14 | 2022-04-07 | 東京エレクトロン株式会社 | 基板処理装置及び測定用基板 |
| CN113473675B (zh) * | 2021-06-03 | 2022-10-18 | 荣耀终端有限公司 | 光源电路及终端 |
| US20250308867A1 (en) * | 2024-03-29 | 2025-10-02 | Tokyo Electron Limited | High-performance adaptable sampling system |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3911314A (en) * | 1972-11-07 | 1975-10-07 | Strahlen Umweltforsch Gmbh | Ion gun for production of ion beams with particular radial current density profile |
| DE2947542A1 (de) * | 1979-11-26 | 1981-06-04 | Leybold-Heraeus GmbH, 5000 Köln | Einrichtung zur ueberwachung und/oder steuerung von plasmaprozessen |
| JPS60202646A (ja) * | 1984-03-26 | 1985-10-14 | Seiko Instr & Electronics Ltd | 二重アノ−ド型四重極分析計 |
| JPH0728695Y2 (ja) * | 1988-04-27 | 1995-06-28 | 日新電機株式会社 | イオン注入装置 |
| JPH03155038A (ja) * | 1989-11-10 | 1991-07-03 | Hitachi Ltd | 荷電粒子分析装置 |
| US5650616A (en) * | 1992-04-14 | 1997-07-22 | Olympus Optical Co., Ltd. | Apparatus and method for analyzing surface |
| US5218204A (en) * | 1992-05-27 | 1993-06-08 | Iowa State University Research Foundation, Inc. | Plasma sampling interface for inductively coupled plasma-mass spectrometry (ICP-MS) |
| US5784424A (en) * | 1994-09-30 | 1998-07-21 | The United States Of America As Represented By The United States Department Of Energy | System for studying a sample of material using a heavy ion induced mass spectrometer source |
| US5614711A (en) * | 1995-05-04 | 1997-03-25 | Indiana University Foundation | Time-of-flight mass spectrometer |
| JP3386287B2 (ja) * | 1995-05-08 | 2003-03-17 | 堀池 靖浩 | プラズマエッチング装置 |
| US5654543A (en) * | 1995-11-02 | 1997-08-05 | Hewlett-Packard Company | Mass spectrometer and related method |
| US5905258A (en) | 1997-06-02 | 1999-05-18 | Advanced Research & Techology Institute | Hybrid ion mobility and mass spectrometer |
| GB9801565D0 (en) * | 1998-01-23 | 1998-03-25 | Micromass Ltd | Method and apparatus for the correction of mass errors in time-of-flight mass spectrometry |
| US6987264B1 (en) * | 1998-01-23 | 2006-01-17 | Analytica Of Branford, Inc. | Mass spectrometry with multipole ion guides |
| US6101971A (en) * | 1998-05-13 | 2000-08-15 | Axcelis Technologies, Inc. | Ion implantation control using charge collection, optical emission spectroscopy and mass analysis |
| US6222186B1 (en) * | 1998-06-25 | 2001-04-24 | Agilent Technologies, Inc. | Power-modulated inductively coupled plasma spectrometry |
| US6137112A (en) * | 1998-09-10 | 2000-10-24 | Eaton Corporation | Time of flight energy measurement apparatus for an ion beam implanter |
| US6956205B2 (en) * | 2001-06-15 | 2005-10-18 | Bruker Daltonics, Inc. | Means and method for guiding ions in a mass spectrometer |
| JP2003086517A (ja) * | 2001-09-10 | 2003-03-20 | Japan Radio Co Ltd | プラズマcvd膜の形成方法及びプラズマcvd装置 |
| US6946653B2 (en) * | 2001-11-27 | 2005-09-20 | Ciphergen Biosystems, Inc. | Methods and apparatus for improved laser desorption ionization tandem mass spectrometry |
| EP1483775B1 (en) | 2002-03-08 | 2017-10-11 | Analytik Jena AG | A plasma mass spectrometer |
| US6831280B2 (en) * | 2002-09-23 | 2004-12-14 | Axcelis Technologies, Inc. | Methods and apparatus for precise measurement of time delay between two signals |
| WO2004051850A2 (en) | 2002-11-27 | 2004-06-17 | Ionwerks, Inc. | A time-of-flight mass spectrometer with improved data acquisition system |
| US20040195503A1 (en) * | 2003-04-04 | 2004-10-07 | Taeman Kim | Ion guide for mass spectrometers |
| US7071466B2 (en) * | 2004-04-19 | 2006-07-04 | Ngx, Inc. | Mass spectrometry system for continuous control of environment |
| US7878145B2 (en) | 2004-06-02 | 2011-02-01 | Varian Semiconductor Equipment Associates, Inc. | Monitoring plasma ion implantation systems for fault detection and process control |
| GB0424426D0 (en) * | 2004-11-04 | 2004-12-08 | Micromass Ltd | Mass spectrometer |
| US7432516B2 (en) * | 2006-01-24 | 2008-10-07 | Brookhaven Science Associates, Llc | Rapid cycling medical synchrotron and beam delivery system |
| US7476849B2 (en) * | 2006-03-10 | 2009-01-13 | Varian Semiconductor Equipment Associates, Inc. | Technique for monitoring and controlling a plasma process |
| US7453059B2 (en) * | 2006-03-10 | 2008-11-18 | Varian Semiconductor Equipment Associates, Inc. | Technique for monitoring and controlling a plasma process |
-
2007
- 2007-02-23 US US11/678,524 patent/US7453059B2/en not_active Expired - Fee Related
- 2007-03-09 KR KR1020087024313A patent/KR20080112266A/ko not_active Ceased
- 2007-03-09 JP JP2008558441A patent/JP2009529765A/ja not_active Ceased
- 2007-03-09 WO PCT/US2007/006244 patent/WO2007106449A2/en not_active Ceased
- 2007-03-12 TW TW096108396A patent/TW200739781A/zh unknown
-
2008
- 2008-11-18 US US12/272,537 patent/US20090283670A1/en not_active Abandoned
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9721768B2 (en) | 2015-04-07 | 2017-08-01 | Samsung Electronics Co., Ltd. | Apparatus for optical emission spectroscopy and plasma treatment apparatus |
| KR20210096310A (ko) * | 2019-03-25 | 2021-08-04 | 아토나프 가부시키가이샤 | 가스 분석 장치 |
| KR20220070339A (ko) * | 2019-03-25 | 2022-05-30 | 아토나프 가부시키가이샤 | 가스 분석 장치 |
| US11557469B2 (en) | 2019-03-25 | 2023-01-17 | Atonarp Inc. | Gas analyzer apparatus |
| US11942312B2 (en) | 2019-03-25 | 2024-03-26 | Atonarp Inc. | Gas analyzer apparatus |
| US12368032B2 (en) | 2019-03-25 | 2025-07-22 | Atonarp Inc. | Gas analyzer apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007106449A3 (en) | 2007-11-01 |
| WO2007106449A2 (en) | 2007-09-20 |
| US20070227231A1 (en) | 2007-10-04 |
| TW200739781A (en) | 2007-10-16 |
| US20090283670A1 (en) | 2009-11-19 |
| US7453059B2 (en) | 2008-11-18 |
| JP2009529765A (ja) | 2009-08-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7453059B2 (en) | Technique for monitoring and controlling a plasma process | |
| CN101401187B (zh) | 监测和控制等离子体制造工艺的技术 | |
| US8698107B2 (en) | Technique and apparatus for monitoring ion mass, energy, and angle in processing systems | |
| JP2009529765A5 (https=) | ||
| JP4803878B2 (ja) | プラズマ浸漬イオン注入ドーピング装置用のドーズ量モニター | |
| US7586100B2 (en) | Closed loop control and process optimization in plasma doping processes using a time of flight ion detector | |
| US7878145B2 (en) | Monitoring plasma ion implantation systems for fault detection and process control | |
| US6831272B2 (en) | Gas cluster ion beam size diagnostics and workpiece processing | |
| KR102325810B1 (ko) | 역 마그네트론 소스를 통한 기체 분석 | |
| US20100159120A1 (en) | Plasma ion process uniformity monitor | |
| EP0452767B1 (en) | Laser ionization sputtered neutral mass spectrometer | |
| JP6006322B2 (ja) | 質量分析装置および質量分離装置 | |
| Karkari et al. | A technique for obtaining time-and energy-resolved mass spectroscopic measurements on pulsed plasmas | |
| EP1533828B1 (en) | Ion detector | |
| JP7548156B2 (ja) | 質量分析装置 | |
| KR100824693B1 (ko) | 혼성 이온 전송 장치 | |
| KR20140051123A (ko) | 프로세싱 시스템들에서 이온 질량, 에너지, 및 각도를 감시하기 위한 기술 및 장치 | |
| AU2005284150B2 (en) | Flight time mass spectrometer | |
| JPH11154485A (ja) | 質量分析装置およびそれを備えるイオン注入装置 | |
| Appelhans et al. | Pulsed extraction field for neutralization of sample charging in secondary‐ion mass spectrometry | |
| US20140264005A1 (en) | Orthogonal acceleration tof with ion guide mode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20081002 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20120216 Comment text: Request for Examination of Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20130823 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20140228 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20130823 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |