KR20080112266A - 플라즈마 공정을 모니터 및 제어하기 위한 기술 - Google Patents

플라즈마 공정을 모니터 및 제어하기 위한 기술 Download PDF

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Publication number
KR20080112266A
KR20080112266A KR1020087024313A KR20087024313A KR20080112266A KR 20080112266 A KR20080112266 A KR 20080112266A KR 1020087024313 A KR1020087024313 A KR 1020087024313A KR 20087024313 A KR20087024313 A KR 20087024313A KR 20080112266 A KR20080112266 A KR 20080112266A
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KR
South Korea
Prior art keywords
ions
ion sensor
drift tube
plasma
ion
Prior art date
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Ceased
Application number
KR1020087024313A
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English (en)
Korean (ko)
Inventor
본웅 구
루도빅 고데트
바실리스 파나요티스 부르루미스
비크람 싱
지웨이 팡
버나드 지. 린제이
Original Assignee
베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크.
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Publication date
Priority claimed from US11/371,907 external-priority patent/US7476849B2/en
Application filed by 베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크. filed Critical 베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크.
Publication of KR20080112266A publication Critical patent/KR20080112266A/ko
Ceased legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J49/00Particle spectrometers or separator tubes
    • H01J49/26Mass spectrometers or separator tubes
    • H01J49/34Dynamic spectrometers
    • H01J49/40Time-of-flight spectrometers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32422Arrangement for selecting ions or species in the plasma
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/244Detectors; Associated components or circuits therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32917Plasma diagnostics
    • H01J37/32935Monitoring and controlling tubes by information coming from the object and/or discharge

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • General Physics & Mathematics (AREA)
  • Molecular Biology (AREA)
  • Food Science & Technology (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Plasma Technology (AREA)
  • Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electron Tubes For Measurement (AREA)
  • Drying Of Semiconductors (AREA)
KR1020087024313A 2006-03-10 2007-03-09 플라즈마 공정을 모니터 및 제어하기 위한 기술 Ceased KR20080112266A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11/371,907 2006-03-10
US11/371,907 US7476849B2 (en) 2006-03-10 2006-03-10 Technique for monitoring and controlling a plasma process
US11/678,524 US7453059B2 (en) 2006-03-10 2007-02-23 Technique for monitoring and controlling a plasma process
US11/678,524 2007-02-23

Publications (1)

Publication Number Publication Date
KR20080112266A true KR20080112266A (ko) 2008-12-24

Family

ID=38319233

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087024313A Ceased KR20080112266A (ko) 2006-03-10 2007-03-09 플라즈마 공정을 모니터 및 제어하기 위한 기술

Country Status (5)

Country Link
US (2) US7453059B2 (https=)
JP (1) JP2009529765A (https=)
KR (1) KR20080112266A (https=)
TW (1) TW200739781A (https=)
WO (1) WO2007106449A2 (https=)

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US9721768B2 (en) 2015-04-07 2017-08-01 Samsung Electronics Co., Ltd. Apparatus for optical emission spectroscopy and plasma treatment apparatus
KR20210096310A (ko) * 2019-03-25 2021-08-04 아토나프 가부시키가이샤 가스 분석 장치

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US7675730B2 (en) * 2007-06-25 2010-03-09 Varian Semiconductor Equipment Associates, Inc. Techniques for detecting wafer charging in a plasma processing system
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US20090004836A1 (en) * 2007-06-29 2009-01-01 Varian Semiconductor Equipment Associates, Inc. Plasma doping with enhanced charge neutralization
US20090017229A1 (en) * 2007-07-10 2009-01-15 Varian Semiconductor Equipment Associates, Inc. Processing System Platen having a Variable Thermal Conductivity Profile
US20090104761A1 (en) * 2007-10-19 2009-04-23 Varian Semiconductor Equipment Associates, Inc. Plasma Doping System With Charge Control
US20090104719A1 (en) * 2007-10-23 2009-04-23 Varian Semiconductor Equipment Associates, Inc. Plasma Doping System with In-Situ Chamber Condition Monitoring
US7888636B2 (en) * 2007-11-01 2011-02-15 Varian Semiconductor Equipment Associates, Inc. Measuring energy contamination using time-of-flight techniques
US7586100B2 (en) * 2008-02-12 2009-09-08 Varian Semiconductor Equipment Associates, Inc. Closed loop control and process optimization in plasma doping processes using a time of flight ion detector
US20090227096A1 (en) * 2008-03-07 2009-09-10 Varian Semiconductor Equipment Associates, Inc. Method Of Forming A Retrograde Material Profile Using Ion Implantation
US7927986B2 (en) * 2008-07-22 2011-04-19 Varian Semiconductor Equipment Associates, Inc. Ion implantation with heavy halogenide compounds
US20100019141A1 (en) * 2008-07-25 2010-01-28 Varian Semiconductor Equipment Associates, Inc. Energy contamination monitor with neutral current detection
US20100048018A1 (en) * 2008-08-25 2010-02-25 Varian Semiconductor Equipment Associates, Inc. Doped Layers for Reducing Electromigration
US20100155600A1 (en) * 2008-12-23 2010-06-24 Varian Semiconductor Equipment Associates, Inc. Method and apparatus for plasma dose measurement
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US8650002B2 (en) * 2009-06-30 2014-02-11 Lam Research Corporation Determining plasma processing system readiness without generating plasma
US8698107B2 (en) * 2011-01-10 2014-04-15 Varian Semiconductor Equipment Associates, Inc. Technique and apparatus for monitoring ion mass, energy, and angle in processing systems
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JP5722125B2 (ja) * 2011-06-03 2015-05-20 株式会社日立ハイテクノロジーズ 質量分析装置
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US10128090B2 (en) * 2012-02-22 2018-11-13 Lam Research Corporation RF impedance model based fault detection
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KR101406696B1 (ko) * 2013-12-27 2014-06-11 (주)제이오션 원격 플라즈마 소스를 위한 플라즈마 블록
US9230773B1 (en) * 2014-10-16 2016-01-05 Varian Semiconductor Equipment Associates, Inc. Ion beam uniformity control
US9627190B2 (en) 2015-03-27 2017-04-18 Agilent Technologies, Inc. Energy resolved time-of-flight mass spectrometry
US10553411B2 (en) 2015-09-10 2020-02-04 Taiwan Semiconductor Manufacturing Co., Ltd. Ion collector for use in plasma systems
TWI897405B (zh) * 2019-03-25 2025-09-11 日商亞多納富有限公司 半導體製造系統、其控制方法及控制該系統的電腦程式
US11521832B2 (en) * 2020-01-10 2022-12-06 COMET Technologies USA, Inc. Uniformity control for radio frequency plasma processing systems
JP7050139B2 (ja) * 2020-12-14 2022-04-07 東京エレクトロン株式会社 基板処理装置及び測定用基板
CN113473675B (zh) * 2021-06-03 2022-10-18 荣耀终端有限公司 光源电路及终端
US20250308867A1 (en) * 2024-03-29 2025-10-02 Tokyo Electron Limited High-performance adaptable sampling system

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Publication number Priority date Publication date Assignee Title
US9721768B2 (en) 2015-04-07 2017-08-01 Samsung Electronics Co., Ltd. Apparatus for optical emission spectroscopy and plasma treatment apparatus
KR20210096310A (ko) * 2019-03-25 2021-08-04 아토나프 가부시키가이샤 가스 분석 장치
KR20220070339A (ko) * 2019-03-25 2022-05-30 아토나프 가부시키가이샤 가스 분석 장치
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Also Published As

Publication number Publication date
WO2007106449A3 (en) 2007-11-01
WO2007106449A2 (en) 2007-09-20
US20070227231A1 (en) 2007-10-04
TW200739781A (en) 2007-10-16
US20090283670A1 (en) 2009-11-19
US7453059B2 (en) 2008-11-18
JP2009529765A (ja) 2009-08-20

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