KR20080096930A - Method of manufacturing antenna for radio frequency identification - Google Patents

Abstract

A manufacturing method of an RFID antenna prevents the short related to the RFID antenna of a loop pattern by printing conductive ink with a loop pattern on one side of a thin film substrate without electrical disconnection. An antenna unit(20) of a consecutive loop pattern is formed. A second terminal(23) has no short with a loop unit(21) and is extended toward the outside of the closed space of the loop unit. A cover layer(30) is coated on both sides of a thin-film substrate(10) in which the antenna unit is formed. The terminal nozzle hole in which the conductive metal foil of the first terminal and the second terminal or the conductive ink is exposed is punched in the thin-film substrate and cover layer of the location corresponding to the terminal(22a) of the first terminal(22) and terminal(23a) of the second terminal, before the conductive metal foil is laminated onto one side of the thin-film substrate, the conductive ink is printed on one side of the thin-film substrate, the cover layer is coated on both sides of the thin-film substrate.

Description

Method of manufacturing antenna for radio frequency identification

1 is a schematic front and rear view of an RFID antenna manufactured according to an exemplary RFID antenna manufacturing method according to the present invention;

2 to 4 is a process chart of the RFID antenna manufacturing method of FIG.

5 is a schematic front and back view of an RFID antenna manufactured according to another exemplary RFID antenna manufacturing method according to the present invention;

6 and 7 is a process chart of the RFID antenna manufacturing method of FIG.

8 is a front and back schematic view of a conventional exemplary RFID antenna applied to a cellular phone battery;

9 is a manufacturing process diagram of the RFID antenna of FIG. 8;

<Explanation of symbols for the main parts of the drawings>

1: RFID antenna of the present invention 2: conductive metal foil or conductive ink

10: thin film substrate 11: incision

11a: protrusion 12: incision

13, 31: terminal exposure hole 14: tangential wire

15: Terminal connection hole 16: Jig hole

20: antenna portion 21: loop portion

21a: closed space 22: first terminal portion

22a, 23a: terminal 23: second terminal portion

30: cover layer

(Technology)

The present invention relates to a method of manufacturing an RFID (Radio Frequency Identification) antenna, and more particularly, a manufacturing process of an RFID antenna applied to an RFID system installed in a limited space such as a mobile communication terminal is very simple. It relates to an RFID antenna manufacturing method that can significantly reduce the manufacturing cost.

(Background)

As is widely known, smart cards equipped with electronic chips equipped with storage, computing and security functions are used to record or identify information in almost all fields of the information and communication society such as finance, communication, education, administration, and transportation. It is widely used as a payment method such as electronic money, credit card or electronic bank account.

Smart cards are classified into various types according to their classification criteria, but may be classified into contact smart cards, contactless smart cards, and combined smart cards, depending on how the data is read.

The contact smart card refers to a form in which the electronic chip is activated by contacting the contact point of the electronic chip with the contact point of the interface device. In the contactless smart card, the operation element and the memory element required for the information processing function are the same as the contact type. It is a form of power supply through the antenna connected to the electronic chip and electromagnetic induction is used for communication with the interface device.Combined smart card is a smart card that supports both contact and non-contact functions. It is a smart card configured to share parts that can be shared in a contactless / contactless manner within an electronic chip of a chip.

Traditionally, smart cards are generally embedded in plastic cards such as credit cards and transportation cards, but as smart card applications are expanded and various mobile communication terminals represented by mobile phones are becoming a necessity, smart cards Rather than the plastic card type has developed into a form that is embedded in the mobile communication terminal.

As a representative example of applying a smart card to a mobile communication terminal, a non-contact smart card (or a combined card such as a combi card) is embedded in the mobile phone, so that the mobile phone can be pre-paid after a 13.56 MHz contactless wireless communication with a card reader. It is intended to be used for various purposes such as transportation fee payment, credit settlement, electronic bank account, loyalty management, and identity verification.

In addition to mounting a smart card (contactless smart card or combination card) that has a non-contact function in a mobile communication terminal, recently, an RFID reader that can read information recorded on an RFID tag is also equipped with a mobile terminal for reading an RFID tag. Also, a technology that can utilize the RFID reader is proposed, and a representative example in which an RFID reader is applied is not only a function of an RFID tag that is mounted on a mobile communication terminal and reads information stored through wireless communication with an external RFID reader, but also with an external RFID tag. A standard NFC (Near Field Communication) technology has also been proposed, which also serves as an RFID reader capable of reading information of an external RFID tag through wireless communication.

As the RFID system is integrated into the mobile communication terminal, the RFID mobile communication terminal needs to have an RFID system in addition to a unique circuit. In general, in such an RFID mobile communication terminal, an electronic chip is installed in the main body of the mobile communication terminal, Is installed in the battery detachably mounted to the mobile communication terminal body.

In the case of a conventional credit card (or transportation card, etc.) in which an RFID system is mounted on a plastic card, there are no elements in the card that interfere with the induced electromotive force of the antenna. It was relatively easy to design an RFID antenna because it was possible to fabricate an RFID antenna with a loop pattern so that the RFID antenna could be fabricated (a RFID antenna is also called a loop antenna because the antenna is wound around a loop pattern to show the desired antenna characteristics).

However, in arranging an RFID antenna in a mobile communication terminal such as a cellular phone, it is necessary to minimize the influence of the electromagnetic shielding device applied to the mobile communication terminal on wireless communication of the RFID antenna in order to block the risk of electromagnetic waves. Due to the compactness, one of the trends of the terminal, the optimum position of the RFID antenna is a battery.

In addition, even when the RFID antenna is installed in the battery of the mobile communication terminal, there is not enough space for the antenna to be placed in the battery. In order to reduce the occupied volume and increase the reliability of the product, the RFID antennas used in the mobile communication terminals are etched in a loop pattern by using a loop pattern. I am designing an antenna.

8 is a schematic view of the surface A and back B of a conventional exemplary RFID antenna applied to a cellular phone battery.

As shown, the conventional RFID antenna 100 is a copper foil (101, copper film: ie, about 35㎛ thickness laminated on the front and rear surfaces of the thin film substrate 110 (eg, about 25㎛ thick) made of polyimide, etc. ) To design the antenna unit 120 by etching in a loop pattern, the annular loop portion 121 and the first terminal portion 122 is formed on one side of the thin film substrate 110 and the thin film substrate 110 The second terminal part 123 is formed on the other side, while the via hole 111 is drilled in the thin film substrate 110 to plate the copper in the via hole 111, and thus the roof part 121 positioned on different surfaces. One end of the second terminal portion 123 and the electrical connection is made.

A method of manufacturing a conventional RFID antenna 100 will be described with reference to FIG.

As shown, the conventional RFID antenna 100, with respect to the polyimide thin film substrate 110, the copper foil 101 is laminated on the entire surface of the front and rear surfaces (see A in Fig. 9), the loop portion 121 and A step of drilling the via hole 111 at a position corresponding to the connection point of the second terminal portion 123 (see FIG. 9B), and the via hole 111 is copper plated 112 so that the surface of the thin film substrate 110 is formed. A process of electrically connecting the loop portion 121 and the second terminal portion 123 electrically located on the back surface (see C of FIG. 9), and the thin film substrate 110 to match the pattern of the entire antenna portion 120. The copper foil 101 on the front surface and the rear surface of the thin film substrate 110 is exposed and etched to form a loop portion 121 and a first terminal portion 122 on the surface of the thin film substrate 110, and a second terminal portion 123 on the back surface of the thin film substrate 110. 9), and the front and rear surfaces of the thin film substrate 110 on which the antenna unit 120 is formed, the cover layer 130 of polyimide or the like (eg, 12.5 μm). After coating (laminating), forming the terminals (122a, 123a) in the first terminal portion 122 and the second terminal portion 123, and pressing and removing unnecessary portions around the formed antenna 100 (Fig. 9) Prepared by E).

In general, such a conventional RFID antenna 100, after forming a plurality of antennas simultaneously on a sheet-like thin film substrate 110, which can design a plurality of RFID antennas to meet the contour of the individual antenna unit 120 at the end Press cutting to fabricate multiple RFID antennas at once.

The conventional manufacturing process of the RFID antenna includes some additional processes in addition to the above-described main process, but the above manufacturing process outlines the processes in contrast to the features of the RFID antenna according to the present invention and is directly related to the present invention. Missing processes are omitted.

In the manufacture of a conventional RFID antenna, a material (double-sided copper foil material) in which copper foils were laminated on both sides of the polyimide thin film substrate 110 was inevitably used. The material in which the copper foil 101 was laminated only on one surface of the thin film substrate 110 ( In the case of using a single-sided copper foil material, when the second terminal portion 123 is drawn out from the inside of the roof portion 121 to the outside, a short occurs because the loop portion 121 and the second terminal portion 123 cross each other. It is inevitable.

As a result, the conventional RFID antenna is a double-sided copper foil material in order to avoid the short-circuit generated in the unavoidable cross wiring of the second terminal portion 123 and the roof portion 121 in the design of the loop antenna RFID antenna. It was not possible to avoid the complicated process of forming via holes and plating, and to use an expensive material in which copper foil was laminated on both sides of the thin film substrate to form the antenna unit 120 having a loop-shaped pattern. In addition, since most of the copper foils stacked on both sides are discarded by etching, it was difficult to reduce the cost of the RFID antenna, and also caused a waste of resources, environmental pollution, and increased wastewater treatment costs.

MEANS TO SOLVE THE PROBLEM In order to solve the problem related to the conventional RFID antenna of the loop pattern used for a limited space, the "RFID antenna and its manufacturing method" of Korean Patent Application No. 10-2007-0027908 (filed March 22, 2007) In the RFID antenna of the '908, the thin film substrate 10 and the conductive metal foil 2 laminated on one side of the thin film substrate 10 or one side surface of the thin film substrate 10 have been proposed. An antenna portion 20 of a continuous loop pattern without disconnection formed by printing the conductive ink 2 on the substrate; The antenna portion 20 includes an annular loop portion 21 and a first terminal portion 22 extended outside the closed ring 21a of the loop portion 21 so as not to intersect the loop portion 21. And a second terminal portion (23) extending into the closed ring (21a) of the loop portion (21) so as not to intersect the loop portion (21); The thin film substrate 10 is cut around a portion of the second terminal portion 23 so that the cut portion 11 is the thin film substrate 10 in which the conductive metal foil 2 or the conductive ink 2 does not exist. An RFID antenna, which is folded toward the other side of the second terminal portion 23 and extends outside the closed ring 21a of the loop portion 21 without a short with the loop portion 21; Method of manufacturing the same '(wherein the reference numeral used herein is the same as that of Fig. 1 of the present invention).

With the provision of the RFID antenna of the '908, it is possible to simply form a loop pattern without a short hole without via hole drilling and plating process while using a material in which conductive metal foil is laminated on only one side of the thin film substrate, not on both sides. Conductive ink can be printed in a loop pattern on one side without electrical disconnection, thereby reducing RFID antenna manufacturing cost, minimizing resource waste and environmental pollution, and solving short problems.

However, in the case of the RFID antenna of '908, the antenna portion is formed only on one side of the thin film substrate (eg, polyimide sheet), and then the cutout is folded to the other side (the opposite side), so that the conductive metal foil or conductive ink of the first terminal portion Since the back surface of the thin film substrate is laminated on the surface of the substrate and the conductive metal foil or the conductive ink of the second terminal portion is laminated, and the cover layer is laminated on both sides thereof, the first terminal portion and the second terminal portion In forming a terminal for soldering or the like to a battery protection circuit (PCM), there is an inconvenience in that the thin film substrate and the cover layer laminated at the end have to be peeled off.

An object of the present invention is to solve the problems related to the conventional RFID antenna of the loop pattern applied to a limited environment, such as a mobile communication terminal as described above, the manufacturing process is simple, and the associated cost can be saved, resource consumption And to provide a method for manufacturing an RFID antenna that can minimize environmental pollution.

Another object of the present invention relates to an RFID antenna in which a metal foil (for example, copper foil) laminated on a thin film substrate is etched to form a loop pattern, and a complicated process such as via hole plating is used while a metal foil is laminated on only one surface thereof. By providing an RFID antenna manufacturing method capable of forming a loop pattern without a short circuit, it is intended to reduce the manufacturing cost of the RFID antenna and minimize resource waste and environmental pollution.

Still another object of the present invention relates to an RFID antenna in which a conductive ink is printed on a thin film substrate to form a loop pattern, and an RFID antenna capable of printing the conductive ink on one side of the thin film substrate in a loop pattern without electrical disconnection. By providing a manufacturing method, it is intended to solve the short problem related to the RFID antenna of the loop pattern.

It is still another object of the present invention to manufacture an RFID antenna in which a loop pattern antenna portion is formed on only one side, not on both sides of a thin film substrate, and then the cutout portion is folded to form the first terminal portion and the second terminal portion of the continuous antenna portion without disconnection. With regard to the method, in order to minimize the inconvenience of the terminal forming work that requires peeling off the thin film substrate and the cover layer laminated at the ends of the first terminal portion and the second terminal portion in forming terminals at the ends of the first terminal portion and the second terminal portion. It is.

Another object of the present invention is to form a part of the antenna by etching the conductive metal foil and printing the conductive ink on one side of the thin film substrate, while the remaining portion of the antenna portion of the conductive metal foil laminated and conductive ink on the other side of the thin film substrate Formed by printing and electrically disconnected antenna parts are electrically connected to the thin film substrate through a connection in a terminal hole which is pre-drilled, thereby forming an antenna part by etching conductive metal foils on both sides of the thin film substrate, An object of the present invention is to provide a method of manufacturing an RFID antenna that does not apply via plating.

According to the present invention, there is provided a method of manufacturing an RFID antenna of the first embodiment.

RFID antenna manufacturing method of the first embodiment according to the present invention, by etching the conductive metal foil of the thin film substrate on which the conductive metal foil is laminated on one side or by printing a conductive ink on one side of the thin film substrate, an annular loop portion, A continuous loop pattern without disconnection, having a first terminal portion extended out of the closed space of the loop portion so as not to intersect the loop portion, and a second terminal portion extended into the closed space of the loop portion so as not to intersect the loop portion Forming an antenna unit; The cutout formed by cutting the thin film substrate along a portion of the second terminal portion is folded toward the other side of the thin film substrate on which the conductive metal foil or the conductive ink does not exist, so that the second terminal portion is the loop portion. Extending out of the closed space of the loop portion without a short; And covering cover layers on both sides of the thin film substrate on which the antenna unit is formed. It includes.

RFID antenna manufacturing method of the first embodiment, before the conductive metal foil is laminated on one side of the thin film substrate, before printing the conductive ink on one side of the thin film substrate, and the cover on both sides of the thin film substrate Before the layer is coated, the conductive metal foil or the conductive material is formed on the thin film substrate and the cover layer at positions corresponding to the terminals of the first terminal portion and the terminals of the second terminal portion. And drilling a terminal exposure hole for exposing the ink.

Preferably, prior to laminating the conductive metal foil on the thin film substrate and before printing the conductive ink on one side of the thin film substrate, on the thin film substrate at a position corresponding to the fold line of the second terminal portion to be folded, And drilling a terminal portion connecting hole for allowing the conductive metal foil or the conductive ink of the folded second terminal portion of the folded portion to be electrically connected over a predetermined area.

Preferably, in the process of drilling the terminal exposure hole, a jig hole in which the jig for mounting the folded second terminal portion of the cutout portion to be maintained in the correct position is mounted at the position adjacent to the terminal exposure hole of the second terminal portion. The method further includes a step of puncturing the substrate.

According to the present invention, there is provided a method of manufacturing an RFID antenna of a second embodiment.

RFID antenna manufacturing method of the second embodiment according to the present invention, by etching the conductive metal foil of the thin film substrate laminated conductive metal foil on one side or by printing a conductive ink on one side of the thin film substrate, the annular loop portion and the loop Forming a part of the antenna part of the loop pattern having a first terminal part extending out of the closed space of the loop part so as not to intersect the part; The conductive metal foil is laminated on the other side of the thin film substrate or the conductive ink is printed on the other side of the thin film substrate so that the end portion of the thin film substrate is overlapped with a predetermined distance so that one end thereof is electrically connected over a predetermined area. Forming a second terminal portion, which is the remaining portion of the antenna portion, extended from the inside of the closed space of the loop portion to the outside; And covering cover layers on both sides of the thin film substrate on which the antenna unit is formed. It includes.

According to the second aspect of the present invention, a method of manufacturing an RFID antenna includes an end portion of the roof portion and one end of the second terminal portion before laminating the conductive metal foil on the thin film substrate and before printing the conductive ink on the thin film substrate. And drilling a terminal portion connecting hole in the thin film substrate at a position corresponding to the overlapping position, so that an end portion of the loop portion and one end of the second terminal portion are electrically connected over a predetermined area.

Hereinafter, a manufacturing method of an RFID antenna according to the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are merely illustrative of the manufacturing method of the RFID antenna according to the present invention, and are not intended to limit the scope of the present invention.

The RFID antenna 1 manufactured by the method of manufacturing an RFID antenna according to the present invention shown in Figs. 1 to 7 is mounted on a battery of a mobile communication terminal, such as a mobile phone, for example, an electronic chip installed in a mobile communication terminal base. In a state of being electrically connected to the electronic chip, for example, a predetermined contactless function mounted on the electronic chip through, for example, 13.56 MHz short-range wireless communication (e.g. payment of post-paid transportation fee, credit settlement, electronic account, loyalty management, identification, etc.) This is the RFID antenna to be realized.

First embodiment

A first specific example of the RFID antenna manufacturing method according to the present invention is an improvement of the RFID antenna manufacturing method of the aforementioned patent application No. 10-2007-0027908, and features the first specific example added to the antenna manufacturing method of '908. The process (terminal exposure hole drilling process) to be achieved is a process that is performed beforehand as a pre-process of the antenna manufacturing method of '908, and in the order of the process, the terminal exposure hole drilling process, which is the first process, should first be described. In order to explain the exposure hole drilling process, it is necessary to understand the antenna manufacturing method of '908. Therefore, the antenna manufacturing method of' 908, which forms part of the RFID antenna manufacturing method of the first embodiment, is applied to the case of applying the conductive metal foil 2 and Divided into the case of applying the conductive ink 2 will be described first, and then the terminal exposure hole drilling process will be described.

(One). When applying conductive metal foil

As shown in Figs. 1 to 4, the RFID antenna 1 manufactured according to the first embodiment is a thin film substrate 10 made of polyimide or the like as a conventional conventional RFID antenna. Thickness) is a basic structure in which the antenna portion 20 of the loop pattern is designed.

The RFID antenna 1 manufactured according to the first embodiment has a conductive metal foil (e.g., thickness of about 35 µm) represented by copper foil on one side of the thin film substrate 10 (surface in A of FIG. 1). Only laminated on the conductive metal foil 2 is formed by the antenna portion 20 of the loop pattern through the etching process.

The antenna unit 20 is an annular loop portion 21 wound many times and a closed space 21a of the loop portion 21 so as not to intersect the loop portion 21 from one end of the loop portion 21. Space between the first terminal portion 22 extended to the outside and the closed portion 21a of the roof portion 21 so as not to intersect the loop portion 21 from the other end of the loop portion 21. It is set as the structure containing the 2nd terminal part 23 extended.

That is, in the conventional RFID antenna, the loop portion and the first terminal portion are electrically disconnected from the second terminal portion, so that the second terminal portion is electrically connected to the loop portion through plating of the via hole. The entire antenna section 20 is electrically continuous without disconnection.

In the thin film substrate 10 of the RFID antenna 1 of the first embodiment, a cutout portion 11 cut around a part of the second terminal portion 23 is formed. The cutout portion 11 is formed around the second terminal portion 23 at a position such that the conductive metal foil 2 of the antenna portion 20 is not disconnected, and in the accompanying drawings, the side connected to the loop portion 21. The cutout 11 is formed by cutting three surfaces of the excluded second terminal portion 23 in a U shape.

The cutout 11 is folded toward the other side (the surface in B of FIG. 1) of the thin film substrate 10 on which the conductive metal foil 2 is not laminated, whereby the second terminal portion 23 is connected to the roof portion 21. It extends from the inside of the closed space 21a of the roof part 21 to the exterior in the absence of a short. In the illustrated embodiment, according to the folding of the cutout part 11, the second terminal part 23 may be spaced apart from the first terminal part 22 in parallel with the thin film substrate 10 overlapped in two layers. Is placed.

According to the characteristic structure of the RFID antenna 1 manufactured by the first embodiment as described above, the conductive metal foil 2 forming the antenna unit 20 is laminated on only one side of the thin film substrate 10 without disconnection. Since it is connected, it is not necessary to use a material in which the conductive metal foil 2 is laminated on both sides of the thin film substrate 10 as in the prior art, and there is no need to apply a via hole plating process for connecting the disconnected antenna unit.

2 to 4, the RFID antenna manufacturing method of the first embodiment except for the terminal exposure hole drilling step (first step) will be described.

In the second step of the method for manufacturing an antenna according to the first embodiment, the conductive metal foil 2 of the thin film substrate 10 (see B in FIG. 2) in which the conductive metal foil 2 is laminated on only one side is etched. This is a step of forming the antenna portion 20 of the illustrated loop pattern (see C of FIG. 2). As described above, the antenna unit 20 has an annular loop portion 21 and a first terminal portion 22 extended outside the closed space 21a of the loop portion 21 so as not to intersect the loop portion 21. And a second terminal portion 23 extending into the closed space 21a of the loop portion 21 so as not to intersect the loop portion 21, and such an antenna portion 20 is electrically continuous without disconnection. .

The process of forming the antenna portion 20 of the loop pattern by exposing and etching the conductive metal foil 2 laminated on one side of the thin film substrate 10 is manufactured of a flexible printed circuit board (FPCB), which is widely used in the related art. Techniques and the like can be applied and implemented in accordance with the present invention.

In a third process of the method of manufacturing an RFID antenna according to the first embodiment, the thin film substrate 10 is cut along a portion of the second terminal part 23 (D in FIG. 3), and the cut out part 11 is cut. The conductive metal foil 2 is folded to the side where it is not laminated (the other side of the thin film substrate), so that the second terminal portion 23 is short with the roof portion 21 and inside the closed space 21a of the roof portion 21. From the outside to the outside (see FIG. 3E).

In this process, in forming the antenna of the loop pattern in the two-dimensional plane, one end of the loop portion 21 (that is, the first terminal portion 22) exists outside the closed space 21a of the loop portion 21, but the other The end portion (ie, the second terminal portion 23) may be located inside the closed space 21 a, and the second terminal portion 23 inside the closed space 21 a may not be shorted with the loop portion 21. The situation of drawing out to the outside is solved by folding the second terminal portion 23 to the other side of the thin film substrate 10 on which the conductive metal foil 2 is not laminated.

In a fourth process of the method of manufacturing an RFID antenna according to the first embodiment, the cover layers 30 made of a material such as polyimide are formed on both surfaces of the thin film substrate 10 on which the antenna unit 20 is formed. The process of protecting the antenna part 20 by covering (stacking) the thickness of the inside and outside of micrometers (refer FIG. 4F). This process can also be carried out by adapting the generalized coating techniques in the art to this invention.

In the RFID antenna manufacturing method of the first embodiment, a step of folding the cutout portion 11 and stacking the cover layer 30 thereon is included. When the cover layer 30 is stacked, the first terminal portion 22 and It is preferable that the cutout 11 be folded well on the other side of the thin film substrate 10 in a state in which the second terminal portion 23 is disposed parallel to the proper position.

To this end, as shown in FIGS. 3D to 4F, in the process of forming the cutout 11, a small protrusion 11a is formed on the thin film substrate 10 on both sides of the cutout 11. In addition, the incision line 12 is formed on the thin film substrate 10 at a position corresponding to the position of the protrusion 11a in a state where the incision 11 is folded, and thus when the incision 11 is folded, the protrusion ( By inserting 11a) into the incision line 12, the incision 11 may be fixed to the thin film substrate 10. In the accompanying drawings, an example in which the protrusions 11a are formed on both sides of the cutout 11 is illustrated, but the positions thereof may be differently disposed, such as one formed on the top surface of the cutout 11. The projections 11a and the incision 12 are all removed in the subsequent cutting process so that they do not remain in the finally manufactured RFID antenna 1 (see G in FIG. 4).

The cutout 11 including the projection 11a shown in FIG. 1 is actually a trace of the cutout 11 that penetrates the thin film substrate 10 after folding the cutout 11, but not the cutout portion. Reference numeral 11 was given. In FIG. 1, the portion indicated by the cutout 11 is a state in which only the upper and lower cover layers 30 remain without the thin film substrate 10.

After the cover layer 30 is formed, the terminals 22a and 23a are formed in the first terminal portion 22 and the folded second terminal portion 23, respectively, and then cut to fit the outer contour of the antenna portion 20. Complete the RFID antenna (see G in FIG. 4).

Terminals 22a and 23a may be electrically connected to an electronic chip located in a main body of a mobile communication terminal by connecting the RFID antenna 1 to a battery of a mobile communication terminal such as a cellular phone, for example, by connecting a battery protection circuit. In general, tin copper plating or gold plating is applied to the terminals of the first terminal portion and the second terminal portion to form terminals that can be connected to other circuits.

(2). When applying conductive ink

The RFID antenna of the loop pattern is not currently widely applied in addition to the method of etching the conductive metal foil laminated on the thin film substrate described above, but a conductive pattern such as silver-nano ink is directly applied to the surface of the thin film substrate. It can also be formed by a printing method.

The problem that a short does not generate | occur | produce by the intersection of a roof part and a 2nd terminal part when drawing a 2nd terminal part from the inside of the closed space of the loop part demonstrated with reference to FIG. The same applies to RFID antennas.

Therefore, in the case of printing a loop pattern with conductive ink by the conventional printing method, the entire antenna portion (loop portion, first terminal portion and second terminal portion) cannot be printed continuously without disconnection. As described with reference to the reference, a complicated process of electrically connecting the loop portion and the second terminal portion without a short by a separate process such as plating the via hole after printing the second terminal portion disconnected from the loop portion is required.

The RFID antenna manufacturing method according to the first embodiment described above may be applied to an RFID antenna which forms a loop pattern by printing conductive ink on a thin film substrate. Hereinafter, the conductive ink may be applied with reference to FIGS. 1 to 4. An example is demonstrated.

The RFID antenna 1 manufactured according to the manufacturing method of applying the conductive ink has a conductive ink directly formed on one side of the thin film substrate 10 instead of etching the conductive metal foil 2 to form the antenna unit 20. 2) Except for the configuration of printing the antenna unit 20 of the loop pattern, since it is substantially the same as the method of applying the conductive gold foil described above, description of the same content as the case of applying the conductive metal foil 2 is omitted. In addition, it will be described using the same '2' as the conductive metal foil without reference to a separate drawing the conductive ink reference number.

In the case of applying conductive ink, the RFID antenna 1 also includes a thin film substrate 10 and an antenna unit having a continuous loop pattern without disconnection formed by printing the conductive ink 2 on one side of the thin film substrate 10. 20). The antenna portion 20 includes an annular loop portion 21, a first terminal portion 22 extending outside the closed space 21a of the loop portion 21 so as not to intersect the loop portion 21, and a loop. The second terminal portion 23 extends into the closed space 21a of the roof portion 21 so as not to intersect the portion 21.

The thin film substrate 10 is cut around a portion of the second terminal portion 23 so that the cut portion 11 is folded toward the other side of the thin film substrate 10 in which the conductive ink 2 does not exist, and thus the second terminal portion 23 extends outside the closed space 21a of the roof portion 21 without a short with the roof portion 21.

Similar to the case where the conductive metal foil 2 is applied, the RFID antenna manufacturing method using the conductive ink 2 also includes the printing of the conductive ink 2 on one side of the thin film substrate 10 to form an annular loop portion 21. The first terminal portion 22 extended out of the closed space 21a of the roof portion 21 so as not to intersect the loop portion 21, and the closed space of the loop portion 21 so as not to cross the loop portion 21. (21a) forming an antenna portion 20 of a continuous loop pattern without disconnection, having a second terminal portion 23 extending therein; The cutout portion 11 formed by cutting the thin film substrate 10 along a portion of the second terminal portion 23 is folded toward the other side of the thin film substrate 10 in which the conductive ink 2 does not exist. Allowing the second terminal portion 23 to extend out of the closed space 21a of the loop portion 21 without a short with the loop portion 21; And covering the cover layer 30 on both surfaces of the thin film substrate 10 on which the antenna unit 20 is formed.

According to the RFID antenna manufacturing method of the first embodiment to which the conductive ink 2 described above is applied, the entire antenna unit 20 can be continuously printed with the conductive ink 2 on one side of the thin film substrate 10 without disconnection. Since it is possible to print the second terminal part disconnected from the loop part, a separate via hole plating process eliminates the difficulty of connecting the loop part and the second terminal part electrically without a short.

(3). Drilling process of terminal exposure

Hereinafter, with reference to FIGS. 1-4, the 1st process of a 1st specific example is demonstrated. The first step is a step (terminal exposure hole drilling step) which is executed in advance before the second to fourth steps of the RFID antenna manufacturing method according to the first embodiment, and finally after the fourth step, the terminal 22a is performed. , 23a is a preliminary step for forming terminals 22a and 23a more conveniently and productively in finally completing the RFID antenna.

The RFID antenna manufactured using only the antenna manufacturing method of '908 applying the conductive metal foil and the conductive ink described above has a structure of folding a cutout including a second terminal part after stacking the conductive metal foil or conductive ink only on one side of the thin film substrate. The first terminal portion 22 has the conductive metal foil 2 or the conductive ink 2 laminated on the surface of the thin film substrate 10, and the second terminal portion 23 has the conductive metal foil or conductive ink formed on the back surface of the thin film substrate 10. Since the cover layer 30 is stacked again on the first terminal part 22, the first terminal part 22 is formed to form the terminals 22a and 23a at the ends of the first terminal part 22 and the second terminal part 23. ) And the thin film substrate 10 and the cover layer 30, which are stacked on the ends of the second terminal portion 23, have to be peeled off. This inconvenience can be solved by applying the first process.

In the terminal exposure hole drilling process of the first process, as shown in FIG. 2, the conductive ink is deposited on one side of the thin film substrate 10 before the conductive metal foil 2 is laminated on one side of the thin film substrate 10. Before printing (2) and before covering the cover layer 30 on both sides of the thin film substrate 10, the thin film substrate at a position corresponding to the ends of the first terminal portion 22 and the second terminal portion 23. The terminal exposure holes 13 and 31 are formed in the size of the terminals 22a and 23a at the ends of the first terminal portion 22 and the second terminal portion 23 in the 10 and the cover layer 30, respectively. ) Is the process of drilling each.

In the illustrated embodiment, the terminal exposure hole 13 of the thin film substrate 10 is a cutout portion at a position corresponding to the position of the terminals 22a and 23a of the first terminal portion 22 and the second terminal portion 23. When the two holes are drilled in 11 and the incision 11 is folded, two of the positions at which the two terminal exposure holes 13 formed in the incision 11 are overlapped are drilled, and a total of four holes are drilled. Two terminal exposure holes 31 of the cover layer 30 are drilled at positions corresponding to the positions of the terminals of the first terminal portion and the second terminal portion, respectively.

As such, the terminal exposure holes 13 and 31 are drilled in the thin film substrate 10 and the cover layer 30 in advance, so that the portions corresponding to the terminals 22a and 23a in the subsequent steps (the first terminal portion and the first layer) are formed. Since the thin film substrate 10 and the cover layer 30 are not laminated due to the presence of the terminal exposure holes 13 and 31, the thin film substrate 10 and the cover layer 30 may be separately The terminals 22a and 23a are exposed through the terminal exposure holes 13 and 31 even if they are not peeled off by the process of, thus handling soldering or the like on the ends of the first terminal portion 22 and the second terminal portion 23. The operation of forming these convenient terminals 22a and 23a can be performed very easily.

In addition, the illustrated first embodiment corresponds to both sides of the ends of the first terminal portion 22 and the second terminal portion 23 so that both front and rear surfaces of the ends of the first terminal portion 22 and the second terminal portion 23 are exposed. The terminal exposure holes 13 and 31 are drilled in the thin film substrate 10 and the cover layer 30 at the position where the first and second terminals 22 and 23 are not preferred. Even when the terminal exposure holes 13 and 31 are drilled only at the position where the surface is exposed, at least one surface of the terminals 22a and 23a is exposed, so that the thin film substrate 10 and the cover layer 30 are not peeled off by a separate process. Even if you can solder it.

In the above description of the third process of the first embodiment, the cutout 11, the protrusion 11a and the cutout line 12 formed on the thin film substrate 10 form a cutout 11. In the first step, when the terminal exposure hole 13 is drilled into the thin film substrate 10, the cutouts 11, the protrusions 11a, and the cutouts 12 are also formed in one step. It is desirable to shorten the process.

(4). Drilling process of terminal connection hole

By folding the RFID antenna 1 and the cutout portion 11 manufactured using only the antenna manufacturing method of the '908 applied the conductive metal foil and the conductive ink described above, the second terminal portion 23 is drawn out from the inside of the closed space 21a to the outside. As the second terminal portion 23 is bent at the position of the fold line 14, there may be a possibility that disconnection of the conductive metal foil 2 or the conductive ink 2 occurs at the portion to be folded.

In order to eliminate such concerns, before the conductive metal foil 2 is laminated on the thin film substrate 10 and before the conductive ink 2 is printed on one side of the thin film substrate 10, the above-described terminal exposure hole ( 13) and the thin film substrate 10 at the position corresponding to the position of the fold line 14 of the second terminal portion 23 to be folded, the second terminal portion 23 of the fold line 14 portion. The terminal connection hole 15 can be drilled so that the conductive metal foil 2 or the conductive ink 2 can be electrically connected over a predetermined area. In the illustrated embodiment, one terminal connection hole 15 is drilled into the thin film substrate 10 at a position spanning the fold line 14.

As shown in FIGS. 2 to 4, when the terminal connection hole 15 is drilled in the thin film substrate 10, when the cutout portion 11 is folded, the second terminal portion 23 of the fold line 14 is formed. Since the conductive metal foil 2 or the conductive ink 2 is brought into electrical contact with each other over a predetermined area by folding in the terminal connection hole 15, the disconnection of the second terminal 23 in the folding line 14 is completely completed. It can be prevented.

(5). Jig hole drilling process

When the cover layer 30 is previously stacked, the cutout portion 11 is accurately positioned on the other side of the thin film substrate 10 with the first terminal portion 22 and the second terminal portion 23 disposed in parallel with the proper position. In order to achieve this, a method of forming the protrusions 11a and the incision line 12 has been described. As another measure for proper parallel arrangement of the first terminal portion 22 and the second terminal portion 23, When drilling the terminal exposure hole 13 in the thin film substrate 10 may also include a step of drilling the jig hole 16 together.

The jig hole 16 is a hole for mounting (inserting) a jig (for example, a pin) for holding the folded second terminal portion 23 of the cutout portion 11 in the correct position. As shown, two are drilled in the thin film substrate 10 at a position adjacent to the terminal exposure hole 13 of the second terminal portion 23, and one jig hole 16 is drilled in the cutout 11. The other jig hole 16 is drilled at the correct position where the jig hole 16 of the cutout 11 is folded when the cutout 11 is folded.

As the jig hole 16 is drilled in the thin film substrate 10, when the incision 11 is folded, the two jig holes 16 coincide with each other to match the two jig holes 16. When the jig is inserted, the first terminal part 22 and the second terminal part 23 may be disposed at the correct position, and the jig hole 16 may be removed in a subsequent cutting process to finally manufacture the RFID antenna 1. Will not remain.

Second embodiment

In the RFID antenna manufacturing method according to the first embodiment of the present invention is a specific embodiment in which the process of forming and folding the cutout 11 is essentially applied. Hereinafter, the formation and the folding process of the cutout will be described with reference to FIGS. 5 to 7. It will be described a method of manufacturing an RFID antenna of another embodiment according to the present invention. In describing a 2nd specific example, the description is abbreviate | omitted about the structure similar to a 1st specific example.

Also in the second embodiment, the first step of drilling the terminal connection hole 15 in the thin film substrate 10 is preceded, but in explaining the reason for drilling the terminal connection hole 15, an understanding of the subsequent steps is understood. Since it is necessary, the following processes will be described first before explaining the punching process of the terminal connection hole 15.

In the second process of the second embodiment, the conductive metal foil 2 of the thin film substrate 10 (B of FIG. 6) on which the conductive metal foil 2 is laminated is etched or the conductive ink is formed on one side of the thin film substrate 10. (2) is printed, the loop pattern including the annular loop portion 21 and the first terminal portion 22 extended out of the closed space 21a of the loop portion 21 so as not to intersect the loop portion 21. Is a step of forming the antenna portion 20 (Fig. 6C).

The difference between the second process of the second embodiment and the second process of the first embodiment is that, in the first embodiment, the antenna unit 20 is formed of the conductive metal foil 2 or the conductive ink 2 on one side of the thin film substrate 10. In the second embodiment, only the loop portion 21 and the first terminal portion 22 are formed of the conductive metal foil 2 or the conductive ink 2 on one side of the thin film substrate 10. The second terminal portion 23 is formed on the other side of the thin film substrate 10 by a separate process. Other matters of the second process of the second embodiment are substantially the same as the first embodiment, and thus description thereof is omitted.

The 3rd process of a 2nd specific example is a process of forming the 2nd terminal part 23 which was not formed in a 2nd process (FIG. 7D). In the process, the second terminal portion 23 may laminate the conductive metal foil 2 having a shape corresponding to the second terminal portion 23 on the other side of the thin film substrate 10 rather than on one side where the first terminal portion 22 is formed. It is formed by printing the conductive ink 2.

In the example in which the conductive metal foil 2 is applied, the loop portion 21 and the first terminal portion 22 are formed by etching the conductive metal foil 2, but the second terminal portion 23 is not etched and the second terminal portion ( The conductive metal foil 2 of the shape corresponding to 23 is formed by only laminating.

At this time, one end 23b of the second terminal portion 23 overlaps the end portion 21b of the loop portion 21 by a predetermined distance and is electrically connected over a predetermined area, so that the closed space 21a of the loop portion 21 is closed. It is elongated from the inside to the outside. The electrical connection between one end 23b of the second terminal portion 23 and the end portion 21b of the loop portion 21 will be described later in the first step of drilling the terminal portion connecting hole 15.

The fourth step of the second embodiment is a step of stacking the cover layer 30 on both sides of the thin film substrate 10 on which the antenna unit 20 is formed (E of FIG. 7), and after stacking the cover layer 30, the antenna Cutting to fit the outer contour of the unit 20 to finally complete the RFID antenna (FIG. 6F). Since the 4th process of 2nd specific example is substantially the same as the 4th process of 1st specific example, the detailed description is abbreviate | omitted.

The first process of the second embodiment is similar to the drilling process of the terminal connection hole 15 of the first embodiment. However, the terminal portion connecting hole 15 of the first embodiment is for preventing disconnection, and the terminal portion connecting hole 15 of the second embodiment is for electrical connection of the loop portion 21 and the second terminal portion 23.

That is, in the first process, one end 23b of the second terminal portion 23 before the conductive metal foil 2 is laminated on the thin film substrate 10 and before the conductive ink 2 is printed on the thin film substrate 10. ) And the overlapping position of the end portion 21b of the loop portion 21 and one end 23b of the second terminal portion 23 so that the end portion 21b of the loop portion 21 is electrically connected over a predetermined area (electrical connection portion). The terminal portion connecting hole 15 is drilled in the thin film substrate 10 at the position corresponding to ().

As shown in FIG. 6, the terminal portion connecting hole 15 is formed in the thin film substrate 10 in advance, so that the loop portion 21 formed on one side of the thin film substrate 10 in the second process and the third process. ) And the second terminal portion 23 formed on the other side of the thin film substrate 10 are electrically connected to each other over a predetermined area at the terminal portion connecting hole 15 which is an overlapping portion thereof, and thus, the second terminal portion 23 as in the prior art. ), It is not necessary to apply a difficult process, such as plating via holes for connecting the second antenna unit, which is etched by stacking the conductive metal foil 2 on the entire other side of the thin film substrate 10, or the like.

It is a matter of course that the steps for drilling the terminal exposure holes 13 and 31 described in the first embodiment can be applied together in the first step of the second embodiment. The difference from the first embodiment in applying the punching process of the terminal exposure holes 13 and 31 to the second embodiment is that the second embodiment has no cutout 11, so the cutout of the first embodiment is not present. It is not necessary to clean the terminal exposure hole 13 in (11).

In the RFID antenna manufacturing method according to the present invention as described above, after forming a plurality of antennas on the thin film substrate 10 of a predetermined size at the same time by pressing and cutting to meet the contour of the individual antenna unit 20 at the end of the plurality of RFID Since it is common to manufacture an antenna simultaneously, the illustrated embodiment shows a process of designing and manufacturing only one RFID antenna.

The manufacturing method of the RFID antenna according to the present invention as described above mainly describes the characteristic configuration of the present invention. Actually, the manufacturing process of the RFID antenna to which the present invention is applied may include some other additional processes, but such additional processes Since it is not directly related to the present invention, it is omitted.

RFID antenna manufacturing method according to the present invention described above and the effects of the antenna produced therefrom are as follows.

First, in relation to an RFID antenna which forms a loop pattern by etching a conductive metal foil laminated on a thin film substrate mounted in a restricted environment such as a mobile communication terminal, a material in which the conductive metal foil is laminated on only one side of the thin film substrate is used. In addition, since the loop pattern can be simply formed without a shorting of the via hole plating process, the manufacturing cost can be significantly reduced and resource waste and environmental pollution can be minimized as compared with the conventional RFID antenna.

Second, in relation to the RFID antenna which forms the loop pattern by printing the conductive ink on the thin film substrate, the short problem related to the RFID antenna of the loop pattern because the conductive ink can be printed in the loop pattern without electrical disconnection on one side of the thin film substrate. There is an effect that can be easily solved.

Third, the inconvenience of having to peel off the thin film substrate and the cover layer laminated at the ends of the first terminal portion and the second terminal portion can be minimized by a process of previously drilling the terminal exposure holes in the thin film substrate and the cover layer.

Fourth, the disconnection of the second terminal portion due to the folding of the cutout portion can be prevented by a step of previously drilling the terminal connection hole in the thin film substrate.

Fifth, it is possible to accurately set the position of the folded second terminal portion when folding the incision by the step of previously drilling a jig hole in the thin film substrate.

Sixth, only the loop portion and the first terminal portion are formed by etching the conductive metal foil and printing the conductive ink on one side of the thin film substrate, while the second terminal portion is formed by laminating the conductive metal foil and printing the conductive ink on the other side of the thin film substrate. By electrically connecting the end portion of the loop portion and one end of the second terminal portion with a terminal portion connecting hole previously drilled into the thin film substrate, there is no need to laminate and etch conductive metal foil on both sides of the thin film substrate to form the antenna portion. The anta portion can be formed without the plating process of.

Claims (6)

The conductive metal foil 2 of the thin film substrate 10 having the conductive metal foil 2 laminated on one side thereof may be etched or the conductive ink 2 may be printed on one side of the thin film substrate 10 to form an annular loop portion ( 21, the first terminal portion 22 extending out of the closed space 21a of the roof portion 21 so as not to intersect the loop portion 21, and the loop so as not to intersect the loop portion 21. Forming an antenna portion 20 having a continuous loop pattern without disconnection, having a second terminal portion 23 extending into the closed space 21a of the portion 21; The thin film in which the conductive metal foil 2 or the conductive ink 2 does not exist is formed in the cutout portion 11 formed by cutting the thin film substrate 10 along a portion of the second terminal portion 23. Folding the second terminal portion (23) out of the closed space (21a) of the roof portion (21) without a short with the roof portion (21) by folding toward the other side of the substrate (10); And Coating a cover layer (30) on both surfaces of the thin film substrate (10) on which the antenna unit (20) is formed; Including: Before laminating the conductive metal foil 2 to one side of the thin film substrate 10, before printing the conductive ink 2 on one side of the thin film substrate 10, and of the thin film substrate 10. Before covering the cover layer 30 on both sides, the thin film substrate 10 at a position corresponding to the terminal 22a of the first terminal portion 22 and the terminal 23a of the second terminal portion 23. And the terminal exposure holes 13 and 31 which expose the conductive metal foil 2 or the conductive ink 2 of the first terminal portion 22 and the second terminal portion 23 to the cover layer 30. Method for manufacturing an RFID antenna, comprising the step of drilling a. The method of claim 1, wherein before the lamination of the conductive metal foil 2 to the thin film substrate 10 and before printing the conductive ink 2 on one side of the thin film substrate 10, The conductive metal foil 2 of the second terminal portion 23 folded at the portion of the fold line 14 to the thin film substrate 10 at a position corresponding to the fold line 14 of the second terminal portion 23, or the A method for manufacturing an RFID antenna, characterized in that it further comprises a step of drilling a terminal connection hole (15) to allow the conductive ink (2) to be electrically connected over a predetermined area. The jig hole (16) according to claim 1, wherein a jig (16) mounted with a jig for keeping the folded second terminal portion (23) of the cutout portion (11) in the correct position in the step of drilling the terminal exposure hole (13). And drilling the thin film substrate (10) at a position adjacent to the terminal exposure hole (13) of the second terminal portion (23). The method according to any one of claims 1 to 3, wherein the cutout (11) is formed in the step of drilling the terminal exposure hole (13). The conductive metal foil 2 of the thin film substrate 10 having the conductive metal foil 2 laminated on one side is etched or the conductive ink 2 is printed on one side of the thin film substrate 10 to form an annular loop portion 21. And a first terminal portion 22 extending out of the closed space 21a of the roof portion 21 so as not to intersect the loop portion 21, forming a part of the antenna portion 20 of the loop pattern. Process of doing; The conductive metal foil 2 is laminated on the other side of the thin film substrate 10 or the conductive ink 2 is printed on the other side of the thin film substrate 10, so that the end portion 21b of the roof portion 21 is formed. And the remaining portion of the antenna portion 20 which extends from the inside of the closed space 21a of the roof portion 21 to the outside in a state where the one end 23b is electrically connected over a predetermined area and overlaps a predetermined distance. Forming a second terminal portion 23; And Coating a cover layer (30) on both surfaces of the thin film substrate (10) on which the antenna unit (20) is formed; Including: Before stacking the conductive metal foil 2 on the thin film substrate 10 and before printing the conductive ink 2 on the thin film substrate 10, the end portion 21b of the roof portion 21 and the On the thin film substrate 10 at the position corresponding to the overlapping position of the one end 23b of the second terminal portion 23, the end 21b of the loop portion 21 and one end 23b of the second terminal portion 23. The method of manufacturing an RFID antenna, characterized in that it comprises a step of drilling a terminal connection hole (15) to be electrically connected over a predetermined area. The said terminal part connection hole 15 is a process of drilling the said terminal part 22a of the said 1st terminal part 22, and the said position of the position corresponding to the terminal 23a of the said 2nd terminal part 23. Terminal exposure holes for exposing the conductive metal foil 2 or the conductive ink 2 of the first terminal portion 22 and the second terminal portion 23 to the thin film substrate 10 and the cover layer 30. A method for manufacturing an RFID antenna, further comprising the step of drilling (13, 31).

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