KR20080095626A - 이미지 센서가 내장된 디스플레이 장치 및 그 제조 방법 - Google Patents
이미지 센서가 내장된 디스플레이 장치 및 그 제조 방법 Download PDFInfo
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- KR20080095626A KR20080095626A KR1020070040376A KR20070040376A KR20080095626A KR 20080095626 A KR20080095626 A KR 20080095626A KR 1020070040376 A KR1020070040376 A KR 1020070040376A KR 20070040376 A KR20070040376 A KR 20070040376A KR 20080095626 A KR20080095626 A KR 20080095626A
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- Prior art keywords
- image sensor
- electrode
- display device
- common electrode
- forming
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 230000001681 protective effect Effects 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims description 17
- 239000004065 semiconductor Substances 0.000 claims description 16
- 238000000206 photolithography Methods 0.000 claims description 8
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 6
- 238000000059 patterning Methods 0.000 claims description 6
- 238000003860 storage Methods 0.000 abstract description 25
- 239000003990 capacitor Substances 0.000 abstract description 20
- 239000012212 insulator Substances 0.000 abstract 2
- 239000004973 liquid crystal related substance Substances 0.000 description 26
- 239000010408 film Substances 0.000 description 10
- 210000002858 crystal cell Anatomy 0.000 description 7
- 239000010409 thin film Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000003071 parasitic effect Effects 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 210000004027 cell Anatomy 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136213—Storage capacitors associated with the pixel electrode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/13606—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit having means for reducing parasitic capacitance
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Liquid Crystal (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
Claims (9)
- 이미지 센싱 소자 및 스위칭 소자를 포함하는 이미지 센서가 내장된 디스플레이 장치로서,상기 이미지 센서는상기 이미지 센싱 소자의 소오스 전극에 연장되어 형성되는 화소전극과;상기 화소전극 상에 형성된 보호 절연막 및;상기 화소 전극 상부의 보호 절연막 상에 형성된 공통전극을 포함하는 것을 특징으로 하는 이미지 센서 내장 디스플레이 장치.
- 제 1항에 있어서,상부 공통전극은비어홀을 통해 하부 공통전극과 연결된 것을 특징으로 하는 이미지 센서 내장 디스플레이 장치.
- 제 1항에 있어서,상기 이미지 센싱 소자의 채널은길이(L)가 1 ~ 100um로 형성된 것을 특징으로 하는 이미지 센서 내장 디스플 레이 장치.
- 제 1항에 있어서,상기 이미지 센싱 소자의 채널은너비(W)가 1 ~ 2000um로 형성된 것을 특징으로 하는 이미지 센서 내장 디스플레이 장치.
- 제 3항 또는 제 4항에 있어서,상기 이미지 센싱 소자의 채널의 크기(W/L)는조사 시간에 따른 전압 변화의 선형성에 따라 결정되는 것을 특징으로 하는 이미지 센서 내장 디스플레이 장치.
- 이미지 센서 내장 디스플레이 장치 제조방법에 있어서,기판 상에 게이트 전극 및 하부 공통전극을 패터닝하여 형성하는 단계와;상기 게이트 전극 및 하부 공통전극 상에 게이트 절연막을 형성하는 단계와;상기 게이트 전극 상부의 절연막 상에 비정질 실리콘층 및 N형 비정질 실리콘층을 패터닝하여 반도체층을 형성하는 단계;상기 반도체층 상에 구동 소자와 스위칭 소자의 드레인/ 소오스 전극 및 이미지 센싱 소자의 전원전극과 화소전극을 패터닝하여 데이터 패턴을 형성하는 단계와;상기 데이터 패턴 상에 보호 절연막을 형성하는 단계와;상기 화소전극 상부의 보호 절연막 상에 상부 공통전극을 패터닝하여 형성하는 단계를 포함하는 것을 특징으로 하는 이미지 센서 내장 디스플레이 장치.
- 제 6항에 있어서,상기 게이트 절연막 및 보호 절연막 형성단계는상부 공통전극과 하부 공통전극이 연결되도록 포토리소그라피 공정을 통해 비어홀을 형성하는 것을 특징으로 하는 이미지 센서 내장 디스플레이 장치 제조 방법.
- 제 6항에 있어서,상기 반도체층 형성 단계는이미지 센싱 소자의 채널의 길이를 1 ~ 100um범위로 형성하는 것을 특징으로 하는 이미지 센서 내장 디스플레이 장치 제조 방법.
- 제 5항에 있어서,상기 반도체층 형성단계는이미지 센싱 소자의 채널의 너비를 1 ~ 2000um범위로 형성하는 것을 특징으로 하는 이미지 센서 내장 디스플레이 장치 제조 방법.
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KR1020070040376A KR100870105B1 (ko) | 2007-04-25 | 2007-04-25 | 이미지 센서가 내장된 디스플레이 장치 및 그 제조 방법 |
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KR1020070040376A KR100870105B1 (ko) | 2007-04-25 | 2007-04-25 | 이미지 센서가 내장된 디스플레이 장치 및 그 제조 방법 |
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KR20080095626A true KR20080095626A (ko) | 2008-10-29 |
KR100870105B1 KR100870105B1 (ko) | 2008-11-25 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8253896B2 (en) | 2009-10-19 | 2012-08-28 | Samsung Electronics Co., Ltd. | Photonic sensor, method of manufacturing same, color filter substrate having same, and display device having the color filter substrate |
US8258004B2 (en) | 2005-11-19 | 2012-09-04 | Samsung Electronics Co., Ltd. | Display device and manufacturing method thereof |
CN110231739A (zh) * | 2018-08-10 | 2019-09-13 | 友达光电股份有限公司 | 像素结构 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101295533B1 (ko) | 2010-11-22 | 2013-08-12 | 엘지디스플레이 주식회사 | 액정표시장치 및 그 제조방법 |
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Publication number | Priority date | Publication date | Assignee | Title |
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KR20060129877A (ko) * | 2005-06-13 | 2006-12-18 | 엘지.필립스 엘시디 주식회사 | 이미지 센싱 기능을 가지는 액정표시장치 및 그 제조방법과이를 이용한 이미지 센싱 방법 |
KR101211110B1 (ko) * | 2005-09-09 | 2012-12-11 | 엘지디스플레이 주식회사 | 이미지 센서 내장형 액정표시장치용 어레이 기판 및 그제조 방법 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8258004B2 (en) | 2005-11-19 | 2012-09-04 | Samsung Electronics Co., Ltd. | Display device and manufacturing method thereof |
US8253896B2 (en) | 2009-10-19 | 2012-08-28 | Samsung Electronics Co., Ltd. | Photonic sensor, method of manufacturing same, color filter substrate having same, and display device having the color filter substrate |
CN110231739A (zh) * | 2018-08-10 | 2019-09-13 | 友达光电股份有限公司 | 像素结构 |
CN110231739B (zh) * | 2018-08-10 | 2021-10-01 | 友达光电股份有限公司 | 像素结构 |
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