KR20080092242A - Heat-resistant light-shading film and production method thereof, and diaphragm or light intensity adjusting device using the same - Google Patents

Abstract

A heat-resistant light-shading film, a manufacturing method thereof, a diaphragm, and a light intensity adjusting device using the heat-resistant light-shading film are provided to reduce a surface polishing amount, lower a refractive index, and to improve a conductive property of the heat-resistant light-shading film by forming a metal carbide layer on a heat-resistant resin film base with a surface roughness between 0.2 and 2.2 mum. A heat-resistant light-shading film includes a resin film base(1) and a light-shading film. The resin film base has a heat-resistant property against a temperature higher than 155 °C. The light-shading film is formed on one or both surfaces of the resin film base by using crystalline metal carbide layer(2). A thickness of the light-shading film is larger than 100 nm. A surface roughness of the light-shading film lies between 0.1 and 2.1 mum. The number of atoms with respect to an overall metal element in the metal carbide layer is greater than 0.3.

Description

Heat-resistant light-shielding film, its manufacturing method, and aperture or light adjusting device using the same {Heat-resistant Light-Shading Film and Production Method etc., and Diaphragm or Light Intensity Adjusting Device Using the Same}

The present invention relates to a heat-resistant light-shielding film, a method for manufacturing the same, and a light quantity adjusting device using an aperture or a film, and more particularly, excellent light shading capacity, heat resistance, sliding characteristic, low glossiness and high Conductive, for shutters or diaphragm shutter blades or aperture blades of digital cameras and digital video cameras, fixed apertures of lens devices for in-vehicle monitors, and projectors Provided are a heat-resistant light blocking film that can be usefully used as a component of an optical device such as an aperture blade of a light amount adjusting device, a method of manufacturing the film, and an aperture or light amount adjusting device using the film.

In recent years, since the shutter blade or aperture blade for a camera has to be operated / stopped in an extremely short time, it is required to be lighter in weight and to have excellent sliding characteristics for improving shutter speed. In addition, since they cover a front surface of a photosensitive material such as a film and an image element such as a charge-coupled device (CCD) to block the light, they basically require light blocking ability. Moreover, since a plurality of blades in the optical device operate while overlapping each other, it is required to have sufficient lubricity for smooth operation of the blades. In addition, it is required to have a low surface reflectance to prevent light leakage between the blades. In addition, since the inside of the camera may be a high temperature depending on the operating environment, it must have heat resistance.

On the other hand, a light shielding film used for an image viewing device such as a presentation, a home theater, or the like, for a light amount control aperture blade for a liquid-crystal projector, requires characteristics similar to those of a digital camera and a digital video camera. In particular, in terms of heat resistance, characteristics beyond the camera are required.

Such commercially available light-shielding films are generally based on plastic film substrates such as polyethylene terephthalate (PET) or metal thin plates such as stainless steel (SUS), SK ash, Al and the like. When a light-shielding film based on a metal substrate is used as a shutter blade or an aperture blade of a camera, the metal plates are engaged with each other when opening and closing the blade, thereby generating a loud noise. In addition, in order to subtract the brightness change when the image changes in the liquid crystal projector, the blades must be moved at high speed, and the blades mesh with each other to repeatedly generate noise. When the blade is operated at a low speed to reduce noise, there is a problem that the image becomes unstable because the light amount adjustment does not sufficiently catch up with the image change.

In view of the above-mentioned problems and light weight, recent light-shielding films are mainly based on plastic film substrates. In addition, it is required to have electrical conductivity to reduce the generation of dust. Therefore, it is considered that a light shielding film needs to satisfy characteristics such as high light shielding property, heat resistance, low gloss property, excellent slipping property, high conductivity, and low oscillation property. In order to satisfy the characteristics that the light shielding film should possess, films using various materials and film structures have been proposed in the past.

For example, Patent Document 1 discloses impregnated with black conductive fine particles such as carbon black and titanium black to provide a film having light shielding properties and conductivity in terms of light shielding properties, low glossiness and high conductivity, and matting to reduce surface gloss. A resin film such as polyethylene terephthalate (PET) treated with matting is disclosed, wherein the black fine particles absorb light from a light source such as a lamp.

Patent Document 2 is coated with a thermosetting resin layer containing a black pigment, a lubricant, a delustering agent, such as carbon black having light shielding properties and conductivity, to have light shielding properties, conductivity, lubricity, low glossiness, and the like. The light shielding film containing the resin film which was made is disclosed.

Patent Document 3 discloses a light shielding material in which a hard carbon film is formed on a surface of a metal blade material such as an aluminum alloy.

Patent Document 4 discloses a structure of a light shielding blade, and is reinforced with a prepreg sheet of a thermosetting resin containing carbon fibers on both sides of a plastic substrate to improve the rigidity of the blade.

Light shielding films are widely used for light shielding blade materials for optical devices such as digital cameras, digital video cameras, liquid crystal projectors, and the like. In recent years, liquid crystal projectors have been required to display clear and high contrast images with high contrast even under bright environments such as living rooms. Accordingly, when the output of the lamp light source is increased for high quality, the temperature in the aperture device for adjusting the light amount tends to increase. When light of high power is irradiated to the light-shielding film for light quantity adjustment, the environment in which a light-shielding film is easy to heat-deform is created.

For example, a light shielding film based on polyethylene terephthalate (PET) is widely used because of its low specific gravity. However, PET has a low thermal deformation temperature and a weak mechanical strength such as tensile modulus. Therefore, when the output of the lamp light source increases, the PET shading blade is deformed by vibration or shock generated during operation or braking of the light source. Can be.

In addition, the light shielding film is matted by sand blasting in order to exhibit low glossiness and excellent slip characteristics. This treatment also exerts an effect of improving image visibility and reducing surface gloss by incident light scattering. In addition, even when the light-shielding films come into contact with each other by such a treatment, it is thought that the increase in the contact area between them can be controlled to prevent the deterioration of the sliding characteristics.

A plurality of light blocking films are used in digital cameras, digital video cameras, and liquid crystal projectors, and are inevitably encountered as shutter blades or aperture blades, and because they operate in a mutually overlapping manner, light blocking films using organic light blocking materials, lubricants, and quenchers. Is subjected to harsh operating environments such as temperature and humidity exposed to digital cameras, digital video cameras and liquid crystal projectors. The fixed aperture used in the lens device of the vehicle interior monitor is used even in a high temperature environment of 100 to 155 ° C. In the liquid crystal projector, in particular, as mentioned above, by increasing the output of the lamp light source to increase the sharpness of the image, the internal temperature of the device (light amount adjusting device, aperture device) is raised to about 200 ℃. Under such a harsh environment, when the above-mentioned conventional light-shielding film is used, a phenomenon in which durability such as deformation or discoloration is poor appears, and there is a problem in practical use.

When used in a high temperature environment of 155 ° C or higher, even a light-shielding film having a fine concavo-convex structure on its surface will be significantly deformed by heat, and as a result, it will not be able to operate at high speed when contacted with each other, and it is often interlocked irregularly. This results in deterioration of slip characteristics and glossiness. Therefore, the original functions of the digital camera, the digital video camera or the liquid crystal projector may not be able to be performed.

Moreover, the matting process of the plastic film of the said base material has the effect of forming fine unevenness | corrugation in the plastic film of a plastic film base material, improving the adhesive force between a base material and the film mutually apply | coated on the base material, and reducing surface glossiness. However, the roughness of the film surface in sand blasting depends on the material and particle size of the shot material, the discharge pressure and the like. If the particle size of the shot material is large, it can be removed from the film surface by washing such as washing or brushing. The shot material of fine particles smaller than 1 mu m cannot be completely removed, and a small amount of particles remain on the surface even after cleaning. The remaining short material causes peeling of the film under a high temperature environment in which the light shielding film is exposed, and the short material is caused by a difference in thermal stress caused by a difference in thermal expansion coefficient between the short material and a film of a metal alloy light shielding film formed on the film. Peeling off the membrane. Such a problem may adversely affect peripheral components, and a problem arises that the original function cannot be performed.

[Patent Document 1] JP-A-1-120503

[Patent Document 2] JP-A-4-9802

[Patent Document 3] JP-A-2-116837

[Patent Document 4] JP-A-2000-75353

Accordingly, an object of the present invention is to include a fine concave-convex structure on the surface of a base film, and a light shading film useful for a light amount adjusting blade of a liquid crystal projector exposed to high temperatures in use, a shutter blade and a fixed aperture of a digital camera exposed to high temperatures in processing. Accordingly, the present invention provides a heat-resistant light-shielding film having excellent electrical conductivity, which is free from slippage and surface glossiness, is excellent in deformation and discoloration during film production, and has excellent durability, and does not cause the shot material to fall off.

In order to solve the problems related to the prior art, the inventors of the present application use a resin film (A) having heat resistance at 155 ° C. or higher as a base material as a resin film having a fine uneven structure on the surface thereof, By forming the light shielding layer (B) of the crystalline metal carbide layer (hereinafter sometimes referred to as 'MeC') having a thickness by the sputtering method while the surface temperature of the resin film substrate (A) is maintained at 155 ° C No deformation, about 155 ℃ or more, depending on the type of substrate, properties (excellent light shielding property, low surface gloss, excellent slipping properties, natural color, low reflectance) can be maintained even in a high temperature environment of 200 ° C. The heat-resistant light-shielding film which can be used for aperture materials, such as a digital video camera or a liquid crystal projector, was obtained.

That is, according to the 1st invention of this invention, the light shielding layer of the resin film base material (A) which has a heat resistance of 155 degreeC or more, and the crystalline metal carbide layer (MeC) formed in one side or both surfaces of the said resin film base material (A) ( B), the thickness of the light blocking layer (B) is 100 nm or more, the surface roughness is 0.1 ~ 2.1 ㎛ (arithmetic mean height Ra), the content of the carbon element (C) in the metal carbide layer (MeC) Silver provides a heat-resistant light-shielding film, characterized in that the atomic ratio (C / Me) to the total metal element (Me) is 0.3 or more.

According to the second invention of the present invention, in the first invention, the resin film substrate (A) is polyethylene naphthalate, polyimide, aramid, polyphenylene sulfide It provides a heat-resistant light-shielding film, characterized in that composed of at least one selected from polyether sulfone.

According to the 3rd invention of this invention, in the 1st invention or 2nd invention, the said resin film base material (A) provides heat resistant light-shielding film characterized by having heat resistance of 200 degreeC or more.

According to the 4th invention of this invention, in any one of the 1st invention-the 3rd invention, the thickness of the said resin film base material (A) provides a heat resistant light shielding film characterized by the above-mentioned.

According to the fifth invention of the present invention, in any one of the first to fourth inventions, the surface roughness of the resin film base material A is 0.2 to 2.2 µm (arithmetic mean height Ra). Provide a heat resistant light shielding film.

According to the sixth invention of the present invention, in any one of the first to fifth inventions, the thickness of the light shielding layer (B) provides a heat resistant light shielding film, characterized in that 110 to 550 nm.

According to a seventh aspect of the present invention, in any one of the first to sixth inventions, the metal carbide layer (MeC) is a main component, silicon carbide, titanium carbide, aluminum Carbide, niobium carbide, tungsten carbide, molybdenum carbide, molybdenum carbide, vanadium carbide, tantalum carbide, zirconium carbide, or It provides a heat-resistant light-shielding film, characterized in that it comprises at least one material selected from hafnium carbide.

According to the eighth aspect of the present invention, in any one of the first to seventh inventions, the content of the carbon element (C) in the metal carbide layer (MeC) is a carbon element relative to the total metal element (Me). The atomic heat shield (C / Me) of (C) is 0.5 or more, The heat shielding film which provides is characterized by the above-mentioned.

According to the ninth invention of the present invention, in any one of the first to eighth inventions, the content of oxygen (O) in the metal carbide layer (MeC) is oxygen (O) to the total metal element (Me). It provides a heat-resistant light-shielding film, characterized in that the atomic ratio (O / Me) of () is 0.5 or less.

According to the tenth aspect of the present invention, in any one of the first to ninth inventions, the reflectance of the light shielding layer (B) is 10% or less for light in the wavelength range of 380 to 780 nm. It provides a heat-resistant light shielding film.

According to the eleventh invention of the present invention, in any one of the first to tenth inventions, the optical density as an index of the light-shading capacity is in the range of 380 to 780 nm. It provides a heat resistant light shielding film characterized by being 4 or more in the wavelength range.

According to the twelfth invention of the present invention, in any one of the first to eleventh inventions, metal carbide layers (MeC) having the same structure and thickness are formed on both sides of the resin film substrate (A). It provides a heat resistant light shielding film characterized in that.

According to the thirteenth invention of the present invention, a crystalline metal carbide layer (MeC) is used as a resin film base material (A) having heat resistance of 155 ° C or higher and a light shielding layer (B) formed on one or both surfaces of the resin film base material (A). A method of manufacturing a heat-resistant light-shielding film comprising: supplying a heat-resistant resin film base material (A) having a surface roughness of 0.2 to 2.2 µm (arithmetic mean height Ra) to a sputtering apparatus; And a thickness of 100 nm or more, a surface roughness of 0.1 to 2.1 µm (arithmetic mean height Ra) by sputtering on the resin film substrate A using a metal carbide target in an inert gas atmosphere, and a metal carbide layer The carbon element (C) content of (MeC) is a step of forming a crystalline metal carbide layer (MeC) having an atomic ratio (C / Me) of 0.3 or more relative to the total amount of metal elements; heat-resistant light-shielding film comprising a It provides a method of manufacturing.

According to a fourteenth aspect of the present invention, in the thirteenth invention, further comprising: supplying a heat resistant light shielding film having a metal carbide layer (MeC) to a sputtering apparatus; And forming a metal carbide layer (MeC) on the other surface of the resin film substrate (A) on which the metal carbide layer (MeC) is not formed by sputtering. do.

According to a fifteenth invention of the present invention, in the thirteenth or fourteenth invention, the pressure of the sputtering gas when forming the light shielding layer (B) is 0.2 to 1.0 Pa to provide a method for producing a heat-resistant light-shielding film. .

According to a sixteenth invention of the present invention, in any one of the thirteenth to fifteenth inventions, the surface temperature of the resin film base material (A) at the time of forming the light shielding layer (B) is 180 ° C or more. It provides a method for producing a light shielding film.

According to a seventeenth invention of the present invention, in any one of the thirteenth to sixteenth inventions, the resin film base material A is set in a film transfer section of the sputtering apparatus in a roll form. Doing; And forming a layer by sputtering while the resin film substrate (A) moves from the wind-off section to the take-up section. It provides a manufacturing method.

According to an eighteenth aspect of the present invention, in any one of the thirteenth to seventeenth inventions, the method further comprises the steps of: setting the resin film substrate (A) in the form of a roll in the film conveying portion of the sputtering apparatus; And forming a layer by sputtering while the resin film base material (A) moves from a wind-off section to a take-up section, wherein the layer is a resin. Provided is a method of manufacturing a heat-resistant light-shielding film, wherein the film base material A is not cooled and is formed while in a floating state in a film-forming chamber during sputtering.

According to a nineteenth aspect of the present invention, there is provided an excellent heat resistant diaphragm manufactured by processing the heat shielding film according to any one of the first to twelfth inventions.

According to a twentieth invention of the present invention, there is provided a light intensity adjusting device using the heat resistant light shielding film according to any one of the first to twelfth inventions.

In the heat-resistant light-shielding film of the present invention, a metal carbide layer having a predetermined thickness is formed on a heat-resistant resin film substrate having a surface roughness of 0.2-2.2 μm (arithmetic mean height Ra), so that low surface gloss, low reflectance and excellent The heat-resistant light shielding film which maintains electroconductivity can be manufactured. In addition, the metal carbide film layer is formed by a sputtering method, and has a denser surface structure than the light shielding layer manufactured by a conventional coating process, and has a high surface wear resistance and friction resistance. great. In addition, in the heat-resistant light-shielding film according to the present invention, a crystalline metal carbide layer is formed as a light-shielding layer on the resin film substrate having heat resistance of 155 ° C or higher, and the metal carbide material is less susceptible to oxidation, and has a high temperature of 155-300 ° C. And since the light-shielding ability hardly changes even in a high humidity environment, compared with the heat-resistant light shielding film which used the oxidizable metal layer as a light shielding layer conventionally, heat resistance is remarkably excellent. Furthermore, the heat-resistant light-shielding film according to the present invention has a symmetrical layer structure in which a heat-resistant resin film is inserted in the center between the metal carbide layers, so that deformation due to stress of the film during sputtering does not occur, thereby improving productivity. great.

Further, through the optimum layering conditions for forming the metal carbide layer according to the present invention by the sputtering method, the metal carbide layer can be made more compact. Due to this dense outermost layer, the heat-resistant light-shielding layer does not separate even when exposed to a high temperature environment of 155 to 300 ° C., even when exposed to a high temperature environment of the film, and the matting treatment of the base film, especially sandblasting The surface treatment of the film prevents the peeling off of the remaining shot material.

In addition, the light amount adjusting device according to the present invention uses a light shielding blade manufactured by processing the heat-resistant light-shielding film, and due to the light-shielding blade made of a resin film base material, a conventional heat-resistant made of a metal foil plate coated with a heat-resistant coating material. The weight is further reduced than the light amount adjusting device using the light shielding blade manufactured by processing the light shielding film. Therefore, when the heat-resistant light-shielding film is used in an aperture blade or the like, the sliding property is improved, the volume of the driving motor can be reduced, and the manufacturing cost can be reduced.

Therefore, the heat-resistant light-shielding film of the present invention can be usefully used for the diaphragm blade member constituting the light amount adjusting device of the liquid crystal projector, in which heat resistance is particularly required, and the fixed diaphragm constituting the lens device of the monitor for the vehicle interior. In addition, the heat-resistant light-shielding film of the present invention is useful in digital cameras, shutter blades of digital video cameras, and the like, and is of great industrial value.

EMBODIMENT OF THE INVENTION Hereinafter, the heat-resistant light-shielding film which concerns on this invention, its manufacturing method, and the light quantity adjusting device and aperture using the same are demonstrated with reference to drawings.

One. Heat resistant shading film

The heat-resistant light-shielding film which concerns on this invention is the light-shielding layer (B) of the resin film base material (A) which has heat resistance of 155 degreeC or more, and the crystalline metal carbide layer (MeC) formed in one side or both surfaces of the said resin film base material (A). The thickness of the light blocking layer (B) is 100 nm or more, the surface roughness is 0.1 to 2.1 ㎛ (arithmetic mean height Ra), the content of the carbon element in the metal carbide layer (MeC) is a total metal element ( It is comprised by the atomic ratio (C / Me) with respect to Me) 0.3 or more.

The heat-resistant light-shielding film having low glossiness and low reflectance can be realized by forming a light-shielding layer having the above-mentioned surface roughness or by covering the surface of the light-shielding layer with metal carbide to make the surface roughness similar. Therefore, when the heat-resistant light-shielding film is used for a fixed aperture of digital image-taking devices, an aperture blade of a mechanical shutter device, or a blade material for light quantity adjusting device of a liquid crystal projector, it is generated by reflected light in an optical system. It can prevent stray light.

1 and 2 schematically show the structure of a heat resistant light shielding film according to the present invention. The heat resistant light shielding film according to the present invention consists of a resin film 1 as a substrate and a metal carbide layer 2 formed on the surface thereof. Further, the surface roughness of the metal carbide layer 2 may be 0.1 to 2.1 μm (arithmetic mean height Ra), preferably 0.2 to 2.0 μm, more preferably 0.3 to 1.9 μm. If the surface roughness is smaller than 0.1 mu m or larger than 2.1 mu m, it is not preferable in view of low glossiness or surface defects.

The metal carbide layer 2 may be formed on one surface of the resin film substrate as shown in FIG. 1, but is preferably formed on both sides as shown in FIG. 2. When the metal carbide layer 2 is formed on both sides, it is more preferable that the two metal carbide layers 2 have the same structure and thickness, and have a symmetrical structure in which a film substrate is inserted in the center. Thin films formed on the substrate stress the substrate, which can cause deformation. Stress-induced deformation in heat-resistant light-shielding films can often be observed immediately after film formation, and especially tends to appear larger and more pronounced when the film is heated to about 155 to 300 ° C. However, by using a metal carbide layer of the same material and thickness on both sides of the substrate and forming a symmetrical structure around the substrate, it is possible to maintain a good balance of stress even under heating conditions, and a flat heat-resistant light-shielding film This can be implemented.

(A) Resin film base material

The resin film base material (A) used in the heat-resistant light-shielding film according to the present invention is not particularly limited as long as it is a heat-resistant resin film base material having a heat resistance of 155 ° C. or higher. Preferably, polyethylene naphthalate, polyimide, It may be made of a material consisting of at least one selected from aramid, polyphenylene sulfide, or polyether sulfone. Among them, polyethylene naphthalate shows heat resistance at about 200 ℃, can be used in the environment of 155 ~ 200 ℃, it can be used as a useful industrial material at a low price. In addition, since polyimide, aramid, polyphenylene sulfide or polyether sulfone also exhibits heat resistance of 200 ° C. or higher, it may be used in an environment of 200 ° C. or higher. In particular, polyimide shows the heat resistance of 300 degreeC or more which is the highest temperature, and is the most preferable film.

In addition, the resin film used as the substrate may be composed of a transparent resin or a colored resin mixed with a pigment, but in this case, it should have heat resistance of 155 ° C or higher. Here, "film having heat resistance of 155 ° C or higher" means a film having a glass transition temperature of 155 ° C or higher, and in the case of a material having no glass transition temperature, it means a film that does not exhibit degeneration at 155 ° C or higher. The kind of resin material is preferably a flexible material so that it can be roll coated by sputtering in consideration of mass productivity.

The resin film substrate may have a thickness of preferably 5 to 200 μm, more preferably 10 to 150 μm, and particularly preferably 20 to 125 μm. If the thickness is less than 5 μm, it is vulnerable to surface defects such as scratches and folds. If the thickness is larger than 200 μm, it is difficult to mount the plurality of light blocking blades to the aperture device or the light amount adjusting device in terms of volume simplification.

In addition, the surface roughness (arithmetic mean height Ra) of the resin film used in the heat-resistant light-shielding film according to the present invention may preferably be 0.2 to 2.2 µm, and may particularly include a fine uneven structure of 0.3 to 2.1 µm. If Ra is smaller than 0.2 μm, sufficient adhesion of the metal carbide layer formed on the film surface may not be obtained, and low gloss and low reflection properties may also not be sufficient. When Ra exceeds 2.2 mu m, the uneven structure of the film surface is too large, and it is difficult to form a metal carbide layer on the uneven portion. When the film surface is completely covered for sufficient light shielding ability, the thickness of the metal carbide layer may be too thick, which is undesirable in terms of cost.

The arithmetic mean height can also be expressed as an arithmetic mean roughness, which takes a roughness curve within a standard length in the direction of the average line, adding the absolute value of the deviation of the roughness curve with respect to the average line within the reference length and , By calculating the average value.

The uneven structure of the resin film surface may be formed by surface treatment of the film surface. The surface uneven structure may be formed, for example, by matting or nano-imprinting using a shot material. In the case of matting, sand may be used as the short material for matting, but is not limited thereto. The uneven structure having an optimal Ra value depends on the film feed rate and the type and size of the shot material during the matting process. Therefore, these conditions are optimized and surface treated so that the arithmetic mean height Ra of the film surface becomes 0.2-2.2 micrometers. After the matting treatment, the film is washed to remove the short material and to dry. When the metal carbide layer is formed on both sides of the film, the both sides of the film are matted.

(B) Shading Layer (Metal Carbide Layer)

The heat-resistant light-shielding film according to the present invention exhibits heat resistance to withstand the high temperature environment of 155 ℃. This is because the resin film base material has heat resistance, and the light shielding metal carbide layer also has heat resistance.

In general, when the metal layer is oxidized, the transparency increases, so that the metal layer must have oxidation resistance when used as a light shielding layer. The material of the light shielding layer used for the heat resistant light shielding layer of the present invention is a metal carbide layer excellent in oxidation resistance.

Specifically, the metal carbide layer (MeC) of the present invention is preferably a main component, silicon carbide (titanium carbide), titanium carbide (titanium carbide), aluminum carbide (aluminum carbide), niobium carbide (tungsten carbide), tungsten carbide (tungsten carbide), molybdenum carbide (molybdenum carbide), vanadium carbide (vanadium carbide), tantalum carbide (tantalum carbide), zirconium carbide, or at least one material selected from hafnium carbide (hafnium carbide) Can be. This metal carbide layer is not only more excellent in oxidation resistance at 155 to 300 ℃ than conventional metal layers (silicon, titanium, aluminum, niobium, tungsten, molybdenum, vanadium, tantalum, zirconium, hafnium), but also the rigidity of the metal carbide ( Abrasion resistance is also excellent due to hardness. On the other hand, when the existing metals (silicon, titanium, aluminum, niobium, tungsten, molybdenum, vanadium, tantalum, zirconium, hafnium) are used as the light shielding layer, they do not have sufficient acid resistance and strength at high temperature as mentioned above. As a protective layer, the surface should be protected by other materials (metal oxides and DLC) having acid resistance and predetermined rigidity. As a result, the structure becomes complicated and the cost increases.

In addition, in the structure of the metal carbide layer (MeC) used in the present invention, the content of the carbon element (C) included in the layer is an atomic ratio (C / Me) of the carbon element (C) to the total metal element (Me). ) May be at least 0.3, preferably at least 0.5, particularly preferably at least 0.7. If the atomic ratio of C / Me is less than 0.3, sufficient oxidation resistance cannot be exhibited under high temperature heating of 155-300 degreeC.

The metal carbide layer formed as the light shielding layer on the resin film should be a crystalline layer. This is because a film made of a crystal structure exhibits strong adhesion to the resin film substrate. If the metal carbide layer is an amorphous layer, the crystallization of the layer proceeds when used at high temperatures. As the crystallization of the layer proceeds, not only discoloration occurs, but also film stress occurs in the crystallized portion, so that the heat-resistant light-shielding film loses balance of stress and is easily deformed.

Since the metal carbide (MeC) layer is a material formed by penetrating carbon into the crystal of the metal element (Me), it is more difficult to crystallize compared to the metal layer made of the metal element (Me). In addition, the penetration of carbon into the metal element (Me) crystals causes the bonds between the elements to have a higher proportion of covalent properties, resulting in more crystallization compared to metallic materials consisting of metal bonds that do not contain carbon. Becomes difficult. A layer having an atomic ratio (C / Me) of 0.3 or more that exhibits excellent heat resistance is particularly difficult to crystallize. Whether the metal carbide layer is a crystalline layer can be determined by observing the presence of diffraction peaks by X-ray diffraction measurement or by observing the presence of crystalline particles by cross section observation of the layer using TEM. have. If the degree of crystallinity is high, a clear diffraction peak as shown in FIG. 6 appears.

As mentioned above, the surface roughness of the metal carbide layer (MeC) according to the present invention should be 0.1 to 2.1 μm (arithmetic mean height Ra), preferably 0.2 to 2.0 μm, more preferably 0.3 to 1.9 μm. Can be. If the surface roughness is smaller than 0.1 mu m or larger than 2.1 mu m, it is not preferable in view of low glossiness or surface defects.

The thickness of the metal carbide layer (MeC) according to the present invention may be 110 to 550 nm, preferably 110 to 400 nm, more preferably 110 to 300 nm. If the thickness is less than 110 nm, sufficient light blocking function cannot be exerted because light transmission occurs through the layer. The thicker the film, the better the light shielding ability. However, when the thickness is larger than 550 nm, the material cost increases and the film formation time increases, thereby increasing the production cost, and the stress of the film increases, which easily causes deformation. By setting the thickness of the metal carbide layer to the above-mentioned level, excellent light shielding ability, low film stress and low production cost can be realized.

In addition, when forming such a metal carbide layer, the surface roughness Ra must be 0.1 to 2.1 μm. Through this surface roughness, the light reflectance can be lowered to 10% or less in the wavelength range of 380 to 780 nm. Regarding the light shielding ability, the light density may preferably be 4 or more, and the transmittance is preferably 1% or less, particularly preferably 0%.

It should be noted that the metal carbide layer may comprise nitrogen. The introduction of nitrogen into the metal carbide layer may be possible by performing sputtering with a mixed gas comprising nitrogen gas as the sputtering gas in the formation of the metal carbide layer, or instead of using the mixed gas described above and using nitrogen instead. The element can also be introduced by using a contained target.

Furthermore, it is preferable that the metal carbide layer (MeC) according to the present invention contain as little oxygen as possible, thereby increasing the adhesion to the resin film and the light shielding ability. However, oxygen contained in the target or oxygen remaining in the sputtering chamber may be introduced into a part or the whole of the metal layer at a level that does not impair the metallicity, the excellent light shielding ability, and the excellent adhesion to the resin film.

As such, the content of oxygen contained in the metal carbide layer (MeC) may be an atomic ratio (O / Me) of oxygen (O) to the total metal element (Me) of 0.5 or less, more preferably 0.1 or less. have. When oxygen is included in the content of the atomic ratio (O / Me) of oxygen (O) to the total metal element (Me) of more than 0.5, the transmittance is increased (reduced optical density) in the wavelength range of 380 to 780 nm, This is because the light shielding ability cannot be sufficiently exhibited. When the atomic ratio (O / Me) of oxygen (O) to the total metal element (Me) is less than 0.5, even if the thickness of the thin film is 110 to 400 nm, the light shielding ability can be sufficiently exhibited, thereby reducing the manufacturing cost. However, if the atomic ratio exceeds 0.5 and is 0.8 or less, sufficient light shielding ability can be obtained by using a thicker 400 to 550 nm film.

The atomic ratio (O / Me) included in the metal carbide layer can be measured by X-ray photoelectron spectroscopy (XPS), for example. Since more oxygen atoms are bonded to the outermost surface of the layer, the atomic ratio (O / Me) contained in the layer can be quantified by measuring after removing the surface layer of 20 to 30 nm by sputtering in a vacuum state.

The metal carbide layer of the heat-resistant light-shielding film according to the present invention may have a laminated structure composed of various types of metal carbide layers having different compositions (content and type of metal element, carbon content, nitrogen content, oxygen content). By stacking a plurality of metal carbide layers having different light constants, an optical interference effect can be induced and reflection characteristics can be controlled.

The light-shielding film according to the present invention can be used by coating other thin layers (for example, fluorine-containing organic layers) having low lubricity and wearability on the surface of the metal carbide layer, so long as the features of the present invention are not impaired.

2. Manufacturing method of heat resistant light shielding film

The heat-resistant light-shielding film which comprises the crystalline metal carbide layer (MeC) as a light-shielding layer (B) formed in the resin film base material (A) which has heat resistance of 155 degreeC or more, and the resin film base material (A) on one side or both surfaces. A method of producing a method comprising the steps of: supplying a heat resistant resin film base material (A) having a surface roughness of 0.2 to 2.2 mu m (arithmetic mean height Ra) to a sputtering apparatus; And a thickness of 100 nm or more, a surface roughness of 0.1 to 2.1 µm (arithmetic mean height Ra) on the resin film substrate A, by sputtering using a metal carbide target in an inert gas atmosphere, and a metal carbide layer The carbon element (C) content of (MeC) is a method for producing a heat-resistant light-shielding film comprising a step of forming a crystalline metal carbide layer (MeC) having an atomic ratio (C / Me) to 0.3 or more of the total amount of metal elements It is about.

The method of forming the metal carbide layer may preferably be gas phase synthesis such as CVD and PVD. Among these, the sputtering method and the ion plating method are more industrially preferable because they can form a uniform and dense film uniformly over a wide area. The layer formed by the sputtering method or the ion implantation method has a more dense structure than the layer formed by the ink coating method or the vacuum deposition method, and thus the bonding force to the lower layer (substrate and film layer) is excellent.

This property is further highlighted when the heat resistant light shielding film is used in a high temperature environment of 155 to 300 ° C. When the film is formed by the ink coating method, detachment and discoloration due to oxidation of the layer are observed. In contrast, the layer formed by the sputtering method according to the present invention hardly causes these problems.

The sputtering method is an efficient thin film formation method when a low vapor pressure material layer is formed on a substrate or precise thickness control is required. This method is generally a glow discharge between the electrodes when the substrate is used as an anode, and the sputtering target, which is a raw material for the film, is used as a cathode, and sputtered in an argon atmosphere at a pressure of about 10 Pa or less. This causes an argon plasma to be generated, and the argon cations in the plasma collide with the sputtering target of the cathode, whereby the sputtering target component particles are scattered and deposited on the substrate.

The sputtering method can be classified into high frequency (RF) sputtering method using high frequency plasma, DC sputtering method using DC plasma, and magnetron sputtering method according to the generation method of argon plasma. By arranging argon plasma on a sputtering target, the argon ion collision efficiency is improved even at low gas pressure.

There are many methods for producing the metal carbide layer by the sputtering method. One method is to use metal carbide as a target, and the other is to target metal and form a layer by sputtering by introducing a hydrocarbon gas or the like into the sputtering gas as a carbon source. Moreover, a layer can be formed by laminating a metal element and a carbon element on a base material simultaneously using a metal target and a carbon target. Among these, it is simple and preferable to target metal carbide because the composition and properties of the layer are stable and the layer formation by sputtering can be performed in a pure argon gas atmosphere.

The metal carbide layer can be formed on the resin film by, for example, a reel-equipped style sputtering unit as shown in FIG. 3. This apparatus sets the roll-shaped resin film base material 1 to the unwinding roll 5, and exhausts the contents of the vacuum chamber 7 which is a layer forming chamber to a vacuum pump 6 such as a turbo molecular pump. Then, the film 1 conveyed from the unwinding roll 5 passes through the surface of the cooling can roll 8, and consists of a structure wound around the unwinding roll 9. The magnetron cathode 10 is provided to face the surface of the cooling can roll 8, and the cathode is provided with a target 11 serving as a raw material of the film. The film conveying part which consists of the unwinding roll 5, the cooling can roll 8, the winding roll 9, etc. is isolate | separated from the magnetron cathode 10 by the barrier 12. As shown in FIG.

First, the resin film base material 1 of a roll form is set to the unwinding roll 5, and the inside of the vacuum chamber 7 is evacuated with the vacuum pump 6, such as a turbo molecular pump. Then, the resin film base material 1 supplied from the unwinding roll 5 is wound around the winding-type roll 9 via the surface of the cooling can roll 8 on the path, during which the cooling can A discharge occurs between the roll 8 and the cathode, and a film is formed on the resin film base material 1 when it is transported to be in close contact with the surface of the cooling can roll. It is preferable to heat and dry the resin film base material 1 about glass transition temperature before sputtering.

In the heat resistant light shielding film according to the present invention, the metal carbide layer may be formed on the resin film substrate through DC magnetron sputtering, for example, using metal carbide as a sputtering target in an argon atmosphere.

The metal carbide film as the light shielding layer formed on the resin film substrate is a crystalline film as mentioned above. Since the metal carbide film MeC is a material formed by infiltrating carbon into the crystal of the metal element Me, it is more difficult to crystallize compared to the metal layer made of the metal element Me. In addition, the penetration of carbon into the metal element (Me) crystals makes the bonds between the elements more covalent, which makes crystallization more difficult compared to metallic materials consisting of metal bonds that do not contain carbon. . A layer having an atomic ratio (C / Me) of 0.3 or more that exhibits excellent heat resistance is particularly difficult to crystallize.

In addition, crystal growth in the thin film depends on the type and the surface shape of the substrate. When an inorganic layer such as a metal carbide layer grows, it is difficult to form a layer having better crystallinity on an organic substrate than on an inorganic substrate such as a metal oxide layer. Furthermore, sputtered particles that reach the substrate can be more easily oriented in the crystal by movement as the flatness of the substrate surface increases. However, when a large uneven structure is produced on the surface of the substrate as in the present invention, it is difficult for the sputtered particles to crystallize by movement, making it difficult to form a thin film having excellent crystallinity.

The heat-resistant light-shielding film having excellent heat resistance and durability as in the present invention may be realized depending on whether a metal carbide layer having excellent crystallinity and a dense metal carbide layer is formed on the surface of the heat-resistant resin film having large irregularities.

In the present invention, in order to form a dense metal carbide layer having excellent crystallinity by sputtering method on the surface of the heat-resistant resin film having a large unevenness, sputtering gas pressure and film surface during the layer formation process The temperature of is especially important.

In forming the layer through sputtering, the layer may be formed by plasma generated using an inert gas, generally under a gas pressure of 10 Pa or less, but forms a metal carbide layer having excellent crystallinity for use as a light shielding layer of a heat resistant light shielding film. In order to achieve this, it can be produced under a predetermined gas pressure. The gas pressure for forming the metal carbide layer having excellent crystallinity cannot be determined as a matter of dependence on the device type or the like, but may preferably be 1.0 Pa or less, for example, 0.2 to 1.0 Pa. Under such gas pressure, the sputtered particles reaching the substrate (resin film) have high energy, so that a crystalline metal carbide layer is formed on the heat resistant resin film substrate, and can exhibit strong adhesion between the film and the resin film.

As a result, even if a small amount of the short material used in the matting treatment remains on the resin film substrate, regardless of the difference in thermal expansion coefficient between the short material and the metal carbide layer, for example, in the high temperature environment of 155 to 300 캜, Desorption can be prevented. If the gas pressure is less than 0.2 Pa, the gas pressure is so low that the argon plasma becomes unstable, resulting in poor quality of the layer produced. Recoil argon particles also sputter the film deposited on the substrate again, making it easy to suppress the formation of a dense layer. In addition, if the gas pressure exceeds 1.0 Pa during the film formation, the energy of the sputtered particles reaching the substrate is too low, so that the crystal layer is difficult to establish, resulting in coarse grains of the metal carbide layer, and low density and crystallinity. Can be. In this case, the bonding force with the resin film base material becomes weak, which may cause the layer to detach. Such a layer may not be used as a light shielding layer used for heat resistance purposes.

The temperature of the film surface during layer formation affects the crystallinity of the metal carbide layer. As the temperature of the film surface rises, the crystallographic orientation of the sputtered particles becomes easy, and the degree of crystallinity becomes more excellent. However, the temperature of the heat-resistant resin film that can be heated is limited, even in the case of a polyimide film, which is one of the films having the most heat resistance, it is possible to form a layer at a surface temperature of 400 ° C or less. Under these conditions, it is possible to produce a metal carbide layer exhibiting excellent bonding force to the resin film. Therefore, when forming a heat resistant light shielding film that can be used in a high temperature environment, the surface temperature is particularly important. In forming the layer, since the optimum surface temperature varies depending on the type of film substrate, it cannot be determined. For example, preferably, the heat-resistant light-shielding film to be used under the conditions of 100 to 155 ° C. can be formed. have.

Thereby, the heat-resistant light-shielding film which consists of a metal carbide layer which is dense and excellent in the bonding force to a resin film base material, and excellent in crystallinity can be formed also in the conditions of 100-155 degreeC. In this case, of course, a resin film having heat resistance of 155 ° C or higher is used. In addition, in order to produce a heat-resistant light-shielding film used in a high temperature environment of 155 ° C. or higher, particularly about 200 to 300 ° C., the temperature of the film surface is preferably 180 to 220 ° C., or high temperature of 220 ° C. or higher. The temperature of the resin film substrate may be the same or lower. Under these conditions, a heat-resistant light-shielding film having excellent bonding strength to a resin film substrate having dense layer properties and heat resistance of 200 ° C. or higher can be obtained.

However, in this connection, in order to obtain the light shielding film used at the temperature of normal temperature-130 degreeC, if surface temperature is 50-100 degreeC, it is enough. However, the crystalline metal carbide layer is particularly difficult at film surface temperatures of 50 to 100 ° C., and it is absolutely essential to form the layer under a sputtering gas pressure of 0.2 to 1.0 Pa. Under these conditions, a heat resistant light shielding film made of a metal carbide layer having excellent adhesion to a resin film substrate can be obtained even in an environment of normal temperature to 130 ° C.

The resin film may be naturally heated by plasma at the time of layer formation. Radiated heat from plasma and incident hot electrons flowing from the target to the substrate, the gas pressure, the power supplied to the target, the film feed rate, etc. are adjusted to adjust the temperature of the surface of the resin film substrate to 155 to 220 ° C. Can be easily maintained. The natural heating effect by plasma may increase as the gas pressure decreases, the power supplied to the target is high, or the film feed rate decreases. Even when a film contacts a cooling can at the time of layer formation, the temperature of a resin film surface is higher than the temperature of a cooling can by a natural heating effect. On the other hand, as the film is conveyed while being cooled by the cooling can in the apparatus of FIG. 3, the temperature of the naturally heated film surface is very dependent on the temperature of the cooling can. In order to make the most of the natural heating effect in forming the layer, it is effective to increase the temperature of the cooling can and to reduce the feeding speed.

The thickness of the metal carbide layer can be controlled by the film feed rate and the power supplied to the target, and the slower the film feed rate, the thicker the power supplied to the target.

In addition, the apparatus shown in FIG. 4 consists of a film conveying system different from the above-mentioned apparatus. The device applies a layer forming method (floating method) that sputters the film without cooling the film with a cooling can, thereby effectively utilizing the natural heating effect. In this way, the film is supported by two supporting rolls 13 positioned away from the target, and the film substrate facing the target 11 is in the layer forming chamber (vacuum bath) 7 without cooling the rear surface. Sputtered while suspended at The layer forming chamber is kept in vacuum, and little heat released from the target and plasma and accumulated on the film can be effectively heated, and a natural heating effect of 270 ° C. or more can be easily realized.

The temperature of the substrate surface at the time of layer formation can be measured by a radiation thermometer. In addition, the temperature can be measured by attaching a thermolabel to the film surface and observing the color change of the label after layer formation.

As described above, a heat resistant light shielding film having a metal carbide layer having excellent adhesion on one surface of the resin film substrate can be produced. The heat-resistant light-shielding film in which the metal carbide layer is formed on both surfaces thereof may also be manufactured by supplying the manufactured heat-resistant light-shielding film to the sputtering apparatus in the same manner sequentially to form a metal carbide layer by sputtering on the rear surface of the resin film substrate.

Further, by way of example, a method of forming a metal carbide layer in a continuous process by a reel mounting sputtering apparatus has been described above, but the present invention is not limited thereto. For example, a batch style method may be applied that does not move the film substrate during layer formation. However, in this case, the process of forming the layer is complicated because the operation of the film is changed and the operation such as film transfer / stop is added. In addition, the base film does not necessarily have to be roll-shaped, and may be fixed in the apparatus after cutting to a predetermined size.

3. Use of heat resistant light shielding film

Heat-resistant light-shielding film according to the present invention produced by the manufacturing method can be punched (punch) to a predetermined shape in a way that no cross-sectional crack, fixed shutter or mechanical shutter blade for a digital camera or digital video camera, specific It can be used for an iris for passing only a quantity of light or for an auto-iris for a light amount adjusting device of a liquid crystal projector.

In particular, the fixed diaphragm used in the lens device for in-vehicle digital video cameras is severely heated by sunlight in summer, and the brightness adjusting device of the liquid crystal projector is extremely heated by heat radiated from the lamp. Therefore, an aperture blade having excellent heat shielding ability manufactured by processing the heat shielding film according to the present invention may be usefully used. In addition, in the case of applying an optical component assembly process such as a reflow process, the fixed aperture and the mechanical shutter blade manufactured by processing the heat-resistant light shielding film according to the present invention may be usefully used since the properties do not change even in a heating environment. Can be.

FIG. 5 schematically shows the diaphragm structure of the brightness adjusting device equipped with the heat-resistant light shielding blade 14 manufactured by drilling. The heat resistant shading blade 14 is composed of a guide hole 15, a guide pin 16 connected to an actuating motor, and a hole 19. The blade is mounted on a substrate 18 provided with a pin 17 to control the position. In addition, the opening 20 is provided at the center of the substrate 18, through which light passes from the lamp. The light blocking blade may have various shapes according to the structure of the aperture device. The blade using the heat-resistant light-shielding film according to the present invention based on the resin film can reduce the weight, thereby miniaturizing the operating member for the operation of the light-shielding blade, it is possible to reduce the power consumption of the operating member. .

EXAMPLE

Hereinafter, the present invention will be described in detail through examples and comparative examples. Evaluation of the produced heat-resistant light-shielding film is made by the following method.

Optical density ( optical density ) And reflectance ( reflectance )

The light density and reflectance of the produced heat-resistant light-shielding film were determined by measuring the light-shielding ability and regular reflectance of the visible region having a wavelength of 380 nm to 780 nm using a spectrophotometer. As an index of light shielding ability, the light density was converted from the transmittance T measured by a spectrophotometer according to the following equation.

Light Density = Log (1 / T)

The light density should be at least 4 and the maximum value of the reflectance should be 10% or less.

Surface gloss

The surface gloss of the produced heat-resistant light-shielding film was measured in accordance with JIS Z8741 with a gloss meter. It is considered to be excellent in surface glossiness when the surface glossiness is less than 3%.

Friction coefficient

The static friction coefficient and the kinetic friction coefficient of the manufactured heat resistant light shielding film were measured according to JIS D1894. If the static friction coefficient and the kinetic friction coefficient were 0.3 or less, it evaluated as favorable.

Surface roughness

The arithmetic mean height Ra of the produced heat-resistant light-shielding film was measured by a surface roughness measuring instrument (Surfcom 570A, manufactured by Tokyo Seimitsu Co., Ltd.). The surface roughness of the film should be 0.1 to 2.1 μm (arithmetic mean height Ra).

Crystallinity of Shading Layer

The crystallinity of the light shielding layer was measured by an X-ray diffraction apparatus. X'PertPROMPD (manufactured by PANalytical Co., Ltd.) was used to measure under a broad spectrum of measurement conditions using Cu Kα-rays at a voltage of 45 kV and a current of 40 mA. The crystallinity of the film was evaluated by the presence of X-ray diffraction peaks. In addition, the degree of crystallinity was evaluated by the presence or absence of crystal grains when observing the cross section of the layer by TEM.

Composition of Shading Layer

The composition of the light shielding layer (atomic ratio C / Me) was measured by quantitative analysis using XPS and electron probe micro analyzer (EPMA). In addition, the amount of oxygen (atomic ratio O / Me) of the light shielding layer was quantitatively analyzed through XPS. Composition analysis using XPS was performed after sputtering in vacuo to remove the surface layer of 20-30 nm. The film should have a C / Me of at least 0.3 and an O / Me of 0.5 or less.

Heat resistance

The heat resistance of the manufactured heat resistant light shielding film was evaluated by the following procedure. The heat-resistant light-shielding film thus prepared was placed in an oven (manufactured by Advantech), heated for 24 hours to the aforementioned heating temperatures (130, 155, and 250 ° C), and then taken out. Evaluation was good (O) if there was no discoloration of the membrane, and insufficient (X) if discoloration of the membrane was observed.

Adhesiveness

The adhesiveness of the produced heat resistant light shielding film was evaluated according to JIS C0021. The evaluation was good (O) if no peel-off of the membrane occurred, and insufficient (X) if the detachment of the membrane was observed.

Electroconductivity

The conductivity of the produced heat resistant light shielding film was evaluated according to JIS K6911.

Example 1

The metal carbide layer was formed on the resin film base material which has heat resistance of 200 degreeC or more using the reel mounting sputtering apparatus shown in FIG. First, the target 11 serving as the raw material of the film was mounted on the magnetron cathode 10 mounted to face the surface of the cooling can roll 8. The film conveying part which consists of the unwinding roll 5, the cooling can roll 8, the winding roll 9, etc. was isolate | separated from the magnetron cathode 10 by the diaphragm 12. As shown in FIG. Then, the roll-shaped resin film base material 1 was set to the unwinding roll 5.

As the resin film base material, the polyimide (PI) film had a thickness of 75 μm and was surface treated by sand blasting so as to form a fine uneven structure having an arithmetic mean height of 0.5 μm on the surface. This polyimide film was heated to a temperature of 200 ° C. or higher before sputtering and dried sufficiently.

Next, after evacuating the contents in the vacuum chamber 7 with a vacuum pump 6 such as a turbo molecular pump, discharge is generated between the cooling can roll 8 and the cathode, and the resin film base material 1 is removed. The layer was formed while conveying in close contact with the surface of the cooling can roll. The degree of vacuum in the vacuum chamber before the formation of the layer was 2 × 10 ⁻⁴ Pa or less.

First, a sintered titanium carbide target (atom ratio of C / Ti: 0.8) was installed on the cathode, and a titanium carbide layer was formed by DC sputtering. A titanium carbide layer was formed under 0.6 Pa sputtering gas pressure using high purity argon gas (99.999%) as the sputtering gas. The thickness of the titanium carbide layer was adjusted by controlling the feed rate of the film and the power applied to the target during layer formation. The resin film base material 1 conveyed from the unwinding roll 5 was wound up by the winding-up roll 9 via the surface of the cooling can roll 8.

When sputtering the titanium carbide layer, the temperature of the film surface was measured through an inspection window of quartz glass in a reel mounted sputtering apparatus using an infrared radiation thermometer, and the temperature was 200 to 210 ° C.

A titanium carbide layer having a thickness of 200 nm was formed on both sides of a 75 μm-thick polyimide (PI) film to prepare a heat resistant light-shielding film. The surface of the polyimide (PI) film was treated by sand blasting at the conditions of discharge time, discharge voltage and transfer speed mentioned above to form fine concavo-convex structures with arithmetic mean height Ra of 0.5 μm on both sides. This layer formation was repeated on both sides to form a light shielding layer having a center-symmetrical structure of the polyimide film substrate.

Then, the heat-resistant light-shielding film thus prepared was evaluated by the aforementioned method. As a result of quantitative analysis of XPS and EPMA, it was confirmed that the structure of the formed titanium carbide layer was the same as the composition of the target (atom ratio of C / Ti of 0.8). In addition, the amount of oxygen in the layer confirmed that the O / Me atomic ratio was 0.3 from XPS quantitative analysis.

The crystallinity of the film was measured by X-ray diffraction, and a pattern as shown in FIG. 6 was obtained. The patterns demonstrate peaks due to the TiC crystal structure and demonstrate excellent crystallinity. In addition, when the cross section was observed by TEM, it was confirmed that the layer was composed of crystal grains.

In addition, the light density in the visible region (wavelength range of 380 to 780 nm) was 4 or more, and the maximum reflectance was 7%. Surface glossiness was less than 3%. The static friction coefficient and the kinetic friction coefficient were excellent as 0.3 or less. In addition, the surface resistance value was 98 ohms / square (ohm per square), and the arithmetic mean height Ra of the surface was 0.4 micrometer.

No distortion or discoloration was found in the heat-resistant light-shielding film even after heating. Desorption of the layer also did not occur, and the bonding strength was excellent. There was no change in the light shielding ability, the reflection characteristic, the surface gloss, and the friction coefficient after heating. These evaluation results are shown in Table 1.

The heat-resistant light-shielding film prepared above was excellent in terms of light density, surface gloss, heat resistance, coefficient of friction and conductivity. Therefore, such heat resistant light shielding film can be used as a part of a liquid crystal projector such as an aperture used in a high temperature environment.

Example 2

A heat-resistant light-shielding film was prepared under the same conditions as in Example 1, except that the thickness of the titanium carbide layer was 110 nm by changing the film feed rate during sputtering. The kind of target material, the kind of resin film, thickness, and surface roughness were the same as in Example 1. The degree of vacuum in the vacuum chamber before the start of sputtering was 6 × 10 ⁻⁵ Pa or less. The amount of carbon in the light shielding layer was the same as in Example 1. As a result of quantitative analysis of the amount of oxygen in the layer by XPS, the atomic ratio of O / Me was 0.4. As a result of X-ray diffraction measurement, it was confirmed that the layer was TiC having excellent crystallinity. Cross-sectional observation by TEM revealed a dense layer of crystal grains.

Evaluation (light characteristics and heat resistance) with respect to the manufactured heat-resistant light-shielding film was performed by the same method and conditions as Example 1. It was 180-200 degreeC when the temperature of the film surface was measured from the quartz glass inspection window of the reel mounting sputtering apparatus with the infrared radiation thermometer similarly to Example 1 at the time of sputtering of a titanium carbide layer.

Properties in the visible region such as light density, reflectance, surface glossiness and the like were comparable to Example 1. Further, the surface resistance and the arithmetic mean height Ra were found to be 190 Ω / □ and 0.4 μm, respectively. In addition, in the adhesive evaluation of the layer performed after heating at 250 ° C. for 24 hours, no distortion or detachment of the layer occurred, and it was confirmed that the same heat resistance characteristics as those of Example 1 were obtained. Table 1 shows the structure and properties of the manufactured heat resistant light shielding film.

Therefore, such heat resistant light shielding film can be used as a part of a liquid crystal projector such as an aperture used in a high temperature environment.

Example 3

The degree of vacuum in the vacuum chamber before sputtering was 8 × 10 ⁻⁴ Pa, and sputtering was repeated five times on the film substrate under the sputtering conditions of Example 2 to form a titanium carbide layer having a thickness of 550 nm on both sides of the film substrate. Except that, a heat-resistant light shielding film was prepared under the same conditions as in Example 2. The kind of target material, the kind of resin film, thickness, and surface roughness were the same as in Example 1.

Evaluation (light characteristics and heat resistance) with respect to the manufactured heat-resistant light-shielding film was performed by the same method and conditions as Example 1. When sputtering the titanium carbide layer, the temperature of the film surface was measured from the quartz glass inspection window of the reel mounting sputtering apparatus with an infrared radiation thermometer similarly to Example 1, and it was 180-200 degreeC.

The carbon content of the light shielding layer was the same as that of Example 1, and the amount of oxygen (O / Ti atomic ratio) of the layer analyzed by XPS was 0.8, which was slightly higher than that of the layers prepared through Examples 1 and 2. As a result of X-ray diffraction measurement, it was confirmed that the layer was TiC having excellent crystallinity. In addition, cross-sectional observation by TEM revealed that it was a dense layer made of crystal grains.

Properties in the visible region, such as light density, reflectance, and surface glossiness, were the same as in Example 1. Surface resistance and arithmetic mean height Ra were found to be 80 Ω / □ and 0.3 μm, respectively. In addition, in the adhesive evaluation of the layer performed after heating at 250 ° C. for 24 hours, no distortion or detachment of the layer occurred, and it was confirmed that the same heat resistance characteristics as those of Example 1 were obtained. Table 1 shows the structure and properties of the manufactured heat resistant light shielding film.

Due to the low degree of vacuum in the vacuum chamber during sputtering, the amount of oxygen contained in the layer prepared in Example 3 was higher than the layers of Examples 1 and 2. In other words, it is considered that the oxygen gas remaining in the vacuum chamber is introduced into the layer by sputtering. Such a layer with a large amount of oxygen cannot exhibit sufficient light shielding ability due to the slightly high transmittance when the thickness is 400 nm or less. However, by increasing the thickness of the layer to about 550 nm as in Example 3, it is possible to ensure sufficient light shielding ability of light density 4 or more.

In a similar experiment, it was confirmed that the layer having an O / Ti of 0.9 exhibits light blocking ability of 4 or more at light density even when the film thickness is 450 nm or 500 nm.

Such heat resistant light shielding film may be used as a part of a liquid crystal projector such as an aperture used in a high temperature environment.

Comparative Example 1

A heat-resistant light-shielding film was prepared under the same conditions as in Example 1 except that the film feed rate was changed to make the thickness of the titanium carbide layer 90 nm. The kind of target material, the kind, thickness, and surface roughness of the resin film were the same as in Example 1. The composition (carbon amount and oxygen amount) and crystallinity of the light shielding layer were the same as those of Example 1, and the evaluation results thereof are shown in Table 2.

The heat-resistant light-shielding film which sputter | spattered the titanium carbide of 90 nm in thickness on both surfaces was evaluated by the same method under the same conditions as Example 1. As a result, the light density was 3, and the film did not have sufficient light shielding ability. Thus, such films do not work sufficiently due to leak of light when used as part of a liquid crystal projector.

Example 4

The heat-resistant light-shielding film was manufactured on the same conditions as Example 1 except that the polyimide film whose arithmetic mean height Ra is 0.2 micrometer was used by sandblasting by changing surface treatment conditions. The kind of target material, the kind of resin film, thickness, and surface roughness were the same as in Example 1.

The temperature of the film surface was measured from the quartz glass inspection window of the reel mounting sputtering apparatus by the infrared radiation thermometer similarly to Example 1 at the time of sputtering of a titanium carbide layer. The temperature was 200-210 ° C., equivalent to the film temperature of Example 1. The characteristics (light characteristics and heat resistance) of the manufactured heat resistant light shielding film were evaluated by the same method and conditions as in Example 1. The composition (carbon amount and oxygen amount) and crystallinity of the light shielding layer were the same as in Example 1. These properties are shown in Table 1.

As a result, films having the same properties as those of Example 1, such as light density and surface gloss, were produced. Surface resistance and arithmetic mean height Ra were found to be 105 Ω / □ and 0.1 μm, respectively. The maximum reflectance in the visible region was 10%. In addition, in the adhesive evaluation of the layer performed after heating at 250 ° C. for 24 hours, no distortion or detachment of the layer occurred, and it was confirmed that the same heat resistance characteristics as those of Example 1 were obtained. Table 1 shows the structure and properties of the manufactured heat resistant light shielding film.

Therefore, such heat resistant light shielding film can be used as a part of a liquid crystal projector such as an aperture used in a high temperature environment.

Example 5

The heat-resistant light-shielding film was manufactured on the same conditions as Example 1 except that the polyimide film whose arithmetic mean height Ra was 0.8 micrometers was used by sandblasting on the surface treatment conditions. The kind of target material, the kind of resin film, thickness, and surface roughness were the same as in Example 1.

The temperature of the film surface was measured from the quartz glass inspection window of the reel mounted sputtering apparatus with an infrared radiation thermometer in the same manner as in Example 1 during sputtering of the titanium carbide layer. The temperature was 200-210 ° C., equivalent to the film temperature of Example 1.

The characteristics (light characteristics and heat resistance) of the manufactured heat resistant light shielding film were evaluated by the same method and conditions as in Example 1. The composition (carbon amount and oxygen amount) and crystallinity of the light shielding layer were the same as in Example 1. The light shielding layer had excellent crystallinity as in Example 1, and the amount of carbon and oxygen were almost the same as in Example 1. These properties are shown in Table 1.

As a result, films such as light density, reflectance, surface gloss and the like could be produced in the same manner as in Example 1. In addition, it was confirmed that surface resistance and arithmetic mean height Ra are 90 ohms / square and 0.7 micrometers, respectively. In addition, in the adhesive evaluation of the layer performed after heating at 250 ° C. for 24 hours, no distortion or detachment of the layer occurred, and it was confirmed that the same heat resistance characteristics as those of Example 1 were obtained. Such heat resistant light shielding film may be used as a part of a liquid crystal projector such as an aperture used in a high temperature environment.

Comparative Example 2

The heat-resistant light-shielding film was manufactured on the same conditions as Example 1 except that the polyimide film whose arithmetic mean height Ra is 0.1 micrometer was used by sandblasting by changing surface treatment conditions. The kind of target material, the kind of resin film, thickness, and surface roughness were the same as in Example 1.

When sputtering the titanium carbide layer, the temperature of the film surface was measured from the quartz glass inspection window of the reel-mounted sputtering apparatus with an infrared radiation thermometer in the same manner as in Example 1. The temperature was 200 to 210 ° C.

Heat-resistant light-shielding films (light characteristics and heat resistance) made of titanium carbide layers formed on both sides of the film substrate were evaluated in the same manner and in the same manner as in Example 1. The light shielding layer was excellent in crystallinity as in Example 1, and the amount of carbon and oxygen contained in the layer were the same as in Example 1. These properties are shown in Table 1. As a result, the film had a light density of 4 or more in the same manner as in Example 1, but had a maximum reflectance of 33% and a surface gloss of 70%, so that the reflectance and surface glossiness were higher than those in Example 2. In addition, the surface resistance and the arithmetic mean height Ra of the surface were 110 ohms / square and 0.05 micrometers, respectively. No distortion or desorption of the layer occurred in the evaluation of the bonding strength of the layer made after heating at 250 ° C. for 24 hours.

Such heat resistant light shielding films having high reflectance and surface gloss cannot be used as shutter blades because they are affected by surface reflection.

Comparative Example 3

A heat-resistant light-shielding film was prepared under the same conditions as in Example 2 except that a polyimide film having an arithmetic mean height Ra of 2.3 μm was used by sandblasting with different surface treatment conditions. The kind of target material, the kind, thickness and surface roughness of the resin film were the same as in Example 2.

When sputtering the titanium carbide layer, the temperature of the film surface was measured from the quartz glass inspection window of the reel-mounted sputtering apparatus with an infrared radiation thermometer in the same manner as in Example 1. The temperature was 200-210 ° C., equivalent to the film temperature of Example 1.

The heat-resistant light-shielding film (optical characteristics and heat resistance) made of a 110 nm thick titanium carbide film formed on both sides of the film substrate was evaluated in the same manner and in the same manner as in Example 1. The light shielding layer had excellent crystallinity as in Example 2, and the amount of carbon and oxygen contained in the layer were also the same as in Example 2. These properties are shown in Table 2. As a result, the film had a maximum reflectance of 3% and a surface glossiness of 3% or less in the same manner as in Example 2, but a light density of 2 means that it was a heat-resistant light-shielding film having insufficient light blocking ability. In addition, the surface resistance and the arithmetic mean height Ra of the surfaces were 86 ohms / square and 2.2 micrometers, respectively. No distortion or desorption of the layer occurred even in the evaluation of the bonding strength of the layer performed after heating at 250 ° C. for 24 hours. Table 2 shows the structure and properties of the manufactured heat resistant light shielding film.

Therefore, such heat-resistant light-shielding film has a low light density, so that a considerable amount of light can pass through as compared to the film manufactured in the above embodiments, and is used not only in the aperture parts used in liquid crystal projectors but also in various devices in the optical field. Cannot be used.

[Examples 6 to 8]

Except that the atomic ratio of C / Ti constituting the titanium carbide layer was varied to 0.3 (Example 6), 0.5 (Example 7) and 1.1 (Example 8) using targets having different carbon contents. Manufactured heat resistant light-shielding film similarly to the conditions in Example 1.

The type, thickness and surface roughness of the resin film and the thickness of the titanium carbide layer were the same as in Example 1. The structure and characteristics of the heat resistant light shielding film are shown in Table 1.

The temperature of the film surface was measured from the quartz glass inspection window of the reel mounting sputtering apparatus by the infrared radiation thermometer similarly to Example 1 at the time of sputtering of a titanium carbide layer. The temperature was 200-210 ° C., which was the same as the film temperature of Example 1.

The characteristics (light characteristics and heat resistance) of the heat-resistant light-shielding film manufactured by the same method and conditions as in Example 1 were evaluated. As a result, films such as light density, reflectance, surface gloss and the like could be produced in the same manner as in Example 1. In addition, surface resistance and arithmetic mean height Ra were confirmed to be 90-115 ohms / square and 0.4 micrometer, respectively. X-ray diffraction of the light shielding layers tended to decrease as the atomic ratio of C / Ti increased, but the crystallinity of each layer was excellent. In addition, similar to these results, it was confirmed that each layer forms a crystal layer in the TEM observation. As a result of quantitative analysis of the oxygen content of the layer by XPS, the O / Ti atomic ratio was 0.2 to 0.4.

In addition, in the adhesive evaluation of the layer performed after heating at 250 ° C. for 24 hours, no distortion or detachment of the layer occurred, and it was confirmed that the same heat resistance characteristics as those of Example 1 were obtained.

Therefore, such heat resistant light shielding film can be used as a part of a liquid crystal projector such as an aperture used in a high temperature environment.

[Comparative Example 4]

A heat-resistant light-shielding film was prepared under the same conditions as in Example 1, except that the atomic ratio of C / Ti in the titanium carbide layer was changed to 0.15 using a target having a different carbon content. The structure and properties of the manufactured heat resistant light shielding film are shown in Table 2.

When sputtering a titanium carbide layer, the temperature of the film surface was measured from the quartz glass inspection window of the reel mounting sputtering apparatus with the infrared radiation thermometer like Example 1. The temperature was 200-210 ° C., which was the same as the film temperature of Example 1.

The characteristics (light characteristics and heat resistance) of the manufactured heat resistant light shielding film were evaluated by the same method and conditions as in Example 1. As a result, the properties of light density, reflectance, surface gloss, and the like were the same as those prepared in Example 1. In addition, it was confirmed that surface resistance and arithmetic mean height Ra were 86 ohms / square and 0.4 micrometer, respectively. The crystallinity of the layer was excellent and the oxygen content of the layer was 0.4 in O / Ti atomic ratio.

Furthermore, no distortion of the layer occurred in the adhesion evaluation of the layer performed after heating at 250 ° C. for 24 hours, but detachment of the layer occurred, causing severe discoloration due to a change in reflectance. The cross-sectional observation of the layer by TEM confirmed that the interface of the light shielding layer facing the surface and the polyimide side was oxidized. It is assumed that this oxidation phenomenon is the cause of the decrease in the bonding strength of the layer and the discoloration.

Therefore, such heat resistant light shielding film cannot be used as a part of a liquid crystal projector such as an aperture used in a high temperature environment.

[Comparative Example 5]

A heat-resistant light-shielding film was prepared under the same conditions as in Example 1, except that a titanium layer prepared using a Ti target and using no carbon was used as the light-shielding layer. The type, thickness and surface roughness of the resin film and the thickness of the light shielding layer were the same as in Example 1.

The structure and characteristics of the heat-resistant light-shielding film are shown in Table 2.

When sputtering the titanium carbide layer, the temperature of the film surface was measured from the quartz glass inspection window of the reel-mounted sputtering apparatus with an infrared radiation thermometer in the same manner as in Example 1. The temperature was 200-210 ° C., which was the same as the film temperature of Example 1.

The properties (light characteristics and heat resistance) of the manufactured heat resistant light shielding films were evaluated in the same manner and in the same manner as in Example 1. As a result, the properties of light density, reflectance, surface gloss, and the like were the same as those prepared in Example 1. In addition, it was confirmed that surface resistance and arithmetic mean height Ra were 86 ohms / square and 0.4 micrometer, respectively.

However, no distortion of the layer occurred in the adhesion evaluation of the layer performed after heating at 250 ° C. for 24 hours, but detachment of the layer occurred, causing severe discoloration due to a change in reflectance. The cross-sectional observation of the layer by TEM confirmed that the interface of the light shielding layer facing the surface and the polyimide side was oxidized. It is assumed that this oxidation phenomenon is the cause of the decrease in the bonding strength of the layer and the discoloration.

Therefore, such heat resistant light shielding film cannot be used as a part of a liquid crystal projector such as an aperture used in a high temperature environment.

Example 9

The same titanium carbide layer as in Example 1 was formed on one surface of the film substrate in the suspended state using the sputtering apparatus shown in FIG. As the resin film base material, a 200 μm thick polyimide film was used. The surface of the film substrate to be sputtered was previously treated by sand blasting, showing the same surface roughness as in Example 1.

The properties (light characteristics and heat resistance) of the manufactured heat resistant light shielding films were evaluated in the same manner and in the same manner as in Example 1. The film surface temperature was measured from the quartz glass inspection window of the reel mounting sputtering apparatus with an infrared radiation thermometer in the same manner as in Example 1 during sputtering of the titanium carbide layer. The temperature was 270-310 ° C., which means that the natural heating effect received from the plasma is more pronounced compared to Example 1.

Properties such as light density, reflectance, surface gloss of the sputtered surface in the visible region were the same as in Example 1. It was also confirmed that the surface resistance and the arithmetic mean height Ra were 95 Ω / □ and 0.4 μm, respectively. The prepared layer had excellent crystallinity, and the carbon and oxygen amounts of the layer were comparable to those of Example 1.

In addition, in the adhesive evaluation of the layer performed after heating at 250 ° C. for 24 hours, no distortion or desorption of the layer occurred, thereby confirming that it had heat resistance equivalent to that of Example 1. Table 1 shows the structure and properties of the manufactured heat resistant light shielding film.

Therefore, such heat resistant light shielding film can be used as a part of a liquid crystal projector such as an aperture used in a high temperature environment.

[Examples 10 to 12, Comparative Examples 6 and 7]

Heat-resistant light-shielding films were prepared in the same manner as in Examples 6 to 8 and Comparative Examples 4 and 5 using tungsten carbide layers having varying carbon contents. The resin film base material was a polyimide film and thickness was 50 micrometers. Fine irregularities having arithmetic mean height Ra of 0.5 µm were formed on both sides of the film substrate. Tungsten carbide layers or tungsten layers, each having a different carbon content, have a thickness of about 150 nm and a film using a tungsten carbide target or tungsten target having a different carbon amount under conditions similar to Examples 6-8 and Comparative Examples 4 and 5. Formed on the substrate surface. When sputtering the tungsten carbide layer or the tungsten layer, the temperature of the film surface was measured from the quartz glass inspection window of the reel mounting sputtering apparatus with an infrared radiation thermometer in the same manner as in Example 1. The temperature was 190-203 ° C.

The structure and characteristics of the heat-resistant light-shielding film prepared are shown in Table 1 and Table 2. As a result of analyzing the oxygen content of the layers through XPS, it was 0.05 to 0.1 in O / Me atomic ratio. X-ray diffraction of the light shielding layer showed a tendency that the diffraction peak was weakened as the C / W atomic ratio increased, but the crystallinity of each layer was excellent. Similarly, the TEM observation confirmed that each layer formed a crystal layer.

Properties such as light density, reflectance, surface gloss, and the like were the same as those prepared in Example 1. In addition, the surface resistance means that it has conductivity from 83 to 123 Ω / □, it was confirmed that the arithmetic mean height Ra of the surface is 0.4 ㎛.

In the adhesive evaluation of the layer carried out after heating at 250 ° C. for 24 hours, discoloration or warping was observed in the layers having C / W atomic ratios of 0.3 (Example 10), 0.6 (Example 11), and 0.9 (Example 12). However, in the layers having a C / W atomic ratio of 0.1 (Comparative Example 6) and 0 (Comparative Example 7), layer detachment occurred and serious discoloration was caused by a change in reflectance.

As a result of cross-sectional observation of the layer by TEM, in Comparative Examples 6 and 7, it was confirmed that the surface of the light shielding layer and a part of the layer interface in contact with the polyimide film were oxidized, but no oxidation phenomenon was observed in the layers of Examples 10 to 12. Did. This oxidation phenomenon is presumed to be the cause of the decrease in the bonding strength and discoloration in Comparative Examples 6 and 7.

Therefore, the heat-resistant light blocking films of Examples 10 to 12 may be used as parts of liquid crystal projectors such as apertures used under high temperature environments, but films such as those of Comparative Examples 6 and 7 cannot be used in high temperature environments.

[Examples 13 to 15, Comparative Examples 8 and 9]

Heat-resistant light-shielding films were prepared in the same manner as in Examples 6 to 8 and Comparative Examples 4 and 5 using silicon carbide layers with varying carbon contents. The resin film base material was a polyimide film and was 125 micrometers in thickness. Fine irregularities having arithmetic mean height Ra of 0.4 µm were formed on both sides of the film substrate. Both the silicon carbide layer and the silicon layer each having a different carbon content are about 270 nm in thickness, using silicon carbide targets or silicon targets having different carbon amounts under conditions similar to those of Examples 6 to 8 and Comparative Examples 4 and 5. To form on a film substrate. When sputtering the silicon carbide layer or silicon layer, the temperature of the film surface was measured from the quartz glass inspection window of the reel mounting sputtering apparatus with an infrared radiation thermometer in the same manner as in Example 1. Temperature was 205-213 degreeC.

The structure and the characteristics of the heat-resistant light-shielding film produced are shown in Table 1 and Table 2. As a result of analyzing the oxygen content of the layers through XPS, the ratio of O / Si was 0.1 to 0.2. X-ray diffraction of the light shielding layer showed a tendency that the diffraction peak was weakened as the C / Si atomic ratio increased, but the crystallinity of each layer was excellent. Similarly, the TEM observation confirmed that each layer formed a crystal layer.

Properties such as light density, reflectance, surface gloss, and the like were the same as those prepared in Example 1. In addition, the surface resistance means that it has conductivity at 91 to 156 Ω / □, and the arithmetic mean height Ra of the surface was found to be 0.3 μm.

In the adhesive evaluation of the layer carried out after heating at 250 ° C. for 24 hours, discoloration or warping was observed in the layers having C / Si atomic ratios of 0.35 (Example 13), 0.5 (Example 14), and 0.95 (Example 15). However, in the layers having a C / Si atomic ratio of 0.2 (Comparative Example 8) and 0 (Comparative Example 9), layer detachment occurred, causing severe discoloration due to a change in reflectance. As a result of cross-sectional observation of the layer by TEM, in Comparative Examples 8 and 9, it was confirmed that a part of the interface of the light shielding layer facing the surface and the polyimide side was oxidized, but no oxidation phenomenon was observed in the layers of Examples 13 to 15. This oxidation phenomenon is presumed to be the cause of the decrease in the bonding strength and discoloration in Comparative Examples 8 and 9.

Thus, the heat-resistant light-shielding films of Examples 13 to 15 may be used as parts of a liquid crystal projector such as an aperture used in a high temperature environment, but films such as those of Comparative Examples 8 and 9 cannot be used in a high temperature environment.

[Examples 16 to 18, Comparative Examples 10 and 11]

Heat-resistant light-shielding films were prepared in the same manner as in Examples 6 to 8 and Comparative Examples 4 and 5 using aluminum carbide layers having varying carbon contents. The resin film substrate was a polyimide film having a thickness of 20 μm. Fine irregularities having arithmetic mean height Ra of 0.6 µm were formed on both sides of the film substrate. The aluminum carbide layer and the aluminum layer, each having a different carbon content, are both about 230 nm thick, and use aluminum carbide targets or aluminum targets having different carbon amounts under conditions similar to Examples 6 to 8 and Comparative Examples 4 and 5. On both sides of the film substrate. When sputtering the aluminum carbide layer or the aluminum layer, the temperature of the film surface was measured from the quartz glass inspection window of the reel mounting sputtering apparatus with an infrared radiation thermometer in the same manner as in Example 1. The temperature was 200 to 210 ° C.

The structure and the characteristics of the heat-resistant light-shielding film produced are shown in Table 1 and Table 2. As a result of analyzing the oxygen content of the layers through XPS, the ratio of O / Al was 0.1 to 0.2. X-ray diffraction of the light shielding layer showed a tendency that the diffraction peak was weakened as the O / Al atomic ratio increased, but the crystallinity of each layer was excellent. Similarly, the TEM observation confirmed that each layer formed a crystal layer.

Properties such as light density, reflectance, surface gloss, and the like were the same as those prepared in Example 1. Further, the surface resistance was 82 to 125 Ω / □, which means that the layer had conductivity, and the arithmetic mean height Ra of the surface was found to be 0.5 μm.

In the adhesive evaluation of the layer carried out after heating at 250 ° C. for 24 hours, discoloration or warping was observed in the layers having C / Al atomic ratios of 0.3 (Example 16), 0.7 (Example 17), and 1.0 (Example 18). However, in the layers having a C / Al atomic ratio of 0.1 (Comparative Example 10) and 0 (Comparative Example 11), layer detachment occurred and serious discoloration was caused by a change in reflectance. As a result of cross-sectional observation of the layer by TEM, in Comparative Examples 10 and 11, the interface facing the surface of the light shielding layer and the polyimide side were partially oxidized, but no oxidation phenomenon was observed in the layers of Examples 16 to 18. This oxidation phenomenon is presumed to be the cause of the decrease in the bonding strength and discoloration in Comparative Examples 10 and 11.

Thus, the heat-resistant light-shielding films of Examples 16 to 18 may be used as parts of liquid crystal projectors such as apertures used under high temperature environments, but films such as those of Comparative Examples 10 and 11 cannot be used in high temperature environments.

Example 19

Heat-resistant light-shielding film was prepared using a light-shielding layer having a double layer structure, and the thickness and composition of the layer were titanium carbide layers (thickness: 200 nm, atomic ratio C / Ti: 0.8) / silicon carbide layer (thickness: 20 nm, atomic Defensive C / Si: 0.5). A titanium carbide layer and a silicon carbide layer were sequentially coated on both sides of a polyimide film having the same type, thickness, and surface roughness as Example 1 using the reel mounting sputtering apparatus shown in FIG. 3.

The temperature of the film surface upon sputtering was measured in the same manner as in Example 1. The temperature was 190 to 210 ° C. The type, thickness and surface roughness of the resin film were the same as in Example 1. The characteristics (light characteristics and heat resistance) of the manufactured heat resistant light shielding film were evaluated by the same method and conditions as in Example 1. Table 1 shows the structure and properties of the manufactured heat resistant light shielding film. The crystallinity degree of the laminated light shielding layer was excellent. In addition, when the oxygen content (O / Me) of each layer was measured by XPS while removing the layer surface by sputtering, the O / Si atomic ratio was 0.1 in the SiC layer, and the O / Ti atomic ratio was in the TiC layer. Was found to be 0.2.

Properties such as surface resistance, surface roughness, light density and surface gloss in the visible region were comparable to those in Example 1. The maximum reflectance in the visible region was 4% and the reflectance was significantly reduced compared to Example 1, in which only the titanium carbide layer was used without coating the silicon carbide layer on the surface. Titanium carbide and silicon carbide layers with different light constants were stacked, resulting in a reduction in reflectance due to the antireflection effect caused by optical interference.

In addition, it can be observed from the adhesion evaluation of the layer performed after heating at 250 ° C. for 24 hours that no distortion of the layer or detachment of the layer is caused, and it can be confirmed that it has the same heat resistance characteristics as in Example 1.

Therefore, such heat resistant light-shielding film can be used as a part of a liquid crystal projector such as an aperture used in a high temperature environment, and especially can be used for a part located near the lens of the projector where low reflectance is required.

Example 20

Experiments were carried out in the same manner as the titanium carbides of Examples 1 to 9 and Comparative Examples 1 to 4 using niobium carbide, molybdenum carbide, tantalum carbide, zirconium carbide or hafnium carbide as the light shielding layer, and the same tendency was observed as a result. . The light-shielding film having heat resistance was found to have a C / Nb atomic ratio, a C / Mo atomic ratio, a C / V atomic ratio, a C / Ta atomic ratio, a C / Zr atomic ratio or a C / Hf atomic ratio of 0.3 or more. The crystallinity of each layer was excellent, and the layer having a thickness of 400 nm or less showed sufficient light blocking ability when the oxygen content of the layer was 0.5 or less in O / Me atomic ratio.

Example 21

Heat-resistant light-shielding film under the same conditions as in Example 1, except that a polyethylene naphthalate (PEN) film having a thickness of 25 μm was used as the heat-resistant resin film, and the film surface temperature was set to 155 to 158 ° C. during sputtering. Was prepared. The kind of target material and the surface roughness of the film substrate were the same as in Example 1.

The characteristics (light characteristics and heat resistance) of the manufactured heat resistant light shielding film were evaluated by the same method and conditions as in Example 1. The temperature of the film surface was measured from the quartz glass inspection window of the reel mounting sputtering apparatus in the same manner as in Example 1 when sputtering the titanium carbide layer. Temperature was 155-158 degreeC.

Properties such as surface resistance, surface roughness, light density and surface gloss in the visible region were comparable to Example 1. In addition, it was confirmed that surface resistance and arithmetic mean height Ra were 90 ohms / square and 0.4 micrometer, respectively. It was confirmed that the crystallinity of the light shielding layer was excellent by a similar method. The carbon and oxygen content of the light shielding layer was comparable with Example 1.

In addition, the adhesion of the layer with respect to heat resistance was similarly evaluated after heating at 155 ° C. for 24 hours. As a result, the layer showed no distortion or detachment and exhibited the same heat resistance characteristics as in Example 1. The structure and properties of the manufactured heat resistant light shielding film are shown in Table 1.

Therefore, such a heat resistant light shielding film can be used as a vehicle interior monitor component such as a fixed aperture of a lens device used at 100 to 155 ° C.

[Examples 22 and 23]

The heat-resistant resin film was heat-resistant under the same conditions as in Example 21, except that the heat-resistant resin film was changed to a polyethylen naphthalate (PEN) film having a thickness of 6 μm (Example 22) and 12 μm (Example 23). A light shielding film was produced. The kind of target material, the surface roughness of a film base material, and the sputtering conditions were the same as that of Example 1. The composition and thickness of the layer were also the same as in Example 1.

It was 155-158 degreeC when the temperature of the film surface at the time of sputtering of a titanium carbide layer was measured from the quartz glass inspection window of the reel mounting sputtering apparatus with the infrared radiation thermometer similarly to Example 1. Analysis of the amount of carbon and amount of oxygen in the layers was performed in a similar manner to give the same results as in Example 1. It was confirmed that the crystallinity of each layer was excellent.

The properties (light characteristics and heat resistance) of the produced heat-resistant light-shielding films were evaluated by the same methods and conditions as in Example 1.

Properties such as light density, reflectance, surface gloss, surface resistance, surface roughness, etc. in the visible region were comparable to those prepared in Example 21.

The heat resistance was tested as in Example 21, and this film had the same heat resistance as in Example 21, and no distortion and detachment occurred. The properties and structure of the heat resistant light shielding film are shown in Table 1.

Therefore, such heat resistant light shielding film can be used as a vehicle interior monitor component such as a fixed aperture of a lens device used at 100 to 155 ° C.

Comparative Example 12

Using the Ti target, a heat resistant light shielding film was prepared under the same conditions as in Example 21, except that a titanium layer containing no carbon was prepared and used as the light shielding film. The type, thickness, surface roughness and thickness of the light shielding layer of the substrate were the same as in Example 21.

Table 2 shows the structure and characteristics of the manufactured heat resistant light shielding layer.

When sputtering the light-shielding film, the temperature of the film surface was measured from the quartz glass inspection window of the reel mounting sputtering apparatus with the infrared radiation thermometer similarly to Example 21. The temperature was 155-158 ° C., which was the same as the film temperature of Example 21.

The characteristics (light characteristics and heat resistance) of the manufactured heat resistant light shielding film were evaluated by the same method and conditions as in Example 21. As a result, the properties of light density, reflectance, surface gloss, surface resistance, arithmetic mean height Ra of the surface and the like were the same as those prepared in Example 21. The crystallization of the layer was also excellent.

However, under the same heat resistance test conditions as in Example 21, no distortion was observed in the adhesion evaluation of the layer performed after heating at 155 ° C. for 24 hours, but detachment of the layer occurred and discoloration was caused by a change in reflectance. The cross-sectional observation of the layer by TEM confirmed that the surface of the light shielding layer and a part of the interface facing the film substrate of the light shielding layer were oxidized. This oxidation phenomenon is presumed to be the cause of the decrease in the binding force and discoloration.

Therefore, such a heat resistant light shielding film cannot be used as a component for monitoring a vehicle interior such as a fixed aperture of a lens device used at 155 ° C.

[Comparative Examples 13 to 16]

In the same manner and conditions as in Comparative Example 12, except that Al (Comparative Example 13), Cr (Comparative Example 14), Ni (Comparative Example 15), and Nb (Comparative Example 16) were used as the light shielding layer. A heat resistant light shielding film was prepared. As a result, a heat resistant light shielding film having the same light density, reflectance, surface gloss, surface resistance, arithmetic mean height Ra as in Example 21 was prepared.

However, under the same heat resistance test conditions as in Example 21, no distortion was observed in the adhesion evaluation of the layer performed after heating at 155 ° C. for 24 hours, but detachment of the layer occurred and discoloration was caused by a change in reflectance. The cross-sectional observation of the layer by TEM confirmed that the surface of the light shielding layer and a part of the interface facing the film substrate of the light shielding layer were oxidized. It is assumed that this oxidation phenomenon is the cause of the decrease in the binding force and discoloration.

Therefore, such a heat resistant light shielding film cannot be used as a vehicle interior monitor component such as a fixed stop of a lens device used at 155 ° C.

Example 24

The heat-resistant light-shielding film was produced in the same manner as in Example 1 except that the surface treatment was performed under different conditions by sand blasting, and the arithmetic mean height Ra of the polyimide (PI) film was set to 2.2 µm. The kind of target material, the kind and thickness of the polyimide film are the same as in Example 1.

The temperature of the film surface during sputtering of the titanium carbide layer was measured from the quartz glass inspection window of the reel-mounted sputtering apparatus with an infrared radiation thermometer in the same manner as in Example 1, and was 200 to 210 ° C., which was the same as the film temperature of Example 1 It was. The characteristics (light characteristics and heat resistance) of the manufactured heat resistant light shielding film were evaluated by the same method and conditions as in Example 1.

As a result, films having the same properties as those of Example 1, such as light density and surface gloss, were produced. In addition, it was confirmed that surface resistance and arithmetic mean height Ra were 120 ohms / square and 2.1 micrometers, respectively. Maximum reflectance in the visible region was 3%. The crystallinity, carbon amount and oxygen amount of the light shielding layer were the same as those in Example 1.

No distortion or desorption of the layer occurred in the adhesion evaluation of the layer made after heating at 250 ° C. for 24 hours, which means that it has heat resistance equivalent to that of Example 1. Table 1 shows the structure and properties of the manufactured heat resistant light shielding film. The general reflectance in the visible range was up to 3% and the film reflects low reflectivity.

Therefore, such heat resistant light shielding film can be used as a part of a liquid crystal projector such as an aperture used in a high temperature environment.

Example 25

The heat-resistant light-shielding film was produced in the same manner as in Example 1, except that the surface treatment was performed under different conditions by sand blasting, and the arithmetic mean height Ra of the polyimide (PI) film was 1.6 µm. The kind of target material, the kind and thickness of a resin film are the same as in Example 1.

The temperature of the film surface at the time of sputtering of the titanium carbide layer was measured from the quartz glass inspection window of the reel mounting sputtering apparatus with an infrared radiation thermometer similarly to Example 1, and it was 200-210 degreeC similarly to the film temperature of Example 1. The characteristics (light characteristics and heat resistance) of the manufactured heat resistant light shielding film were evaluated by the same method and conditions as in Example 1.

As a result, films having the same properties as those of Example 1, such as light density and surface gloss, were produced. In addition, it was confirmed that surface resistance and arithmetic mean height Ra were 110 ohms / square and 1.5 micrometers, respectively. Maximum reflectance in the visible region was 4%. The crystallinity, carbon amount and oxygen amount of the light shielding layer were the same as those in Example 1.

No distortion or desorption of the layer occurred in the adhesion evaluation of the layer made after heating at 250 ° C. for 24 hours, which means that it has heat resistance equivalent to that of Example 1. Table 1 shows the structure and properties of the manufactured heat resistant light shielding film. The general reflectance in the visible region was at most 4% and the reflectance of the film is low.

Therefore, such heat resistant light shielding film can be used as a part of a liquid crystal projector such as an aperture used in a high temperature environment.

Example 26

The heat-resistant light-shielding film prepared in Examples 1 to 25 was punched to prepare a light shielding blade of 20 mm x 30 mm. The weight of one shading blade was 0.01-0.03 g. Two blades were mounted in the diaphragm and the durability test was done.

The durability test evaluated the heat resistance and wear resistance of the shading blades by irradiating a lamp light source and moving tens of thousands of times in the range including the maximum and minimum opening diameters of the shading blades.

The tested shading blades had abrasion resistance, so there was no change in appearance, and no worn foreign matter was deposited in the aperture device. Therefore, the heat resistant shading blade has various advantages, for example, low friction, abrasion and noise, can be reduced by using a resin film as a substrate, and the driving torque of the motor for operating the shading blade is reduced. It can be reduced, and the slip characteristics are excellent.

[Comparative Example 17]

Except for replacing the shading blades with a metallic stainless steel (SUS) foil plate, perforated the SUS foil plate in the same manner as in Example 26, having a size of 20 x 30 mm and using an SUS foil plate as the substrate. A light shielding blade was prepared. The weight of the light shielding blade was 0.2 to 0.5 g.

There was no change in the appearance of the shading blades that evaluated the wearability, and no worn foreign matter adhered to the aperture device. However, the weight of the shading blades increased to increase the drive torque of the motor for driving the shading blades, resulting in poor slip characteristics.

Example 27

Except that the film surface temperature at the time of sputtering was changed to 50-100 degreeC, the heat-resistant light-shielding film which has the same structure under the same conditions as Example 1 was produced. This film surface temperature was achieved by adjusting the temperature of the cooling can in the range of -20 to 20 ° C. The light shielding layer was a crystal layer, and the amount of carbon and oxygen contained in the layer were the same as in Example 1.

After the heat-resistant light-shielding film thus prepared was heated at 250 ° C. for 24 hours, the adhesion of the layer was evaluated. The layer was not warped and there was no discoloration due to the change in reflectance, but desorption was caused. The same results were obtained when evaluated after heating at 155 ° C. for 24 hours.

However, no distortion, discoloration and desorption occurred when evaluated after heating at 130 ° C. for 24 hours. Perforated samples were also heated at 130 ° C. for 24 hours, but no detachment from the edges was induced. Therefore, such heat resistant light shielding film may be used as an optical component such as a fixed aperture of a digital still camera used at a relatively low temperature, for example, a normal temperature or a temperature of 130 ° C. or lower.

Example 28

Except that the film surface temperature at the time of sputtering was changed to 50-100 degreeC, the heat-resistant light-shielding film which has the same structure was manufactured under the same manufacturing conditions as Example 21-23. This film surface temperature was achieved by adjusting the temperature of the cooling can in the range of -20 to 20 ° C. The light shielding layer was a crystal layer, and the amount of carbon and oxygen contained in the layer was the same as in Example 21.

After the heat-resistant light-shielding film prepared above was heated at 250 ° C. for 24 hours, the adhesion of the layer was evaluated. The layer was not warped and there was no discoloration due to the change in reflectance, but desorption was caused. The same results were obtained when evaluated after heating at 155 ° C. for 24 hours.

However, when evaluated after heating at 130 ° C. for 24 hours, no distortion, discoloration and desorption occurred. Perforated samples were also heated at 130 ° C. for 24 hours, but no detachment from the edges was induced. Therefore, such heat resistant light shielding film can be used as an optical component such as a fixed aperture of a digital still camera used at a relatively low temperature, for example, a normal temperature or a temperature of 130 ° C. or lower.

[Examples 29 to 31]

Heat shielding of the same structure under the same conditions as in Example 28, except that the gas pressure during sputtering was changed to 0.2 Pa (Example 29), 0.8 Pa (Example 30) and 1.0 Pa (Example 31). A film was prepared. The light shielding layer was a crystal layer, and the amount of carbon and oxygen contained in the layer was the same as in Example 21.

After the heat-resistant light-shielding film prepared above was heated at 250 ° C. for 24 hours, the adhesion of the layer was evaluated. The layer was not warped and there was no discoloration due to the change in reflectance, but desorption was caused. The same results were obtained when evaluated after heating at 155 ° C. for 24 hours.

However, when evaluated after heating at 130 ° C. for 24 hours, no distortion, discoloration and desorption occurred. Perforated samples were also heated at 130 ° C. for 24 hours, but no detachment from the edges was induced. Therefore, such heat resistant light shielding film can be used as an optical component such as a fixed aperture of a digital still camera used at a relatively low temperature, for example, a normal temperature or a temperature of 130 ° C. or lower.

[Comparative Examples 18 and 19]

Except that the gas pressure during sputtering was 1.3 Pa (Comparative Example 18) and 1.8 Pa (Comparative Example 19), a heat-resistant light-shielding film having the same structure was prepared under the same conditions as in Preparation Example 28. Each light shielding layer was amorphous, unlike Examples 28-31. The amount of carbon and oxygen in each layer were the same as in Example 21.

Evaluation of the heat resistance of the heat-resistant light-shielding film prepared above was made for 24 hours at 130 ℃. Both films caused distortion, discoloration due to reflectance change and severe layer detachment.

The heat resistance evaluation made for 24 hours at 80 ° C. or 24 hours at 100 ° C. also showed the same result. Therefore, such heat-resistant light-shielding film cannot be used as an optical component such as a fixed aperture such as a digital still camera used at a relatively low temperature, for example, a normal temperature or a temperature of 130 ° C. or lower. .

Example 32

The heat-resistant light-shielding film having the same structure as in Example 11 under the same conditions as in Example 11 except that the argon gas pressure at sputtering was 1.0 Pa and the film surface temperature at sputtering was varied from 50 to 100 ° C. Was prepared. This film surface temperature was achieved by adjusting the temperature of the cooling can in the range of -20 to 20 ° C. The light shielding layer was a crystal layer as shown in FIG. 7, and the amount of carbon and oxygen contained in the layer were the same as in Example 11.

The heat resistance evaluation of the produced heat-resistant light-shielding film was made at 250 ° C. for 24 hours. The film did not discolor due to distortion and change in reflectance, but detachment of the layer occurred. The same results were obtained when evaluated after heating at 155 ° C. for 24 hours.

However, when evaluated after heating at 130 ° C. for 24 hours, no distortion, discoloration and desorption occurred. Perforated samples were also heated at 130 ° C. for 24 hours, but no detachment from the edges was induced. Therefore, such heat resistant light shielding film can be used as an optical component such as a fixed aperture of a digital still camera used at a relatively low temperature, for example, a normal temperature or a temperature of 130 ° C. or lower.

[Comparative Example 20]

Except that the gas pressure was set to 1.5 Pa at the time of sputtering, the heat-resistant light-shielding film of the same structure was produced on the conditions similar to Example 32. The amount of carbon and oxygen contained in the layer was the same as in Example 11. As a result of X-ray diffraction measurement in the light shielding layer, no diffraction peak was observed, which means that it is an amorphous layer unlike Examples 11 and 32.

Evaluation of the heat resistance of the heat-resistant light-shielding film prepared above was made for 24 hours at 130 ℃. The film was warped, discolored due to reflectance change and severe desorption.

The same result was obtained when the heat resistance was evaluated at 80 ° C. for 24 hours or at 100 ° C. for 24 hours. Therefore, such heat resistant light shielding film cannot be used as an optical component such as a fixed aperture of a digital still camera used at a relatively low temperature, for example, 130 ° C. or lower.

Comparative Example 21

A heat resistant light-shielding film having the same structure as in Example 1 was prepared under the same conditions as in Example 11 except that the gas pressure was set to 1.5 Pa during sputtering. The type, thickness, surface roughness and thickness of the tungsten carbide layer of the resin film were the same as in Example 11.

The temperature of the film surface was measured from the quartz glass inspection window of the reel mounting sputtering apparatus in the same manner as in Example 1 when sputtering the titanium carbide layer. The temperature was 185-195 ° C., which was the same as the film temperature of Example 11.

Evaluation (light characteristics and heat resistance) with respect to the manufactured heat-resistant light-shielding film was performed by the same method and conditions as Example 1. As a result, characteristics such as light density, reflectance, surface glossiness, and the like were the same as those of Example 1. It was also confirmed that the surface resistance and the arithmetic mean height Ra were 105 Ω / □ and 0.4 μm, respectively. The amount of carbon and oxygen contained in the layer was the same as in Example 11. However, as a result of X-ray diffraction measurement of the light shielding layer, no diffraction peak was observed, which means that the layer was an amorphous structure.

No distortion occurred in the adhesion evaluation of the layer performed after heating at 250 ° C. for 24 hours, but detachment occurred, causing severe discoloration due to a change in reflectance. The cross-sectional observation of the layer by TEM confirmed that the interface facing the surface of the light shielding layer and the polyimide side was oxidized. It is assumed that this oxidation phenomenon is the cause of the decrease in the bonding strength and discoloration of the layer.

Therefore, such heat resistant light shielding film cannot be used as a part of a liquid crystal projector such as an aperture used in a high temperature environment.

 TABLE 1

TABLE 2

In the heat-resistant light-shielding film of the present invention, a metal carbide layer having a predetermined thickness is formed on a heat-resistant resin film substrate with a surface roughness of 0.1 to 2.1 µm (arithmetic mean height Ra), so that low surface gloss, low reflectance and excellent conductivity A heat resistant light shielding film can be produced. In addition, the metal carbide film layer is formed by a sputtering method, and has a denser surface structure than the light shielding film manufactured by a conventional coating process, and has excellent surface wear and friction. In addition, the metal carbide material is more resistant to oxidation, and the light shielding ability does not change even in a high temperature environment and a high humidity environment of 155 to 300 ° C., thus, the heat resistance light shielding film using the metal oxide layer as a light shielding layer is significantly superior. In addition, the heat-resistant light-shielding film according to the present invention has a symmetrical layer structure sandwiched between metal carbide layers around the heat-resistant resin film, so that deformation due to stress of the film during sputtering is not induced, thereby providing excellent productivity.

Therefore, the heat-resistant light-shielding film of the present invention can be usefully used for the diaphragm blade member constituting the light amount adjusting device of the liquid crystal projector, in which heat resistance is particularly required, and the fixed diaphragm constituting the lens device of the monitor for the vehicle interior. Moreover, when used for the shutter blades of a digital camera, a digital video camera, etc., it is very useful industrially.

1 is a cross-sectional view of a heat resistant light shielding film according to the present invention in which a metal carbide film is bonded to one surface of a substrate;

2 is a cross-sectional view of a heat resistant light shielding film according to the present invention in which a metal carbide film is bonded to both sides of a substrate;

3 is a schematic view showing one example of a reel-mounted substrate-cooled sputtering apparatus used for producing a heat-resistant light-shielding film according to the present invention;

4 is a schematic view showing one example of a reel-mounted sputtering apparatus used for producing a heat-resistant light-shielding film according to the present invention;

5 is a schematic diagram showing an aperture structure in which a heat resistant light shielding film according to the present invention is used;

6 is a diagram showing an X-ray diffraction pattern of a light shielding layer (titanium carbide layer) of a heat resistant light shielding film made by a manufacturing method according to the present invention;

FIG. 7 is a diagram showing an X-ray diffraction pattern of a light shielding layer (tungsten carbide layer) of a heat resistant light shielding film produced by a manufacturing method according to the present invention. FIG.

<Description of Major Symbols in Drawing>

1 resin film base material

2 metal carbide layers

5 unwinding roll

6 vacuum pump

7 vacuum chamber

8 cooling cans roll

9 winding rolls

10 magnetron cathode

11 targets

12 bulkhead

13 Support roll

14 heat resistant shading blade

15 guide holes

16 guide pin

17 pin

18 description

19 holes

20 openings

Claims (20)

The light-shielding layer (B) which consists of a resin film base material (A) which has a heat resistance of 155 degreeC or more, and the light shielding layer (B) of the crystalline metal carbide layer (MeC) formed in one or both surfaces of the said resin film base material (A). ) Has a thickness of 100 nm or more, a surface roughness of 0.1 to 2.1 μm (arithmetic mean height Ra), and the content of carbon elements in the metal carbide layer (MeC) is an atomic ratio (C / to total metal elements (Me)). Me) is 0.3 or more, The heat-resistant light-shielding film characterized by the above-mentioned. The heat-resistant light-shielding film according to claim 1, wherein the resin film base material (A) is composed of at least one selected from polyethylene naphthalate, polyimide, aramid, polyphenylene sulfide, or polyether sulfone. The heat-resistant light-shielding film according to claim 1 or 2, wherein the resin film base material (A) has heat resistance of 200 ° C or higher. The heat-resistant light-shielding film according to any one of claims 1 to 3, wherein the resin film base material (A) has a thickness of 5 to 200 µm. The surface roughness of the said resin film base material (A) is 0.2-2.2 micrometers (arithmetic mean height Ra), The heat-resistant light-shielding film in any one of Claims 1-4 characterized by the above-mentioned. The heat resistant light shielding film according to any one of claims 1 to 5, wherein the light shielding layer (B) has a thickness of 110 to 550 nm. The metal carbide layer (MeC) according to any one of claims 1 to 6, the main component is silicon carbide, titanium carbide, aluminum carbide, niobium carbide, tungsten carbide, molybdenum carbide, vanadium carbide, tantalum carbide, zirconium carbide Or at least one material selected from hafnium carbide. The content of carbon element (C) in the metal carbide layer (MeC) is an atomic ratio (C / Me) of the carbon element (C) to the total metal element (Me). Is 0.5 or more, the heat-resistant light-shielding film characterized by the above-mentioned. The method of any one of claims 1 to 8, wherein the content of oxygen (O) in the metal carbide layer (MeC) is 0.5 atomic ratio (O / Me) of oxygen (O) to the total metal element (Me). The heat-resistant light shielding film characterized below. The heat resistant light shielding film according to any one of claims 1 to 9, wherein the reflectance of the light shielding layer (B) is 10% or less with respect to light in a wavelength range of 380 to 780 nm. The heat resistant light shielding film according to any one of claims 1 to 10, wherein the optical density as an index of light-shading capacity is 4 or more in a wavelength range of 380 to 780 nm. The heat-resistant light-shielding film according to any one of claims 1 to 11, wherein metal carbide layers (MeC) having the same structure and thickness are formed on both surfaces of the resin film substrate (A). As a method of manufacturing a heat-resistant light-shielding film made of a crystalline metal carbide layer (MeC) as a light-shielding layer (B) formed on one or both surfaces of a resin film base material (A) having a heat resistance of 155 ° C. or higher and the resin film base material (A). , Supplying a heat resistant resin film base material (A) having a surface roughness of 0.2 to 2.2 mu m (arithmetic mean height Ra) to the sputtering apparatus; And Sputtering method on the said resin film base material A using a metal carbide target in inert gas atmosphere, thickness is 100 nm or more, surface roughness is 0.1-2.1 micrometers (arithmetic mean height Ra), and a metal carbide layer ( The carbon element (C) content of MeC) may include forming a crystalline metal carbide layer (MeC) having an atomic ratio (C / Me) of 0.3 or more to the total metal element (M); Method for producing a heat-resistant light-shielding film comprising a. The method of claim 13, Additionally supplying a heat resistant light shielding film having a metal carbide layer (MeC) formed thereon; And Forming a metal carbide layer (MeC) by sputtering on the other surface of the resin film substrate (A) on which the metal carbide layer (MeC) is not formed. The manufacturing method of the heat resistant light shielding film according to claim 13 or 14, wherein the pressure of the sputtering gas is 0.2 to 1.0 Pa at the time of forming the light shielding layer (B). The surface temperature of the said resin film base material (A) is 180 degreeC or more in the light shielding layer (B) formation timing, The manufacturing method of the heat resistant light shielding film in any one of Claims 13-15 characterized by the above-mentioned. The method according to any one of claims 13 to 16, Setting the resin film substrate (A) in a roll form in a film transfer section of a sputtering apparatus; And Forming a layer by sputtering while the resin film substrate (A) is moved from the wind-off section to the take-up section; manufacturing a heat-resistant light-shielding film, characterized in that consisting of Way. The method according to any one of claims 13 to 17, Setting the resin film base material (A) in the form of a roll on the film transfer part of the sputtering apparatus; And Forming a layer by sputtering while the resin film substrate (A) moves from the unwinding portion to the winding-up portion; Here, the layer is a method of manufacturing a heat-resistant light-shielding film, characterized in that the resin film base (A) is not cooled, but is formed in a floating state in a film-forming chamber during sputtering. . An excellent heat resistance diaphragm manufactured by processing the heat shielding film according to any one of claims 1 to 12. Light intensity adjusting device using the heat-resistant light blocking film according to any one of claims 1 to 12.

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