KR20080090618A - A piezoelectric element - Google Patents

A piezoelectric element Download PDF

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Publication number
KR20080090618A
KR20080090618A KR1020070033629A KR20070033629A KR20080090618A KR 20080090618 A KR20080090618 A KR 20080090618A KR 1020070033629 A KR1020070033629 A KR 1020070033629A KR 20070033629 A KR20070033629 A KR 20070033629A KR 20080090618 A KR20080090618 A KR 20080090618A
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South Korea
Prior art keywords
case
lid
piezoelectric element
support jaw
adhesive material
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KR1020070033629A
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Korean (ko)
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KR100866349B1 (en
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한규진
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주식회사 코스텍시스
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Priority to KR1020070033629A priority Critical patent/KR100866349B1/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/202—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using longitudinal or thickness displacement combined with bending, shear or torsion displacement
    • H10N30/2027—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using longitudinal or thickness displacement combined with bending, shear or torsion displacement having cylindrical or annular shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/802—Circuitry or processes for operating piezoelectric or electrostrictive devices not otherwise provided for, e.g. drive circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

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  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

A piezoelectric element is provided to improve electric characteristics by completely closing the inside of a case to efficiently prevent the leakage of inert gas. A piezoelectric element includes a case(10), electrode circuits(12), a vibration member(30) and a metal alloy lid(20). The electrode circuits are arranged between ceramic insulators(11) in the multi-layered case. The vibration member is received in the case to be connected to electrodes. The metal alloy lid is adhered to an upper portion of the case. The inside of the case is closed. A supporting jaw(20a) is formed at the lower periphery of the lid. A ring-shaped adhesion material(21) is adhered to the supporting jaw. When the ring-shaped adhesion material is melt by heat, the supporting jaw prevent it from flowing to the inner side along the lower surface of the lid.

Description

압전소자{a piezoelectric element}Piezoelectric element

도 1은 종래의 기술을 예시한 단면도,1 is a cross-sectional view illustrating a conventional technique,

도 2는 본 발명의 일실시예를 예시한 분해사시도,2 is an exploded perspective view illustrating an embodiment of the present invention;

도 3은 본 발명의 일실시예를 예시한 단면도,3 is a cross-sectional view illustrating an embodiment of the present invention;

도 4는 본 발명의 다른 실시예를 예시한 단면도,4 is a cross-sectional view illustrating another embodiment of the present invention;

도 5는 본 발명의 또 다른 실시예를 예시한 단면도.5 is a cross-sectional view illustrating another embodiment of the present invention.

* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

1 : 압전소자 10 : 케이스1: piezoelectric element 10: case

11 : 절연체 12 : 전극회로11 insulator 12 electrode circuit

20 : 리드 20a : 지지턱20: lead 20a: support jaw

21 : 접착소재 30 : 진동편21: adhesive material 30: vibrating piece

31 : 와이어31: wire

본 발명은 압전소자에 관한 것으로서, 더욱 상세하게는 압전소자의 케이스에 결합되는 리드(LID)의 둘레 하부에 지지턱이 형성되어 지지턱에 부착된 링형의 접착소재가 열에 의하여 용융될 때 리드의 저면을 따라 흘러 들어가는 폐단이 방지되어 접착력을 높여줄 수 있도록 한 발명에 관한 것이다.The present invention relates to a piezoelectric element, and more particularly, a support jaw is formed in the lower portion of a circumference of a lid (LID) coupled to a case of a piezoelectric element so that the ring-shaped adhesive material attached to the support jaw is melted by heat. It relates to an invention to prevent the closed end flowing along the bottom to increase the adhesive force.

일반적으로 압전소자(水晶振動子)는 얇은 조각의 수정, 전기석, 로셸염과 같은 결정판(結晶板)에 일정한 방향에서 압력을 가하면 판의 양면에 외력에 비례하는 양·음의 전하(電荷)가 나타나 압전효과(壓電效果)에 의하여 진동되면서 안정된 주파수를 공급하는 것으로서 발진기나 필터 등으로 다양하게 사용된다.In general, a piezoelectric element has a positive and negative charge proportional to external force on both sides of a plate when pressure is applied to a crystal plate such as a thin piece of crystal, tourmaline, and Rochelle salt in a certain direction. It oscillates by the piezoelectric effect and supplies a stable frequency. It is used in various ways as an oscillator or a filter.

이중에서도 도 1에서 도시한 바와 같이, 세라믹 절연체(11) 사이에 전극회로(12)들이 다층 배열된 케이스(10) 내부에 수정 진동편(30)이 수납되어 전극에 연결되고 케이스(10)의 상부에 코발트와 니켈의 합금인 코바(kovar)로 이루어진 리드(20)(Lid)가 열에 의하여 용융되는 링형의 접착소재(21)에 의하여 접착되어 그 내부가 밀폐되는 압전소자(1)가 제안된 바 있었다.Among them, as shown in FIG. 1, the crystal vibrating element 30 is accommodated in the case 10 in which the electrode circuits 12 are multilayered between the ceramic insulators 11, connected to the electrodes, and connected to the electrodes. A piezoelectric element (1) is proposed in which a lid (20) (Lid) made of a cobalt (kovar) made of an alloy of cobalt and nickel is adhered by a ring-shaped adhesive material 21 that is melted by heat and sealed inside thereof. There was a bar.

상기 철(Fe), 니켈(Ni), 코발트(Co)의 합금인 페르니코계의 코바(Kovar)의 저면에는 금속으로 이루어진 링형의 접착소재(21)가 부착되어 있고, 리드를 세라믹 절연체로 구성된 케이스(10)의 상부면에 올려놓고 열을 가하면 금속 접착소재(21)가 용융(鎔融)되면서 리드가 케이스에 접착될 수 있도록 구성되어 있다.A ring-shaped adhesive material 21 made of a metal is attached to the bottom of a perico-based kovar, which is an alloy of iron (Fe), nickel (Ni) and cobalt (Co), and the lead is made of a ceramic insulator. When the heat is applied to the upper surface of the case 10 and the metal adhesive material 21 is melted, the lead is configured to be adhered to the case.

그러나, 전술한 바와 같이 열을 가하면 금속 접착소재(21)가 용융(鎔融)되면서 팡면으로 구성된 리드(20)의 저면에서 내측으로 흘러 들어가는 형상이 발생되어 리드의 접착력이 현저하게 저하되는 문제점이 발생되었다.However, when the heat is applied as described above, the metal adhesive material 21 is melted, and a shape that flows inward from the bottom surface of the lead 20 formed of the flat surface is generated, thereby causing a significant decrease in the adhesive strength of the lead. Occurred.

이와 같이 접착력이 저하되는 경우에는 케이스에 부착된 리드가 분리되는 폐단이 발생되어 불량률이 높아지는 등의 폐단이 발생되었을 뿐 아니라 리드가 분리되지 않더라도 케이스 내부에 주입된 불활성기체가 외부로 유출되어 압전소자의 전기적 특성이 현저하게 저하되는 폐단이 있었다.In this case, when the adhesive force is lowered, a closed end is generated such that a lead attached to the case is separated and a defective rate is increased. In addition, even if the lead is not separated, an inert gas injected into the case is leaked to the outside and the piezoelectric element is discharged. There was a closed end that the electrical properties of the markedly decreased.

본 발명은 상기한 문제점을 감안하여 창안한 것으로서, 그 목적은 압전소자의 케이스에 결합되는 리드(LID)의 하부 둘레에 지지턱이 형성되어 지지턱에 부착된 링형의 접착소재가 열에 의하여 용융될 때 리드의 저면을 따라 흘러 들어가는 폐단이 방지되어 접착력을 높여줄 수 있는 압전소자를 제공함에 있는 것이다.The present invention has been made in view of the above problems, and an object thereof is that a support jaw is formed around a lower portion of a lid LID coupled to a case of a piezoelectric element so that a ring-shaped adhesive material attached to the support jaw is melted by heat. This is to provide a piezoelectric element that can prevent the closed end flowing along the bottom of the lead to increase the adhesion.

상기한 목적을 달성하기 위한 본 발명의 특징은, 세라믹 절연체(11) 사이에 전극회로(12)들이 다층 배열된 케이스(10) 내부에 진동편(30)이 수납되어 전극들과 연결되고, 케이스(10) 상부에는 금속합금 리드(20)가 접합되어 케이스(10) 내부가 밀폐되는 압전소자(1)에 있어서, 상기 리드(20)의 저면 둘레에는 지지턱(20a)이 형성되어, 지지턱(20a)에 부착된 링형의 접착소재(21)가 열에 의하여 용융(鎔融)되었을 때 지지턱(20a)에 의하여 차단되어 리드(20)의 저면을 따라 내측으로 흘러 들어가지 않도록 한 것을 특징으로 하는 압전소자에 의하여 달성될 수 있는 것이다.A characteristic of the present invention for achieving the above object is that the vibration piece 30 is accommodated in the case 10 in which the electrode circuits 12 are arranged in multiple layers between the ceramic insulators 11 and connected to the electrodes. (10) In the piezoelectric element (1) in which the metal alloy lead (20) is joined to the upper part to seal the inside of the case (10), the support jaw (20a) is formed around the bottom of the lead (20). When the ring-shaped adhesive material 21 attached to the 20a is melted by heat, the ring-shaped adhesive material 21 is blocked by the supporting jaw 20a so as not to flow inward along the bottom surface of the lid 20. It can be achieved by a piezoelectric element.

이하, 상기한 목적을 달성하기 위한 바람직한 실시예를 첨부된 도면에 의하여 상세히 설명하면 다음과 같다.Hereinafter, described in detail by the accompanying drawings a preferred embodiment for achieving the above object is as follows.

도 2 내지 도 5에서 도시한 바와 같이, 상기 케이스(10)는 세라믹 절연체(11) 사이에 전극회로(12) 들이 다층 배열되고, 그 내부에는 수납공간이 형성된 구성으로 되어 있다.As shown in FIGS. 2 to 5, the case 10 has a structure in which electrode circuits 12 are arranged in multiple layers between ceramic insulators 11, and storage spaces are formed therein.

상기 케이스(10)의 내부 바닥에 구비된 전극회로(12)에는 진동편(30)이 고정되어 있고, 진동편(30)은 양측 전극회로(12)들과 와이어(31)로 연결되어 있다.The vibrating piece 30 is fixed to the electrode circuit 12 provided on the inner bottom of the case 10, and the vibrating piece 30 is connected to both electrode circuits 12 and the wire 31.

상기 케이스(10)의 개방된 상부에는 철(Fe), 니켈(Ni), 코발트(Co)의 합금인 코바(Kovar)를 얇은 판재로 가공한 리드(20)가 접착소재(21)에 의하여 접착되어 케이스(10) 내부가 밀폐되어 있다.On the open upper part of the case 10, a lead 20 obtained by processing Kovar, which is an alloy of iron (Fe), nickel (Ni), and cobalt (Co), using a thin plate is bonded by an adhesive material 21. Thus, the inside of the case 10 is sealed.

물론, 전술한 구성의 압전소자(1)는 이미 알려진 공지의 기술사상이다. 그러나, 본 발명에 있어서 가장 중요한 특징은, 상기 리드(20)의 하부 둘레에 지지턱(20a)이 형성되어 링형의 접착소재가 열에 의하여 용융될 때 리드(20)의 저면을 따라 흘러 들어가지 않도록 한 것에 있다.Of course, the piezoelectric element 1 having the above-described configuration is a known technical idea. However, in the present invention, the most important feature is that the support jaw 20a is formed around the lower portion of the lid 20 so that the ring-shaped adhesive material does not flow along the bottom surface of the lid 20 when it is melted by heat. It is in one thing.

즉, 상기 리드(20)의 저면 둘레에는 단차를 갖는 지지턱(20a)이 형성되어 있고, 지지턱(20a)에는 링형의 접착소재(21)가 부착되어 있다.That is, a support jaw 20a having a step is formed around the bottom of the lid 20, and a ring-shaped adhesive material 21 is attached to the support jaw 20a.

따라서, 링형의 접착소재(21)에 열을 가하여 접착소재가 용융(鎔融)되면 지지턱(20a)에 의하여 흐름성이 차단되어 리드(20)의 저면을 따라 내측으로 흘러 들어가지 않도록 할 수 있는 것이므로 대부분의 접착소재(21)가 리드(20)의 접착에만 사용되어 접착력을 최대한 높여줄 수 있는 등의 이점이 있는 것으로서 케이스(10)의 내부가 완벽하게 밀폐되어 불활성 기체의 누출을 효과적으로 방지할 수 있는 것이다.Therefore, when the adhesive material is melted by applying heat to the ring-shaped adhesive material 21, flowability is blocked by the support jaw 20a so as not to flow inward along the bottom surface of the lid 20. Since most of the adhesive material 21 is used only for the adhesion of the lead 20, the adhesive material has the advantage of increasing the adhesive strength as much as possible, and the inside of the case 10 is completely sealed to effectively prevent the leakage of inert gas. You can do it.

한편, 상기 지지턱(20a)은 도 3에서 도시한 바와 같이, 리드(20)의 저면 둘레에서 하부로 돌출되도록 할 수도 있고, 도 4에서 도시한 바와 같이, 리드(20)의 둘레를 하부로 절곡시켜 지지턱(20a)을 형성할 수도 있으며, 도 5에서 도시한 바와 같이, 리드(20)의 저면 둘레에서 상부로 단턱이 형성되도록 할 수도 있는 것으로서 본 발명에서는 지지턱(20a)의 구조에 국한되는 것은 아니다.Meanwhile, as shown in FIG. 3, the support jaw 20a may protrude downward from the circumference of the bottom of the lid 20, and as shown in FIG. 4, the circumference of the lid 20 is downward. It may be bent to form a support jaw 20a, as shown in Figure 5, the step may be formed from the upper periphery around the bottom of the lid 20 in the present invention in the structure of the support jaw 20a It is not limited.

이상에서는 본 발명의 바람직한 실시예에 대하여 도시하고 또한 설명하였으나, 본 발명은 상기한 실시예에 한정되지 아니하며, 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 본 발명이 속하는 분야에서 통상의 지식을 가진 자라면 누구든지 다양한 변형 실시가 가능한 것은 물론이고, 그와 같은 변경은 기재된 청구범위 내에 있게 된다.Although the preferred embodiments of the present invention have been illustrated and described above, the present invention is not limited to the above-described embodiments, and the present invention is not limited to the above-described embodiments without departing from the spirit of the present invention as claimed in the claims. Various modifications can be made by those skilled in the art, and such modifications are intended to fall within the scope of the appended claims.

이상에서 상술한 바와 같은 본 발명은, 링형의 접착소재(21)에 열을 가하여 접착소재가 용융(鎔融)되면 지지턱(20a)에 의하여 흐름성이 차단되어 리드(20)의 저면을 따라 내측으로 흘러 들어가지 않도록 할 수 있는 것이므로 대부분의 접착소재(21)가 리드(20)의 접착에만 사용되어 접착력을 최대한 높여줄 수 있는 것으로서 케이스(10)의 내부가 완벽하게 밀폐되어 불활성 기체의 누출이 효과적으로 방지되 어 압전소자의 전기적 특성을 높여줄 수 있는 것이므로 압전소자의 대외 경쟁력을 최대한 높여줄 수 있는 등의 이점이 있는 것이다.According to the present invention as described above, when the adhesive material is melted by applying heat to the ring-shaped adhesive material 21, the flowability is blocked by the support jaw 20a and along the bottom surface of the lid 20. Since most of the adhesive material 21 is used only for the adhesion of the lid 20, the adhesive force can be increased as much as possible. Therefore, the inside of the case 10 is completely sealed, and the inert gas leaks. This effectively prevents the electrical properties of the piezoelectric element, so that it is possible to enhance the external competitiveness of the piezoelectric element as much as possible.

Claims (2)

세라믹 절연체(11) 사이에 전극회로(12)들이 다층 배열된 케이스(10) 내부에 진동편(30)이 수납되어 전극들과 연결되고, 케이스(10) 상부에는 금속합금 리드(20)가 접합되어 케이스(10) 내부가 밀폐되는 압전소자(1)에 있어서,The vibrating element 30 is accommodated in the case 10 in which the electrode circuits 12 are arranged in a multilayer manner between the ceramic insulators 11 and connected to the electrodes, and the metal alloy lead 20 is bonded to the case 10. In the piezoelectric element 1 which is sealed to the inside of the case 10, 상기 리드(20)의 저면 둘레에는 지지턱(20a)이 형성되어, 지지턱(20a)에 부착된 링형의 접착소재(21)가 열에 의하여 용융(鎔融)되었을 때 지지턱(20a)에 의하여 차단되어 리드(20)의 저면을 따라 내측으로 흘러 들어가지 않도록 한 것을 특징으로 하는 압전소자.  A support jaw 20a is formed around the bottom of the lid 20. When the ring-shaped adhesive material 21 attached to the support jaw 20a is melted by heat, it is supported by the support jaw 20a. Piezoelectric element, characterized in that the cut off so as not to flow inside the bottom of the lead (20). 제 1항에 있어서,The method of claim 1, 상기 지지턱(20a)은 리드(20)의 저면 둘레에서 하부로 돌출되거나, 리드(20)의 둘레를 하부로 절곡시켜 형성하거나, 리드(20)의 저면 둘레에서 상부로 단턱이 형성되도록 한 것 중 어느 하나인 것을 특징으로 하는 압전소자.The support jaw 20a protrudes downward from the periphery of the bottom of the lid 20, or is formed by bending the periphery of the lid 20 downward, or a stepped portion is formed from the periphery of the lid 20 to the top. Piezoelectric element, characterized in that any one of.
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Cited By (4)

* Cited by examiner, † Cited by third party
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KR101499722B1 (en) * 2013-05-21 2015-03-09 삼성전기주식회사 Piezoelectric element and electronic component having the same
KR20150126152A (en) 2014-05-02 2015-11-11 삼성전기주식회사 Vibrator
US9579691B2 (en) 2013-05-21 2017-02-28 Mplus Co., Ltd. Piezoelectric element and electronic component including the same
KR20180137974A (en) * 2017-06-20 2018-12-28 임정택 Ultrasonic sensor and method of manufacturing the same

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JP2004281545A (en) 2003-03-13 2004-10-07 Seiko Epson Corp Sealing method for piezoelectric device package, package lid, and piezoelectric device
JP2005026974A (en) 2003-07-01 2005-01-27 Daishinku Corp Method of manufacturing piezoelectric vibration device and piezoelectric vibration device manufactured by the method
JP2007067831A (en) 2005-08-31 2007-03-15 Kyocera Kinseki Corp Piezoelectric device and method of manufacturing same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101499722B1 (en) * 2013-05-21 2015-03-09 삼성전기주식회사 Piezoelectric element and electronic component having the same
US9579691B2 (en) 2013-05-21 2017-02-28 Mplus Co., Ltd. Piezoelectric element and electronic component including the same
KR20150126152A (en) 2014-05-02 2015-11-11 삼성전기주식회사 Vibrator
US10008658B2 (en) 2014-05-02 2018-06-26 Mplus Co., Ltd. Vibrator
KR20180137974A (en) * 2017-06-20 2018-12-28 임정택 Ultrasonic sensor and method of manufacturing the same

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