JP2008193180A - Piezoelectric oscillator - Google Patents

Piezoelectric oscillator Download PDF

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JP2008193180A
JP2008193180A JP2007022508A JP2007022508A JP2008193180A JP 2008193180 A JP2008193180 A JP 2008193180A JP 2007022508 A JP2007022508 A JP 2007022508A JP 2007022508 A JP2007022508 A JP 2007022508A JP 2008193180 A JP2008193180 A JP 2008193180A
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hole
piezoelectric oscillator
silicon substrate
piezoelectric
mount electrode
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JP5143439B2 (en
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Tomoyuki Nakazawa
智之 中澤
Kazuhiro Chokai
和宏 鳥海
Kazuo Murata
一男 村田
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Citizen Miyota Co Ltd
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Citizen Miyota Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a highly reliable piezoelectric oscillator capable of preventing air from remaining in a through-hole and preventing the characteristics of the piezoelectric oscillator from being deteriorated due to remaining air. <P>SOLUTION: The piezoelectric oscillator is composed of a silicon substrate 10, a circuit pattern formed on one surface side of the silicon substrate 10 and a piezoelectric vibration piece 3 mounted on the other surface side of the silicon substrate 10. On the silicon substrate 10, a through-hole 10a for electrically connecting the circuit pattern 11 is formed and a mount electrode 12a connected to the through-hole 10a is formed and the piezoelectric vibration piece 3 is mounted on the mount electrode 12a through a conductive fixing member 6. The conductive fixing member 6 is arranged on a position which is not superposed to an opening part of the through-hole 10a. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、圧電発振器に関するものである。   The present invention relates to a piezoelectric oscillator.

従来より、圧電デバイスは、電子回路のクロック源として広く使用される圧電振動子や圧電発振器として様々な電子機器に用いられている。電子機器の小型化・薄型化に伴い、前記圧電振動子や圧電発振器も、より一層の小型化・薄型化が要求されているのが現状である。   Conventionally, piezoelectric devices have been used in various electronic devices as piezoelectric vibrators and piezoelectric oscillators widely used as clock sources for electronic circuits. As electronic devices become smaller and thinner, the piezoelectric vibrator and the piezoelectric oscillator are also required to be further reduced in size and thickness.

図１１は、従来の圧電発振器の断面図で、図１２は図１１に示す圧電発振器の上面図である。但し、図１２は、圧電発振器の一構成部品である蓋部材を取り除いた状態を示すものである。従来技術による圧電発振器は、平板状のシリコン基板１の下面に、回路パターン２を形成し、前記シリコン基板１の上面に圧電振動片３を実装したものである。４は圧電振動片３を覆うようにして前記シリコン基板１上面に搭載される蓋部材である。   11 is a sectional view of a conventional piezoelectric oscillator, and FIG. 12 is a top view of the piezoelectric oscillator shown in FIG. However, FIG. 12 shows a state in which the lid member which is one component of the piezoelectric oscillator is removed. The piezoelectric oscillator according to the prior art is obtained by forming a circuit pattern 2 on the lower surface of a flat silicon substrate 1 and mounting the piezoelectric vibrating piece 3 on the upper surface of the silicon substrate 1. A cover member 4 is mounted on the upper surface of the silicon substrate 1 so as to cover the piezoelectric vibrating piece 3.

前記回路パターン２としては、圧電振動片を動作させる帰還増幅回路のパターンが形成される。さらに、必要に応じて、周辺温度の変化による周波数変化を低減させるための温度補償回路のパターンを付加したり、外部からの制御電圧によって出力周波数を変化させるための電圧制御回路のパターンを付加することも可能である。 As the circuit pattern 2, a pattern of a feedback amplification circuit for operating the piezoelectric vibrating piece is formed. Furthermore, if necessary, a temperature compensation circuit pattern for reducing frequency changes due to changes in ambient temperature is added, or a voltage control circuit pattern for changing output frequencies by an external control voltage is added. It is also possible.

回路パターン２の表面には、アルミニウム等の導電性材料からなる電極パッド（不図示）が形成され、回路パターン２と外部との電気的な入出力が可能となる。また、前記電極パッド（不図示）の形成部分を除く回路パターン２の表面には、図示しない保護膜が形成され、回路パターン２が外部から保護される。 An electrode pad (not shown) made of a conductive material such as aluminum is formed on the surface of the circuit pattern 2 so that electrical input / output between the circuit pattern 2 and the outside is possible. Further, a protective film (not shown) is formed on the surface of the circuit pattern 2 excluding a portion where the electrode pad (not shown) is formed, and the circuit pattern 2 is protected from the outside.

また、圧電振動片３と回路パターン２との導通を確保するため、シリコン基板１の上面から回路パターン２にかけてスルーホール１ａが形成されている。スルーホール１ａは、マウント電極５の形成位置に穿設する。スルーホール１ａの形成は、エッチング等の化学的方法や、ドリル等を用いた機械的方法などによって行われる。尚、スルーホール１ａ内は導電材料が充填され、マウント電極５と接触した構成である。 In addition, a through hole 1 a is formed from the upper surface of the silicon substrate 1 to the circuit pattern 2 in order to ensure conduction between the piezoelectric vibrating piece 3 and the circuit pattern 2. The through hole 1a is formed at a position where the mount electrode 5 is formed. The through hole 1a is formed by a chemical method such as etching or a mechanical method using a drill or the like. The through hole 1 a is filled with a conductive material and is in contact with the mount electrode 5.

前記マウント電極５は、圧電振動片３の端部に形成された接続電極（不図示）を接続する部分であり、シリコン基板１の上面の端部寄りに形成され、スルーホール１ａの開口部の周辺に形成されている。 The mount electrode 5 is a portion for connecting a connection electrode (not shown) formed at the end portion of the piezoelectric vibrating piece 3, is formed near the end portion of the upper surface of the silicon substrate 1, and is formed at the opening portion of the through hole 1 a. It is formed around.

図１３は、従来の圧電発振器のスルーホール形成部分の拡大図である。マウント電極５は、金やアルミニウム等によって構成されている。マウント電極５の形成は、マウント電極形成部分以外の部分をマスクした状態で、スパッタリングやメッキ手法によって行われる。まず、スルーホール１ａの内周面に導電膜５ａを形成する。さらに、導電膜５ａの内側には充填部材として、導電材料５ｂが充填された構成であるが、該導電材料５ｂの充填は、前記導電膜５ａの形成に合わせて連続的に行われる。前記導電膜５ａと導電材料５ｂにより、マウント電極５が形成され、回路パターン２とマウント電極５との導通を確保することができる。また、前記導電材料５ｂにより、スルーホール１ａを通じた圧電発振器内部の気密を確保しようとしたものである。 FIG. 13 is an enlarged view of a through hole forming portion of a conventional piezoelectric oscillator. The mount electrode 5 is made of gold, aluminum, or the like. The mount electrode 5 is formed by sputtering or plating in a state where portions other than the mount electrode forming portion are masked. First, the conductive film 5a is formed on the inner peripheral surface of the through hole 1a. Furthermore, the conductive film 5a is filled with a conductive material 5b as a filling member. The conductive material 5b is continuously filled in accordance with the formation of the conductive film 5a. The mount electrode 5 is formed by the conductive film 5a and the conductive material 5b, and electrical connection between the circuit pattern 2 and the mount electrode 5 can be ensured. Further, the conductive material 5b is intended to ensure airtightness inside the piezoelectric oscillator through the through hole 1a.

圧電振動片３は、水晶等の圧電材料からなる平板の両面に、励振電極を形成したものである。ＡＴカット水晶平板の場合には、その両面中央部に励振電極（不図示）を配置するとともに、その端部に２個の接続電極を並べて配置し、これらは、それぞれ各励振電極との導通を確保する。尚、各電極は、金／クロムまたは銀／クロムの２層で構成されている。 The piezoelectric vibrating piece 3 has excitation electrodes formed on both sides of a flat plate made of a piezoelectric material such as quartz. In the case of an AT-cut quartz plate, an excitation electrode (not shown) is arranged at the center of both surfaces, and two connection electrodes are arranged side by side at the end, and these are connected to each excitation electrode. Secure. Each electrode is composed of two layers of gold / chrome or silver / chrome.

図１１に示すように、圧電振動片３は、シリコン基板１上面のマウント電極５の上面に導電性固定部材６を塗布し、圧電振動片３の接続電極（不図示）をマウント電極５に接着する。前記導電性固定部材６は、例えば、半田や銀ペースト等である。このようにして、圧電振動片３は片持ち状態で実装される。これにより、回路パターン２から圧電振動片３の励振電極（不図示）に対して通電可能としたものである。 As shown in FIG. 11, in the piezoelectric vibrating piece 3, a conductive fixing member 6 is applied to the upper surface of the mount electrode 5 on the upper surface of the silicon substrate 1, and a connection electrode (not shown) of the piezoelectric vibrating piece 3 is bonded to the mount electrode 5. To do. The conductive fixing member 6 is, for example, solder or silver paste. In this way, the piezoelectric vibrating piece 3 is mounted in a cantilever state. Thus, it is possible to energize the excitation electrode (not shown) of the piezoelectric vibrating piece 3 from the circuit pattern 2.

さらに、圧電振動片３をシリコン基板１上に実装した後、蓋部材４を装着する。蓋部材４は、例えば、コバール等の金属材料やガラス材料によって構成したものである。蓋部材４の装着は、窒素雰囲気または真空雰囲気で行うことにより、圧電発振器の内部を窒素雰囲気または真空雰囲気の状態で気密封止している。（例えば、特許文献１参照。） Further, after the piezoelectric vibrating piece 3 is mounted on the silicon substrate 1, the lid member 4 is attached. The lid member 4 is made of, for example, a metal material such as Kovar or a glass material. The lid member 4 is mounted in a nitrogen atmosphere or a vacuum atmosphere, whereby the inside of the piezoelectric oscillator is hermetically sealed in a nitrogen atmosphere or a vacuum atmosphere. (For example, refer to Patent Document 1.)

特開２００４−２１４７８７号公報JP 2004-214787 A

しかしながら、前述の従来技術による圧電発振器の構成においては、以下のような問題点がある。   However, the configuration of the piezoelectric oscillator according to the above-described prior art has the following problems.

図１４は従来の圧電発振器のスルーホール形成部分の拡大図で、スルーホール内に充填される導電材料が充填不充分な状態を示す図である。スルーホール１ａは、孔径６０μｍで、深さ１００μｍ程度の微細な孔である。このようなスルーホール１ａ内に導電材料５ｂを充填しようとした場合、図１４に示す如く、充填不良部分Ａが生じてしまう。このような状態で、スルーホール１ａ上方に導電性固定部材６が塗布され、圧電振動片３が実装されてしまうと、充填不良部分Ａに残留空気を閉じ込めた状態となってしまう。この残留空気は、圧電発振器完成後に当該圧電発振器内部に放出し、窒素雰囲気若しくは真空雰囲気での気密状態を悪化させ、圧電発振器の特性劣化を招く虞がある。   FIG. 14 is an enlarged view of a through hole forming portion of a conventional piezoelectric oscillator, and shows a state where the conductive material filled in the through hole is insufficiently filled. The through hole 1a is a fine hole having a hole diameter of 60 μm and a depth of about 100 μm. When trying to fill the through hole 1a with the conductive material 5b, a poorly filled portion A occurs as shown in FIG. In this state, if the conductive fixing member 6 is applied above the through hole 1a and the piezoelectric vibrating piece 3 is mounted, the residual air is confined in the poorly filled portion A. This residual air is released into the piezoelectric oscillator after completion of the piezoelectric oscillator, which may deteriorate the airtight state in a nitrogen atmosphere or a vacuum atmosphere, leading to deterioration of the characteristics of the piezoelectric oscillator.

そこで、本発明は、スルーホール内に空気を残さず、残留空気に起因する圧電発振器の特性劣化を防止した、高信頼性の圧電発振器を提供することを目的とする。   Accordingly, an object of the present invention is to provide a highly reliable piezoelectric oscillator that does not leave air in a through hole and prevents deterioration of the characteristics of the piezoelectric oscillator due to residual air.

本発明は、少なくとも、シリコン基板と、該シリコン基板の一方の面側に回路パターンを形成し、前記シリコン基板の他方の面側に圧電振動片を実装して成る圧電発振器において、前記シリコン基板には、前記回路パターンと電気的接続を成すためのスルーホールが形成されるとともに、該スルーホールに繋がるマウント電極が形成されており、該マウント電極上に導電性固定部材を介して前記圧電振動片が実装される構成であって、前記導電性固定部材は、前記スルーホールの開口部上に重ならない位置に設けられることを特徴とする。   The present invention provides a piezoelectric oscillator comprising at least a silicon substrate, a circuit pattern formed on one surface side of the silicon substrate, and a piezoelectric vibrating piece mounted on the other surface side of the silicon substrate. Has a through hole for electrical connection with the circuit pattern, and a mount electrode connected to the through hole, and the piezoelectric vibrating piece via a conductive fixing member on the mount electrode. The conductive fixing member is provided at a position that does not overlap the opening of the through hole.

さらに、本発明の圧電発振器は、前記シリコン基板が矩形状基板であり、前記マウント電極及び前記スルーホールが、前記シリコン基板の同一辺側寄りに設けられるとともに、前記マウント電極が外側に、前記スルーホールが内側になるよう、それぞれ配置される構成であることを特徴とする。   Furthermore, in the piezoelectric oscillator according to the aspect of the invention, the silicon substrate is a rectangular substrate, the mount electrode and the through hole are provided closer to the same side of the silicon substrate, and the mount electrode is on the outside. It is the structure which is each arrange | positioned so that a hole may become inside.

さらに、本発明の圧電発振器は、前記シリコン基板が矩形状基板であり、前記マウント電極は前記シリコン基板の一辺側寄りに設けられ、前記スルーホールは前記マウント電極が設けられていない他の辺側寄りに設けられていることを特徴とする。   Furthermore, in the piezoelectric oscillator of the present invention, the silicon substrate is a rectangular substrate, the mount electrode is provided closer to one side of the silicon substrate, and the through hole is on the other side where the mount electrode is not provided. It is provided in the side.

さらに、本発明の圧電発振器は、前記スルーホール内が充填部材により埋められていないことを特徴とする。   Furthermore, the piezoelectric oscillator of the present invention is characterized in that the through hole is not filled with a filling member.

さらに、本発明の圧電発振器は、前記スルーホールの開口部周辺部に、前記導電性固定部材の前記スルーホール開口部上への流出を防止する流出防止部材が設けられていることを特徴とする。   Furthermore, the piezoelectric oscillator of the present invention is characterized in that an outflow prevention member for preventing the conductive fixing member from flowing out onto the through hole opening is provided in the periphery of the opening of the through hole. .

さらに、本発明の圧電発振器は、前記スルーホールが、圧電振動片を実装する面側に広がるテーパー形状を有することを特徴とする。   Furthermore, the piezoelectric oscillator according to the present invention is characterized in that the through hole has a tapered shape that extends to a surface side on which the piezoelectric vibrating piece is mounted.

前記導電性固定部材は、前記スルーホールの開口部上に重ならない位置に設けられる構成としたので、前記導電性固定部材によって前記スルーホールを閉塞してしまうことが無いので、実装過程において生ずる残留空気による特性劣化等の問題がなくなり、高信頼性の圧電発振器が得られる。   Since the conductive fixing member is provided at a position that does not overlap the opening of the through hole, the conductive fixing member does not block the through hole. Problems such as deterioration of characteristics due to air are eliminated, and a highly reliable piezoelectric oscillator can be obtained.

以下、本発明の圧電発振器について、図面に基づき詳細に説明する。図１は本発明の一実施形態を示す圧電発振器の断面図で、図２は、図１に示す圧電発振器の上面図である。但し、図２は、圧電発振器の一構成部品である蓋部材を取り除いた状態を示すものである。尚、従来技術に示した圧電発振器と同様の部材については、同一符号を付して説明する。   Hereinafter, a piezoelectric oscillator according to the present invention will be described in detail with reference to the drawings. FIG. 1 is a sectional view of a piezoelectric oscillator showing an embodiment of the present invention, and FIG. 2 is a top view of the piezoelectric oscillator shown in FIG. However, FIG. 2 shows a state in which the lid member which is one component of the piezoelectric oscillator is removed. Note that members similar to those of the piezoelectric oscillator shown in the prior art will be described with the same reference numerals.

１０は平板状のシリコン基板で、その下面には回路パターン１１が形成されている。該回路パターン１１は、圧電振動片３を動作させる帰還増幅回路のパターンであり、さらに、必要に応じて、周辺温度の変化による周波数変化を低減させるための温度補償回路のパターンを付加したものである。尚、回路パターン１１の表面には、アルミニウム等の導電性材料からなる電極パッド（不図示）が形成され、回路パターン１１と外部との電気的な入出力が可能となる構成である。また、前記電極パッド（不図示）の形成部分を除く回路パターン１１の表面には、図示しない保護膜を形成することによって、回路パターン１１が外部から保護されている。   Reference numeral 10 denotes a flat silicon substrate on which a circuit pattern 11 is formed. The circuit pattern 11 is a pattern of a feedback amplifier circuit for operating the piezoelectric vibrating reed 3 and, if necessary, a pattern of a temperature compensation circuit for reducing a frequency change due to a change in ambient temperature is added. is there. An electrode pad (not shown) made of a conductive material such as aluminum is formed on the surface of the circuit pattern 11 so that electrical input / output between the circuit pattern 11 and the outside is possible. In addition, the circuit pattern 11 is protected from the outside by forming a protective film (not shown) on the surface of the circuit pattern 11 excluding a portion where the electrode pad (not shown) is formed.

前記シリコン基板１の上面から回路パターン１１にかけては、スルーホール１０ａが形成されている。スルーホール１０ａは、シリコン基板１０の上面に形成されたマウント電極１２の形成位置に穿設する。スルーホール１０ａの形成は、エッチング等の化学的方法によって行われる。尚、スルーホール１０ａ内壁面には導電膜１２ａが形成され、マウント電極１２と接触している。前記導電膜１２ａは、回路パターン１１とも接触している。   A through hole 10 a is formed from the upper surface of the silicon substrate 1 to the circuit pattern 11. The through hole 10 a is formed at a position where the mount electrode 12 formed on the upper surface of the silicon substrate 10 is formed. The through hole 10a is formed by a chemical method such as etching. A conductive film 12 a is formed on the inner wall surface of the through hole 10 a and is in contact with the mount electrode 12. The conductive film 12 a is also in contact with the circuit pattern 11.

前記マウント電極１２は、圧電振動片３の端部に形成された接続電極（不図示）を接続する部分であり、シリコン基板１の上面の端部寄りに形成され、スルーホール１ａの開口部の周辺に形成されている。   The mount electrode 12 is a part for connecting a connection electrode (not shown) formed at the end of the piezoelectric vibrating piece 3, is formed near the end of the upper surface of the silicon substrate 1, and is formed at the opening of the through hole 1 a. It is formed around.

圧電振動片３は、シリコン基板１０上面のマウント電極１２の上面に導電性固定部材６を塗布し、圧電振動片３の接続電極（不図示）をマウント電極１２に接着する。前記導電性固定部材６は、例えば、半田や銀ペースト等である。このようにして、圧電振動片３は片持ち状態で実装され、回路パターン１１から圧電振動片３の励振電極（不図示）に対して通電可能としている。   In the piezoelectric vibrating piece 3, the conductive fixing member 6 is applied to the upper surface of the mount electrode 12 on the upper surface of the silicon substrate 10, and the connection electrode (not shown) of the piezoelectric vibrating piece 3 is bonded to the mount electrode 12. The conductive fixing member 6 is, for example, solder or silver paste. In this way, the piezoelectric vibrating piece 3 is mounted in a cantilever state, and current can be supplied from the circuit pattern 11 to the excitation electrode (not shown) of the piezoelectric vibrating piece 3.

尚、前記導電性固定部材６は前記スルーホール１０ａの直上に重ならない位置に塗布する。したがって、前記マウント電極１２は図示するように、スルーホール１０ａの穿設位置よりもシリコン基板１０の中央側に延在して形成されている。   The conductive fixing member 6 is applied to a position that does not overlap directly above the through hole 10a. Therefore, as shown in the figure, the mount electrode 12 is formed so as to extend to the center side of the silicon substrate 10 from the position where the through hole 10a is formed.

さらに、圧電振動片３をシリコン基板１０上に実装した後、蓋部材４を装着する。蓋部材４は、例えば、コバール等の金属材料やガラス材料によって構成したものである。蓋部材４の装着は、窒素雰囲気または真空雰囲気で行うことにより、圧電発振器の内部を窒素雰囲気または真空雰囲気の状態で気密封止する。   Further, after the piezoelectric vibrating piece 3 is mounted on the silicon substrate 10, the lid member 4 is attached. The lid member 4 is made of, for example, a metal material such as Kovar or a glass material. The lid member 4 is mounted in a nitrogen atmosphere or a vacuum atmosphere to hermetically seal the inside of the piezoelectric oscillator in a nitrogen atmosphere or a vacuum atmosphere.

前記構成によれば、導電性固定部材６がスルーホール１０ａ上に重ならない位置関係になるので、スルーホール１０ａ内に残留空気を閉じ込めてしまうことがなくなる。よって、圧電発振器完成後に、残留空気の放出による特性劣化を防止することができる。   According to the above configuration, since the conductive fixing member 6 is in a positional relationship that does not overlap the through hole 10a, residual air is not confined in the through hole 10a. Therefore, after the piezoelectric oscillator is completed, it is possible to prevent characteristic deterioration due to the release of residual air.

尚、スルーホール１０ａの上部には、何も配置されない構成で、開放状態となるが、蓋部材４の装着時に、スルーホール１０ａ内部を含め、圧電発振器内部が窒素雰囲気あるいは真空雰囲気に保たれることになる。従って、スルーホール１０ａ内部は導電材料等による充填を行い気密状態にする必要はないので、該構成を採用すれば、導電材料として用いられる金材料などの削減にも繋がる。もちろん、従来の如く導電材料を充填しても構わない。   In addition, although nothing is arranged in the upper part of the through hole 10a, it is in an open state, but when the lid member 4 is mounted, the inside of the piezoelectric oscillator including the inside of the through hole 10a is maintained in a nitrogen atmosphere or a vacuum atmosphere. It will be. Therefore, since it is not necessary to fill the inside of the through hole 10a with a conductive material to make it airtight, the adoption of this configuration leads to a reduction in the gold material used as the conductive material. Of course, a conductive material may be filled as in the prior art.

図３は本発明の他の実施形態を示す圧電発振器の断面図で、図４は、図３に示す圧電発振器の上面図である。但し、図４は、圧電発振器の一構成部品である蓋部材を取り除いた状態を示すものである。   3 is a sectional view of a piezoelectric oscillator showing another embodiment of the present invention, and FIG. 4 is a top view of the piezoelectric oscillator shown in FIG. However, FIG. 4 shows a state in which the lid member which is one component of the piezoelectric oscillator is removed.

本実施形態の圧電発振器は、矩形状のシリコン基板２０に形成されるマウント電極２１及びスルーホール２０ａの穿設位置に特徴を有するものである。他の基本構成については、前述の実施形態と同様であるため詳細説明は省略する。前記マウント電極２１及びスルーホール２０ａは、シリコン基板２０の同一辺側に設けられるとともに、マウント電極２１を外側寄りに配置し、スルーホール２０ａを内側寄りにそれぞれ配置した構成である。   The piezoelectric oscillator of the present embodiment is characterized by the mounting positions of the mount electrode 21 and the through hole 20a formed on the rectangular silicon substrate 20. Since the other basic configuration is the same as that of the above-described embodiment, detailed description thereof is omitted. The mount electrode 21 and the through hole 20a are provided on the same side of the silicon substrate 20, and the mount electrode 21 is disposed on the outer side and the through hole 20a is disposed on the inner side.

前記構成によれば、導電性固定部材６がスルーホール１０ａ上に重ならない位置関係になるので、スルーホール１０ａ内に残留空気を閉じ込めてしまうことがなくなる。よって、圧電発振器完成後に、残留空気の放出による特性劣化を防止することができる。また、圧電振動片３のマウント位置を接続電極の位置に合わせてシリコン基板２０の一辺端部側に寄せて実装できるので、前述の実装形態と比較して、パッケージ全体の小型化が可能になる。   According to the above configuration, since the conductive fixing member 6 is in a positional relationship that does not overlap the through hole 10a, residual air is not confined in the through hole 10a. Therefore, after the piezoelectric oscillator is completed, it is possible to prevent characteristic deterioration due to the release of residual air. In addition, since the mounting position of the piezoelectric vibrating piece 3 can be moved close to the one side end of the silicon substrate 20 in accordance with the position of the connection electrode, the entire package can be reduced in size as compared with the above-described mounting form. .

図５は本発明の他の実施形態を示す圧電発振器の断面図で、図６は、図５に示す圧電発振器の上面図である。但し、図６は、圧電発振器の一構成部品である蓋部材を取り除いた状態を示すものである。 FIG. 5 is a cross-sectional view of a piezoelectric oscillator showing another embodiment of the present invention, and FIG. 6 is a top view of the piezoelectric oscillator shown in FIG. However, FIG. 6 shows a state in which the lid member which is one component of the piezoelectric oscillator is removed.

本実施形態の圧電発振器も、矩形状のシリコン基板に形成されるマウント電極及びスルーホールの穿設位置に特徴を有するものである。他の基本構成については、前述の実施形態と同様であるため詳細説明は省略する。前記シリコン基板３０上に設けられるマウント電極３１は、シリコン基板３０の一辺側の端部寄りに設けられ、スルーホール３０ａは前記マウント電極３１が設けられていない他の辺側の端部寄りに配置した構成である。尚、前記マウント電極３１は、接続パターン３１ａによりスルーホール３０ａ側との電気的接続が成される。   The piezoelectric oscillator of this embodiment is also characterized by the mounting position of the mount electrode and the through hole formed on the rectangular silicon substrate. Since the other basic configuration is the same as that of the above-described embodiment, detailed description thereof is omitted. The mount electrode 31 provided on the silicon substrate 30 is provided near the end on one side of the silicon substrate 30, and the through hole 30a is arranged near the end on the other side where the mount electrode 31 is not provided. This is the configuration. The mount electrode 31 is electrically connected to the through hole 30a side by the connection pattern 31a.

前記構成によれば、マウント電極３１とスルーホール３０ａがシリコン基板３０上の対向する辺側にそれぞれ対向配置されるので、導電性固定部材６がスルーホール３０ａ上に重ならない位置関係となることは言うまでもなく、スルーホール１０ａ内に残留空気を生ずることがなくなる。よって、圧電発振器完成後に、残留空気の放出による特性劣化を防止することができる。   According to the above configuration, since the mount electrode 31 and the through hole 30a are arranged to face each other on the opposite sides on the silicon substrate 30, the conductive fixing member 6 does not overlap the through hole 30a. Needless to say, no residual air is generated in the through hole 10a. Therefore, after the piezoelectric oscillator is completed, it is possible to prevent characteristic deterioration due to the release of residual air.

図７は本発明の他の実施形態を示す圧電発振器の断面図で、図８は、図７に示す圧電発振器の上面図である。但し、図６は、圧電発振器の一構成部品である蓋部材を取り除いた状態を示すものである。   7 is a cross-sectional view of a piezoelectric oscillator showing another embodiment of the present invention, and FIG. 8 is a top view of the piezoelectric oscillator shown in FIG. However, FIG. 6 shows a state in which the lid member which is one component of the piezoelectric oscillator is removed.

本実施形態の圧電発振器は、図１に示した構成に導電性固定部材６のスルーホール１０ａ内への流出を防止する流出防止部材１２ｂを付加したものである。流出防止部材１２ｂはマウント電極１２形成過程において、同一材料で同時に形成することが可能である。また、別材料、別部材で形成することも、もちろん可能である。   The piezoelectric oscillator of this embodiment is obtained by adding an outflow prevention member 12b for preventing the conductive fixing member 6 from flowing out into the through hole 10a in the configuration shown in FIG. The outflow prevention member 12b can be simultaneously formed of the same material in the process of forming the mount electrode 12. Of course, it is also possible to form with another material and another member.

前記構成によれば、流出防止部材１２ｂが導電性固定部材６の流出ストッパーとなるので、スルーホール１０ａ上に流れてスルーホール１０ａ開口部を塞いでしまうことはない。よって、残留空気を閉じ込めてしまうことはない。   According to the said structure, since the outflow prevention member 12b becomes an outflow stopper of the electroconductive fixing member 6, it does not flow on the through hole 10a and block the opening of the through hole 10a. Therefore, the residual air is not trapped.

図９は本発明の他の実施形態を示す圧電発振器の断面図で、図１０は、図９に示す圧電発振器の上面図である。但し、図１０は、圧電発振器の一構成部品である蓋部材を取り除いた状態を示すものである。   FIG. 9 is a sectional view of a piezoelectric oscillator showing another embodiment of the present invention, and FIG. 10 is a top view of the piezoelectric oscillator shown in FIG. However, FIG. 10 shows a state in which the lid member which is one component of the piezoelectric oscillator is removed.

本発明の圧電発振器は、スルーホール形状に特徴を有するものである。シリコン基板４０には、圧電振動片３を実装する面側に広がるテーパー形状を成すスルーホール４０ａを設けている。   The piezoelectric oscillator of the present invention is characterized by a through-hole shape. The silicon substrate 40 is provided with a through hole 40a having a taper shape spreading toward the surface on which the piezoelectric vibrating piece 3 is mounted.

前記テーパー形状を成すスルーホール４０ａは、ウェットエッチングにより形成する。一般に、単結晶シリコンをアルカリ水溶液中でエッチングすると、結晶方位によってエッチング速度が著しく異なるため、３次元微細形状を加工出来ることが知られている。例えば、シリコン基板の表面（水晶振動片３実装面）の結晶方位を１．０．０面とし、スルーホール４０ａのテーパー面の結晶方位を１．１．１面とすると、１．０．０面に対して１．１．１面は２００倍程度エッチング速度が遅い。そこで、１．０．０のシリコン基板４０表面にレジスト等でマスキングして開口部をアルカリエッチングすると、１．０．０面に対して５４．７°の角度で１．１．１面が現れ、図９に示すような断面Ｖ字形状のスルーホール４０ａが形成できる。   The through hole 40a having the tapered shape is formed by wet etching. In general, it is known that when single crystal silicon is etched in an alkaline aqueous solution, a three-dimensional fine shape can be processed because the etching rate varies significantly depending on the crystal orientation. For example, if the crystal orientation of the surface of the silicon substrate (the crystal resonator piece 3 mounting surface) is 1.0.0 plane and the crystal orientation of the tapered surface of the through hole 40a is 1.1. The etching rate of the 1.1. 1 surface is about 200 times slower than the surface. Therefore, if the surface of the 1.0.0 silicon substrate 40 is masked with a resist or the like and the opening is alkali etched, the 1.1.1 plane appears at an angle of 54.7 ° with respect to the 1.0.0 plane. A through hole 40a having a V-shaped cross section as shown in FIG. 9 can be formed.

前記構成によれば、仮に導電性固定部材６がスルーホール４０ａ内に流れ込んだとしても、広い開口を有しているので、スルーホール４０ａを閉塞してしまう状態にはならず、残留空気を生ずるようなこともない。また、スルーホール４０ａはテーパー面を有する構成であるため、内壁面への導電膜形成が精度良く行える。   According to the above configuration, even if the conductive fixing member 6 flows into the through-hole 40a, the conductive fixing member 6 has a wide opening, so that the through-hole 40a is not closed and residual air is generated. There is no such thing. Further, since the through hole 40a has a tapered surface, the conductive film can be accurately formed on the inner wall surface.

本発明の一実施形態を示す圧電発振器の断面図。1 is a cross-sectional view of a piezoelectric oscillator showing an embodiment of the present invention. 図１に示す圧電発振器の上面図。The top view of the piezoelectric oscillator shown in FIG. 本発明の他の実施形態を示す圧電発振器の断面図。Sectional drawing of the piezoelectric oscillator which shows other embodiment of this invention. 図３に示す圧電発振器の上面図。FIG. 4 is a top view of the piezoelectric oscillator shown in FIG. 3. 本発明の他の実施形態を示す圧電発振器の断面図。Sectional drawing of the piezoelectric oscillator which shows other embodiment of this invention. 図５に示す圧電発振器の上面図。FIG. 6 is a top view of the piezoelectric oscillator shown in FIG. 5. 本発明の他の実施形態を示す圧電発振器の断面図。Sectional drawing of the piezoelectric oscillator which shows other embodiment of this invention. 図７に示す圧電発振器の上面図。The top view of the piezoelectric oscillator shown in FIG. 本発明の他の実施形態を示す圧電発振器の断面図。Sectional drawing of the piezoelectric oscillator which shows other embodiment of this invention. 図９に示す圧電発振器の上面図。FIG. 10 is a top view of the piezoelectric oscillator shown in FIG. 9. 従来の圧電発振器の断面図。Sectional drawing of the conventional piezoelectric oscillator. 図１１に示す圧電発振器の上面図。FIG. 12 is a top view of the piezoelectric oscillator shown in FIG. 11. 従来の圧電発振器のスルーホール形成部分の拡大図。The enlarged view of the through-hole formation part of the conventional piezoelectric oscillator. 従来の圧電発振器のスルーホール形成部分の拡大図で、スルーホール内に充填される導電材料が充填不充分な状態を示す図。The enlarged view of the through-hole formation part of the conventional piezoelectric oscillator, and the figure which shows the state with insufficient filling of the electrically-conductive material with which it fills in a through-hole.

符号の説明Explanation of symbols

１ シリコン基板
１ａ スルーホール
２ 回路パターン
３ 圧電振動片
４ 蓋部材
５ マウント電極
５ａ 導電膜
５ｂ 導電材料
６ 導電性固定部材
１０ シリコン基板
１０ａ スルーホール
１１ 回路パターン
１２ マウント電極
１２ａ 導電膜
１２ｂ 流出防止部材
２０ シリコン基板
２０ａ スルーホール
２１ マウント電極
３０ シリコン基板
３０ａ スルーホール
３１ マウント電極
３１ａ 接続パターン
４０ シリコン基板
４０ａ スルーホール DESCRIPTION OF SYMBOLS 1 Silicon substrate 1a Through hole 2 Circuit pattern 3 Piezoelectric vibrating piece 4 Cover member 5 Mount electrode 5a Conductive material 5b Conductive material 6 Conductive fixing member 10 Silicon substrate 10a Through hole 11 Circuit pattern 12 Mount electrode 12a Conductive film 12b Outflow prevention member 20 Silicon substrate 20a Through hole 21 Mount electrode 30 Silicon substrate 30a Through hole 31 Mount electrode 31a Connection pattern 40 Silicon substrate 40a Through hole

Claims (6)

少なくとも、
シリコン基板と、該シリコン基板の一方の面側に回路パターンを形成し、前記シリコン基板の他方の面側に圧電振動片を実装して成る圧電発振器において、
前記シリコン基板には、前記回路パターンと電気的接続を成すためのスルーホールが形成されるとともに、該スルーホールに繋がるマウント電極が形成されており、該マウント電極上に導電性固定部材を介して前記圧電振動片が実装される構成であって、前記導電性固定部材は、前記スルーホールの開口部上に重ならない位置に設けられることを特徴とする圧電発振器。 at least,
In the piezoelectric oscillator formed by forming a circuit pattern on one surface side of the silicon substrate and the silicon substrate, and mounting a piezoelectric vibrating piece on the other surface side of the silicon substrate,
The silicon substrate has a through hole for electrical connection with the circuit pattern, and a mount electrode connected to the through hole, and a conductive fixing member is provided on the mount electrode. The piezoelectric oscillator, wherein the piezoelectric vibrating piece is mounted, wherein the conductive fixing member is provided at a position not overlapping the opening of the through hole. 前記シリコン基板は、矩形状基板であり、前記マウント電極及び前記スルーホールが、前記シリコン基板の同一辺側寄りに設けられるとともに、前記マウント電極が外側に、前記スルーホールが内側に、それぞれ配置される構成であることを特徴とする請求項１に記載の圧電発振器。   The silicon substrate is a rectangular substrate, and the mount electrode and the through hole are provided closer to the same side of the silicon substrate, the mount electrode is disposed on the outer side, and the through hole is disposed on the inner side. The piezoelectric oscillator according to claim 1, wherein the piezoelectric oscillator is configured as follows. 前記シリコン基板は矩形状基板であり、前記マウント電極は前記シリコン基板の一辺側寄りに設けられ、前記スルーホールは前記マウント電極が設けられていない他の辺側寄りに設けられていることを特徴とする請求項１に記載の圧電発振器。   The silicon substrate is a rectangular substrate, the mount electrode is provided closer to one side of the silicon substrate, and the through hole is provided closer to the other side where the mount electrode is not provided. The piezoelectric oscillator according to claim 1. 前記スルーホール内は、充填部材により埋められていないことを特徴とする請求項１、２又は３に記載の圧電発振器。   4. The piezoelectric oscillator according to claim 1, wherein the through hole is not filled with a filling member. 前記スルーホールの開口部周辺部には、前記導電性固定部材の前記スルーホール開口部上への流出を防止する流出防止部材が設けられていることを特徴とする請求項１〜４の何れか１つに記載の圧電発振器。   The outflow prevention member for preventing the outflow of the conductive fixing member onto the through hole opening is provided around the opening of the through hole. The piezoelectric oscillator according to one. 前記スルーホールは、圧電振動片を実装する面側に広がるテーパー形状を有することを特徴とする請求項１〜５の何れか１つに記載の圧電発振器。   The piezoelectric oscillator according to claim 1, wherein the through-hole has a tapered shape that spreads toward a surface on which the piezoelectric vibrating piece is mounted.
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011097553A (en) * 2009-09-30 2011-05-12 Seiko Instruments Inc Piezoelectric resonator, oscillator and oscillator package
JP2011233977A (en) * 2010-04-23 2011-11-17 Daishinku Corp Piezoelectric oscillator
JP2014146907A (en) * 2013-01-28 2014-08-14 Asahi Kasei Electronics Co Ltd Piezoelectric device
US9161450B2 (en) 2012-04-10 2015-10-13 Seiko Epson Corporation Electronic device, electronic apparatus, and method of manufacturing electronic device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07154183A (en) * 1993-11-25 1995-06-16 Citizen Watch Co Ltd Package and its manufacture
JP2004193909A (en) * 2002-12-10 2004-07-08 Nippon Dempa Kogyo Co Ltd Surface mount quartz oscillator
JP2004214787A (en) * 2002-12-27 2004-07-29 Seiko Epson Corp Piezoelectric oscillator and manufacturing method thereof
JP2004320150A (en) * 2003-04-11 2004-11-11 Seiko Epson Corp Piezoelectric device, package therefor, method of manufacturing the same
WO2006025139A1 (en) * 2004-09-01 2006-03-09 Matsushita Electric Industrial Co., Ltd. Circuit board, manufacturing method thereof, and electronic parts using the same
JP2007013628A (en) * 2005-06-30 2007-01-18 Kyocera Kinseki Corp Manufacturing method of piezoelectric vibrator and piezoelectric vibrator

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07154183A (en) * 1993-11-25 1995-06-16 Citizen Watch Co Ltd Package and its manufacture
JP2004193909A (en) * 2002-12-10 2004-07-08 Nippon Dempa Kogyo Co Ltd Surface mount quartz oscillator
JP2004214787A (en) * 2002-12-27 2004-07-29 Seiko Epson Corp Piezoelectric oscillator and manufacturing method thereof
JP2004320150A (en) * 2003-04-11 2004-11-11 Seiko Epson Corp Piezoelectric device, package therefor, method of manufacturing the same
WO2006025139A1 (en) * 2004-09-01 2006-03-09 Matsushita Electric Industrial Co., Ltd. Circuit board, manufacturing method thereof, and electronic parts using the same
JP2007013628A (en) * 2005-06-30 2007-01-18 Kyocera Kinseki Corp Manufacturing method of piezoelectric vibrator and piezoelectric vibrator

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011097553A (en) * 2009-09-30 2011-05-12 Seiko Instruments Inc Piezoelectric resonator, oscillator and oscillator package
JP2011233977A (en) * 2010-04-23 2011-11-17 Daishinku Corp Piezoelectric oscillator
US9161450B2 (en) 2012-04-10 2015-10-13 Seiko Epson Corporation Electronic device, electronic apparatus, and method of manufacturing electronic device
JP2014146907A (en) * 2013-01-28 2014-08-14 Asahi Kasei Electronics Co Ltd Piezoelectric device

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