KR20080063203A - Hybrid imprinting stamp and method of manufacturing the same - Google Patents

Abstract

A hybrid imprinting stamp and a method of manufacturing the same are provided to minimize the shrinkage and expansion of stamp plate by utilizing rigid material having the same thermal expansion coefficient as a substrate. A hybrid imprinting stamp includes a stamp plate(110), a stamp protrude member(120), and an exposing surface of the stamp plate(130). The stamp plate is formed by rigid material having the same thermal expansion coefficient as a substrate for supporting imprinting objects. The stamp protrude member is made of high polymer resin which is formed on a surface of the stamp plate. The exposing surface of the stamp plate is formed on the surface of the stamp plate having the stamp protruding member. The stamp plate is made of ultraviolet transmission materials.

Description

Composite imprinting stamp and method of manufacturing the same

The present invention relates to a composite nano-imprinting stamp, and more particularly, to a composite nano-imprinting stamp and a method of manufacturing the composite nano-imprinting stamp that can be repeatedly used as a long-term replication mold with excellent durability and less deformation.

When manufacturing a semiconductor, electronic, photoelectric, magnetic, display device, etc., a process of forming a fine pattern on a substrate is performed. As a representative technique for forming a fine pattern on a substrate, a fine pattern is formed using light. There is a photolithography method to form. In the photolithography method, the circuit line width (or pattern line width or size) is determined by the wavelength of light used in the exposure process. In consideration of the current state of the art, an ultrafine pattern on a substrate using a photolithography process, For example, it is very difficult to form an ultrafine pattern having a line width of 100 nm or less. In addition, the conventional photolithography method is complicated because it has to go through several steps (eg, substrate cleaning, substrate surface treatment, photosensitive polymer coating, low temperature heat treatment, exposure, development, cleaning, high temperature heat treatment, etc.). Not only does it require a lot of processing time, but also requires expensive process equipment, and these problems have led to an increase in manufacturing costs and a decrease in productivity. As the semiconductor industry evolves, there is a need for reliable technology for manufacturing micrometer- or nanometer-scale devices, and nanometer-scale features using lithography based on other fundamental principles. Technology with high resolution, high throughput, low cost and large area of application. In this regard, electron beam writing is used as a new technique for forming excellent fine patterns, but this technique has a practical problem that it is time-consuming and expensive.

In addition to the pattern forming method described above, a lens sheet including a plurality of lens units such as a prism is formed on the surface of a substrate for the purpose of improving optical efficiency of the display device. From the standpoint of the above, those in which a lens portion is formed by using an active energy ray curable composition such as an ultraviolet curable composition are used. For example, the form in which the lens part which consists of hardened | cured material of an active energy ray curable composition is integrally formed on transparent base materials, such as a transparent resin film and a transparent resin sheet, is mentioned. As a mold for forming the pattern, a metal mold in the form of a core plated with copper, nickel, or the like is used, and is used in a form or plate form in which a thin mold is attached to a core roll. When the metal mold is used, accurate transfer of the shape is possible, but it is difficult to handle the thin mold and when the electron beam writing method is used to form an excellent micropattern, the manufacturing period is long and the manufacturing cost is also high. There is a problem.

That is, in the case of the metal mold, the manufacturing period is long and the manufacturing cost is high, so that the metal mold is directly used in the transfer process, and there is a problem in that cost and time are largely damaged when contamination or damage occurs. In order to solve the problem, instead of using the metal mold directly in the transfer process, a replica mold made of a material such as a polymer was used in the transfer process using the metal mold as the master mold. That is, the metal mold is used as a master template, and a polymer is filled in the pattern portion of the master mold, and then cured, and then a replication mold (polymer mold) on which the pattern of the master mold is transferred is separated from the master mold and then polymerized. A replica mold was formed, and a polymer resin layer formed on a surface of a display panel made of a material such as glass was pressed with the replica mold, cured, and then the replica mold was removed to prepare a display panel having a desired pattern layer. In this way, it was intended to avoid contamination or damage of the master mold made of a difficult metal material.

However, in the case of the replication mold made of the polymer or the like, due to the characteristics of low strength and low hardness, in the process of forming a pattern on the surface of the substrate to be transferred, the patterns on the surface of the replication mold adhere to each other or the patterns are bent. Problems such as falling down occurred. In addition, in the process of forming a pattern on the surface of the substrate to be transferred using the replication mold, when the heat or pressure is applied to the substrate to be transferred, the problems as described above, that is, the patterns stick together or bend down. Problems such as this occur more greatly.

In addition, in a situation in which a fine pattern is to be formed on the surface of an enlarged display device, panels made of a polymer replication mold and glass of a display device supporting the transferred material have different thermal expansion coefficients, and thus, heat during pattern formation. In the case of repeated exposure and cooling by light or light, the polymer replication mold is affected by the substrate supporting the transfer material, causing deformation. That is, the replication mold contracts or expands, so that the relative position change of the pattern formed on the surface of the replication mold occurs. Prior to imprinting, alignment is well performed so that the pattern of the original master mold can be accurately transferred to a resin on a glass substrate. However, as the imprinting is repeated, the shrinkage or expansion occurs. That is, the replication mold shrinks more than the circular shape, so that the relative position of the pattern is narrowed, or the replication mold expands more than the circular shape, so that the relative position of the pattern is opened. As a result of the contraction and expansion phenomenon, an alignment key is initially displaced. As a result, a pattern different from that of the master mold is transferred. The change in the shape of the pattern may not be a big problem, but the change in the relative position of the pattern due to the shrinkage or expansion of the replica mold may result in a very small error rate, especially when a pattern is to be formed in a large area display. This is a serious problem because it causes a large error.

Accordingly, the first technical problem to be achieved by the present invention is to provide a composite nanoimprinting stamp that can be repeatedly used as a replication mold for a long time with excellent durability and less deformation.

The second technical problem to be achieved by the present invention is to provide a method for manufacturing the composite nanoimprinting stamp.

The present invention to achieve the first technical problem,

A rigid stamp plate having the same coefficient of thermal expansion as the substrate supporting the imprint target material;

A stamp protrusion formed of a polymer resin formed on one surface of the stamp plate; And

It provides a composite imprinting stamp comprising a stamp plate exposed surface formed on the stamp plate surface formed with the stamp protrusion.

According to an embodiment of the present invention, the stamp plate may be made of a UV-transparent material.

According to another embodiment of the present invention, the UV-permeable material is glass, quartz, sapphire, diamond, quartz, polycarbonate, calcium fluoride (CaF ₂ ), magnesium fluoride (MgF ₂ ) or pyrexyl Can be.

According to another embodiment of the present invention, the polymer resin may be PDMS (polydimethylsiloxane), thermosetting resin or ultraviolet curing resin.

The present invention to achieve the second technical problem,

(a) preparing a master stamp having irregularities formed on one surface thereof;

(b) forming and curing a polymer resin layer on the uneven surface of the master stamp;

(c) bonding the stamp plate to the surface of the polymer resin layer formed on the uneven surface of the master stamp;

(d) separating the master stamp from the polymer resin layer; And

(e) providing a method of manufacturing a composite imprinting stamp comprising removing a polymer resin layer on a stamp plate corresponding to the iron surface of the separated master stamp, wherein the removal of the polymer resin layer is performed when the stamp plate is exposed. Can proceed until.

According to an embodiment of the present invention, the formation of the polymer resin in step (b) may be performed by the filling of the polymer resin layer by spin coating or drop on demand.

According to another embodiment of the present invention, the curing of step (b) may be by heating.

According to another embodiment of the present invention, the bonding in step (c) may be by heating and pressing.

According to another embodiment of the present invention, the step of removing the polymer resin layer of step (e) may be by plasma etching, ion etching or ion milling.

In addition, the present invention to achieve the second technical problem,

(a) forming a polymer resin layer on one surface of the stamp plate;

(b) heating the polymer resin above the glass transition temperature of the polymer resin while the iron surface of the master stamp having the uneven surface is in close contact with the surface of the polymer resin layer;

(c) pressing the master stamp onto the polymer resin layer until the iron surface of the master stamp having the uneven surface is in close contact with one surface of the stamp plate;

(d) cooling the polymer resin layer to which the master stamp is pressurized to below the glass transition temperature of the polymer resin;

(e) separating the master stamp from the polymer resin layer; And

(f) providing a method of manufacturing a composite imprinting stamp comprising removing the polymer resin layer on a stamp plate remaining on a portion corresponding to the iron surface of the separated master stamp, wherein the removal of the polymer resin layer is performed by the stamp. It may proceed until the plate is exposed.

According to one embodiment of the present invention, the polymer resin layer of step (a) may be formed by a polymer resin dropping method or a spin coating method.

According to another embodiment of the present invention, the pressing in the step (c) may be performed at a pressure of 10 to 40 bar.

According to another embodiment of the present invention, the polymer resin layer removal of step (f) may be by plasma etching, ion etching or ion milling.

Composite nanoimprinting stamp according to the present invention is excellent in durability, less deformation can be repeated use as a long-term replication mold, it can be easily produced the composite nanoimprinting stamp by the manufacturing method according to the present invention.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings and examples, but the present invention is not limited thereto.

1 is a cross-sectional view showing an example of a composite imprinting stamp according to the present invention. As shown in FIG. 1, the composite imprinting stamp 100 according to the present invention includes a stamp plate 110, a stamp protrusion 120, and a stamp plate exposed surface 130. Since the stamp plate 110 uses a rigid material having the same thermal expansion coefficient as that of the substrate supporting the material to be imprinted, the composite nanoimprinting stamp may be repeatedly performed by an imprint process involving heating and pressing. The shrinkage or expansion of the stamp plate itself can be minimized. That is, as shown in Figure 1, the stamp plate 110, even if the substrate and the thermal expansion coefficient of the same material, for example, the same glass, using the same substrate, the stamp plate 110, even if heated and pressed in the imprint process ) And the support substrate are contracted and expanded in the same manner, thereby minimizing thermal deformation of the stamp plate due to the influence of the support substrate. Since the stamp plate is not contracted or expanded, the relative position of the pattern to be transferred can be prevented from changing, and in particular, when applied to a large-area substrate, an error rate can be reduced. In addition, the composite imprinting stamp according to the present invention is a state in which the protrusion 120 is bonded to the stamp plate to form a convex portion of the pattern, and the exposed stamp plate surface forms a pattern by forming the bottom surface of the recess. The irregularities of the pattern are made of the same polymer resin, thereby preventing problems such as adhesion between the patterns. In the case of the composite imprinting stamp according to the present invention, since a hard material having a low ductility is used, a problem such as bending of the stamp may be overcome, especially when used in a large area substrate.

The stamp plate may be made of a UV-transparent material. By making the stamp plate into a UV-permeable material, the complex imprinting stamp according to the present invention may be used as an UV-transmitting medium in an imprint process using the UV curing method in an imprint process. That is, the complex imprinting stamp according to the present invention may be used in a process such as SFIL (Step amp; Flash Imprint Lithography), which is a technique for manufacturing nanostructures at room temperature and low pressure using an ultraviolet curable material.

The stamp plate is glass, quartz, sapphire, diamond, quartz, polycarbonate, PVC, PC, PS (polystyrene), calcium fluoride (CaF ₂ ), magnesium fluoride (MgF ₂ ) or pyrex (reinforced) Glass) and the like. The glass, quartz, sapphire, diamond, quartz, polycarbonate, calcium fluoride (CaF ₂ ), magnesium fluoride (MgF ₂ ), or pyrex may also be used in the SFIL process and the like, as well as UV transmittance.

The protrusion 120 may be formed of a polymer resin, and the polymer resin may be polydimethylsiloxane (PDMS), thermosetting resin, or ultraviolet curing resin. Since the PDMS (polydimethylsiloxane) is transparent in itself and has low reactivity and interfacial energy with respect to the polymer material, it can transmit light in the SFIL process and the like, and sticking may occur after imprinting a pattern on the polymer. It is possible to separate the stamp and the patterned polymer without distortion of the pattern or pattern. In addition, the elasticity is good to give a constant contact (even) even on non-uniform surface, there is an advantage that can reduce the defect (defect) on the pattern. The thermosetting resin is poly (methyl methacrylate), polystyrene, poly (benzyl methacrylate) or poly (cyclohexyl methacrylate) (poly ( cyclohexyl methacrylate)). The photocurable resin may be polyester, epoxy, urethane, polyether or polyacryl. When the stamp protrusion 120 is made of a thermosetting resin, the protrusion may be cured by a thermosetting process, and when the protrusion is made of a photocurable resin, the protrusion may be cured by a photocuring process. When the protrusion is cured by the photocuring process, the protrusion may not be deformed by heat, thereby forming a pattern having a desired shape.

2 shows an example of a method of manufacturing a composite imprinting stamp according to the present invention. In order to manufacture a composite imprinting stamp according to the present invention, a step of first preparing a master stamp 200 having irregularities indicating a desired pattern shape on one surface by a known technique having high precision such as an electron beam process in step (a) Can be rough. Subsequently, in step (b), the polymer resin layer 210 may be formed and cured on the concave-convex surface 207 formed of the concave surface 203 and the concave surface 205 of the master stamp 200. In order to form the polymer resin layer on the concave-convex surface 207 of the master stamp in step (b), a spin coating or a resin dropping method in which the resin is distributed to the target portion of the substrate in the form of droplets (so-called drop on demand) demand). In the case of using the polymer resin dropping method, only the recesses corresponding to the protrusions 120 of the complex imprinting stamp can be effectively formed, and the iron surface 203 of the master stamp to be removed in a subsequent step (e). The polymer resin layer remaining in the corresponding site is minimized to simplify the process. Curing in the step (b) is not limited to the curing method, if the polymer resin used is a thermosetting resin may be by a thermosetting process. Thereafter, in the step (c), the stamp plate 110 may be bonded to the surface of the polymer resin layer 210 formed on the uneven surface 207 of the master stamp. The bonding may be by an adhesive or by a process of heating and simultaneously pressing the stamp plate 110. Subsequently, in step (d), the master stamp 200 is separated from the polymer resin layer 210, and in step (e), the master stamp 200 remains at a portion corresponding to the iron surface 205 of the separated master stamp 200. The polymer resin layer may be removed to form a stamp plate exposed surface 130 corresponding to the iron surface 205 of the master stamp 200. In step (e), by cleaning the surface of the stamp plate exposed surface 130 of the composite imprinting stamp according to the present invention, a phenomenon such as an imprint target material adheres to the composite imprinting stamp or a foreign substance adheres at a later imprint. It can prevent. Removing the remaining polymer resin layer of step (e) may be by plasma etching, ion etching or ion milling. By the above method, it is possible to arrange the stamp flat surface in a clean state.

In addition, Figure 3 shows another example of the composite imprinting stamp manufacturing method according to the present invention. In order to manufacture the composite imprinting stamp according to the present invention, first, the polymer resin layer 310 may be formed on one surface of the stamp plate 110 in step (a). In order to form the polymer layer on one surface of the stamp plate 110 in the step (a), spin coating or resin is applied to the polymer resin dropping method (so-called drop on demand process) which is distributed to the target portion of the substrate in the form of droplets. ) Can be. By the spin coating, there is an advantage in that the polymer resin layer having a predetermined thickness can be formed flat in a simple process. Subsequently, in the step (b), the glass transition of the polymer resin in the state where the iron surface 205 of the master stamp 200 on which the uneven surface 207 is formed is in close contact with the surface of the polymer resin layer 310. The polymer resin can be heated above the temperature (Tg). The above step is to use the so-called buckling phenomenon. That is, when the polymer resin is heated above the glass transition temperature of the polymer resin in a state in which the iron surface 205 of the master metal stamp 200 having the uneven surface 207 is in close contact with the polymer resin layer 310. Since only the polymer resin has fluidity selectively, stress is generated by the difference in flow and thermal expansion at the interface between the thin film layers (ie, the interface between the metal material and the organic material). At this time, the generated stress is accumulated at the interface, but if it exceeds the absolute stress (critical stress) that can be included in the multi-layer thin film, the buckling phenomenon occurs to emit the accumulated stress. This buckling phenomenon generally occurs randomly on the surface, but when a master stamp having an arbitrary shape is in close contact, the buckling phenomenon is constant along the pattern of the master stamp because it is affected by the contacted master stamp. Will occur. That is, the polymer resin layer formed on the stamp plate is deformed by buckling and patterned in an arbitrary pattern. That is, a simple process of intimately contacting a master stamp having a target shape, inducing fluidity to the polymer resin layer through heat treatment, inducing buckling caused by interfacial stress, and physically controlling the buckling phenomenon according to the shape of the mold. Through this, it is possible to form a fine pattern of a thin film having various target shapes on the substrate. Thereafter, in the step (c), the master stamp 200 until the iron surface 205 of the master stamp 200 on which the uneven surface 207 is formed is in close contact with one surface of the stamp plate 110. ) May be pressed onto the polymer resin layer. In the pressing process in the step (c), the polymer resin of the polymer resin layer 310 fills the recesses of the master stamp 200, and the master stamp to be removed in a subsequent step (f). The polymer resin layer remaining on the portion corresponding to the iron surface 205 of the can be minimized to simplify the process. Thereafter, in the step (d), the polymer resin layer 310 pressurized by the master stamp 200 may be cooled below the glass transition temperature (Tg) of the polymer resin. By cooling below the glass transition temperature of the polymer resin, the polymer resin layer 310 can be cured. Thereafter, in step (e), the master stamp 200 is separated from the polymer resin layer 310, and in step (f), remaining on a portion corresponding to the iron surface 205 of the separated master stamp 200. Removing the polymer resin layer may expose a stamp flat surface corresponding to the iron surface 205 of the master stamp 200 to generate a stamp flat exposed surface 130. By cleaning the surface of the stamp plate exposed surface of the complex imprinting stamp according to the present invention in the step (f), it is possible to prevent the phenomenon such as the imprint target material is attached to the stamp or the foreign matter adhered in the future imprint. Removal of the remaining polymer resin layer in step (f) may be by plasma etching, ion etching or ion milling. As a result, it is possible to produce a composite imprinting stamp according to the present invention. By the above method, it is possible to arrange the stamp flat surface in a clean state. Pressing of the step (c) can be carried out at a pressure of 10 ~ 40bar. If the pressure is less than 10bar the polymer resin flows into the recess of the master is slow, there is a fear that the shape of the stamp protrusion may not be uniformly produced, if it is more than 40bar the polymer resin flows into the recess is faster There is a fear that bubbles or the like are generated in the generated stamp protrusion. As a result, it is possible to produce a composite imprinting stamp according to the present invention.

4 shows another example according to the present invention.

Referring to FIG. 4, the stamp plate 400 is stacked with a polymer resin layer 420 constituting the stamp protrusion 410. That is, the composite imprinting stamp of FIG. 4 may be manufactured by controlling a process condition when the polymer resin layer is removed to leave some polymer resin layers on the stamp plate. The polymer resin layer 420 on the stamp plate 400 can increase the life of the mold, the reason is that the stamp protrusion in the composite imprint stamp provided in the other examples, etc. are supported by the bonding with the stamp plate. In this case, since the stamp plate has a material property different from that of the stamp protrusion, the bonding force of the stamp protrusion may be weakened during the process, and thus the stamp protrusion may fall, but in this example, the polymer resin layer This is because some of the residue remains on the stamp plate, and as a result, the stamp protrusion can be stably maintained for a longer time by the polymer resin layer having the same physical property.

<Example 1>

In order to manufacture a composite imprinting stamp according to the present invention, a master stamp having an uneven surface formed on its surface was manufactured by an electron beam process. Thereafter, the acrylate polymer resin (micro resist, MRI 8000 and MRI 7000 series) was spin-coated at 2000 to 5000rpm on the uneven surface of the master stamp, and the polymer resin was thermally cured by heating at 90 to 150 ° C. Thereafter, a glass plate (stamp made by Asahi Glass Co., Ltd., glass for LCD substrate) is bonded to the surface of the polymer resin layer formed on the uneven surface of the master stamp using UV light irradiation at room temperature and pressure of 2 to 10 atmospheres. It was. Since then the separation and the number of polymer layers to the master stamp using RIE system for the polymer resin layer photoresist ashing (ashing) remaining in the region that corresponds to the convex surface of the divided master stamp O ₂ Plasma removal was performed to expose a stamp flat surface corresponding to the iron surface of the master stamp, thereby producing a composite imprinting stamp of the type shown in FIG.

<Example 2>

In order to manufacture the composite imprinting stamp according to the present invention, first of all, a spin coating method of acrylate polymer resin (microresist MRI 8000 and MRI 7000 series) on one surface of a stamp plate (Asahi Glass Co., Ltd., glass substrate for LCD) Midas Systems Co., Ltd., 2000 ~ 4000rpm) to form a polymer resin layer of 200 ~ 300nm thickness. Thereafter, the iron surface of the master stamp on which the uneven surface of Example 1 was formed was heated to 90 to 140 ° C. above the glass transition temperature of the polymer resin while being in close contact with the polymer resin layer. Thereafter, the master stamp was pressed to the polymer resin layer at a pressure of 3 to 50 bar until the iron surface of the master stamp on which the uneven surface was formed was in close contact with one surface of the stamp plate. Thereafter, the master stamp pressurized polymer layer was cooled to 50 to 60 ° C. which is less than or equal to the glass transition temperature (Tg) of the polymer resin. Thereafter, the master stamp is separated from the polymer resin layer, and the polymer resin layer remaining on the portion corresponding to the iron surface of the separated master stamp is removed by O ₂ plasma using a RIE system for photoresist ashing. The stamp flat surface corresponding to the iron surface of the master stamp was exposed to produce a composite imprinting stamp of the form shown in FIG. 1.

<Example 3>

In the same manner as in Example 1 above, the composite imprinting stamp of FIG. 4 was manufactured by shortening the O ₂ plasma removal time.

1 is a cross-sectional view showing an example of a composite imprinting stamp according to the present invention.

Figure 2 shows an example of a method of manufacturing a composite imprinting stamp according to the present invention.

Figure 3 shows another example of the manufacturing method of the composite imprinting stamp according to the present invention.

Figure 4 shows another example of the composite imprinting stamp according to the present invention.

<Description of the symbols for the main parts of the drawings>

100: composite imprinting stamp 110: stamp reputation

120: stamp protrusion 130: stamp plate exposed portion

200: master stamp 203: master stamp

205: master stamp iron surface 207: master stamp irregular surface

210, 310 polymer resin layer

Claims (16)

A rigid stamp plate having the same coefficient of thermal expansion as the substrate supporting the imprint target material; A stamp protrusion formed of a polymer resin formed on one surface of the stamp plate; And And a stamp plate exposed surface formed on the stamp plate surface on which the stamp protrusion is formed. The composite imprinting stamp as claimed in claim 1, wherein the stamp plate is made of a UV-transparent material. The method of claim 1, wherein the stamp plate is made of glass, quartz, sapphire, diamond, quartz, polycarbonate, calcium fluoride (CaF ₂ ), magnesium fluoride (MgF ₂ ) or pyrex. Composite Imprint Stamp. The composite imprinting stamp of claim 1, wherein the polymer resin is polydimethylsiloxane (PDMS), a thermosetting resin, or an ultraviolet curable resin. A rigid stamp plate having the same coefficient of thermal expansion as the substrate supporting the imprint target material; A polymer resin layer laminated on the stamp plate; The composite imprinting stamp formed on the polymer resin layer and including a stamp protrusion formed of the same polymer resin as the polymer resin. (a) preparing a master stamp having irregularities formed on one surface thereof; (b) forming and curing a polymer resin layer on the uneven surface of the master stamp; (c) bonding the stamp plate to the surface of the polymer resin layer formed on the uneven surface of the master stamp; (d) separating the master stamp from the polymer resin layer; And (e) removing the polymer resin layer on the stamp plate corresponding to the iron surface of the separated master stamp. The method of claim 6, wherein the removing of the polymer resin layer in the step (e) is performed until the flat plate of the polymer resin layer is exposed. The method of claim 6, wherein the forming of the polymer resin layer in the step (b) is performed by filling the polymer resin layer by spin coating or polymer resin dropping. The method of claim 6, wherein the curing of step (b) is performed by heating. The method of claim 6, wherein the bonding in step (c) is performed by heating and pressing. 7. The method of claim 6, wherein the removing of the polymer resin layer in the step (e) is performed by plasma etching, ion etching or ion milling. (a) forming a polymer resin layer on one surface of the stamp plate; (b) heating the polymer resin above the glass transition temperature of the polymer resin while the iron surface of the master stamp having the uneven surface is in close contact with the surface of the polymer resin layer; (c) pressing the master stamp onto the polymer resin layer until the iron surface of the master stamp having the uneven surface is in close contact with one surface of the stamp plate; (d) cooling the polymer resin layer to which the master stamp is pressurized to below the glass transition temperature of the polymer resin; (e) separating the master stamp from the polymer resin layer; And (f) removing the polymer resin layer on the stamp plate corresponding to the iron surface of the separated master stamp. The method of claim 12, wherein the removing of the polymer resin layer of (f) is performed until the stamp plate is exposed. The method of claim 12, wherein the polymer resin layer of step (a) is formed by a polymer resin dropping method or a spin coating method. The method of claim 12, wherein the pressing in the step (c) is performed at a pressure of 10 to 40 bar. The method of claim 12, wherein the removing of the polymer resin layer of the step (f) is performed by plasma etching, ion etching or ion milling.

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