KR20080057908A - Lapping apparatus - Google Patents

Abstract

A lapping apparatus is provided to reduce the thickness of a glass substrate by lapping the surface of the glass substrate used for an LCD(Liquid Crystal Display). A lapping apparatus includes a lapping unit(50) and a dressing carrier managing unit(60). The lapping unit laps the surface of substrates. The dressing carrier managing unit is provided at one side of the lapping unit. The dressing carrier managing unit loads or unloads a dressing carrier(57) to or from the lapping unit in order to remove partial abrasion of the lapping unit. The dressing carrier managing unit includes a box(61), a driver(62), and an arm(63). The box includes the dressing carrier. The driver elevates the dressing carrier. The arm transfers the dressing carrier between the box and the lapping unit.

Description

Lapping Device {LAPPING APPARATUS}

1 is an exemplary view showing a liquid crystal panel of a general liquid crystal display device.

Figure 2 is an exemplary view showing the uneven wear state of the lower plate in the conventional lapping apparatus.

Figure 3 is a configuration diagram of one embodiment of a wrapping apparatus according to the present invention.

4 is a side view of an embodiment of the wrapping apparatus shown in FIG.

5 is a plan view of an embodiment of the wrapping apparatus shown in FIG.

Figure 6 is an exemplary view showing a state in which the dressing carrier is transferred to the lower plate in the lapping apparatus shown in FIG.

7 is an exemplary view showing a state in which the dressing carrier is transported from the lower plate to the stacker in the lapping apparatus shown in FIG. 3.

<Explanation of symbols for main parts of the drawings>

10: liquid crystal panel 11: lower substrate

12: upper substrate 13: liquid crystal layer

50: grinding unit 60: dressing carrier management unit

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for processing a surface of a glass substrate, and more particularly, to a wrapping device for reducing the thickness of a glass substrate by polishing a surface of a glass substrate applied to a liquid crystal display device.

Liquid crystal displays (hereinafter referred to as "LCDs") are representative flat panel displays that display an image by adjusting the amount of light beams transmitted to correspond to an image signal. In particular, LCDs are becoming more and more widespread due to light weight, thinness, and low power consumption. As such, LCDs are used as display devices for office automation devices and notebook computers. have.

1 is an exemplary view showing a liquid crystal panel of a general liquid crystal display device. 2 is an exemplary view showing the uneven wear state of the lower plate in the conventional lapping apparatus.

The LCD includes a liquid crystal panel 10 in which liquid crystal cells are arranged in a matrix, and a backlight unit (not shown) for irradiating light to the liquid crystal panel, wherein the liquid crystal panel and the backlight unit are fastening mechanisms such as a support main. (Not shown).

As shown in FIG. 1, the liquid crystal panel 10 includes a thin film transistor substrate (TFT substrate) (hereinafter, simply referred to as a 'lower substrate') 11 for receiving a driving signal, and a color filter substrate including a color filter layer ( C / F substrate) (hereinafter, simply referred to as an upper substrate) 12 and a liquid crystal layer 13 interposed between the upper substrate and the lower substrate.

Meanwhile, the manufacturing process of the liquid crystal display device including the liquid crystal panel 10 as described above is largely divided into three processes, a substrate manufacturing process, a liquid crystal panel manufacturing process, and a module process.

The substrate manufacturing process is a process of manufacturing the lower substrate 11 and the upper substrate 12 by using the cleaned glass substrate, the liquid crystal panel process is bonded to the lower substrate 11 and the upper substrate 12 The process of manufacturing a liquid crystal panel by injecting a liquid crystal in the meantime, the module process refers to the process of completing the liquid crystal display device by connecting the liquid crystal panel and the signal processing circuit.

The liquid crystal display device manufactured by the above process is used for various kinds of electronic products such as TV, notebook computer, monitor, mobile phone, PDA, PMP, MP3 player.

In particular, as the thickness of electronic products such as mobile phones, PDAs, PMPs, MP3 players, and the like becomes smaller and smaller, the thicknesses of liquid crystal displays applied to the electronic products are also required to have smaller and smaller sizes. Since the thickness of the liquid crystal display device is particularly dependent on the thickness of the glass substrate constituting the upper substrate and the lower substrate, a method of reducing the thickness of the glass substrate to reduce the thickness of the liquid crystal display device applied to the electronic products as described above. This is mainly used.

As a method of reducing the thickness of the glass substrate, there is a method of reducing the thickness of the glass substrate itself introduced into the substrate manufacturing process. That is, the above method is a method of reducing the thickness of the glass substrate itself in the production stage of the glass substrate, which is theoretically possible, but is not widely used because the production process is difficult and it is difficult to transport the produced glass substrate. Can not do it.

As another method of reducing the thickness of the glass substrate, there is a method of etching the upper and lower glass substrates of the liquid crystal panel through the liquid crystal panel manufacturing process by a chemical method. That is, both surfaces of the liquid crystal panel in which the upper substrate 12 and the lower substrate 11 are combined are immersed in a container containing a chemical solution, and the glass substrates constituting the upper substrate and the lower substrate are chemically reacted. It is etched by thickness. However, the method is not widely used because not only chemical products are used, but complicated process equipment is required.

As another method of reducing the thickness of the glass substrate, there is a method of physically etching the upper and lower glass substrates of the liquid crystal panel through the liquid crystal panel manufacturing process. A lapping apparatus is used as an apparatus for etching the upper and lower glass substrates of the liquid crystal panel by a physical method.

The lapping apparatus includes a lower panel 21 in which a liquid crystal panel is placed and fine lapping particles are formed to polish the organic substrate under the liquid crystal panel, and the lower panel is rotated while the liquid crystal panel placed on the lower panel is fixed. Carrier to rotate by the rotation, the rotary shaft 22 for rotating the lower plate, fine lapping particles are formed to polish the glass substrate on the upper portion of the liquid crystal panel is combined with the rotating shaft and rotated together with the lower plate It is comprised including the upper plate which presses a liquid crystal panel.

The upper and lower plates 21 are generally made of cast iron, and fine lapping particles protrude from the surfaces of the upper and lower plates, thereby laminating the surface of the glass substrate.

On the other hand, the top plate and the bottom plate performs the function of polishing the surface of the glass substrate as described above, but the surface of the top plate and the lower plate 21 may also be worn by the repeated polishing function. In particular, the upper and lower plates are formed in a circle that is rotated by the rotating shaft 22, due to the difference in the rotational angular velocity, rotational speed, rotation radius, etc. in each portion, as shown in Figure 2 On the lower plate 21 or the upper plate, uneven wear may occur. Therefore, a dressing process for removing uneven wear of the uneven upper and lower plates is periodically performed.

The dressing process presses the dressing carrier onto the top plate after seating the dressing carrier on the bottom plate 21 in which the carrier and the liquid crystal panel are removed so that the dressing carrier polishes the surfaces of the top plate and the bottom plate. It is a process of removing uneven wear formed on the surfaces of the upper and lower plates.

The dressing carrier has to be provided for the dressing process. In the related art, a method of directly transporting the dressing carrier has been used. However, as the liquid crystal panel is enlarged, the lapping apparatus is also enlarged, and the dressing carrier is also enlarged, so that it is difficult for a user to carry the dressing carrier directly.

In addition, the top plate is a device having a weight of 2 tons or more, and the safety problem is raised because it is very dangerous for the user to work for transporting the dressing carrier under the top plate.

Accordingly, an object of the present invention for solving the above problems is to provide a wrapping apparatus capable of transferring a dressing carrier to a lower plate by an arm while loading the dressing carrier.

In order to achieve the above object, the lapping apparatus according to the present invention, the polishing unit for polishing the surface of the substrate; And a dressing carrier management unit formed at one side of the polishing unit and configured to load or unload the dressing carrier for removing uneven wear of the polishing unit from or to the polishing unit.

Other objects and features of the present invention in addition to the above objects will become apparent from the description of the embodiments with reference to the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a configuration diagram of an embodiment of a wrapping apparatus according to the present invention. 4 is a side view of an embodiment of the wrapping apparatus shown in FIG. 3, and FIG. 5 is a plan view of an embodiment of the wrapping apparatus illustrated in FIG. 3.

Lapping apparatus according to the present invention is formed on one side of the polishing portion 50 and the polishing portion for polishing the upper and lower surfaces of the liquid crystal panel and loading the dressing carrier for removing uneven wear of the polishing portion to the polishing portion or the polishing portion It is comprised including the dressing carrier management part 60 which manages by unloading.

The polishing unit 50 includes a lower plate 51 in which a liquid crystal panel is placed and fine lapping particles are formed to polish the organic substrate under the liquid crystal panel, and the lower plate in a state in which the liquid crystal panel is fixed therein. Fine wrapping particles are formed to polish the glass substrate on the upper side of the carrier (not shown) and the upper surface of the liquid crystal panel, and the upper surface plate 53 for pressing the liquid crystal panel together with the lower surface plate to form an outer portion of the lower surface plate. An outer portion 54, a first elevating portion 55 formed inside the outer portion and capable of elevating movement, a second elevating portion 56 formed to enable the elevating movement in the outer periphery of the rotation shaft 52; It includes a rotation shaft 52 for rotating the first lifting unit or the second lifting unit.

The polishing unit 50 is a part of etching the upper and lower glass substrates of the liquid crystal panel, which have undergone the liquid crystal panel manufacturing process, of the liquid crystal display device. The liquid crystal panel is disposed inside the carrier placed on the lower plate 51. In a fixed state, the upper plate 53 is moved downward so that the liquid crystal panel is in close contact with the surfaces of the upper plate 53 and the lower plate 51. A tooth is formed on an outer side of the second elevating unit 56, a tooth is formed on an outer side of the first elevating unit 55, and a first elevating unit 55 is formed on an outer side of the carrier (not shown). ) And teeth that engage with the teeth of the second elevating portion 56 are formed. Therefore, the first elevating portion 55 or the second elevating portion 56 is rotated by the rotation of the rotary shaft 52, so that the carrier (not shown) is the first and second elevating portions 55, 56. The liquid crystal panel, which is fixed by the carrier by the rotation of the carrier, wears while being in contact with the surfaces of the upper plate 53 and the lower plate 51. In the above, the first and second lifting units 55 and 56 are rotated by the rotation shaft 52, but the present invention is not limited thereto. Therefore, in the present invention, the carrier is rotated by at least one of the rotation shaft 52, the first and the second lifting units 55 and 56, and the teeth of the first and the second lifting units 55 and 56. It may be configured to engage and rotate. In order for the liquid crystal panel to contact the upper plate 53 and the lower plate 51, the thickness of the carrier must be smaller than the thickness of the liquid crystal panel. The upper plate 53 and the lower plate 51 are made of cast iron, and fine lapping particles protrude from the surfaces of the upper plate 53 and the lower plate 51, thereby laminating the surface of the glass substrate. Done. The driving of the polishing unit 50 is controlled by a controller not shown.

On the other hand, the upper surface plate 53 and the lower surface plate 51 performs the function of polishing the surface of the glass substrate as described above, the surface of the upper surface and the lower surface plate may also be worn by the repeated polishing function. In particular, the upper and lower plate is formed in a circular bar, due to the difference in the rotational angular velocity, rotational speed, rotation radius, etc. in each part, uneven wear may occur. Therefore, a dressing process for removing uneven wear of the unweared upper and lower surfaces should be performed periodically, and the dressing carrier 57 is used for the dressing process. That is, in the dressing process, the dressing carrier 57 is pressed on the top plate 53 after the dressing carrier 57 is seated on the lower plate 51 in which the carrier and the liquid crystal panel are removed. Is a step of removing the uneven wear formed on the surfaces of the upper and lower plates by polishing the surfaces of the upper and lower surfaces.

According to the present invention, the dressing carrier 57 is stored, while the dressing carrier 57 is transferred (loaded) to the lower plate 51 for the dressing process or the dressing carrier 57 is finished. The dressing carrier management part 60 for conveying (unloading) from the lower surface plate 51 is provided.

The dressing carrier management unit 60 includes a loading box 61 in which at least one dressing carrier 57 is loaded, a driver 62 for raising and lowering the dressing carrier 57 loaded in the loading box, and the driver 62. The dressing carrier 57 placed on the upper end of the loading box to the lower platen 51 or the dressing carrier 57 placed on the lower platen 51 from the lower plate 51. It includes an arm (63) for transporting to the stacker and a controller (64) for controlling the operation of the driver and the arm.

The arm 63 is preferably formed in multiple joints so that the arm 63 can be moved from the loading box 61 to the lower plate 51, but is not limited thereto. In addition, an end portion of the arm 63 is formed with a ring 65 for pushing or pulling the dressing carrier 57 substantially.

The controller 64 is for controlling the operation of the arm and the driver as described above, or may be configured to control the operation of the polishing unit together. That is, in the above description, a controller (not shown) is provided to control the polishing unit 50, but the controller 64 may include a function of the controller.

On the other hand, where the dressing carrier management unit 60 and the polishing unit 50 are adjacent to each other, as shown in FIGS. 3 and 5, the outer portion 54 is not formed, and the first elevating unit 55 is not formed. ) Is configured to move up and down, the dressing carrier 57 may be transferred from the dressing carrier management unit 60 to the lower plate 51. However, the present invention is not limited thereto, and therefore, the outer portion 54 may also be configured to be descended. That is, when the dressing carrier 57 is transferred to the lower plate 51 by the arm 63, the outer portion 54 and the first raising and lowering portion 55 are lowered, whereby the dressing carrier 57 ) Can be secured.

6 is an exemplary view showing a state in which the dressing carrier is transferred to the lower plate in the lapping apparatus shown in FIG. 3.

The dressing carrier 57 is configured in a circular shape as shown in Figs. 3 to 5, and teeth are formed on the outer side thereof. In addition, the dressing carrier 57 is configured such that the inner space 57-1 is empty, and the ring 65 of the arm 63 is configured to be caught in the inner space. However, the present invention is not limited thereto, and grooves may be formed on the surface of the dressing carrier 57 so that the dressing carrier 57 can be moved by the ring 65.

When the transfer command signal is input from the user to the controller 64 to transfer the dressing carrier 57 to the lower plate 51, the controller 64 drives the driver 61 to The dressing carrier 57 loaded in the stacking box 61 is exposed to the surface of the stacking box 61.

When the dressing carrier 57 is exposed to the surface 61 of the loading box, the controller 64 moves the arm 63 so that the ring 65 formed at the end of the arm 63 is the dressing carrier. To (57). That is, the ring 65 is inserted into the inner space 57-1 of the dressing carrier 57, thereby moving the dressing carrier 57 toward the lower plate 51.

During the movement of the dressing carrier 57 as described above, the first raising and lowering portion 55 is lowered, so that the dressing carrier 57 is cut off of the outer portion 54 and the first raising and lowering portion 55. It can be moved to the lower plate 51 through the upper end. However, as described above, both the outer portion 54 and the first elevating portion 55 may be lowered to secure a movement path of the dressing carrier 57.

7 is an exemplary view showing a state in which the dressing carrier is transferred from the lower plate to the stacker in the lapping apparatus shown in FIG. 3.

When a transfer command signal is input from the user to the controller 64 to transfer the dressing carrier 57 from the lower plate 51 to the loading box 61, the controller 64 moves the arm 63. By driving, the ring 65 formed at the end of the arm 63 extends over the outer portion of the dressing carrier 57 placed on the lower plate 51. To this end, the second lifting unit 56 should be lowered.

That is, in order for the ring 65 to pull the dressing carrier 57, the ring 65 must be hung on the outer portion of the dressing carrier 57 adjacent to the rotating shaft 52. When the second lifting unit 56 is lowered, the ring 65 is inserted into the position where the second lifting unit 56 is raised to pull the dressing carrier 57.

When the length of the arm 63 is reduced while the ring 65 is in close contact with the outer portion of the dressing carrier 57, the dressing carrier 57 is transferred from the lower plate 51 toward the loading box 61. do.

During the movement of the dressing carrier 57 as described above, the first raising and lowering portion 55 is lowered, so that the dressing carrier 57 is cut off of the outer portion 54 and the first raising and lowering portion 55. It can be moved to the lower plate 51 through the upper end. However, as described above, both the outer portion 54 and the first elevating portion 55 may be lowered to secure a movement path of the dressing carrier 57.

When the dressing carrier 57 is transported to the surface 61 of the stacker, the controller 64 lowers the driver 62 so that the dressing carrier 57 is loaded inside the stacker 61. do.

The lapping apparatus according to the present invention as described above has an excellent effect of not only reducing the loading and unloading time of the dressing carrier for the lapping process, but also reducing the manpower for loading and unloading.

In addition, the present invention has an excellent effect of improving the working stability of the user by automatically loading and unloading the dressing carrier.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims (8)

Polishing unit for polishing the surface of the substrate; And And a dressing carrier management unit formed on one side of the polishing unit and configured to load or unload the dressing carrier for removing uneven wear of the polishing unit from or to the polishing unit. The method of claim 1, The dressing carrier management unit, A loading box in which the dressing carrier is loaded; An actuator for elevating and lowering the dressing carrier loaded in the stacking box; An arm for transferring the dressing carrier placed on the upper end of the loading box by the driver to the polishing unit or transferring the dressing carrier 57 placed on the polishing unit from the polishing unit to the loading bin; And And a controller for controlling the operation of the driver and the arm. The method of claim 2, The arm is, Lapping apparatus characterized in that formed in multiple joints to be moved from the loading box to the polishing unit. The method of claim 2, Wrapping device, characterized in that the end of the arm is formed with a ring that can push or pull the dressing carrier. The method of claim 1, The polishing unit, A lower plate in which fine lapping particles are formed to polish the lower surface of the substrate; A carrier placed on the lower plate while the substrate is fixed; An upper surface plate having fine lapping particles formed thereon to polish the upper surface of the substrate and pressurizing the substrate together with the lower surface plate; An outer portion forming an outer portion of the lower plate; A first elevating portion formed inside the outer portion and capable of moving up and down; A second elevating unit configured to move up and down at an outer side of the rotary shaft; And Lapping apparatus including a rotating shaft which is rotated to form an axis in the center of the first lifting unit, the second lifting unit and the lower plate. The method of claim 5, wherein Lapping apparatus, characterized in that the outer portion is not formed on the movement path to move the dressing carrier from the dressing carrier management unit to the polishing unit. The method of claim 5, wherein Lapping apparatus, characterized in that the outer portion is formed to be moved up and down. The method according to any one of claims 1 to 7, The substrate, A lapping apparatus, wherein the upper substrate and the lower substrate are coupled to each other, and a liquid crystal panel in which liquid crystal is injected therebetween.

Images