JP5544319B2 - Surface grinding method - Google Patents

Description

  The present invention relates to a method for surface grinding of the upper and lower surfaces of an object to be ground by a vertical double-head surface grinding machine.

  FIG. 4 shows a schematic configuration of a conventional general vertical double-sided surface grinder (hereinafter simply referred to as “grinding machine”). As shown in FIG. 4, the grinding machine 1 is fixed to the lower and upper main shafts 10 and 20 that are coaxially arranged in the vertical direction, and the ends of the main shafts 10 and 20 facing each other. Cup-shaped grindstones 11, 21, drive motors 13, 23 for rotating the main shafts 10, 20 around the axes, lower and upper elevating mechanisms 14, 24 for moving the main shafts 10, 20 up and down, A surface plate 30 on which W is placed, a transfer arm 40 that holds and transfers a workpiece W, an arm rotation drive mechanism 43 that horizontally rotates the transfer arm 40 around a vertical axis, and the transfer The work rotation drive mechanism 44 that rotates the work W held by the arm 40 about its axis, the drive motors 13 and 23, the elevating mechanisms 14 and 24, the arm rotation drive mechanism 43, and the work rotation drive mechanism 44 are controlled. System And a device 50.

  Each of the grindstones 11 and 21 has grinding surfaces 12 and 22 having flat end faces on the opening side, and the main spindles so that the grinding faces 12 and 22 face each other and are coaxial with the spindles 10 and 20. 10 and 20 are fixed. The main shafts 10 and 20 are rotated in the same direction or opposite to each other by the drive motors 13 and 23, and are individually lifted and lowered in the axial direction by the lower and upper lifting mechanisms 14 and 24, respectively. .

  Thus, the lower and upper elevating mechanisms 14 and 24 raise and lower the main shafts 10 and 20 by the control device 50 to bring the grinding surfaces 12 and 22 of the grindstones 11 and 21 to preset positions. Position. The grinding surfaces 12 and 22 of the grindstones 11 and 21 are horizontal.

  The surface plate 30 is disposed on the side of the grindstone 11 of the lower main spindle 10 in close proximity thereto. The upper surface 31 of the surface plate 30 is parallel to the grinding surfaces 12 and 22, and the workpiece W placed on the upper surface 31 is transferred onto the grinding surface 12 of the grindstone 11 by the transfer arm 40. It will be posted.

  A plan view of the transfer arm 40 is shown in FIG. As shown in the figure, the transfer arm 40 has workpiece holding holes 42 and 42 penetrating in the vertical direction at both ends thereof, and holds the workpiece W in the workpiece holding holes 42 and 42, respectively. Can be done.

  Further, the transfer arm 40 is provided with a rotation shaft 41 perpendicular to the upper surface 31 of the surface plate at the center thereof, and the rotation shaft 41 is rotated by the arm rotation drive mechanism 43. For example, the workpiece W is rotated about the rotation shaft 41 in the direction indicated by the arrow A in FIG. 5A, and the workpiece W placed on the upper surface 31 of the surface plate is carried onto the grinding surface 12 of the grinding stone 11. The workpiece W on the 11 grinding surface 12 is carried out to the upper surface 31 of the surface plate. Since the transfer arm 40 is symmetrical, the illustration of one end side thereof is omitted in FIG.

  Further, although a specific structure of the workpiece rotation driving mechanism 44 is not shown, the workpiece W held in the workpiece holding holes 42, 42 of the transfer arm 40 is transferred to the workpiece rotation driving mechanism 44 as shown in FIG. As shown in FIG. 5, for example, it is rotated in the direction of arrow B, and in this rotated state, it is loaded onto the grinding surface 12 of the lower grindstone 11 and unloaded onto the upper surface 31 of the surface plate. When the workpiece W held in the workpiece holding holes 42 and 42 is transferred onto the grinding surface 12 by the transfer arm 40, the workpiece W is rotated by the workpiece rotation driving mechanism 44 and is carried out onto the surface plate 30. The rotation may be stopped.

  The mechanism for transporting the workpiece W between the surface plate 30 and the grinding surface 12 of the grindstone 11 is not limited to the so-called double arm type transfer arm 40 shown in FIGS. A so-called single arm type having a workpiece holding hole only at one end may be used. Alternatively, a mechanism of a so-called rotary carrier system may be used in which a disk-shaped member having a plurality of holding holes formed annularly at a predetermined interval on the peripheral portion is conveyed horizontally.

  As a conventional grinding method for surface grinding of the upper and lower surfaces of the workpiece W using the grinding machine 1 having the above configuration, first, the lower spindle 10 is moved by the lower lifting mechanism 14, and the grinding wheel 11 is positioned so that the grinding surface 12 is slightly above the upper surface 31 (usually 5 μm or more and 15 μm or less), and the upper spindle 20 is moved by the upper elevating mechanism 24 to grind the grindstone 11. The grinding surface 22 of the grindstone 21 is positioned so as to have an interval at which the workpiece W can be carried between the surface 12 and the surface 12.

  At this time, one of the transfer arms 40 is above the surface plate 30, the workpiece W is held in the workpiece holding hole 42, and the other is located between the grindstones 11 and 21, and the workpiece holding hole 42 Suppose that the workpiece W is not held.

  Next, the transfer arm 40 is rotated by the arm rotation drive mechanism 43, and the workpiece W held in the workpiece holding hole 42 is transferred from the upper surface 31 of the surface plate onto the grinding surface 12 of the grindstone 11. The upper spindle 20 is lowered by the mechanism 24 to bring the grinding surface 22 of the grindstone 21 into contact with the upper surface of the workpiece W, and the upper and lower surfaces of the workpiece W are ground by a predetermined amount by the grinding surfaces 12 and 22. As described above, the workpiece W is rotated about its axis by the workpiece rotation drive mechanism 44.

  Next, after the grinding process is completed in this way, the upper spindle 20 is raised to separate the grindstone 21 from the workpiece W, and then the transfer arm 40 is rotated again by the arm rotation drive mechanism 43. Then, the ground workpiece W is transferred from the ground surface 12 to the upper surface 31 of the surface plate.

  At this time, a new workpiece W is supplied and held in the other workpiece holding hole 42 located above the surface plate 30 of the transfer arm 40, and this new arm is rotated by the rotation of the transfer arm 40. A workpiece W is transferred onto the grinding surface 12.

  Thus, the workpiece W is continuously ground by repeating the same operation as described above.

  By the way, in such a general grinding machine 1 and a grinding method using the same, a double-sided surface grinding apparatus and a grinding method thereof improved in the conventional grinding machine 1 are proposed as disclosed in JP-A-10-543. Has been.

  In addition to the configuration of the conventional grinding machine 1 described above, this double-head surface grinding apparatus detects the vertical distance between the lower surface of the workpiece placed on the grinding surface of the lower grindstone and the upper surface of the surface plate. A non-contact sensor is provided, and the non-contact sensor can detect the amount of wear on the lower grinding wheel grinding surface caused by continuously machining a plurality of workpieces.

  Then, the lower grindstone is raised by a dimension corresponding to the detected wear amount so that the grinding surface of the lower grindstone is always positioned at a fixed position.

  If the grinding surface of the lower grindstone moves downward due to wear and its vertical position approaches the upper surface of the surface plate, the lower surface of the workpiece contacts the upper surface of the surface plate during processing, and the lower surface of the workpiece is damaged. However, in the grinding apparatus and the grinding method disclosed in Japanese Patent Application Laid-Open No. 10-543, such a problem arises by controlling the grinding surface of the lower grindstone to always be in a fixed position. Trying to prevent.

JP-A-10-543

  However, in the conventional general grinding machine 1, the position (carrying position) of the grinding surface 12 of the lower grindstone 11 when the workpiece W is transferred and the grinding surface when the workpiece W is ground. Since the position 12 (grinding position) is the same position, and the carry-in position and the grinding position are set slightly above the upper surface 31 of the platen as described above, as described below. There was a problem.

  That is, when the workpiece W is ground by pressing the grinding surface 22 of the upper grinding wheel 21 against the workpiece W on the grinding surface 12 of the lower grinding stone 11, the grinding stones 11 and 21 have a grinding load as a matter of course. In addition to the grinding load, a load due to the weight of the workpiece W also acts on the lower grindstone 11, and such a load is applied to the upper spindle 20 and the lower spindle as shown in FIG. 10 is an offset load that deviates from the central axis, and it is not a problem when the load acting on the grindstones 11 and 21 is a light load, but when a heavy load acts, 6 (b), the flanges of the lower main shaft 10 and the upper main shaft 20 are inclined or the grindstones 11 and 21 are bent, so that the lower surface of the work W comes into contact with the upper surface 31 of the surface plate. The problem that the lower surface and the upper surface 31 of the surface plate are damaged Is Jill. In FIG. 6B, in order to make it easy to understand the tilted state, the tilt angle is larger than the actual tilt angle.

  Further, since the work W lower surface and the surface plate upper surface 31 are in contact with each other, the work W is supported by the surface plate 30, and therefore the grinding amount of the lower grindstone 11 is greater than the grinding amount of the upper grindstone 21. There is also a problem that clogging of the lower grindstone 11 occurs or it becomes difficult to properly distribute the grinding allowance between the upper and lower surfaces of the workpiece W. In addition, since the workpiece W is ground in an inclined state, problems such as a decrease in grinding accuracy (particularly flatness) and loss of shape of the grindstones 11 and 21 occur. When collapse occurs frequently, the required number of dressing operations increases, and the processing cost increases.

  These problems can be solved by raising the carry-in position upward. However, when the carry-in position is set upward, the step between the grinding surface 12 of the lower grindstone 11 and the upper surface 31 of the surface plate becomes too large. When the workpiece W is transferred from the grinding surface 12 of the side grindstone 11 to the upper surface 31 of the surface plate, there is a problem that the lower surface of the workpiece W after grinding is easily damaged at the edge portion of the lower grindstone 11, and this step is an obstacle. Thus, the fundamental problem that the workpiece W cannot be transferred onto the grinding surface 12 occurs.

  In addition, the grinding apparatus disclosed in Japanese Patent Laid-Open No. 10-543 is the same in that the carry-in position and the grinding position are set to the same position, and these positions are set slightly above the upper surface of the surface plate. In the grinding apparatus, the same problem as described above has occurred.

  The present invention has been made in view of the above circumstances, and provides a surface grinding method that can reliably prevent the workpiece and the surface plate from contacting each other during grinding and improve the grinding accuracy and the life of the grinding wheel. For that purpose.

The present invention for solving the above problems is as follows.
A pair of grindstones each having a flat grinding surface are arranged up and down so that the grinding surfaces face each other, and the pair of grindstones are rotated around an axis orthogonal to the grinding surface, respectively. Surface grinding in which the workpiece placed on the mounting table is slid horizontally and carried between the pair of grinding wheels, and then the upper and lower surfaces of the workpiece are ground by the pair of grinding wheels. A method,
The lower grindstone is positioned at a position where the object to be ground on the mounting table can be slid into the ground surface, and the upper grindstone is positioned at the lower position with a space at which the object to be ground can be carried in a non-contact manner. Position above the side whetstone,
Next, the object to be ground on the mounting table is slid into and placed on the grinding surface of the lower grindstone,
Thereafter, the upper grindstone is brought into contact with the grinding surface of the upper grindstone by raising the lower grindstone or raising the lower grindstone and lowering the upper grindstone. , Grinding the upper and lower surfaces of the workpiece,
Next, the lower grindstone is lowered, and the object to be ground is positioned at a position where it can be slid out on the mounting table,
Thereafter, according to the flat surface grinding method so as to unload the object to be ground on the lower grinding wheel on the mounting table.

  According to this surface grinding method, first, there is an interval between the lower grindstone and the upper grindstone so that the workpiece can be carried in, and the position on the mounting table where the workpiece can be carried in slide, i.e., the carry-in. After positioning at the position, the object to be ground on the mounting table is placed on the grinding surface of the lower grindstone.

  Next, the lower grindstone is raised to a grinding position set above the carry-in position, and the lower grindstone and the upper grindstone are used to move the lower grindstone to the grinding position. Grind the bottom surface.

  Then, after the grinding process is completed, the lower grindstone is lowered to a position where the object to be ground can be slid out onto the mounting table, that is, an unloading position, and after the descending, the object to be ground is carried out onto the mounting table.

Thus, according to this surface grinding method , since the grinding position of the workpiece is set above the carry-in position of the workpiece, the grinding position is set to an appropriate position. Even if a heavy load is applied during grinding, it is possible to reliably prevent the lower surface of the workpiece and the upper surface of the surface from coming into contact with each other due to the bending or elastic deformation of the grinding wheel or the inclination of the spindle due to the heavy load. The wheel life can be improved. In addition, it is possible to prevent damage to the work and the surface plate caused by this contact.

  On the other hand, when loading and unloading the object to be ground, the lower grindstone is positioned at a position where the object to be ground can be slid and transferred to and from the mounting table. An object to be ground can be smoothly conveyed between the grindstone and the mounting table.

The carry-in position and the carry-out position are set so that the grinding surface of the lower grindstone is above the upper surface of the mounting table.

As another aspect, the grinding surface of the lower grindstone at the carry-in position is positioned below the upper surface of the mounting table, and the ground surface at the unloading position is positioned above the upper surface of the mounting table. set to.

  By doing in this way, in any case of carrying in and carrying out, the protrusion which protruded in the conveyance direction does not arise, but a to-be-ground object can be conveyed more smoothly.

  Moreover, it is preferable that the grinding surface of the said lower grindstone in the said grinding position is a position which becomes 20 to 300 micrometers (more preferably 30 to 120 micrometers) from the mounting table upper surface. By setting the position of the grinding surface 20 μm or more higher than the upper surface of the mounting table, it is possible to effectively prevent the lower surface of the object to be ground and the upper surface of the mounting table from contacting each other during grinding. It is possible to suppress the lowering time of the lower grindstone from being increased to an appropriate range, and it is possible to suppress the grinding cycle time from being increased within an allowable range.

  As described above, according to the surface grinding method according to the present invention, since the grinding position is set higher than the loading position of the object to be ground, even if a heavy load is applied during grinding, it is mounted on the lower surface of the object to be ground. It is possible to reliably prevent contact with the upper surface of the pedestal, and to prevent a decrease in grinding accuracy and an increase in grindstone cost due to uneven wear. Moreover, it is possible to prevent problems such as clogging of the lower grindstone, deviation of the workpiece grinding allowance, damage to the workpiece and the mounting table as described above.

It is explanatory drawing which shows the procedure of the surface grinding method which concerns on this invention. Only one end of the transfer arm is shown. It is explanatory drawing which shows the procedure of the surface grinding method which concerns on this invention. Only one end of the transfer arm is shown. It is explanatory drawing which shows the procedure of the surface grinding method which concerns on this invention. Only one end of the transfer arm is shown. It is a front view which shows schematic structure of the conventional vertical double-sided surface grinder. It is a top view which shows the transfer arm in the conventional vertical double-sided surface grinder. Only one end of the transfer arm is shown. It is explanatory drawing which shows the process in which the inclination of a grindstone grinding surface arises with the conventional vertical double-sided surface grinder.

  Hereinafter, a surface grinding method according to a specific embodiment of the present invention will be described with reference to the drawings. The vertical double-sided surface grinder used in this embodiment is the same as the conventional grinder 1 shown in FIG. Therefore, the description about the specific structure is abbreviate | omitted.

  According to the surface grinding method according to the present embodiment, first, the lower spindle 10 and the lower grindstone 11 are moved by the lower lifting mechanism 14 to grind the lower grindstone 11 as shown in FIG. Positioning is performed so that the surface 12 is positioned slightly above the upper surface 31 of the surface plate, and the workpiece W can be carried between the grinding surface 22 of the upper grindstone 21 and the grinding surface 12 of the lower grindstone 11. The upper spindle 20 and the upper grindstone 21 are moved and positioned by the upper elevating mechanism 24 so as to have an interval. Hereinafter, the positions of the lower grindstone 11 and the upper grindstone 21 are referred to as “work carry-in positions”.

  Thus, in this example, the position of the grinding surface 12 at the workpiece loading position is set slightly above the surface plate upper surface 31, and a step is provided between the grinding surface 12 and the surface plate upper surface 31. This is to prevent the lower surface of the workpiece W from contacting the upper surface 31 of the surface plate when the workpiece W is subsequently loaded and placed on the grinding surface 12. The workpiece loading position is also a workpiece unloading position, as will be described later. This is to prevent the lower surface of the workpiece W after grinding from being easily damaged by the edge portion of the grindstone 11 when the workpiece W is unloaded.

  On the other hand, when a step is provided between the grinding surface 12 and the upper surface 31 of the surface plate, this step becomes an obstacle when the workpiece W is slid and conveyed onto the grinding surface 12, so that the step is preferably as small as possible.

  Considering the above, it is preferable to set the step in the range of 5 μm to 15 μm as a whole. For example, the step may be set to about 15 μm when the weight of the workpiece W is heavy, and about 5 μm when the weight is light, or the step may be set regardless of the weight of the workpiece W. May be.

  In this way, when the lower grindstone 11 and the upper grindstone 21 are positioned at the workpiece loading position, one end of the transfer arm 40 is above the surface plate 30 and the workpiece holding hole 42 has a workpiece. It is assumed that W is held, the other end is located between the grindstones 11 and 21, and the workpiece W is not held in the workpiece holding hole 42. 1-3, illustration of the other end side of the transfer arm 40 is omitted.

  Further, the supply of the workpiece W to the workpiece holding hole 42 positioned above the surface plate 30 and the take-out described later can be performed using a suitable automatic device such as a loader or a robot.

  Next, as shown in FIG. 1B, the arm 40 is rotated by the arm rotation drive mechanism 43 to rotate the transfer arm 40 by 180 ° and is held in the work holding hole 42 on the one end side. The workpiece W placed on the upper surface 31 of the surface plate in a state is carried around between the grinding surface 12 of the lower grindstone 11 and the grinding surface 22 of the upper grindstone 21 while being rotated about its axis by the workpiece rotation drive mechanism 44. Then, it is placed on the grinding surface 12 of the lower grindstone 11. In addition, after carrying in between the grinding surface 12 of the lower grindstone 11 and the grinding surface 22 of the upper grindstone 21, the workpiece W may be rotated about its axis by the workpiece rotation drive mechanism 44.

Then, as shown in FIG. 2 (a), along with raising the lower spindle 10 and the lower grindstone 11 by a distance d ₁ by the lower lift mechanism 14, by the upper lifting mechanism 24 the upper spindle 20 and the upper grinding wheel 21 work The distance is lowered toward W by a distance d ₂ (cut amount). At that time, the ascending speeds of the lower main spindle 10 and the lower grindstone 11 are not particularly limited, but the descending speeds of the upper main spindle 20 and the upper grindstone 21 are set to a grinding speed.

  Thereby, the grinding surface 22 of the upper grindstone 21 contacts the upper surface of the workpiece W, and the upper and lower surfaces of the workpiece W are ground by the grinding surface 12 of the lower grindstone 11 and the grinding surface 22 of the upper grindstone 21.

Incidentally, the rising amount d ₁ of the lower grindstone 11 is such that the distance between the upper surface 31 of the surface plate and the lower surface of the workpiece W (that is, the grinding surface 12 of the lower grindstone 11) The amount is appropriately set so that the lower surface of the workpiece W and the surface plate upper surface 31 do not come into contact with each other even when the upper spindles 10 and 20 and the lower grindstone 11 are deformed. It is preferable to set the distance between the surface 12 and the surface 12 within a range of 20 μm to 300 μm (more preferably 30 μm to 120 μm) (for example, d ₁ = 50 μm). If it is less than 20 μm, the contact between the lower surface of the workpiece W and the upper surface 31 of the surface plate due to grinding load or the like cannot be effectively prevented, while if it exceeds 300 μm, the rising time of the lower grindstone 11 is long. This is because the cycle time of the grinding process becomes longer than the allowable range.

Also, depth of cut d ₂ is an amount equivalent to the sum of the set grinding allowance on the upper and lower surfaces of the workpiece W, is set appropriately also for this depth of cut d _2.

  Thus, assuming that the thickness of the workpiece W after completion of grinding is t, the position of the grinding surface 22 of the upper grinding wheel 21 at the workpiece loading position, that is, the distance L from the grinding surface 12 of the lower grinding stone 11 is given by the following equation. The calculated position of the grinding surface 22 of the upper grindstone 21 is set upward by a distance L from the grinding surface 12 of the lower grindstone 11.

L = d ₁ + d ₂ + t

  When grinding of the workpiece W is completed as described above, next, as shown in FIG. 2B, the lower spindle 10 and the upper spindle 20 are respectively restored by the lower elevator mechanism 14 and the upper elevator mechanism 24. To the loading position.

  Thereafter, as shown in FIG. 3, the transfer arm 40 is rotated 180 ° by the arm rotation drive mechanism 43, and the workpiece W after grinding is carried out from the grinding surface 12 of the lower grindstone 11 to the upper surface 31 of the surface plate. To do.

  In addition, a new workpiece W is supplied and held in the other workpiece holding hole 42 located above the surface plate 30 of the transfer arm 40 in the same manner as described above, and the rotation of the transfer arm 40 is performed. Thus, the new workpiece W is transferred onto the grinding surface 12.

  And the workpiece | work W carried out on the surface plate 30 is taken out from the workpiece | work holding hole 42, and the new workpiece | work W is supplied to the workpiece | work holding hole 42 which became empty.

  Thus, the workpiece W is continuously ground by repeating the same operation as described above.

  As described above, according to the surface grinding method of the present invention, the workpiece W is ground by moving the position of the grinding surface 12 of the lower grindstone 11 to a position set higher than the workpiece loading position. Even if a heavy load is applied to the grinding surfaces 12 and 22 of the grindstones 11 and 21 during grinding, the contact between the lower surface of the workpiece W and the upper surface 31 of the surface plate is ensured due to the inclination of each flange of the lower main shaft 10 and the upper main shaft 20. Can be prevented. Thereby, the damage of the workpiece | work W and the surface plate 30 which arises by the contact of the workpiece | work lower surface and the surface plate upper surface 31 can be prevented beforehand.

  Further, the work W is supported by the surface plate 30 and the grinding amount of the lower and upper grindstones 11 and 21 is different, which means clogging of the lower grindstone 11 and the difficulty of distributing the grinding allowance of the work W. Problems can also be prevented. Furthermore, since the workpiece W in an inclined state is not ground, high grinding accuracy (particularly flatness) can be maintained. In addition, since the occurrence of shape loss (uneven wear) of the grindstones 11 and 21 can be suppressed, the number of dressing operations can be reduced, and the grindstone can be made long lasting.

  In addition to the above-described points, when the workpiece W is loaded and unloaded, the step between the grinding surface 12 of the lower grindstone 11 and the upper surface 31 of the lower grindstone 11 is a step that allows the workpiece W to be slid and conveyed. Therefore, the workpiece W can be transferred smoothly.

  As mentioned above, although specific embodiment of this invention was described, the specific aspect which this invention can take is not limited to these at all.

  For example, the position of the lower grindstone 11 at the workpiece loading position may be set so that the grinding surface 12 of the lower grindstone 11 is positioned slightly below the upper surface 31 of the surface plate.

In this case, when the work W is carried in, the position of the grinding surface 12 of the lower grindstone 11 is slightly lower than the upper surface 31 of the surface plate (for example, 0 to 15 μm lower than the upper surface 31 of the surface plate). The lower spindle 10 and the lower grindstone 11 are moved by the lower lifting mechanism 14 and the transfer arm 40 is rotated by the arm rotation driving mechanism 43 so that the workpiece W is transferred to the grinding surface 12. after, as the grinding surface 12 of the lower grinding wheel 11 is positioned a predetermined amount above the platen surface 31, with increases by increasing the amount d ₁ that predetermined lower spindle 10 and the lower grindstone 11, the upper The upper spindle 20 and the upper grindstone 21 are lowered by the lifting mechanism 24 to grind the upper and lower surfaces of the workpiece W, and then the grinding surface 12 of the lower grindstone 11 is slightly above the upper surface 31 of the surface plate. Lower by the lower lifting mechanism 14 Moves the main shaft 10 and a lower grindstone 11, raising the upper shaft 20 and the upper grinding wheel 21 by the upper lifting mechanism 24, and carries out the workpiece W from the grinding surface 12 of the lower grinding wheel 11 to the platen surface 31.

  In this way, even when the workpiece W is transported from the upper surface 31 of the surface plate to the grinding surface 12 of the lower grindstone 11, no protruding protrusion is generated in the transport direction, and the workpiece W can be transported more smoothly. it can.

Further, after transferring the workpiece W to the grinding surface 12 of the lower grinding wheel 11, while fixing the upper spindle 20, raise the lower main shaft 10 and the lower grindstone 11 by the increase amount d _1, further wherein is raised by the depth of cut d _2, it may be to grind the upper and lower surfaces of the workpiece W.

DESCRIPTION OF SYMBOLS 1 Grinding machine 10 Lower spindle 11 Lower grinding wheel 12 Grinding surface 13 Lower drive motor 14 Lower lifting mechanism 20 Upper spindle 21 Upper grinding wheel 22 Grinding surface 23 Upper drive motor 24 Upper lifting mechanism 30 Surface plate 31 Surface plate upper surface 40 Transfer Mounting arm 41 Rotating shaft 42 Workpiece holding hole 43 Arm rotation drive mechanism 44 Workpiece rotation drive mechanism 50 Controller W Workpiece

Claims (3)

A pair of grindstones each having a flat grinding surface are arranged up and down so that the grinding surfaces face each other, and the pair of grindstones are rotated around an axis orthogonal to the grinding surface, respectively. Surface grinding in which the workpiece placed on the mounting table is slid horizontally and carried between the pair of grinding wheels, and then the upper and lower surfaces of the workpiece are ground by the pair of grinding wheels. A method,
The lower grindstone is positioned at a position where the object to be ground on the mounting table can be slid into the ground surface, and the upper grindstone is positioned at the lower position with a space at which the object to be ground can be carried in a non-contact manner. Position above the side whetstone,
Next, the object to be ground on the mounting table is slid into and placed on the grinding surface of the lower grindstone,
Thereafter, the upper grindstone is brought into contact with the grinding surface of the upper grindstone by raising the lower grindstone or raising the lower grindstone and lowering the upper grindstone. , Grinding the upper and lower surfaces of the workpiece,
Next, the lower grindstone is lowered, and the object to be ground is positioned at a position where it can be slid out on the mounting table,
After this, the workpiece on the lower grinding wheel is carried out on the mounting table ,
A surface grinding method, wherein the position of the lower grindstone when loading and unloading the object to be ground is set so that the ground surface is located above the upper surface of the mounting table . A pair of grindstones each having a flat grinding surface are arranged up and down so that the grinding surfaces face each other, and the pair of grindstones are rotated around an axis orthogonal to the grinding surface, respectively. Surface grinding in which the workpiece placed on the mounting table is slid horizontally and carried between the pair of grinding wheels, and then the upper and lower surfaces of the workpiece are ground by the pair of grinding wheels. A method,
The lower grindstone is positioned at a position where the object to be ground on the mounting table can be slid into the ground surface, and the upper grindstone is positioned at the lower position with a space at which the object to be ground can be carried in a non-contact manner. Position above the side whetstone,
Next, the object to be ground on the mounting table is slid into and placed on the grinding surface of the lower grindstone,
Thereafter, the upper grindstone is brought into contact with the grinding surface of the upper grindstone by raising the lower grindstone or raising the lower grindstone and lowering the upper grindstone. , Grinding the upper and lower surfaces of the workpiece,
Next, the lower grindstone is lowered, and the object to be ground is positioned at a position where it can be slid out on the mounting table,
After this, the workpiece on the lower grinding wheel is carried out on the mounting table,
The position of the lower grindstone when the workpiece is carried in is positioned below the upper surface of the mounting table, and the position of the lower grindstone when the workpiece is carried out is flat surface grinding method you characterized in that the grinding surface is set so as to be positioned above the mounting table top. Wherein when grinding the top and bottom surfaces of the object to be ground, the lower grinding stone, or claim 1, characterized in that raising to its grinding surface is positioned from the mounting table top to 20μm or 300μm or less 2 flat surface grinding method as claimed.

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