KR20080054832A - Multi loop core plasma generator and plasma reactor having the same - Google Patents

Abstract

A multi-loop core plasma generator and a plasma reactor having the same are provided to obtain high-density plasma by controlling balance of current applied to primary wires of a multi-loop core. A multi-loop core(326) of a lattice type has a multi-loop. A plurality of primary wires(P1-Pn) are wound around each loop of the multi-loop core and are electrically connected to a power supply source for supplying a wireless frequency. The multi-loop core is installed in a core case(325). The core case includes a plurality of holes(324). The core case includes a metal material and one or more electrical insulating region. The core case includes a case body(321) having the holes, a case cover(323) for covering the case body, and an insulating member(322) formed between the case body and the case cover.

Description

MULTI LOOP CORE PLASMA GENERATOR AND PLASMA REACTOR HAVING THE SAME

In order to more fully understand the drawings used in the detailed description of the invention, a brief description of each drawing is provided.

1 is a cross-sectional view showing the main configuration of the plasma reactor according to the first embodiment of the present invention.

2 is a perspective view of a multi-loop core plasma generator.

3 is an exploded perspective view of a multi-loop core plasma generator.

4 to 6 are views showing examples of modifying the arrangement of a plurality of primary windings of a multi-loop core.

7 is a perspective view illustrating an example in which a nonmagnetic spacer is installed in a multi-loop core.

8 is a cross-sectional view illustrating an example in which a cooling channel is installed in a multi-loop core plasma generator.

9 is a cross-sectional view showing the main configuration of the plasma reactor according to the second embodiment of the present invention.

10 to 12 are diagrams illustrating one embodiment of a current balancing circuit and variations thereof.

13 and 14 show other embodiments and modifications of the current balancing circuit.

15 is a view showing an example in which the configuration of the current variable controller is configured with a variable capacitor.

16 is a circuit diagram showing another embodiment of the current balancing circuit.

17 is a detailed circuit diagram of the current balancing circuit of FIG. 16.

18 is a view showing a modification of the current balance divider of FIG.

19A through 19C are circuit diagrams illustrating modifications of a power transformer.

20 is a circuit diagram showing another modified example of the current balancing circuit.

21 is a block diagram showing a control circuit configuration for controlling a current balancing circuit.

* Description of the symbols for the main parts of the drawings *

100: power supply circuit 110: radio frequency generator

120: impedance matcher 200: current balance circuit

300: vacuum chamber 310: gas supply source

320: multi-core plasma generator 330: substrate support

The present invention relates to a transformer plasma source, and more particularly, to a plasma reactor having a multi-loop core plasma generator capable of generating a large area of uniform plasma.

Plasma is a highly ionized gas containing the same number of positive ions and electrons. Plasma discharges are used for gas excitation to generate active gases containing ions, free radicals, atoms, molecules. The active gas is widely used in various fields and is typically used in a variety of semiconductor manufacturing processes such as etching, deposition, cleaning, ashing, and the like.

There are a number of plasma sources for generating plasma, and the representative examples are capacitive coupled plasma and inductive coupled plasma using radio frequency.

Capacitively coupled plasma sources have the advantage of high process productivity compared to other plasma sources due to their high capacity for precise capacitive coupling and ion control. On the other hand, since the energy of the radio frequency power supply is almost exclusively connected to the plasma through capacitive coupling, the plasma ion density can only be increased or decreased by increasing or decreasing the capacitively coupled radio frequency power. However, increasing radio frequency power increases ion bombardment energy.

On the other hand, the inductively coupled plasma source can easily increase the ion density with the increase of the radio frequency power source, the ion bombardment is relatively low, it is known to be suitable for obtaining a high density plasma. Therefore, inductively coupled plasma sources are commonly used to obtain high density plasma. Inductively coupled plasma sources are typically developed using a method using a radio frequency antenna (RF antenna) and a method using a transformer.

Inductively coupled plasma sources using a transformer can obtain a high density of plasma relatively easily, but the plasma uniformity is affected by structural features. Therefore, efforts have been made to improve the plasma source structure to obtain a uniform high density plasma.

In the recent semiconductor manufacturing industry, plasma processing technology has been further improved due to various factors such as ultra-miniaturization of semiconductor devices, the enlargement of silicon wafer substrates for manufacturing semiconductor circuits, the enlargement of glass substrates for manufacturing liquid crystal displays, and the emergence of new target materials. This is required. In particular, there is a need for improved plasma sources and plasma processing techniques that have good processing capabilities for large area workpieces.

Plasma reactors employing a plurality of transformer coupling structures have been proposed to obtain large area plasma. However, if a plurality of transformers are used, a large area plasma can be obtained, but it is not easy to obtain a uniform plasma. In addition, when a plurality of cores are used, the overall plasma generation efficiency is affected by the arrangement of the cores.

SUMMARY OF THE INVENTION An object of the present invention is to provide a plasma generator having a multi-loop core structured to increase the plasma generation efficiency, and to increase the plasma generation efficiency and to control the balance of the current supplied to the primary windings of the multi-loop core. It is an object of the present invention to provide a plasma reactor capable of obtaining a high density of plasma.

One aspect of the present invention for achieving the above technical problem relates to a plasma generator having a multi-loop core. The multi-loop core plasma generator of the present invention comprises: a lattice multi-loop core having multiple loops; A plurality of primary windings electrically connected to a power source for supplying radio frequencies and wound around each loop of the multiple loop core; And a core case in which a multi-loop core is mounted and provided with a plurality of holes passing through each loop of the multi-loop core.

In one embodiment, the core case comprises a metallic material and includes one or more electrically insulating regions to have electrical discontinuities.

In one embodiment, the core case includes: a case body equipped with a multi-loop core and provided with a hole passing through each loop of the multi-loop core; A case cover covering the core case body; And an insulating member configured between the case body and the case cover.

In one embodiment, a radio frequency supplied from a power source is provided to the plurality of primary windings, and includes a current balancing circuit for controlling the balance of the current supplied to each primary winding.

In one embodiment, the core case includes a cooling channel.

In one embodiment, the multi-loop magnetic core includes a layer of nonmagnetic material.

Another aspect of the invention relates to a plasma reactor having a multi-loop core plasma generator. The plasma reactor of the present invention comprises: a multi-loop core plasma generator; A vacuum chamber having a multi-loop core plasma generator installed thereon and having a substrate support on which a substrate to be processed is placed; And a gas supply unit installed on the multi-loop core plasma generator.

In one embodiment, a bias power source for supplying bias power to the substrate support, the bias power source having a bias structure of either single bias or dual bias.

In one embodiment, the substrate support is free of bias power.

DETAILED DESCRIPTION In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the embodiments of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the accompanying drawings. The embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. This embodiment is provided to more completely explain the present invention to those skilled in the art. Accordingly, the shape of the elements in the drawings and the like are exaggerated to emphasize a clearer description. In understanding the drawings, it should be noted that like parts are intended to be represented by the same reference numerals as much as possible. And a detailed description of known functions and configurations that are determined to unnecessarily obscure the subject matter of the present invention is omitted.

(Example)

Hereinafter, a multi-loop core plasma generator and a plasma reactor having the same will be described in detail by describing a preferred embodiment of the present invention with reference to the accompanying drawings.

1 is a cross-sectional view showing the main configuration of the plasma reactor according to the first embodiment of the present invention.

Referring to FIG. 1, a plasma reactor according to a first embodiment of the present invention includes a vacuum chamber 300 having a substrate support 330 therein and a multi-loop core plasma generator installed above the vacuum chamber 300. 320 and a gas supply unit 310. The process gas supplied through the gas supply unit 310 is injected into the vacuum chamber 300 through the multi-loop core plasma generator 320. The gas supply unit 310 may include a gas supply cover 312 which covers the entire upper portion of the multi-loop core plasma generator 320, a gas inlet 311 connected to a gas supply source (not shown), and one or more for evenly distributing the process gas. The gas distribution diaphragm 313 is comprised.

The multi-loop plasma generator 320 receives a radio frequency from the power supply 100 and transfers induced electromotive force into the vacuum chamber 300 to ionize the process gas input through the gas supply unit 310 by plasma discharge. . The inside of the vacuum chamber 100 is provided with a substrate support 330 on which the substrate W to be processed is disposed, and a gas outlet 302 connected to a vacuum pump (not shown) is provided at one side of the vacuum chamber 100. The substrate W to be processed is, for example, a silicon wafer substrate for producing a semiconductor device or a glass substrate for producing a liquid crystal display or a plasma display.

The vacuum chamber 300 is rebuilt from metallic materials such as aluminum, stainless steel, and copper. Or coated metal, for example anodized aluminum or nickel plated aluminum. Or refractory metal. Alternatively, it is possible to rewrite the chamber body 301 entirely with an electrically insulating material such as quartz, ceramic, or other materials suitable for carrying out the intended plasma process. In order to prevent the eddy current from being generated in the vacuum chamber 300 by the induced electromotive force transmitted from the multi-loop core plasma generator 320, an electrical insulation layer may be provided in a required portion of the vacuum chamber 300.

The power supply 100 includes a radio frequency generator 110 for generating a radio frequency and an impedance matcher 120 for impedance matching. The radio frequency generator 110 may be configured using a radio frequency generator capable of controlling the output power without a separate impedance matcher. The radio frequency supplied from the power supply 100 is input to the primary windings P1, P2, P3,..., Pn of the multi-loop core plasma generator 320. The primary windings P1, P2, P3,..., Pn may be connected to the power supply 100 in any one of a series, parallel, series-parallel mixing scheme.

The substrate support 330 is connected to and biased by the bias power supply 340. For example, two power sources 341 and 342 supplying different radio frequency powers are electrically connected and biased to the substrate support 330 through the impedance matcher 343. The dual bias structure of the substrate support 330 further facilitates plasma generation inside the vacuum chamber 300 and further improves plasma ion energy control on the surface of the substrate W to further improve process productivity. have. Alternatively, the present invention may be modified into a single biased structure by a single power supply. In addition, in the inductively coupled plasma reactor of the present invention, the substrate support 330 may be modified to have a structure having a zero potential without supplying bias power. The plasma reactor of the present invention can perform plasma processing on the substrate W without being supplied with a bias.

2 is a perspective view of a multi-loop core plasma generator, and FIG. 3 is an exploded perspective view of the multi-loop core plasma generator.

2 and 3, the multi-loop core plasma generator 320 includes a multi-loop core 326 having a lattice-shaped multi-loop and a core case 325 on which the multi-loop core 326 is mounted. Each of the loops of the multi-loop core 326 is wound with primary windings P1, P2, P3, ..., Pn, and primary windings P1, P2, P3, ..., Pn are the power source ( 100) is connected in any one of a series, parallel, series-parallel mixing method.

The core case 325 is provided with a plurality of holes 324 passing through each loop of the multi-loop core 326, and is composed of a case body 321 and a case cover 323. When the case body 321 and the case cover 323 are made of a metallic material, an insulating member 322 for preventing eddy current is preferably formed therebetween to have electrical discontinuity. As such, when the core case 325 includes a metal material, an electrically insulating region may be configured at any necessary portion of the core case 325 to prevent eddy currents.

The primary windings P1, P2, P3,..., Pn of the multi-loop core plasma generator 320 may be configured in various forms in the multi-loop core 326. For example, as illustrated in FIG. 3 or 4, two primary windings may be configured in one loop by arranging only one direction of each loop. Alternatively, as shown in FIG. 5, four primary windings may be configured in one loop by arranging them in two directions. Alternatively, as shown in FIG. 6, only one primary winding may be configured in one loop.

7 is a perspective view illustrating an example in which a nonmagnetic spacer is installed in a multi-loop core.

Referring to FIG. 7, the multi-loop core 326 may be configured by using a magnetic core of one body, or may be configured by using a plurality of magnetic core pieces. In the case of forming the multi-loop core 236 using a plurality of magnetic core pieces, a nonmagnetic material layer 327 such as an insulating material may be inserted into the assembly surface of each piece.

8 is a cross-sectional view illustrating an example in which a cooling channel is installed in a multi-loop core plasma generator.

Referring to FIG. 8, the core case 325 of the multi loop core plasma generator 320 includes a cooling channel 329. The cooling channel 329 is installed in the space 327 between the case body 321 and the case cover 324. In this embodiment, the cooling channel 329 is installed in a structure that is placed on the upper portion of the multi-loop core 326 mounted on the case body 321, but may be implemented in other forms. For example, the primary windings P1, P @, P3, ..., Pn may be properly insulated and the case body 325 may also serve as a cooling channel.

The plasma reactor according to the first embodiment of the present invention as described above can efficiently generate a large-area plasma by the multi-loop core plasma generator 320 having the multi-loop core 326 having a lattice structure. In particular, by using the multi-loop core 326 having a lattice structure, not only can be easily expanded in large area, but also the plasma generation efficiency can be improved.

9 is a cross-sectional view showing the main configuration of the plasma reactor according to the second embodiment of the present invention.

9, the plasma reactor according to the second embodiment of the present invention is almost the same as the first embodiment described above. However, the multi-loop core plasma generator 320 is supplied with the radio frequency of the power supply 100 through the current balance circuit 200. Thus, a more uniform high density plasma can be generated. In the following description of the second embodiment, the repeated portions of the first embodiment will be described in detail with reference to the current balance circuit 200.

The plasma generating units G1, G2, and G3 described in the following description of the embodiments are constituted by the multi-loop core plasma generator 320, and one plasma generating unit basically has one primary winding. However, one plasma generating unit may comprise two or more primary windings. The primary winding of the multi loop core plasma generator 320 is connected in parallel to the current balancing circuit 200. However, in the case where one plasma generating unit has two or more primary windings, the primary windings belonging to each plasma generating unit are connected in series so that the primary windings of the multi-loop core plasma generator 320 as a whole are current balanced in a series-parallel mixing manner. It may have a structure connected to the circuit 200.

10 to 12 show one embodiment and modifications of the current balancing circuit. First, referring to FIG. 10, the current balancing circuit 200 is composed of a current balance divider 210 having a plurality of transformers 211, 212, 213 of the same capacity connected in series. The plurality of transformers 211, 212, and 213 are configured in the same number as the plurality of plasma generating units G1, G2, and G3, and the primary sides of the plurality of transformers 211, 212, and 213 are grounded and a radio frequency input terminal RFin. ) Is connected in series between the output stages of the impedance matcher 120, and the secondary side is connected to both ends of the plurality of plasma generating units G1, G2, and G3, respectively. The plurality of transformers 211, 212, and 213 equally divide the voltage between the ground and the radio frequency input terminal RFin to divide the divided voltages Vo_1, Vo_2, and Vo_n into the plurality of plasma generation units G1, Output to G2, G3).

Since the currents flowing to the primary sides of the plurality of transformers 211, 212, and 213 are the same, the power supplied to the plurality of plasma generating units G1, G2, and G3 is also the same. When the impedance of any one of the plurality of plasma generating units G1, G2, and G3 is changed to change the current amount, the plurality of transformers 211, 212, and 213 may interact with each other to achieve a current balance. Thus, the currents supplied to the plurality of plasma generating units G1, G2, G3 are continuously and automatically adjusted uniformly. Although a plurality of transformers 211, 212, and 213 have winding ratios of primary and secondary sides of 1: 1 respectively, this can be changed.

Although not shown in the drawing, the plurality of transformers 211, 212, and 213 may include a protection circuit for preventing a transient voltage from occurring. The protection circuit prevents an increase in the transient voltage of the transformer due to any one of the plurality of transformers 211, 212, and 213 being electrically open. The protection circuit of this function is preferably implemented by connecting a varistor to both ends of each of the plurality of transformers 211, 212 and 213, or using a constant voltage diode such as a Zener diode. Can be implemented.

Referring to FIG. 11, the current balance divider 210a includes a plurality of transformers 211, 212, and 213 and a multi-tap switching circuit 214, 215, and 216. The multi-tap switching circuit 214, 215, 216 includes a switch for controlling the turns ratio by switching between the multi-tap and the multi-tap configured on the secondary side of the plurality of transformers 211, 212, 213. Each switch of the multi-tap switching circuits 214, 215, 216 is electrically connected to one end of the corresponding plasma generating units G1, G2, G3. One end of the secondary side of the plurality of transformers 211, 212, and 213 and one end of the plurality of plasma generating units G1, G2, and G3 are commonly connected.

By controlling the switches of the multi-tap switching circuits 214, 215, and 216, the secondary winding ratios of the plurality of transformers 211, 212, and 213 may be controlled individually or in conjunction with each other. By adjusting the secondary winding ratios of the plurality of transformers 211, 212, and 213 individually or in conjunction with each other, the voltage levels Vo_1, Vo_2, and Vo_n supplied to the plurality of plasma generation units G1, G2, and G3 are individually separated from each other. Can be adjusted differently or in conjunction. Therefore, the density and ion energy of the plasma generated by the plurality of plasma generating units G1, G2, and G3 can be partially controlled as necessary.

Referring to FIG. 12, another variation of the current balance divider 210b includes a plurality of transformers 211, 212, 213 and a multi-tap switching circuit 217, 218, 219. The multi-tap switching circuits 217, 218, and 219 are configured on the secondary side of the plurality of transformers 211, 212, and 213, respectively, between the middle tap connected to the ground, the multi tap consisting of both sides of the middle tap, and the multi taps on both sides. It consists of two switches that adjust the turns ratio by switching operation. One of the two switches is electrically connected to one end of the corresponding plasma generation unit G1, G2, G3, and the other switch is connected to the other end.

In the current balancing circuit 200b, the secondary side of the plurality of transformers 207, 208, and 209 transfers the constant voltages (Vop_1, Vop_2, and Vop_n) to the lower switch based on the middle tap connected to the ground, respectively. Through the negative voltage (Von_1, Von_2, Von_n) is output through. The voltage levels of the constant voltages (Vop_1, Vop_2, Vop_n) and the negative voltages (Von_1, Von_2, Von_n) output from the secondary side of each transformer (211, 212, 213) are switched by the multi-tap switching circuit (217, 218, 219). It is controlled according to the operation.

13 and 14 show other embodiments and modifications of the current balancing circuit. Referring to FIG. 13, the current balancing circuit 200 of another embodiment includes a current variable 227 and a current balance divider 220. The current variable unit 227 may be configured as a variable inductor, and one end of the variable inductor has a plurality of plasma generating units G1, G2, and G3 at the other end of the RF inlet (RFin) (the output end of the impedance matcher 120). ) Are commonly connected. In the current balance divider 220, a plurality of induction coils 221, 222, and 223 and a plurality of induction coils 221, 222, and 223 respectively connected to the plurality of plasma generating units G1, G2, and G3 are wound in common. Consisting of a magnetic core 214. The plurality of induction coils 221, 222, and 223 are connected in one-to-one correspondence with the plurality of plasma generating units G1, G2, and G3, and the other end is grounded. The plurality of induction coils 221, 222, and 223 basically have the same number of turns. However, it is also possible to vary the number of turns depending on the structural characteristics of the plasma reactor.

The current variable 227 controls the total amount of current supplied to the plurality of plasma generating units G1, G2, G3. The current balance divider 220 is automatically controlled to balance the amount of current input to each plasma generating unit G1, G2, G3 by the interaction of the plurality of induction coils 221, 222, 223.

The current balance divider 220 may include a multi-tap switching circuit 224, 225, 226 including a power strip and a switch configured in each of the plurality of induction coils 221, 222, and 223. The turns ratios of the plurality of induction coils 221, 222, and 223 may be individually or globally changed using the multi-tap switching circuits 224, 225, and 226. Current variable 227 may be configured between ground and current balance divider 220, as shown in FIG. 14. As shown in FIG. 15, the current variable 227a may be configured as a variable capacitor.

16 is a circuit diagram showing another embodiment of the current balancing circuit. Referring to the drawings, another variation of the current balancing circuit 200 is composed of a power transformer 240 and a current balancing divider 210. The power transformer 240 has a primary side connected to a radio frequency input terminal RFin, receives a radio frequency, and outputs a constant voltage V_p and a negative voltage V_n at the secondary side. The current balance divider 210 receives the constant voltage V_p and divides the voltage into a plurality of voltages, and applies the divided voltages Vo_1, Vo_2, and Vo_n to one end of the plurality of plasma generation units G1, G2, and G3, respectively. do. The negative voltage V_n of the power transformer 240 is commonly applied to the other ends of the plurality of plasma generating units G1, G2, and G3. In this case, the current balance divider 210 automatically adjusts and distributes the amount of current so that the current values input to the plurality of plasma generating units G1, G2, and G3 are balanced with each other.

17 is a detailed circuit diagram of the current balancing circuit of FIG. 16. Referring to the figure, one end of the power transformer 240 is connected to a radio frequency input (RFin), the other end is connected to ground. The secondary side of power transformer 240 has an intermediate tab 241 electrically connected to ground. Therefore, one end of the secondary side outputs the constant voltage V_p and the other end outputs the negative voltage V_n. The ratio of the constant voltage V_p and the negative voltage V_n is determined according to the position of the intermediate tap 241. For example, the intermediate tap 241 may be configured such that the ratio of the constant voltage V_p and the negative voltage V_n is 1: 2. In this case, the current balance divider 210 includes a plurality of plasma generating units G1, The current balance is performed in a power capacity range of about 1/3 of the total power capacity for driving G2 and G3).

As described above with reference to FIG. 10, the current balance divider 210 includes a plurality of transformers 211, 212, and 213 respectively corresponding to the plurality of plasma generating units G1, G2, and G3. Although a plurality of transformers 211, 212, and 213 have winding ratios of primary and secondary sides of 1: 1 respectively, this can be changed. Each primary side of the plurality of transformers 211, 212, 213 is connected in series between one end of the secondary side of the power transformer 240 and ground, and one end of each secondary side has a plurality of plasma generating units G1, G2, G3. Are connected to each other and the other end is connected to ground.

The current balance divider 220 equally divides the constant voltage V_p by the plurality of transformers 211, 212, and 213, and divides the divided voltages Vo_1, Vo_2, and Vo_n into a plurality of plasma generation units G1 and G2. , G3). When the primary sides of the plurality of transformers 211, 212, and 213 are connected in series and the impedance of any one of the plurality of plasma generating units G1, G2, and G3 is changed to change the amount of current, the plurality of transformers 211 is generated. , 212, 213 interact as a whole to automatically balance the current. As described above, the plurality of transformers 211, 212, and 213 may include a protection circuit for preventing a transient voltage from occurring.

18 is a view showing a modification of the current balance divider of FIG. Referring to the drawings, the current balance divider 210c according to the modification further includes a multi-tap switching circuit 217, 218, 219 on the secondary side of the plurality of transformers 211, 212, 213. The multi-tap switching circuits 217, 218, and 219 are configured of a switch connected to a second side of the plurality of transformers 211, 212, and 213 and one of the power strips to a ground.

The divided voltages Vo_1, Vo_2, and Vo_n induced and output to the secondary side of the plurality of transformers 211, 212, and 213 are adjusted to different voltage levels according to the switching states of the multi-tap switching circuits 217, 218, and 219. . Accordingly, the power delivered to the plurality of plasma generating units G1, G2, G3 may be adjusted to be low or high as a whole, and may be adjusted to be low or high in part.

19A through 19C are circuit diagrams illustrating modifications of a power transformer.

First, referring to FIG. 19A, the secondary side of the power transformer 240a according to one modification is composed of two separate windings 222-1 and 222-2. One of the two windings 242 and 243 outputs a constant voltage V_p to one end and the other end is connected to ground, and the other winding 243 is connected to the other end and connected to the other end. Output the voltage V_n.

Referring to FIG. 19B, a power transformer 240b according to another modification includes a multi-tap switching circuit 245 on the secondary side. In the multi-tap switching circuit 245, the power transformer 240b is configured as a switch for connecting one of the multi-tap and the multi-tap configured on the secondary side to ground. In the power transformer 240b, the ratio of the constant voltage V_p and the negative voltage V_n varies according to the switching state of the multi-tap switching circuit 245.

Referring to FIG. 19C, a power transformer 240c according to another modified example includes first and second multi-tap switching circuits 246 and 247 configured on both sides of the secondary side with respect to the intermediate tap 241. The first multi-tap switching circuit 246 outputs a constant voltage Vp that varies according to the switching state, and the second multi-tap switching circuit 247 also outputs a negative voltage Vn that varies according to the switching state. Accordingly, the ratio of the constant voltage V_p and the negative voltage V_n and the respective voltage levels vary according to the switching of the first and second multi-tap switching circuits 245 and 246.

20 is a circuit diagram showing another modified example of the current balancing circuit. Referring to the drawings, another variation of the current balancing circuit 200d includes a power transformer 240d and a current balancing divider 210d. The primary side of the power transformer 240d has one end connected to a radio frequency input terminal RFin and the other end connected to ground. Secondary side 22 of power transformer 240d has an intermediate tab 241 electrically connected to ground. Therefore, one end of the secondary side 22 outputs the constant voltage V_p, and the other end outputs the negative voltage V_n. In addition, a multi-tap switching circuit 248 including a switch connected to any one of the multi-tap and the multi-tap configured between the intermediate tap 241 and the constant voltage output terminal is provided.

The plurality of transformers 211, 212, 213 of the current balance divider 210d are connected in series between a primary voltage output terminal of the power transformer 240 and a switch of the multi-tap switching circuit 248 on each primary side. One end of each secondary side of the plurality of transformers 211, 212, 213 is connected to one end of a corresponding plurality of plasma generating units G1, G2, G3, and the other end of each secondary side of the multi-tap switching circuit 248. Connected to the switch.

In the current balance divider 210d configured as described above, the voltage level applied to the primary sides of the plurality of transformers 211, 212, and 213 is basically higher than the ground voltage level and varies according to the switching state of the multi-tap switching circuit 248. Thus, the current balance divider 210d allows the current balance adjustment to be made within a minimum power range that can cover the current imbalance of the plurality of plasma generating units G1, G2, G3. The multi-tap switching circuit 248 may be replaced with a fixed tap.

21 is a block diagram showing a control circuit configuration for controlling a current balancing circuit. Referring to the drawings, the current balancing circuit 200 is controlled by the controller 350. The controller 350 may be configured as a computer system including a central processing unit, a memory device, and a control program. The controller 350 controls the current balancing circuit 200 according to the user control, the process condition data, and the plasma state value detected by the plasma state monitoring circuit 352. The plasma state monitoring circuit 352 detects the plasma state using one or more sensors 354 for sensing the plasma state.

For example, referring to FIG. 11, the controller 350 controls the switching states of the multi-tap switching circuits 214, 215, and 216 provided in the current balance divider 210a to control a plurality of plasma generating units G1, G2, and the like. The power supplied to G3) can be controlled variably. 12, the power supplied to the plurality of plasma generation units G1, G2, and G3 is variably controlled by controlling the switching states of the multi-tap switching circuits 217, 218, and 219 included in the current balance divider 210b. Can be controlled.

13 and 14, the controller 350 controls the multi-tap switching circuits 224, 225, and 227 and the current variable 227 of the current balance divider 220 to independently control each other to generate a plurality of plasmas. The power supplied to the units G1, G2, G3 can be controlled in whole or in part.

Referring to FIG. 18, the controller 350 may control the multi-tap switching circuits 217, 218, and 219 of the current balance divider 210c to variably control the power supply to the plurality of plasma generating units G1, G2, and G3. Can be. Referring to FIGS. 19B, 19C, and 20, the controller 350 controls a plurality of power strip switching circuits 245, 246, 247, and 248 provided in the power transformers 240b, 240c, and 240d. The power supplied to the plasma generating units G1, G2, and G3 can be controlled to be changed as a whole.

In addition, even when the power transformer 240 and the current balance divider 210 are each provided with a multi-tap switching circuit, the control unit 350 controls each of the multi-tap switching circuits to control the plurality of plasma generating units G1, G2, and G3. The power supplied to the controller can be controlled in whole or in part.

The above-described multi-tap switching circuits configured in the current balance circuit configured in the inductively coupled plasma reactor of the present invention may be configured as mechanical multi-tap switches, but are preferably semiconductor switch elements (eg, field effect transistors). Etc.).

Embodiments of the multi-loop core plasma generator of the present invention and the plasma reactor having the same described above are merely exemplary, and those skilled in the art to which the present invention pertains can make various modifications and equivalents therefrom. It will be appreciated that examples are possible. Therefore, it is to be understood that the present invention is not limited to the specific forms mentioned in the above description. Therefore, the true technical protection scope of the present invention should be defined by the technical spirit of the appended claims, and the present invention is intended to cover all modifications, equivalents, and substitutes within the spirit and scope of the present invention as defined by the appended claims. It should be understood to include.

According to the multi-loop core plasma generator of the present invention and the plasma reactor having the same as described above, the plasma reactor can efficiently generate a large-area plasma by the multi-loop core plasma generator having the multi-loop core of the lattice structure. . In particular, by using a multi-loop core of a lattice structure, not only can be easily expanded in a large area, but also the plasma generation efficiency can be improved. In addition, a more uniform high density plasma can be obtained by controlling the balance of the current supplied to the primary windings of the multiple loop core.

Claims (9)

Lattice multiple loop cores with multiple loops; A plurality of primary windings electrically connected to a power source for supplying radio frequencies and wound around each loop of the multiple loop core; And A multi-loop core plasma generator comprising a core case equipped with a multi-loop core and provided with a plurality of holes passing through each loop of the multi-loop core. The multi-loop core plasma generator of claim 1, wherein the core case comprises a metallic material and includes one or more electrically insulating regions to have electrical discontinuities. The method of claim 1, wherein the core case comprises: a case body mounted with a multi-loop core and provided with a hole passing through each loop of the multi-loop core; A case cover covering the core case body; A multi-loop core plasma generator comprising an insulating member configured between the case body and the case cover. 2. The multi-loop core plasma generator of claim 1 comprising a current balancing circuit for supplying a radio frequency supplied from a power source to a plurality of primary windings, the current balance circuit controlling the balance of the current supplied to each primary winding. The multi-loop core plasma generator of claim 1 wherein the core case comprises a cooling channel. The multi-loop core plasma reactor of claim 1, wherein the multi-loop magnetic core comprises a layer of nonmagnetic material. A plasma reactor having the multi-loop core plasma generator of claims 1 to 6, comprising: A vacuum chamber having a multi-loop core plasma generator installed thereon and having a substrate support on which a substrate to be processed is placed; And A plasma reactor comprising a gas supply unit installed on top of the multi-loop core plasma generator. 8. The method of claim 7, further comprising a bias power supply for supplying bias power to the substrate support, Wherein said bias power source has a bias structure of either a single bias or a double bias. 8. The plasma reactor of Claim 7, wherein said substrate support is free of bias power supply.

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