KR20080053735A - Chip network resistor capable of solder ball contact with pcb and semiconductor module having the same - Google Patents

Abstract

A chip network resistor using solder balls and a semiconductor module including the same are provided to prevent defective of the chip network resistor by adhering the chip network resistor and a printed circuit board at a bottom surface. A chip network resistor includes a body made of an insulating material and a resistor(110) disposed on the body. External electrodes are connected to the resistor, and are disposed on a lower surface of the body. Solder balls(114) are adhered on the external electrodes. The insulating material of the body comprises alumina and a polymer, and the body has convex portions(106) and concave portions(104). The upper portion of the resistor is covered by an insulating layer.

Description

Chip network resistor capable of solder ball contact with PCB and semiconductor module having the same}

1 is a plan view of a chip network resistor according to the prior art.

2 is a cross-sectional view illustrating a conventional chip network resistor mounted on a printed circuit board.

3 is a perspective view of a chip network resistor capable of solder ball bonding according to a first embodiment of the present invention.

4 is a bottom view of FIG. 3, and FIG. 5 is a front view of the A direction of FIG. 3.

6 is a perspective view of a chip network resistor capable of solder ball bonding according to a second embodiment of the present invention.

FIG. 7 is a bottom view of FIG. 6, and FIG. 8 is a front view of the direction B of FIG. 6.

9 is a perspective view of a chip network resistor capable of solder ball bonding according to a third embodiment of the present invention.

10 is a perspective view of a chip network resistor capable of solder ball bonding according to a fourth embodiment of the present invention.

11 is a plan view of a chip network resistor capable of solder ball bonding according to a fifth embodiment of the present invention.

12 is a bottom view of FIG. 11, FIG. 13 is a side view of FIG. 11, and FIG. 14 is a front view of the D direction of FIG. 11.

15 is a plan view of a semiconductor module including a chip network resistor capable of solder ball bonding according to a preferred embodiment of the present invention.

FIG. 16 is a graph illustrating an energy density value that a chip network resistor receives in a reliability test when the chip network resistor has the same structure as in FIG. 2.

FIG. 17 is a graph illustrating an energy density value that a chip network resistor receives in a reliability test when the chip network resistor has the same structure as in FIG. 14.

Explanation of symbols on the main parts of the drawings

100: chip network resistor, 102: uneven structure body,

104: convex portion, 106: concave portion,

108: wiring line, 110: resistor,

112: electrode pad, 114: solder ball.

516: through hole, 1000: semiconductor module,

103: module substrate, 201: semiconductor package,

301: alignment hole, 401: external connection terminal.

The present invention relates to a chip network resistor and a semiconductor module including the same. More particularly, the present invention relates to a chip network resistor and a semiconductor module including the same, which can be bonded to a printed circuit board through solder balls.

A chip network resistor is a resistor manufactured in the form of a semiconductor package by putting several resistors in one body in order to further increase the density of electronic products. Of course, the shape of the part is a resistance, but because the resistance is contained in one body is a structure that includes a lead (exposed) exposed to the outside. Such a chip network resistor reduces the number of assembly parts when mounted on a printed circuit board, and is particularly convenient for automatic assembly. However, the price is expensive, and there is a disadvantage that the temperature and time management when soldering.

On the other hand, while personal computers (PCs) and servers become smaller, semiconductor modules, such as memory modules, which enter the personal computers and servers are limited in their size reduction. As a result, resistors used in memory modules use passive devices having high integration, such as chip network resistors. The chip network resistor is used to reduce noise of signal waves reflected from a semiconductor package entering a memory module. However, when the chip network resistor is mounted on the printed circuit board for the memory module, various quality problems of the chip network resistor may occur, so improvement is required.

1 is a plan view of a chip network resistor according to the prior art, and FIG. 2 is a cross-sectional view showing a form in which the chip network resistor according to the prior art is mounted on a printed circuit board.

1 and 2, the chip network resistor 10 according to the related art is a concave-convex structure in which the structure of the body 12 includes a convex portion 14 and a concave portion 16. The resistor 20 is formed at the top. The resistor 20 is extended to the side and the bottom of the body 12 as shown in FIG. 2 through the wiring line 18 in the convex portion 14 and used as an external electrode.

Meanwhile, the chip network resistor 10 is mounted on the printed circuit board 30 as shown in FIG. 2, and the bonding method of the printed circuit board 30 and the chip network resistor 10 is the chip network resistor 10. It is electrically bonded to the printed circuit board 30 through the external electrode 18 on the side and bottom of the. At this time, the stand off height of the chip network resistor 10 is mounted as low as about 30 μm.

However, in the chip network resistor 10 according to the related art, as shown in FIG. 1, a defect 22 in which the body 10 is broken due to an external impact occurs, or a part of the conductive material plated on the external electrode 18 is peeled off. (24) It has a structure that is easy to cause visual defects. In addition, since the chip network resistor 10 according to the prior art is soldered through an external electrode 18 formed on the side of the chip network resistor 10, the coefficient of thermal expansion in the reliability test, such as a temperature cycle, is used. There is a problem in that cracks 28 are generated in the soldering part 26 as shown in FIG. 2 due to the side stress caused by the difference.

The technical problem to be solved by the present invention is to improve the structure of the external electrode to solve the above problems, and to change the printed circuit board and the bonding method to the lower surface rather than the side to suppress the occurrence of defects and improved solder joint reliability It is to provide a chip network resistor that can be bonded.

Another object of the present invention is to provide a semiconductor module including a chip network resistor capable of the solder ball junction.

In order to achieve the above technical problem, the chip network resistor capable of solder ball bonding according to the present invention includes a body of an insulating material, a resistor formed on an upper body of the insulating material, and a plurality of resistors connected to the resistor and extending below the body. It characterized in that it comprises a solder ball pad-shaped external electrode, and a solder ball attached to the external electrode.

According to a preferred embodiment of the present invention, the body may be a concave-convex structure including a concave portion and a convex portion, or may have a rectangular structure.

When the body has a concave-convex structure, a wiring line connected to the resistor through the side of the convex portion extending to the lower portion of the body or connected to the resistor through the side of the concave portion extending to the lower portion of the body It may include. In this case, the external electrode is connected to the wiring line and formed under the body.

When the body has a rectangular structure, it is preferable that a through hole corresponding to the number of external electrodes is formed in the body, and the through hole is preferably filled with a conductive material inside.

Preferably, the chip network resistor further includes an insulating layer covering the upper portion of the resistor, and the insulating layer is preferably made of glass.

According to another aspect of the present invention, a chip network resistor capable of solder ball bonding may include an insulating body, a resistor formed on an upper portion of the body, and a resistor and a wiring line. And an external electrode provided on the upper portion, an insulating layer covering the wiring line and the resistor except for the external electrode, and a solder ball attached to the external electrode.

According to a preferred embodiment of the present invention, the body may be a concave-convex structure including a concave portion and a convex portion, or may have a rectangular structure. At this time, the external electrode is preferably formed on the convex portion in the body of the concave-convex structure, or is formed on the edge formed with a resistor in the body of the square structure.

In accordance with another aspect of the present invention, a semiconductor module includes a module board on which a plurality of semiconductor packages are mounted, a plurality of semiconductor packages mounted on the module board, and solder balls on the module board. And a chip network resistor mounted and not exposed to the outside.

According to the present invention, the connection between the chip network resistor and the printed circuit board is bonded on the lower surface instead of the side to suppress the occurrence of defects of the chip network resistor due to external damage, and the height of the chip network resistor to be bonded is increased. Can increase.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the embodiments disclosed in the following detailed description are not meant to limit the present invention, but to those skilled in the art to which the present invention pertains, the disclosure of the present invention may be completed in a form that can be implemented. It is provided to inform the category.

3 is a perspective view of a chip network resistor capable of solder ball bonding according to a first embodiment of the present invention, FIG. 4 is a bottom view of FIG. 3, and FIG. 5 is a front view of the A direction of FIG. 3.

3 to 5, the chip network resistor 100 capable of solder ball bonding according to the first embodiment of the present invention includes a concave-convex body 102 having a convex portion 104 and a concave portion 106. ). The body 102 is made by sintering at a temperature of 850 ℃ or more using a mixture of alumina and polymer.

A resistor 110 made of ruthenium oxide (RuO) is formed on the body 102 of the uneven structure, and a wiring line 108 connected to the resistor 110 is lowered through the recess 106 of the body. It extends to the side. The wiring line 108 is connected to a pad, which is an external electrode 112, at the lower portion of the body 102, and solder balls 114 are attached to the pad, respectively. The external electrode 112 is preferably made of copper (Cu) or silver (Ag), and is shown as a circle in the drawing, but may be modified in other shapes such as a square.

On the other hand, an insulating layer (not shown) that is over-coated, such as glass, may be further formed on the resistor 110, and the insulating layer may be formed except for a pad used as the external electrode 112. The chip network resistor 100 may cover the entire body 102.

The feature of the chip network resistor 100 that can be solder ball bonded according to the first embodiment of the present invention described above is that the wiring line is peeled off due to external damage because the wiring line 108 is provided inside the recess 106. This can reduce the problem. In addition, since the external electrode 112 is formed on the lower surface of the body 102 instead of being formed on the side of the body 102 as in the prior art, the external electrode 112 may be broken by external damage.

 In addition, since the connection with the printed circuit board is made through the solder ball 115 formed in the lower part of the body 102, it is possible to mount the printed circuit board using only the bottom surface without using the side of the chip network resistor 100. . Therefore, it is possible to increase the solder joint reliability by suppressing the occurrence of cracks in reliability checks such as the temperature cycle. To this end, the side of the body 102 of the chip network resistor 100 used in the present invention has a vertical shape rather than a convex shape when compared with FIG. In addition, since the height of the chip network resistor 100 is mounted on the printed circuit board, the energy density concentrated on the chip network resistor 100 may be reduced in the reliability test. This may improve the reliability of the chip network resistor 100 in the semiconductor module. In the drawing, the dotted line in FIG. 5 indicates the point where the recess 106 is located.

6 is a perspective view of a chip network resistor capable of solder ball bonding according to a second exemplary embodiment of the present invention, FIG. 7 is a bottom view of FIG. 6, and FIG. 8 is a front view of direction B of FIG. 6.

6 to 8, in the chip network resistor 200 capable of solder ball bonding according to the second embodiment of the present invention, the resistor 210 is formed on the body 202 of the uneven structure as in the first embodiment. Formed structure. The resistor 210 is connected to a wiring line 208 extending along the convex portion 204 of the body to the lower surface of the body 202, and the wiring line 208 is shown in FIG. 7 on the lower surface of the body 202. Likewise connected to the solder ball pad, which is the external electrode 212. In addition, solder balls 214 are attached to the external electrodes 212, respectively.

The difference between the second embodiment compared with the first embodiment is that the portion where the wiring line 208 is formed is a convex portion 204 rather than the recess 206 of the body 202. Since most of the other matters are the same as those of the first embodiment, description is omitted to avoid duplication.

9 is a perspective view of a chip network resistor capable of solder ball bonding according to a third embodiment of the present invention.

Referring to FIG. 9, in the chip network resistors 100 and 200 capable of solder ball bonding according to the first and second embodiments described above, external electrodes are formed at the bottom of the body. However, in the chip network resistor 300 capable of solder ball bonding according to the third embodiment of the present invention, the external electrode 312 is formed on the upper surface of the body 302 instead of the lower surface of the body 302. That is, the solder ball pads directly connected through the wiring line 308 at the upper surface of the resistor 310 and the body 302 formed on the body 302 of the concave-convex structure including the convex portion 304 and the concave portion 306. It has an external electrode 312 in the shape. Accordingly, the chip network resistor 300 capable of solder ball bonding according to the third embodiment of the present invention is different from the chip network resistors 100 and 200 according to the first and second embodiments described above when mounted on a printed circuit board. The surface C is attached. Solder balls 314, which are terminals for external connection, are attached to the external electrodes 312.

10 is a perspective view of a chip network resistor capable of solder ball bonding according to a fourth embodiment of the present invention.

Referring to FIG. 10, the chip network resistor 300 capable of solder ball bonding according to the third embodiment described above has a concave-convex shape of a body made of a mixture of alumina and polymer, but the solder ball according to the fourth embodiment of the present invention. The chip network resistor 400 that can be bonded has a square shape. Accordingly, the wiring line 408, the external electrode 412, and the solder ball 414 are formed at the edges of the resistor 410, respectively. In addition, the chip network resistor 400 capable of solder ball bonding according to the fourth embodiment of the present invention is different from the chip network resistors 100 and 200 according to the first and second embodiments described above when mounted on a printed circuit board. The upper surface C is attached.

In the chip network resistor capable of solder ball bonding according to the present invention, the position of the external electrode may be formed on the upper or lower surface of the body, respectively, and the structure of the body may also be applied whether the shape is uneven or square.

11 is a plan view of a chip network resistor capable of solder ball bonding according to a fifth embodiment of the present invention, FIG. 12 is a bottom view of FIG. 11, FIG. 13 is a side view of FIG. 11, and FIG. 14 is D of FIG. 11. Front view of the direction.

11 to 14, the chip network resistor 500 capable of solder ball bonding according to the fifth embodiment of the present invention uses a rectangular body 502. In addition, a resistor 510 made of ruthenium oxide (RuO) is formed on the body 502 as illustrated in FIG. 11. Meanwhile, a through hole 516 corresponding to the number of external electrodes 512 in the form of solder ball pads is formed in the body 502, and a conductive material, for example, copper, is formed in the through hole 516. Paste containing or a paste containing silver is filled. Therefore, the resistor 510 is connected to the external electrode 512 under the body 502 by the conductive material filling the through hole 516. Solder ball 514 is connected to the surface of the external electrode 512 is used for bonding when connecting to the printed circuit board 101.

On the other hand, since the chip network resistor 500 capable of solder ball bonding according to the fifth embodiment of the present invention is bonded through the printed circuit board 101 and the solder ball 514, the bonding height H2 is the chip network according to the prior art. It becomes about 200 micrometers higher than the junction height (H1 of FIG. 2) of a resistor. As a result, the reliability of the chip network resistor 500 may be further improved in reliability checks such as a temperature cycle. This will be described in detail later with reference to the simulation results of FIGS. 16 and 17.

15 is a plan view of a semiconductor module including a chip network resistor capable of solder ball bonding according to a preferred embodiment of the present invention.

Referring to FIG. 15, a semiconductor module 1000 according to a preferred embodiment of the present invention may include a module board 103 on which a plurality of semiconductor packages are mounted, and a plurality of semiconductor packages 201 mounted on the module board 103. And a chip network resistor 100 mounted on the module board 103 through solder balls and not exposing external electrodes to the outside.

Herein, the module board 103 may be modified in any number of forms, and the semiconductor package 201 may be modified in various shapes. The chip network resistor 100 may be replaced with the chip network resistors 200, 300, 400, and 500 capable of solder ball bonding according to the second to fifth embodiments described above. In addition, the location and number of the chip network resistors 100 may be modified in various forms at the level of those skilled in the art. In the drawings, reference numeral 301 denotes an alignment hole in the module board 103, and 401 denotes an external connection terminal of the module board 103, respectively.

The present invention is not limited to the above embodiments, and it is apparent that many modifications can be made by those skilled in the art within the technical spirit to which the present invention belongs.

Therefore, according to the present invention described above, the bonding of the chip network resistor and the printed circuit board is bonded on the lower surface instead of the side, so that failure of the chip network resistor due to external damage can be suppressed first. In addition, the junction height of the chip network resistors can be increased to improve quality in reliability checks.

On the other hand, the characteristics of the chip network resistor (10 in FIG. 2) of the prior art and the chip network resistor (500 in FIG. 14) capable of solder ball bonding according to the present invention were verified through reliability test such as a temper-etcher cycle.

The temper-echer cycle reliability test method is a reliability test that repeats a test in which the chip network resistor is left at -25 ° C for 10 minutes and then left for 10 minutes at a high temperature of 125 ° C. The state shifted once is defined as one cycle.

FIG. 16 is a graph illustrating an energy density value that a chip network resistor receives in a reliability test when the chip network resistor has the same structure as in FIG. 2, and FIG. 17 illustrates a chip in the reliability test when the chip network resistor has the same structure as in FIG. 14. This graph shows the energy density value received by the network resistor.

Referring to FIGS. 16 and 17, in each graph, the X axis represents a cycle, and the Y axis represents the stress value absorbed against the height at which the chip network resistor is mounted, for example, the energy density value, and the unit is [MPa]. ]to be. The result of the graph is a simulation result of analyzing the stress applied to each chip network resistor as an energy density value according to the mounting height of each chip network resistor.

When the chip network resistor (10 in FIG. 2) is mounted on a printed circuit board with a height of 30 占 퐉 (H1 in FIG. 2) as in the prior art, the maximum value of the energy density applied to the chip network resistor is 1.8 MPa, When the height (H2 in FIG. 14) on which the chip network resistor (500 in FIG. 14) is mounted as in the present invention is increased to a range of 200 mu m due to the use of solder balls, the maximum value of the energy density applied to the chip network resistor is Lowered to 0.04 MPa. Therefore, in the reliability test, the maximum value of the energy density applied to the chip network resistor is about 45 times lower, indicating that the reliability is remarkably improved.

Claims (20)

Body of insulating material; A resistor formed on the body of the insulating material; An external electrode connected to the resistor and extending to a lower portion of the solder ball pad shape; And And a solder ball attached to the external electrode. The method of claim 1, The insulation material of the body is a chip network resistor capable of solder ball bonding, characterized in that the mixture of alumina and polymer. The method of claim 1, The body of the chip network resistor capable of solder ball bonding, characterized in that the concave-convex structure including a concave portion and a convex portion. The method of claim 1, The body of the chip network resistor capable of solder ball bonding, characterized in that the rectangular structure. The method of claim 1, The external electrode is a copper (Cu) or silver (Ag) chip network resistor capable of solder ball junction, characterized in that the material. The method of claim 1, The chip network resistor capable of solder ball bonding, And an insulating layer covering the upper portion of the resistor. The method of claim 6, The insulating layer covering the upper portion of the resistor, A chip network resistor capable of solder ball bonding, characterized in that the material is glass. The method of claim 3, The body of the uneven structure, And a wiring line connected to the resistor through the side surface of the convex portion and extending to the lower portion of the body. The method of claim 8, The external electrode is connected to the wiring line in the convex portion is a chip network resistor capable of solder ball bonding, characterized in that formed in the lower body. The method of claim 3, The body of the request structure, And a wiring line connected to the resistor through the side of the recess and extending below the body. The method of claim 10, The external electrode is connected to the wiring line in the concave portion is a chip network resistor capable of solder ball bonding, characterized in that formed under the body. The method of claim 4, wherein The body of the rectangular structure, And a through hole corresponding to the number of the external electrodes in the body. The method of claim 12, The through hole is a chip network resistor capable of solder ball junction, characterized in that the inside is filled with a conductive material. The method of claim 13, The conductive material filling the inside of the through hole is A chip network resistor capable of solder ball bonding, characterized in that it is a paste containing copper or a paste containing silver. Body of insulating material; A resistor formed on an upper portion of the body; An external electrode connected to the resistor through a wiring line and provided at an upper portion of the body; An insulating layer covering the wiring line and the resistor except the external electrode; And And a solder ball attached to the external electrode. The method of claim 15, The body is a chip network resistor capable of solder ball bonding, characterized in that the concave-convex structure. The method of claim 15, The body is a chip network resistor capable of solder ball junction, characterized in that the rectangular structure. The method of claim 16, And the external electrode is formed on the convex portion of the body of the uneven structure. The method of claim 17, And the external electrode is formed at an edge where a resistor is formed in the body of the rectangular structure. A module board on which a plurality of semiconductor packages are mounted; A plurality of semiconductor packages mounted on the module board; And And a chip network resistor mounted on the module board through solder balls and not exposing external electrodes to the outside.

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