KR20080042993A - A sur-small size type chip led lamp socket assembly - Google Patents

A sur-small size type chip led lamp socket assembly Download PDF

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KR20080042993A
KR20080042993A KR1020060111426A KR20060111426A KR20080042993A KR 20080042993 A KR20080042993 A KR 20080042993A KR 1020060111426 A KR1020060111426 A KR 1020060111426A KR 20060111426 A KR20060111426 A KR 20060111426A KR 20080042993 A KR20080042993 A KR 20080042993A
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socket
pcb
terminal
mounting
elastic
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KR1020060111426A
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Korean (ko)
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KR100830417B1 (en
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장영환
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장영환
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00Illumination
    • Y10S362/80Light emitting diode

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

A micromini chip LED lamp socket assembly is provided to emit light, emitted from an LED chip of a PCB, upwardly by mounting a PCB horizontally in an upper end of a socket, thereby expanding a usage range, efficiently utilizing the light generated in the LED chip, variably maintaining and using a height of the socket assembly, and easily installing a socket. In a socket, a socket flange(4) is integrally formed in a lower end of an outer circumference of a socket body(3). In the socket, a couple of elastic terminal mount grooves are formed to face each other. In each elastic terminal mount groove, elastic terminals(10) are respectively mounted. In an upper part of the socket, a PCB(Printed Circuit Board)(20) mounted with an LED(Light Emitting Diode) chip(21) and a resistance(22) is mounted. In an upper surface of the socket, the PCB is horizontally mounted by a mount unit. The PCB mounted on the upper surface of the socket is mounted with proper power polarity by using a setting unit. In one side of each elastic terminal mounting groove, mount protrusions(5) are respectively and integrally formed. In the outer circumference of the PCB, a couple of terminal support pieces are integrally formed to be opposite to each other.

Description

초소형 칩 발광다이오드램프 소켓조립체 {A Sur-Small Size Type Chip LED Lamp Socket Assembly}Micro Chip Emitting Diode Lamp Socket Assembly {A Sur-Small Size Type Chip LED Lamp Socket Assembly}

도 1은 본 발명에 따른 초소형 칩 발광다이오드램프 소켓 조립체의 분해사시도.1 is an exploded perspective view of a microchip LED lamp socket assembly according to the present invention.

도 2a 및 도 2b는 본 발명에 따른 초소형 칩 발광다이오드램프 소켓 조립체의 결합상태를 각기 다른 위치에서 본 사시도.Figure 2a and Figure 2b is a perspective view of the bonded state of the ultra small chip light emitting diode lamp socket assembly according to the present invention from different positions.

도 3은 본 발명에 따른 초소형 칩 발광다이오드램프 소켓 조립체의 조립상태 단면도.Figure 3 is an assembled cross-sectional view of the ultra small chip LED lamp socket assembly according to the present invention.

도 4a 내지 도 4e는 본 발명에 따른 초소형 칩 발광다이오드램프 소켓 조립체에서 소켓을 보인 평면도, 정면도, 측면도, 단면도.4A to 4E are plan views, front views, side views, and sectional views showing the sockets in the ultra-small chip LED lamp socket assembly according to the present invention;

도 5a 내지 도 5d는 본 발명에 따른 초소형 칩 발광다이오드램프 소켓 조립체의 탄성단자를 보인 사시도, 정면도, 측면도, 평면도.5a to 5d is a perspective view, a front view, a side view, a plan view showing an elastic terminal of the ultra small chip light emitting diode lamp socket assembly according to the present invention.

* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

1: 칩 발광다이오드램프 소켓조립체 2: 소켓1: chip LED lamp socket assembly 2: socket

3: 소켓몸체 4: 소켓플랜지 5: 장착돌부3: socket body 4: socket flange 5: mounting protrusion

6: 탄성단자장착홈 7: 단자결속홈 8: PCB셋팅돌편6: Elastic terminal mounting groove 7: Terminal binding groove 8: PCB setting stone piece

10: 탄성단자 11: 단자본체 12: 결속편10: elastic terminal 11: terminal body 12: binding piece

13: 하측단자 14: 상측단자 15: 단자핀13: Lower terminal 14: Upper terminal 15: Terminal pin

20: PCB 21: LED칩 22: 저항20: PCB 21: LED chip 22: resistance

23: 단자지지편 24: 단자설치공23: terminal support 24: terminal mounting hole

본 발명은 각종 전기전자 제품, 공작기계, 차량 등의 계기판 내부에 장착되어 계기판의 식별력을 높여주도록 하는 초소형 칩 발광다이오드램프 소켓조립체에 관한 것이다.The present invention relates to an ultra-small chip light emitting diode lamp socket assembly which is mounted inside the instrument panel of various electrical and electronic products, machine tools, vehicles, etc. to enhance the identification of the instrument panel.

더욱 상세하게는, 몸체의 하단에 플랜지가 일체로 형성된 소켓의 내부에 한 쌍의 단자를 내장하여 장착하고, 소켓의 상부에 LED칩과 저항이 식설된 PCB를 장착한 것에 있어서, 상기 소켓의 상단에 PCB를 수평으로 유지시켜 장착한 것으로서, 수평으로 설치되는 PCB의 LED칩에서 발산되는 빛이 상측으로 발산되도록 하여 발산능력과 발산범위를 향상시킬 수 있도록 된 초소형 칩 발광다이오드램프 소켓조립체를 제공하려는 것이다.In more detail, a pair of terminals are built in a socket at the lower end of the body and integrally mounted inside the socket, and an LED chip and a PCB on which a resistor is implanted are mounted on the upper part of the socket. It is designed to provide a small chip light emitting diode lamp socket assembly that is designed to keep the PCB horizontally and to allow the light emitted from the LED chip of the PCB installed horizontally to be diverted upward to improve the divergence capacity and range. will be.

칩 발광다이오드램프 소켓 조립체에 장착되어 특정 방향으로 빛을 조사하는 발광다이오드(LED)는 특성상 단자에 입력되는 전압의 영향에 민감하게 반응하게 되므로 발광다이오드(LED)가 식설된 PCB를 바르게 장전(삽입)시켜 주어야 한다.The light emitting diode (LED) mounted on the chip LED lamp socket assembly irradiates light in a specific direction is sensitive to the influence of the voltage input to the terminal. Therefore, the LED on which the LED is installed is properly loaded (inserted). You must.

본 발명은 이러한 LED의 특성을 고려하여 오 장전(삽입)으로 인하여 야기될 수 있는 원인을 원천적으로 배제하면서 조립할 수 있고, 구성요소를 간단하게 구성하여 조립에 따른 소요시간을 단축하며, 발광다이오드(LED)가 식설된 PCB를 수평으로 조립하여 상측(전방)으로 조사시킬 수 있도록 칩 발광다이오드램프 소켓 조립체를 제공하려는 것이다.The present invention can be assembled while excluding the cause that can be caused by a malfunction (insertion) in consideration of the characteristics of the LED, and by simply configuring the components to reduce the time required for assembly, the light emitting diode ( The purpose of the present invention is to provide a chip light emitting diode lamp socket assembly to assemble a PCB mounted with LEDs horizontally and irradiate the upper side (front side).

일반적으로 전기전자 제품, 공작기계, 차량, 산업기기 등에 설치되는 각종계기판은 계기판의 식별력을 향상시켜(높여)주도록 하기 위하여 계기판의 내부에 조명수단을 장착하여, 계기판의 조작에 따른 오 조작 등 예방할 수 있도록 하고 있다.In general, various instrument panels installed in electrical and electronic products, machine tools, vehicles, industrial equipment, etc. are equipped with lighting means inside the instrument panel in order to improve the identification ability of the instrument panel, thereby preventing misoperation due to the operation of the instrument panel. To make it possible.

상기와 같이 계기판의 내부(내측)에 설치되는 조명수단(장치)은 계기판의 내부에 장착되어야 하는 특성으로 인해 조명수단의 크기를 소형화시키면서 빛의 밝기를 향상시켜 주어야 하는 까다로운 조건이 요구된다.As described above, the lighting means (apparatus) installed in the inside (inside) of the instrument panel requires a demanding condition to improve the brightness of the light while miniaturizing the size of the lighting means due to the characteristics that must be mounted inside the instrument panel.

상기와 같은 까다로운 조건을 충족시킨 것으로서, 본인은 특허출원 제10-2004-56436호"와 특허등록 제10-580445호(특허출원 제10-2004-94398호)의 "초소형 칩 발광다이오드램프 소켓 조립체"를 제안하였다.In order to satisfy the above demanding conditions, I have a "mini chip light emitting diode lamp socket assembly" of Patent Application No. 10-2004-56436 and Patent Registration No. 10-580445 (Patent Application No. 10-2004-94398). Suggested.

전자는, 소켓몸체의 외주 하단에 플랜지가 일체로 형성된 소켓에는 대향 되게 형성된 한 쌍의 각 탄성단자장착홈에는 탄성단자를 각각 장착하고, 소켓몸체의 외면에는 한 쌍의 장착돌기를 각 탄성단자장착홈과 인접하게 형성하며, 각 장착돌기의 내측에는 한 쌍의 내측터미널을 이격시켜 장착하고 각 내측터미널의 하측 내부에 터미널고정구를 삽입 장착하며, 상기 터미널고정구의 사이에서 내측터미널의 상측에는 LED칩이 식설된 PCB를 수직(직립)으로 삽입하여 장착한 것이다.The former is provided with a pair of elastic terminals in each of the pair of elastic terminal mounting grooves formed to face the socket formed integrally with the flange on the outer circumferential bottom of the socket body, and a pair of mounting protrusions are mounted on the outer surface of the socket body. It is formed adjacent to the groove, and a pair of inner terminals are spaced apart inside each mounting projection, and the terminal fasteners are inserted into the lower side of each inner terminal, and an LED chip is placed on the upper side of the inner terminals between the terminal fasteners. This implanted PCB is inserted and mounted vertically (upright).

후자는, 소켓몸체의 외주 하단에 플랜지가 형성된 소켓에는 대향 되게 형성된 한 쌍의 각 탄성단자장착홈에는 탄성단자를 각각 장착하고, 소켓몸체의 외면에는 한 쌍의 장착돌기를 각 탄성단자장착홈과 인접하게 형성하며, 각 장착돌기의 내측에서 탄성단자의 사이에는 LED칩이 식설된 PCB를 수직(직립)으로 삽입하여 장착한 것이다.The latter is equipped with a pair of elastic terminals in each of the pair of elastic terminal mounting grooves formed opposite to the socket with a flange formed on the outer peripheral bottom of the socket body, and a pair of mounting projections on the outer surface of the socket body and each of the elastic terminal mounting grooves. It is formed adjacent to each other, and inserted into the vertical (upright) by inserting the PCB in which the LED chip is implanted between the elastic terminals in the inside of each mounting projection.

이와 같이 형성된 종래의 "초소형 칩 발광다이오드램프 소켓 조립체"들은, 소켓의 상측에서 내부에는 PCB가 수직(직립)으로 삽입되어 장착되므로 소켓과 PCB는 수평 수직의 교차형태를 유지하게 되고, 따라서 PCB에 식설된 LED칩에서 발생하는 빛이 수평상태로 조사되므로 사용범위가 한정되는 문제가 있고, LED칩에서 발생하는 빛을 효율적으로 활용할 수 없는 문제가 있다.The conventional " miniature chip light emitting diode lamp socket assemblies " formed as described above have the socket and the PCB maintaining a horizontal and vertical intersection because the PCB is inserted and mounted vertically (upright) inside the socket. Since the light generated from the LED chip is irradiated in a horizontal state, there is a problem in that the use range is limited, and there is a problem in that the light generated from the LED chip cannot be effectively utilized.

또한, LED칩에서 발생하는 빛을 계기판으로 조사시키기 위해서는 소켓을 계기판과는 교차 되게 설치하여야하므로 소켓을 용이하게 설치할 수 없는 문제가 있으며, 소켓의 상측에서 내부로 삽입 장착되는 PCB가 소켓의 상면으로 돌출되어 소켓 조립체의 키(높이)가 높아지므로 설치공간을 크게 확보해주어야 하는 문제가 있다.In addition, in order to irradiate the light generated from the LED chip with the instrument panel, the socket must be installed to intersect with the instrument panel, so there is a problem that the socket cannot be easily installed, and the PCB inserted into the socket from the upper side to the upper surface of the socket is Since the height (height) of the socket assembly is protruded to increase, there is a problem that must secure a large installation space.

본 발명은 상기와 같은 문제를 해소할 수 있도록 더욱 개선한 칩 발광다이오드램프 소켓 조립체를 제공하려는 것이다.The present invention is to provide a further improved chip LED lamp socket assembly to solve the above problems.

본 발명은, 몸체의 하단에 플랜지가 일체로 형성된 소켓의 내부에 한 쌍의 단자를 내장하여 장착하고, 소켓의 상부에 LED칩과 저항이 식설된 PCB를 장착한 것에 있어서, 상기 소켓의 상단에 PCB를 수평으로 유지시켜 장착한 것을 특징으로 하는 칩 발광다이오드램프 소켓 조립체를 제공하려는데 그 목적이 있다.The present invention is to mount a pair of terminals in the interior of the socket integrally formed with a flange at the lower end of the body, and mounted on the upper portion of the socket LED chip and a PCB in which resistance is implanted, the upper end of the socket An object of the present invention is to provide a chip light emitting diode lamp socket assembly comprising a PCB mounted horizontally.

본 발명의 다른 목적은, 소켓의 상단에 PCB를 수평으로 유지시켜 장착하여 줌으로서 수평으로 설치되는 PCB의 LED칩에서 발산되는 빛이 상측으로 발산되도록 하여 사용범위를 확대시키고, LED칩에서 발생하는 빛을 효율적으로 활용할 수 있도록 된 초소형 칩 발광다이오드램프 소켓조립체를 제공하려는데 있다.Another object of the present invention, by holding the PCB horizontally mounted on the top of the socket to expand the range of use by causing the light emitted from the LED chip of the PCB installed horizontally to be emitted upwards, and occurs in the LED chip The aim is to provide a compact chip light emitting diode lamp socket assembly capable of efficiently utilizing light.

본 발명의 또 다른 목적은, 소켓의 상단에 장착되는 PCB가 소켓과는 수평 상태를 유지하므로 소켓 조립체의 키(높이)를 낮게 유지시킬 수 있고, 소켓 조립체가 계기판의 배면에서 계기판과 나란하게 설치되므로 소켓을 용이하게 설치할 수 있도록 된 초소형 칩 발광다이오드램프 소켓조립체를 제공하려는데 있다.Still another object of the present invention is to keep the height of the socket assembly low because the PCB mounted on the top of the socket is horizontal with the socket, and the socket assembly is installed side by side with the instrument panel at the back of the instrument panel. Therefore, the present invention is to provide a small chip light emitting diode lamp socket assembly that can easily install the socket.

본 발명의 상기 및 기타 목적은,The above and other objects of the present invention,

소켓몸체(3)의 외주 하단에 소켓플랜지(4)가 일체로 형성된 소켓(2)에는 한 쌍의 탄성단자장착홈(6)(6-1)을 대향되게 각각 형성하고, 각 탄성단자장착홈(6)(6-1)에는 탄성단자(10)를 각각 내장하여 장착하고, 소켓(2)의 상부에는 LED칩(21)과 저항(22)이 식설된 PCB(20)를 장착한 것에 있어서, In the socket 2, in which the socket flange 4 is integrally formed at the lower periphery of the socket body 3, a pair of elastic terminal mounting grooves 6 and 6-1 are formed to face each other, and each elastic terminal mounting groove is provided. (6) (6-1), in which elastic terminals 10 are mounted and mounted respectively, and on the upper part of the socket 2, a PCB 20 in which the LED chip 21 and the resistor 22 are mounted is mounted. ,

상기 소켓(2)의 상단에는 통상의 PCB(20)를 수평으로 유지시켜 장착수단에 의해 장착한 것과;The upper part of the socket 2 is mounted by means of mounting means by keeping the normal PCB 20 horizontal;

소켓(2)의 상면에 장착되는 PCB(20)를 셋팅수단에 의해 전원의 극성을 바르 게 하여 장착시킬 수 있도록 한 것;이 포함되는 것을 특징으로 하는 칩 발광다이오드램프 소켓조립체(1)에 의해 달성된다.The PCB 20 mounted on the upper surface of the socket 2 to be mounted by setting the polarity of the power by the setting means; by the chip light emitting diode socket assembly (1) comprising a Is achieved.

본 발명의 상기 및 기타 목적과 특징은 첨부된 도면에 의거한 다음의 상세한 설명에 의해 더욱 명확하게 이해할 수 있을 것이다.The above and other objects and features of the present invention will be more clearly understood by the following detailed description based on the accompanying drawings.

첨부된 도면 도 1 내지 도 5d는 본 발명에 따른 칩 발광다이오드램프 소켓조립체(1)의 구체적인 실현 예를 보인 예시도로서, 1 to 5D are exemplary views showing specific implementation examples of the chip LED lamp socket assembly 1 according to the present invention.

도 1과 도 2a 및 도 2b는 본 발명에 따른 칩 발광다이오드램프 소켓조립체(1)의 분해사시도와 각기 다른 위치에서 본 사시도이고, 도 3은 본 발명의 조립상태 단면도이며, 도 4a 내지 도 4e는 본 발명에서 소켓(2)을 보인 예시도이며, 도 5a 내지 도 5d는 본 발명에서 탄성단자(10)를 보인 예시도이다.1 and 2a and 2b is an exploded perspective view and a perspective view from different positions of the chip light emitting diode socket assembly 1 according to the present invention, Figure 3 is an assembled cross-sectional view of the present invention, Figures 4a to 4e 5 is an exemplary view showing a socket 2 in the present invention, Figures 5a to 5d is an exemplary view showing an elastic terminal 10 in the present invention.

본 발명에 따른 칩 발광다이오드램프 소켓조립체(1)는 소켓(2)과 그 소켓(2)에 장착되는 한 쌍의 탄성단자(10)와 소켓(2)의 상면에 장착되는 PCB(20)로 크게 분할 형성하였다.Chip light emitting diode socket assembly (1) according to the present invention is a socket (2) and a pair of elastic terminals 10 mounted on the socket (2) and a PCB (20) mounted on the upper surface of the socket (2) Formed into large divisions.

도 4a 내지 도 4e에 구체적으로 도시된 소켓(2)은, 통상의 합성수지와 같은 비 전도물질을 이용하여 형성하되 소켓몸체(3)를 상면으로 개방되고 내부가 공간으로 되는 원기둥형으로 형성하였고, 소켓몸체(3)의 외주 하단에는 소켓플랜지(4)를 일체로 형성하였으며, 소켓플랜지(4)에는 복수의 장착공(4-1)을 형성하여 피 장착물에 용이하게 장착시킬 수 있도록 하였다.4a to 4e specifically, the socket 2 is formed by using a non-conductive material such as a conventional synthetic resin, but the socket body 3 is formed in a cylindrical shape that is open to the upper surface and the inside is a space, A socket flange 4 was integrally formed at the outer circumferential bottom of the socket body 3, and a plurality of mounting holes 4-1 were formed in the socket flange 4 so that the socket flange 4 could be easily mounted on the object to be mounted.

소켓몸체(3)와 소켓플랜지(4)에는 "ㄴ"형으로 된 한 쌍의 탄성단자장착홈(6)(6-1)을 반대 방향에 각각 형성하여 차후에 구체적으로 설명되는 탄성단자(10)를 각각 장착시킬 수 있도록 하였고, 소켓플랜지(4)에 형성되는 각 탄성단자장착홈(6-1)의 일면에는 단자결속홈(7)을 그 탄성단자장착홈(6-1)과 연결되도록 형성하였다.In the socket body 3 and the socket flange 4, a pair of elastic terminal mounting grooves 6 and 6-1, each having a "b" shape, are formed in opposite directions, so that the elastic terminal 10 will be described in detail later. And each terminal of the elastic terminal mounting groove (6-1) formed in the socket flange (4) is formed so as to connect the terminal binding groove (7) and its elastic terminal mounting groove (6-1) It was.

특히, 소켓몸체(3)의 외면과 소켓플랜지(4)의 상면에는 각 탄성단자장착홈(6)(6-1)의 일 측편으로 장착돌부(5)를 일체로 형성하되, 장착돌부(5)의 상면이 소켓몸체(3)의 상면과 일치되도록(평행하도록) 형성하였고, 상기 장착돌부(5)는 지지편(5-1)을 폭이 넓고 사다리꼴 형으로 형성하였고 그 지지편(5-1)의 상측에 폭이 좁은 PCB장착편(5-2)을 일체로 형성하여 차후에 구체적으로 설명되는 PCB(20)의 단자지지편(23)을 안치하여 장착수단에 의해 고정시킬 수 있도록 하였다.In particular, the outer surface of the socket body (3) and the upper surface of the socket flange (4) is formed integrally with the mounting protrusions (5) on one side of each of the elastic terminal mounting groove (6) (6-1), the mounting protrusions (5) ) Is formed so as to coincide (parallel) with the upper surface of the socket body (3), the mounting protrusion (5) formed a support piece 5-1 in a wide and trapezoidal shape and the support piece (5- The narrow PCB mounting piece 5-2 was integrally formed on the upper side of 1) so that the terminal support piece 23 of the PCB 20, which will be described in detail later, was settled and fixed by the mounting means.

또한, 소켓몸체(3)의 상면에는 셋팅수단으로 PCB셋팅돌편(8)을 형성하되 탄성단자장착홈(6)의 중간에 위치하도록 형성하여 PCB(20)를 안치 장착할 때에 PCB(20)의 일면에 형성된 셋팅공(25)이 삽입되도록 하여 PCB(20)를 바르게 장착시킬 수 있도록 하였다.In addition, the upper surface of the socket body (3) to form a PCB setting stone piece (8) as a setting means is formed so as to be located in the middle of the elastic terminal mounting groove (6) of the PCB 20 when mounting the PCB 20 The setting hole 25 formed on one surface was inserted to allow the PCB 20 to be correctly mounted.

소켓몸체(3)의 내부에서 각 장착돌부(5)의 내측에는 장착홈(3-1)을 형성하였고, 장착홈(3-1)의 일단(탄성단자장착홈(6)의 반대면)에는 결속지지편(3-2)을 탄성단자장착홈(6)의 방향으로 형성하여 이들 사이에 장착공간(3-3)이 형성되도록 하였으며, 장착홈(3-1)과 탄성단자장착홈(6)과의 사이에서 소켓몸체(3)의 내면에는 지지돌기(3-4)를 형성하여, 탄성단자장착홈(6)(6-1)에 각각 장착되는 각 탄성단 자(10)를 지지하도록 하였다.Inside the socket body 3, a mounting groove 3-1 is formed inside each mounting protrusion 5, and at one end of the mounting groove 3-1 (opposite side of the elastic terminal mounting groove 6). The binding support piece 3-2 is formed in the direction of the elastic terminal mounting groove 6 so that a mounting space 3-3 is formed therebetween, and the mounting groove 3-1 and the elastic terminal mounting groove 6 are formed therebetween. A support protrusion (3-4) is formed on the inner surface of the socket body (3) to support each elastic terminal (10) respectively mounted in the elastic terminal mounting groove (6) (6-1). It was.

상기 소켓(2)의 각 탄성단자장착홈(6)(6-1)에 각각 장착되는 각 탄성단자(10)는, 구리와 같은 전도체를 이용하여 도 5a 내지 도 5d에 예시된 바와 같이 형성하였다.Each of the elastic terminals 10 mounted in each of the elastic terminal mounting grooves 6 and 6-1 of the socket 2 was formed as illustrated in FIGS. 5A to 5D using a conductor such as copper. .

길이가 길고 폭이 좁은 단자본체(11)와 결속편(12)을 일체로 형성하였고, 단자본체(11)의 단부 상면에는 상측단자(14)를 일체로 형성하되 상측단자(14)의 상면 단부에 단지핀(15)을 상측으로 돌출되게 일체로 형성하였으며, 결속편(12)의 하단에는 하측단자(13)를 상측단자(14)와 반대 방향으로 형성하였다.The long and narrow terminal body 11 and the binding piece 12 are integrally formed, and the upper terminal 14 is integrally formed on the upper surface of the end of the terminal body 11, but the upper end of the upper terminal 14 is formed. The pin 15 was formed integrally to protrude upward, and the lower terminal 13 was formed at the lower end of the binding piece 12 in the opposite direction to the upper terminal 14.

소켓(2)의 상면에 장착되는 PCB(20)는, 도 1 내지도 2b에 예시된 바와 같이 원판형으로 형성하여 소켓몸체(3)의 상면에 안치할 수 있도록 하였고, 원판형으로 형성된 PCB(20)에는 통상의 LED칩(21)과 저항(22)을 식설하였으며, 원판형으로 형성된 PCB(20)의 외주에는 한 쌍의 단자지지편(23)을 반대편에 각각 형성하여 장착돌부(5)의 상면에 안치하여 장착수단에 의해 장착시킬 수 있도록 하였다.The PCB 20 mounted on the upper surface of the socket 2 is formed in a disk shape as illustrated in FIGS. 1 to 2 b so that it can be placed on the upper surface of the socket body 3, and the PCB formed in a disk shape ( 20, a conventional LED chip 21 and a resistor 22 are implanted, and a pair of terminal support pieces 23 are formed on opposite sides on the outer periphery of the PCB 20, which is formed in a disc shape, and the mounting protrusions 5 are formed. It is placed on the upper surface of the to be mounted by the mounting means.

장착돌부(5)의 상면에 안치되는 PCB(20)의 단자지지편(23)을 장착시키는 장착수단으로서는, PCB(20)의 각 단자지지편(23)에 단자설치공(24)을 뚫어 주었고, 소켓(2)의 탄성단자장착홈(6)(6-1)에 장착되는 각 탄성단자(14)의 단자편(15)이 단자설치공(24)을 통해 돌출되도록 하였으며, 단자설치공(24)을 통해 상측으로 돌출되는 단자편(15)의 상단을 좌우로 분할하여 양측으로 절곡하여 고정시키거나, 단자설치공(24)을 통해 상측으로 돌출되는 단자편(15)의 상단을 단자지지편(23)의 상측에서 납땜하여 고정시킬 수 있도록 하였다.As a mounting means for mounting the terminal support pieces 23 of the PCB 20 placed on the upper surface of the mounting protrusion 5, the terminal mounting holes 24 were drilled in the terminal support pieces 23 of the PCB 20. The terminal pieces 15 of each of the elastic terminals 14 mounted in the elastic terminal mounting grooves 6 and 6-1 of the socket 2 are protruded through the terminal mounting holes 24, and the terminal mounting holes ( Split the upper end of the terminal piece 15 protruding upward through the 24 to the left and right to be bent and fixed to both sides, or to support the upper end of the terminal piece 15 protruding upward through the terminal installation hole 24 The upper side of the piece 23 was soldered and fixed.

상기와 같이 소켓(2)과 한 쌍의 탄성단자(10) 및 PCB(20)가 각각 형성된 본 발명에 따른 칩 발광다이오드램프 소켓조립체(1)는 다음과 같이 조립한다.As described above, the chip light emitting diode lamp socket assembly 1 according to the present invention in which the socket 2, the pair of elastic terminals 10 and the PCB 20 are formed, is assembled as follows.

발명에 따른 칩 발광다이오드램프 소켓조립체(1)를 조립하기 위해서는 소켓(2)의 각 탄성단자장착홈(6)(6-1)에 탄성단자(10)를 조립 장착하여야 한다.In order to assemble the chip light emitting diode lamp socket assembly 1 according to the invention it is necessary to assemble and mount the elastic terminal 10 in each of the elastic terminal mounting groove (6) (6-1) of the socket (2).

단자본체(11)가 소켓몸체(3)의 내측 즉, 장착공간(3-3)에 위치하고 하측단자(13)가 소켓몸체(3)의 외측 즉, 단자결속홈(7)의 상측에 위치하도록 한 상태에서 탄성단자장착홈(6)에 결속편(12)을 삽입(장착)시키면, 단자본체(11)는 결속지지편(3-2)에 의해 지지되고, 상측단자(14)는 장착홈(3-1)에 삽입되며, 하측단자(13)는 탄성단자장착홈(6-1)과 단자결속홈(7)에 삽입되어 안치되며, 상측단자(14)의 단자핀(15)은 장착돌부(5)를 형성하는 PCB장착편(5-2)의 상측으로 돌출된 상태를 유지하게 된다.The terminal body 11 is located inside the socket body 3, that is, the mounting space 3-3, and the lower terminal 13 is located outside the socket body 3, that is, above the terminal binding groove 7. When the binding piece 12 is inserted (mounted) in the elastic terminal mounting groove 6 in one state, the terminal body 11 is supported by the binding support piece 3-2, and the upper terminal 14 is the mounting groove. (3-1), the lower terminal 13 is inserted and placed in the elastic terminal mounting groove (6-1) and the terminal binding groove (7), the terminal pin 15 of the upper terminal 14 is mounted The protruding state of the PCB mounting piece 5-2 forming the protrusions 5 is maintained.

상기와 같이 소켓(2)의 각 탄성단자장착홈(6)(6-1)에 탄성단자(10)를 각각 조립하여 장착한 상태에서 소켓몸체(3)의 상측에는 PCB(20)를 셋팅수단에 의해 구성을 바르게 하여 안치하고 장착수단에 의해 일체형으로 장착하였다.The means for setting the PCB 20 on the upper side of the socket body 3 in a state in which the elastic terminal 10 is assembled and mounted in each of the elastic terminal mounting grooves 6 and 6-1 of the socket 2 as described above. The structure was correctly settled by the mounting structure, and the unit was mounted integrally by the mounting means.

PCB(20)의 외주에 형성된 셋팅공(25)을 소켓몸체(3)의 상면에 형성된 PCB셋팅돌편(8)에 삽입하여 결합(셋팅)시키면, LED침(21)과 저항(22)은 자연스럽게 상측을 향하게 되고, 전원의 극성도 자연스럽게 맞춰지게 되며, 각 단자지지편(23)의 단자설치공(24)에는 각 탄성단자(10)의 단자핀(15)을 삽입하여 결합시킨다.When the setting hole 25 formed on the outer circumference of the PCB 20 is inserted into the PCB setting stone piece 8 formed on the upper surface of the socket body 3 to be coupled (set), the LED needle 21 and the resistor 22 naturally Towards the upper side, the polarity of the power supply is naturally matched, and the terminal pins 15 of the respective elastic terminals 10 are coupled to the terminal installation holes 24 of the respective terminal support pieces 23.

각 단자설치공(24)으로 삽입되어 상측으로 돌출되는 각 탄성단자(10)의 단자 핀(15)은 상단을 좌우 양측으로 분할하여 외측으로 절곡시켜 줌으로써 PCB(20)를 고정시키거나고, 단자설치공(24)을 통해 상측으로 돌출되는 단자편(15)의 상단을 단자지지편(23)의 상측에서 통상의 납땜을 실시하여 고정한다.The terminal pin 15 of each elastic terminal 10 inserted into each terminal installation hole 24 and projecting upward is fixed to the PCB 20 by dividing the upper end into left and right sides and bending it outward. The upper end of the terminal piece 15 protruding upward through the installation hole 24 is fixed by performing normal soldering on the upper side of the terminal support piece 23.

상기와 같이 조립함으로써 발명에 따른 칩 발광다이오드램프 소켓조립체(1)를 완성(제조)하게 되고, 제조된 발명에 따른 칩 발광다이오드램프 소켓조립체(1)은 각종 기계장치의 계기판의 내면에 장착하며, 계기판의 식별력을 높여주는데 사용하게 된다.By assembling as described above, the chip light emitting diode lamp socket assembly 1 according to the invention is completed (manufactured), and the chip light emitting diode lamp socket assembly 1 according to the invention is mounted on the inner surface of the instrument panel of various mechanical devices. In addition, it is used to enhance the identification of the instrument cluster.

본 발명에서는 구체적인 실시예에 대하여 설명했지만 본 발명의 기술사상범위 내에서 다양하게 변형 및 수정할 수 있음은 당업자에게 있어서 명백한 것이며, 이러한 변형 및 수정이 첨부된 특허청구범위에 속함은 당연한 것이다.Although specific embodiments have been described in the present invention, it will be apparent to those skilled in the art that various changes and modifications can be made within the technical scope of the present invention, and such modifications and variations belong to the appended claims.

본 발명은, 몸체의 하단에 플랜지가 일체로 형성된 소켓의 내부에 한 쌍의 단자를 내장하여 장착하고, 소켓의 상부에 LED칩과 저항이 식설된 PCB를 장착한 것에 있어서, 상기 소켓의 상단에 PCB를 수평으로 유지시켜 장착한 칩 발광다이오드램프 소켓 조립체에 관한 것으로서, 소켓의 상단에 PCB를 수평으로 유지시켜 장착하여 줌으로서 수평으로 설치되는 PCB의 LED칩에서 발산되는 빛이 상측으로 발산되도록 하여 사용범위를 확대시킬 수 있고, LED칩에서 발생하는 빛을 효율적으로 활용할 수 있으며, 소켓의 상단에 장착되는 PCB가 소켓과는 수평 상태를 유지하므로 소켓 조립체의 키(높이)를 낮게 또는 높게 가변적으로 유지시켜 사용할 수 있으며, 소켓 조립체가 계기판의 배면에서 계기판과 나란하게 설치되므로 소켓을 용이하게 설치할 수 있다.The present invention is to mount a pair of terminals in the interior of the socket integrally formed with a flange at the lower end of the body, and mounted on the upper portion of the socket LED chip and a PCB in which resistance is implanted, the upper end of the socket It relates to a chip light emitting diode socket assembly mounted by holding the PCB horizontally, by holding and mounting the PCB horizontally on the top of the socket so that the light emitted from the LED chip of the horizontally installed PCB is emitted upward. It can expand the range of use, efficiently utilize the light emitted from the LED chip, and the height of the socket assembly can be made low or high because the PCB mounted on the top of the socket is horizontal with the socket. The socket assembly is installed in parallel with the instrument panel at the back of the instrument panel, so that the socket can be easily installed.

Claims (6)

소켓몸체(3)의 외주 하단에 소켓플랜지(4)가 일체로 형성된 소켓(2)에는 한 쌍의 탄성단자장착홈(6)(6-1)을 대향되게 각각 형성하고, 각 탄성단자장착홈(6)(6-1)에는 탄성단자(10)를 각각 내장하여 장착하고, 소켓(2)의 상부에는 LED칩(21)과 저항(22)이 식설된 PCB(20)를 장착한 것에 있어서, In the socket 2, in which the socket flange 4 is integrally formed at the lower periphery of the socket body 3, a pair of elastic terminal mounting grooves 6 and 6-1 are formed to face each other, and each elastic terminal mounting groove is provided. (6) (6-1), in which elastic terminals 10 are mounted and mounted respectively, and on the upper part of the socket 2, a PCB 20 in which the LED chip 21 and the resistor 22 are mounted is mounted. , 상기 소켓(2)의 상면에는 통상의 PCB(20)를 수평으로 유지시켜 장착수단에 의해 장착한 것과;An upper surface of the socket 2 is mounted by means of mounting means by keeping a normal PCB 20 horizontal; 소켓(2)의 상면에 장착되는 PCB(20)를 셋팅수단에 의해 전원의 극성을 바르게 하여 장착한 것;이 포함되는 것을 특징으로 하는 초소형 칩 발광다이오드램프 소켓조립체.The PCB (20) mounted on the upper surface of the socket (2) by mounting the right polarity of the power supply by the setting means; Ultra small chip light emitting diode socket assembly comprising a. 청구항 1에 있어서, 소켓몸체(3)의 외면과 소켓플랜지(4)의 상면에는 각 탄성단자장착홈(6)(6-1)의 일 측편으로 장착돌부(5)를 각각 일체로 더 형성한 것과;The method according to claim 1, wherein the outer surface of the socket body 3 and the upper surface of the socket flange 4, the mounting protrusions 5 are further formed integrally with one side of each elastic terminal mounting groove 6, 6-1, respectively. With; PCB(20)의 외주에는 한 쌍의 단자지지편(23)을 반대 방향에 각각 일체로 더 형성한 것과;On the outer circumference of the PCB 20, a pair of terminal support pieces 23 are further formed integrally in opposite directions, respectively; 각 장착돌부(5)의 상측에 PCB(20)의 외주에 각 단자지지편(23)을 안치하여 장착수단에 의해 장착 고정한 것;을 특징으로 하는 초소형 칩 발광다이오드램프 소켓조립체.An ultra-small chip LED lamp socket assembly, characterized in that the terminal support piece 23 is placed on the outer periphery of the PCB 20 on the upper side of each mounting protrusion 5 to be fixed by mounting means. 청구항 1에 있어서, 소켓(2)의 상면에 수평으로 장착되는 PCB(20)는;The method according to claim 1, wherein the PCB (20) mounted horizontally on the upper surface of the socket (2); PCB(20)를 원판형으로 형성하여 소켓몸체(3)의 상면에 안치할 수 있도록 한 것과;Forming the PCB 20 in the shape of a disc so that it can be placed on the upper surface of the socket body (3); 원판형으로 형성된 PCB(20)에는 통상의 LED칩(21)과 저항(22)을 식설하 srjt과;PCB 20 formed in a disc shape has a conventional srjt to implant a conventional LED chip 21 and the resistor 22; 원판형으로 형성된 PCB(20)의 외주에는 한 쌍의 단자지지편(23)을 반대편에 각각 형성한 것;을 특징으로 하는 초소형 칩 발광다이오드램프 소켓조립체.A small chip light emitting diode lamp socket assembly, characterized in that formed on the outer periphery of the PCB (20) formed in a disc shape on the opposite side. 청구항 1에 있어서, 소켓몸체(3)의 상면에 안치되는 PCB(20)를 셋팅시키는 셋팅수단은;The method according to claim 1, wherein the setting means for setting the PCB 20 is placed on the upper surface of the socket body (3); 소켓몸체(3)의 상면에 PCB셋팅돌편(8)을 형성하고 PCB(20)의 일면에 셋팅공(25)을 각각 형성한 것과;Forming a PCB setting stone piece 8 on the upper surface of the socket body 3 and forming a setting hole 25 on one surface of the PCB 20; 소켓몸체(3)의 PCB셋팅돌편(8)에 PCB(20)의 셋팅공(25)을 삽입하여 결합시킨 것;을 특징으로 하는 초소형 칩 발광다이오드램프 소켓조립체.A microchip chip light-emitting diode lamp socket assembly, comprising: inserting the setting hole (25) of the PCB (20) into the PCB setting stone piece (8) of the socket body (3). 청구항 1에 있어서, 장착돌부(5)의 상면에 안치되는 PCB(20)의 단자지지편(23)을 장착시키는 장착수단은;According to claim 1, Mounting means for mounting the terminal support piece 23 of the PCB 20 placed on the upper surface of the mounting protrusion (5); PCB(20)의 각 단자지지편(23)에 단자설치공(24)을 뚫어 준 것과;The terminal mounting holes 24 are drilled in each terminal support piece 23 of the PCB 20; 소켓(2)의 탄성단자장착홈(6)(6-1)에 장착되는 각 탄성단자(14)의 단자편(15)을 단자설치공(24)으로 삽입하여 돌출시킨 것과;Inserting the terminal pieces 15 of each of the elastic terminals 14 mounted in the elastic terminal mounting grooves 6 and 6-1 of the socket 2 into the terminal installation holes 24 to protrude; 단자설치공(24)을 통해 상측으로 돌출되는 단자편(15)의 상단을 좌우로 분할하고 외측으로 절곡하여 고정시킨 것;을 특징으로 하는 초소형 칩 발광다이오드램프 소켓조립체.A small chip light emitting diode lamp socket assembly, characterized in that the upper end of the terminal piece (15) protruding upward through the terminal installation hole (24) is divided into left and right and bent outward. 청구항 1에 있어서, 장착돌부(5)의 상면에 안치되는 PCB(20)의 단자지지편(23)을 장착시키는 장착수단은;According to claim 1, Mounting means for mounting the terminal support piece 23 of the PCB 20 placed on the upper surface of the mounting protrusion (5); PCB(20)의 각 단자지지편(23)에 단자설치공(24)을 뚫어 준 것과;The terminal mounting holes 24 are drilled in each terminal support piece 23 of the PCB 20; 소켓(2)의 탄성단자장착홈(6)(6-1)에 장착되는 각 탄성단자(14)의 단자편(15)을 단자설치공(24)으로 삽입하여 돌출시킨 것과;Inserting the terminal pieces 15 of each of the elastic terminals 14 mounted in the elastic terminal mounting grooves 6 and 6-1 of the socket 2 into the terminal installation holes 24 to protrude; 단자설치공(24)을 통해 상측으로 돌출되는 단자편(15)의 상단을 단자지지편(23)의 상측에서 납땜하여 고정한 것;을 특징으로 하는 초소형 칩 발광다이오드램프 소켓조립체.The upper end of the terminal piece 15 protruding upward through the terminal mounting hole 24 is fixed by soldering on the upper side of the terminal support piece 23; Ultra small chip light emitting diode socket assembly characterized in that the.
KR1020060111426A 2006-11-13 2006-11-13 A Sur-Small Size Type Chip LED Lamp Socket Assembly KR100830417B1 (en)

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Cited By (2)

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Publication number Priority date Publication date Assignee Title
WO2013077561A1 (en) * 2011-11-23 2013-05-30 Kwon Mi Suk Led lamp
WO2018021725A1 (en) * 2016-07-29 2018-02-01 엘에스오토모티브 주식회사 Vehicle led lamp unit

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KR100986219B1 (en) * 2008-09-10 2010-10-07 장영환 A sur-small size type of Chip LED Lamp Socket Assembly for preventing a misfitting
KR101059468B1 (en) 2008-12-16 2011-08-25 장영환 Base lamp assembly using light emitting diode
KR101185052B1 (en) 2010-08-16 2012-09-21 장영환 The lamp
KR101168004B1 (en) 2012-02-16 2012-07-26 권미숙 The lamp

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US5378158A (en) 1994-01-21 1995-01-03 Delco Electronics Corporation Light emitting diode and socket assembly
KR20040027642A (en) * 2004-02-19 2004-04-01 (주) 케이티지 Hybrid ic type led lamp
KR100683126B1 (en) * 2004-07-20 2007-02-15 장영환 Sur-small size type chip LED Lamp socket Assembly
KR200418307Y1 (en) 2006-03-10 2006-06-08 김성식 LED lamp for vehicle

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Publication number Priority date Publication date Assignee Title
WO2013077561A1 (en) * 2011-11-23 2013-05-30 Kwon Mi Suk Led lamp
KR101271569B1 (en) * 2011-11-23 2013-06-11 권미숙 The lamp
US9328901B2 (en) 2011-11-23 2016-05-03 Younghwan Jang LED lamp
WO2018021725A1 (en) * 2016-07-29 2018-02-01 엘에스오토모티브 주식회사 Vehicle led lamp unit

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