KR200452118Y1 - Led lighting device - Google Patents

Led lighting device Download PDF

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Publication number
KR200452118Y1
KR200452118Y1 KR2020090008952U KR20090008952U KR200452118Y1 KR 200452118 Y1 KR200452118 Y1 KR 200452118Y1 KR 2020090008952 U KR2020090008952 U KR 2020090008952U KR 20090008952 U KR20090008952 U KR 20090008952U KR 200452118 Y1 KR200452118 Y1 KR 200452118Y1
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South Korea
Prior art keywords
led
printed circuit
circuit board
terminal
led substrate
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KR2020090008952U
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Korean (ko)
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KR20110000521U (en
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하진호
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하진호
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/508—Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/0005—Fastening of light sources or lamp holders of sources having contact pins, wires or blades, e.g. pinch sealed lamp
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
    • F21Y2105/18—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array annular; polygonal other than square or rectangular, e.g. for spotlights or for generating an axially symmetrical light beam
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Abstract

본 고안은 엘이지 조명장치에 관한 것으로, 복수의 엘이디가 장착되는 엘이디 기판, 상기 엘이디 기판과 간격(T3)을 두고 이격되게 배치되는 인쇄회로기판, 그리고 상기 엘이디 기판과 상기 인쇄회로기판에 설치되어 두 기판 사이의 전원을 연결함과 아울러 간격(T3)을 유지하도록 지지하는 전원 연결단자를 포함하여 엘이디 기판에서 발생되는 열이 인쇄회로기판으로 전달되는 것을 최소화하여 인쇄회로기판의 열화를 방지할 수 있다. The present invention relates to an LED lighting apparatus, an LED substrate on which a plurality of LEDs are mounted, a printed circuit board spaced apart from the LED substrate at a distance T3, and installed on the LED substrate and the printed circuit board. In addition to connecting power between the two boards, and including a power connector for maintaining the gap (T3) to minimize the transfer of heat generated from the LED board to the printed circuit board to prevent degradation of the printed circuit board have.

엘이디, 엘이디조명기구, 조명장치 LED, LED lighting equipment, lighting device

Description

엘이디 조명장치{LED LIGHTING DEVICE}LED lighting device {LED LIGHTING DEVICE}

본 고안은 엘이디 조명장치에 관한 것이다.The present invention relates to an LED lighting device.

일반적으로, 실내외용 조명장치 중에는 백열등, 형광등, 할로겐 램프 등이 다양하게 사용되고 있다. 할로겐 램프는 전력소모가 심하고 또한 사용시 열이 과다하게 발생되고 아울러서 자외선이 발생된다는 문제점이 있다. 이에 따라 최근에는 엘이디(LED)를 이용한 조명기구가 제공되고 있다. 이러한 엘이디(LED) 조명장치는 종래의 광원에 비해 소형이고, 수명은 길며, 전기에너지가 빛에너지로 직접 변환하기 때문에 전력효율이 좋다.In general, incandescent lamps, fluorescent lamps, halogen lamps and the like are used in a variety of indoor and outdoor lighting devices. Halogen lamps have a problem in that power consumption is severe and heat is excessively generated during use and ultraviolet rays are generated. Accordingly, recently, lighting apparatuses using LEDs have been provided. The LED (LED) lighting device is smaller than the conventional light source, has a long life, and good power efficiency because the electrical energy is converted directly to light energy.

하지만, 기존의 엘이디 조명장치는 발광 다이오드의 특성상 열발생이 많기 때문에 엘이디에서 발생되는 열이 인쇄회로기판(PCB)으로 전달되어 인쇄회로기판(PCB)을 손상시키는 문제가 발생된다.However, in the conventional LED lighting apparatus, since heat is generated due to the characteristics of the light emitting diode, heat generated from the LED is transferred to the printed circuit board (PCB), thereby causing a problem of damaging the printed circuit board (PCB).

따라서, 기존의 엘이디 조명장치는 반드시 엘이디를 방열하기 위한 방열판을 구비해야되므로 제조비용이 비싸지고 조립공정이 불편한 문제점이 발생된다.Therefore, the existing LED lighting device must be provided with a heat sink for heat dissipation of the LED, so the manufacturing cost is high and the assembly process is inconvenient.

본 고안이 해결하고자 하는 과제는 엘이디가 장착되는 엘이디 기판과, 각종 회로부품이 장착되는 인쇄회로기판 사이를 일정 간격을 두고 이격되게 배치함으로써, 엘이디 기판에서 발생되는 열이 인쇄회로기판으로 전달되는 것을 최소화하여 인쇄회로기판의 열화를 방지할 수 있는 엘이디 조명장치를 제공하는 것이다. The problem to be solved by the present invention is that the heat is generated from the LED substrate is transferred to the printed circuit board by placing a spaced interval between the LED board on which the LED is mounted, and the printed circuit board on which various circuit components are mounted. It is to provide an LED lighting device that can minimize the degradation of the printed circuit board.

본 고안의 한 실시예에 따른 엘이디 조명장치는 복수의 엘이디가 장착되는 엘이디 기판, 상기 엘이디 기판과 간격(T3)을 두고 이격되게 배치되는 인쇄회로기판, 그리고 상기 엘이디 기판과 상기 인쇄회로기판에 설치되어 두 기판 사이의 전원을 연결함과 아울러 간격(T3)을 유지하도록 지지하는 전원 연결단자를 포함한다.LED lighting apparatus according to an embodiment of the present invention is a plurality of LED mounted on the substrate, the printed circuit board is spaced apart from the LED substrate at a distance (T3), and installed on the LED substrate and the printed circuit board And a power supply terminal for supporting the power supply between the two substrates and maintaining the gap T3.

상기 엘이디 기판은 원판 형태이고, 그 전면에 엘이디가 방사상으로 배열될 수 있다.The LED substrate may be in the form of a disc, and the LEDs may be radially arranged on the front surface thereof.

상기 전원 연결단자는 상기 엘이디 기판의 하면에서 돌출되는 제1단자부, 상기 제1단자부와 접속되고 전원 연결단자의 상면에서 돌출되는 제2단자부를 포함할 수 있다.The power connection terminal may include a first terminal portion protruding from a bottom surface of the LED substrate, and a second terminal portion connected to the first terminal portion and protruding from an upper surface of the power connection terminal.

상기 두 기판 사이의 간격(T3)은 제1단자부의 높이(T1)와 제2단자부의 높이(T3)를 합친 높이일 수 있다.The distance T3 between the two substrates may be the sum of the height T1 of the first terminal portion and the height T3 of the second terminal portion.

본 고안의 실시예에 따르면, 엘이디 기판과 인쇄회로기판 사이를 일정정도 이격되고 배치하여 엘이디 기판에서 발생되는 열이 인쇄회로기판으로 전달되는 것을 최소화하여 인쇄회로기판의 열화를 방지할 수 있다.According to an embodiment of the present invention, the LED substrate and the printed circuit board are spaced apart to some extent to minimize the transfer of heat generated from the LED substrate to the printed circuit board to prevent degradation of the printed circuit board.

또한, 엘이디 기판과 인쇄회로기판 사이의 간격이 엘이디 기판과 인쇄회로기판 사이의 전원을 연결하는 전원연결용 단자에 의해 유지되도록 하여 두 기판 사이의 간격을 유지하기 위해 별도의 부품이 불필요하여 제조비용을 줄일 수 있다.In addition, the distance between the LED board and the printed circuit board is maintained by the power connection terminal for connecting the power between the LED board and the printed circuit board, so that no separate parts are needed to maintain the gap between the two boards. Can be reduced.

이하, 본 고안이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 본 고안의 실시예에 대하여 첨부한 도면을 참고로 하여 상세히 설명한다. 그러나 본 고안은 여러 가지 상이한 형태로 구현될 수 있으며 여기에서 설명하는 실시예에 한정되지 않는다. 명세서 전체를 통하여 유사한 부분에 대해서는 동일한 도면 부호를 붙였다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Like parts are designated by like reference numerals throughout the specification.

그러면 본 고안의 한 실시예에 따른 엘이디 조명장치에 대하여 도 1 내지 도 4를 참고하여 설명한다. Then, the LED lighting apparatus according to an embodiment of the present invention will be described with reference to FIGS. 1 to 4.

도 1은 본 고안의 한 실시예에 따른 엘이디 조명장치의 단면도이고, 도 2는 본 고안의 한 실시예에 따른 엘이디 조명장치의 사시도이고, 도 3은 본 고안의 한 실시예에 따른 엘이디 기판의 평면도이고, 도 4는 본 고안의 한 실시예에 따른 엘이디 조명장치의 전원 연결단자의 단면도이다.1 is a cross-sectional view of the LED lighting apparatus according to an embodiment of the present invention, Figure 2 is a perspective view of the LED lighting apparatus according to an embodiment of the present invention, Figure 3 is a view of the LED substrate according to an embodiment of the present invention 4 is a cross-sectional view of a power connection terminal of the LED lighting apparatus according to an embodiment of the present invention.

본 고안의 일 실시예에 따른 엘이디 조명장치는 복수의 엘이디(12)가 장착되는 엘이디 기판(10)과, 이 엘이디 기판(10)과 일정 간격을 두고 이격되게 배치되는 인쇄회로기판(20)과, 엘이디 기판(10)과 인쇄회로기판(20) 사이의 전원을 연결하고 두 기판(10,20) 사이의 간격을 유지시키는 전원 연결단자(30,40)를 포함한다. LED lighting apparatus according to an embodiment of the present invention is a plurality of LED boards on which the LED 12 is mounted, the printed circuit board 20 is spaced apart from the LED substrate 10 at a predetermined interval and And a power connection terminal 30 and 40 connecting the power between the LED substrate 10 and the printed circuit board 20 and maintaining a gap between the two substrates 10 and 20.

엘이디 기판(10)은 원판 형태이고, 그 상면에 방사상으로 복수의 엘이디(12) 가 장착된다. 그리고, 이러한 엘이디 기판(10)은 하우징 내부에 장착되고 엘이디 기판(10)의 전면에 엘이디(12)를 보호하기 위한 투명 또는 불투명 커버가 설치될 수 있다. The LED substrate 10 is in the form of a disc, and a plurality of LEDs 12 are radially mounted on an upper surface thereof. In addition, the LED substrate 10 may be mounted inside the housing, and a transparent or opaque cover may be installed on the front surface of the LED substrate 10 to protect the LED 12.

인쇄회로기판(20)은 그 전면에 각종 회로부품(22)이 실장되고, 그 일측에는 외부 전원과 연결되는 외부전원 연결선이 장착된다.The printed circuit board 20 has various circuit components 22 mounted on the front thereof, and an external power connection line connected to an external power source is mounted on one side thereof.

전원 연결단자(30,40)는 엘이디 기판(10)의 하면에 수직방향으로 돌출되게 장착되는 제1단자부(30)와, 인쇄회로기판(20)의 전면에 상측방향으로 돌출되게 장착되고 제1단자부(30)와 접속되어 전원이 연결되는 제2단자부(40)를 포함한다.The power connection terminals 30 and 40 are mounted to protrude upwardly on the front surface of the first terminal portion 30 and the printed circuit board 20, which are mounted to protrude in a vertical direction on the bottom surface of the LED substrate 10. And a second terminal portion 40 connected to the terminal portion 30 to which a power source is connected.

여기에서, 제1단자부(30)는 복수의 단자핀(32)이 일정 간격을 두고 돌출되게 장착되고, 엘이디 기판(10)의 하면에 서로 일정 간격으로 배열되는 한 쌍으로 구성됨이 바림직하다. Here, the first terminal portion 30 is preferably mounted in a pair of terminal pins 32 are mounted so as to protrude at a predetermined interval, arranged on the lower surface of the LED substrate 10 at a predetermined interval from each other.

그리고, 제2단자부(40)는 복수의 단자핀(32)이 삽입될 수 있는 접속홀(44)이 형성되고, 그 접속홀(44)의 내부에는 단자핀(32)과 접촉되는 단자판(42)이 장착된다. 여기에서, 단자핀(32)이 단자판(42)과 접속홀(44)에 삽입되어 지지되는 강도는 엘이디 기판(10)과 인쇄회로기판(20) 사이를 별도의 지지부가 없이 전원연결단자(30,40)에 의해 상호 지지될 수 있도록 일정 정도의 강도를 갖는 것이 바람직하다. The second terminal portion 40 has a connection hole 44 into which a plurality of terminal pins 32 can be inserted, and a terminal plate 42 in contact with the terminal pin 32 in the connection hole 44. ) Is mounted. Here, the strength that the terminal pin 32 is inserted into and supported by the terminal plate 42 and the connection hole 44 is a power connection terminal 30 without a separate support portion between the LED substrate 10 and the printed circuit board 20. It is desirable to have a certain degree of strength so as to be mutually supported by (40).

여기에서, 상기 제1단자부(30)의 높이(T1)과 제2단자부(40)의 높이(T2)를 합하면 전원 연결단자(30,40)의 높이(T3)가 되고, 이 전원 연결단자(30,40)의 높이(T3)가 엘이디 기판(10)과 인쇄회로기판(20) 사이의 간격을 나타낸다. 이러한 전 원 연결단자의 높이(T3)는 엘이디 기판(10)에서 발생되는 열이 인쇄회로기판(20)에 영향을 미치지 않을 정도의 높이를 갖는다. Here, the sum of the height T1 of the first terminal portion 30 and the height T2 of the second terminal portion 40 results in a height T3 of the power connection terminals 30 and 40, and the power connection terminal ( The height T3 of 30 and 40 represents the gap between the LED substrate 10 and the printed circuit board 20. The height T3 of the power connection terminal has a height such that heat generated from the LED substrate 10 does not affect the printed circuit board 20.

이와 같이, 제1단자부(30)와 제2단자부(40) 사이를 접속시키면 엘이디 기판(10)과 인쇄회로기판(20) 사이가 간격(T3)을 유지하게 되어 엘이디 기판(10)에서 발생되는 열이 인쇄회로기판(20)으로 전달되는 것을 최소화할 수 있게 되고, 이에 따라 인쇄회로기판(20)의 열화를 방지할 수 있게 된다. As such, when the first terminal portion 30 and the second terminal portion 40 are connected to each other, the gap between the LED substrate 10 and the printed circuit board 20 is maintained at the gap T3, which is generated in the LED substrate 10. It is possible to minimize the transfer of heat to the printed circuit board 20, thereby preventing deterioration of the printed circuit board 20.

또한, 엘이디 기판(10)과 인쇄회로기판(20) 사이가 전원 연결단자(30,40)에 의해 상호 지지됨과 아울러 전원이 연결된다. 따라서 엘이디 기판(10)과 인쇄회로기판(20) 사이의 간격을 유지하기 위한 별도의 부재가 불필요하다. In addition, the LED substrate 10 and the printed circuit board 20 are mutually supported by the power connection terminals 30 and 40 and the power is connected. Therefore, a separate member for maintaining the gap between the LED substrate 10 and the printed circuit board 20 is unnecessary.

이상에서 본 고안의 바람직한 실시예에 대하여 상세하게 설명하였지만 본 고안의 권리범위는 이에 한정되는 것은 아니고 다음의 청구범위에서 정의하고 있는 본 고안의 기본 개념을 이용한 당업자의 여러 변형 및 개량 형태 또한 본 고안의 권리범위에 속하는 것이다.Although the preferred embodiment of the present invention has been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concept of the present invention defined in the following claims are also provided. It belongs to the scope of rights.

도 1은 본 고안의 한 실시예에 따른 엘이디 조명장치의 단면도이고, 1 is a cross-sectional view of the LED lighting apparatus according to an embodiment of the present invention,

도 2는 본 고안의 한 실시예에 따른 엘이디 조명장치의 사시도이고, 2 is a perspective view of the LED lighting apparatus according to an embodiment of the present invention,

도 3은 본 고안의 한 실시예에 따른 엘이디 기판의 평면도이고, 3 is a plan view of the LED substrate according to an embodiment of the present invention,

도 4는 본 고안의 한 실시예에 따른 엘이디 조명장치의 전원 연결단자의 단면도이다.4 is a cross-sectional view of a power connection terminal of the LED lighting apparatus according to an embodiment of the present invention.

* 도면의 주요 부분에 대한 부호의 설명 * Explanation of symbols on the main parts of the drawings

10: 엘이디 기판 12: 엘이디10: LED substrate 12: LED

20: 인쇄회로기판 22: 회로부품 20: printed circuit board 22: circuit components

30: 제1단자부 32: 단자핀30: first terminal portion 32: terminal pin

40: 제2단자부 42: 단자판40: second terminal portion 42: terminal plate

Claims (4)

엘이디 기판, Led board, 상기 엘이디 기판과 간격(T3)을 두고 이격되게 배치되는 인쇄회로기판, 그리고A printed circuit board spaced apart from the LED substrate at a distance T3; and 상기 엘이디 기판과 상기 인쇄회로기판에 설치되어 두 기판 사이의 전원을 연결함과 아울러 간격을 유지하도록 지지하는 전원 연결단자를 포함하고, It is provided on the LED substrate and the printed circuit board includes a power connection terminal for supporting to maintain a gap while connecting the power between the two substrates, 상기 전원 연결단자는 The power connection terminal 상기 엘이디 기판의 하면에서 한 쌍이 장착되어 있으며, 각각에는 하부로 돌출되어 있는 복수의 단자핀이 장착되어 있는 제1단자부, 및 A pair is mounted on the lower surface of the LED substrate, each of the first terminal portion is mounted with a plurality of terminal pins protruding downward, and 상기 인쇄회로기판의 상면에 각 상기 제1단자부에 대응되게 장착되어 있고, 상기 복수의 단자핀이 삽입될 수 있는 접속홀들이 형성되어 있으며, 각 상기 접속홀의 내부에 장착되어 상기 단자핀에 접촉되는 단자판이 구비되어 있는 제2단자부를 포함하고, The upper surface of the printed circuit board is mounted to correspond to each of the first terminal portion, and the connection holes for inserting the plurality of terminal pins are formed, and are mounted in each of the connection holes to contact the terminal pins A second terminal portion provided with a terminal plate, 상기 두 기판은 상기 제1단자부와 상기 제2단자부의 접속에 의하여서만 이격되게 지지되고 있는 엘이디 조명장치.And the two substrates are supported to be spaced apart only by the connection of the first terminal portion and the second terminal portion. 제1항에서, In claim 1, 상기 엘이디 기판은 원판 형태이고, 그 전면에 복수의 엘이디가 방사상으로 배열되는 엘이디 조명장치.The LED substrate is in the form of a disc, the LED lighting apparatus in which a plurality of LEDs are arranged radially on the front. 삭제delete 삭제delete
KR2020090008952U 2009-07-10 2009-07-10 Led lighting device KR200452118Y1 (en)

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Publication number Priority date Publication date Assignee Title
KR100895709B1 (en) 2008-01-03 2009-04-30 박교양 Radiant heat illumination lamp
KR20090006633U (en) * 2007-12-28 2009-07-02 김미경 Connecting structure of led lighting module

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090006633U (en) * 2007-12-28 2009-07-02 김미경 Connecting structure of led lighting module
KR100895709B1 (en) 2008-01-03 2009-04-30 박교양 Radiant heat illumination lamp

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