KR20040027642A - Hybrid ic type led lamp - Google Patents

Hybrid ic type led lamp Download PDF

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Publication number
KR20040027642A
KR20040027642A KR1020040011178A KR20040011178A KR20040027642A KR 20040027642 A KR20040027642 A KR 20040027642A KR 1020040011178 A KR1020040011178 A KR 1020040011178A KR 20040011178 A KR20040011178 A KR 20040011178A KR 20040027642 A KR20040027642 A KR 20040027642A
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KR
South Korea
Prior art keywords
hybrid
led
light emitting
unit
attached
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Application number
KR1020040011178A
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Korean (ko)
Inventor
김갑성
전찬구
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(주) 케이티지
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Priority to KR1020040011178A priority Critical patent/KR20040027642A/en
Publication of KR20040027642A publication Critical patent/KR20040027642A/en

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Classifications

    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J37/00—Baking; Roasting; Grilling; Frying
    • A47J37/06—Roasters; Grills; Sandwich grills
    • A47J37/067—Horizontally disposed broiling griddles
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J36/00—Parts, details or accessories of cooking-vessels
    • A47J36/02—Selection of specific materials, e.g. heavy bottoms with copper inlay or with insulating inlay
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Food Science & Technology (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

PURPOSE: A hybrid IC type LED lamp is provided to achieve improved luminous intensity by mounting a plurality of LED chips in a small area. CONSTITUTION: A hybrid IC type LED lamp comprises a plurality of LED chips(51) attached on a hybrid IC substrate(53); a light reflecting unit(52) attached around the LED chips; a lens unit(50) covering and protecting the LED chips; a metal plate(54) attached beneath the hybrid IC substrate; a heat sink(56) attached beneath the metal plate; and a circuit controller(58) and a socket arranged at the bottom of the lamp. The light reflecting unit has an inclined side surface, and the heat sink has a side surface where a radiation fin(55) is attached so as to allow for ease of heat radiation.

Description

하이브리드 IC형 LED 전등{Hybrid IC Type LED Lamp}Hybrid IC Type LED Lamp {Hybrid IC Type LED Lamp}

본 발명은 발광다이오드(LED)를 이용한 전등구조에 관한 것으로 특히, 발광다이오드 칩을 하이브리드 IC화한 하이브리드 IC형 LED 전등에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light structure using a light emitting diode (LED), and more particularly, to a hybrid IC type LED light lamp using a hybrid IC of a light emitting diode chip.

최근 다수의 발광다이오드를 PCB에 장착한 신호등이 많이 사용되고 있는데 직경이 30 센티미터 정도의 큰 PCB기판에 LED소자를 다수 배치하여 발광부를 구비한 신호등이 사용되고 있는데 부피가 크고 그에 따른 PCB가 커지며 가격의 저렴화 및 기존 함체를 바꾸어야하는 문제점이 있고 향후 수명이 다 될 때에 폐기물이 다량 발생하는 문제점이 있다.Recently, a large number of light emitting diodes mounted on a PCB are widely used. A large number of LED elements are placed on a large PCB substrate having a diameter of about 30 centimeters, and a signal light having a light emitting portion is used. And there is a problem that needs to replace the existing enclosure and there is a problem that a large amount of waste occurs when the end of life.

특히, LED 조명등으로 사용할 때에는 부피가 커져 장착 및 사용하기가 불편한 문제점이 있다.In particular, when using the LED light, the volume is large, there is a problem inconvenient to install and use.

도 1은 종래기술에 의한 LED신호등 구조를 나타내는 단면도로서 (1)은 전기가 공급되면 발광하는 LED소자이고 (2)는 케이스 전면의 투명하거나 착색된 렌즈를 나타내며 (3)은 케이스를 나타내고 (4)는 다수의 LED를 장착시켜 회로패턴으로 연결하는 PCB를 나타낸다. (5)는 교류전원으로부터 공급되는 교류전기를 직류전기로변환하여 LED소자에 공급하는 제어회로부이고 (6)은 교류전원을 공급하는 전선이며 (7)은 PCB와 제어회로부를 지지하는 지지부(7)이다. 상기와 같은 LED신호등은 외부로부터 제어회로부(5)로 전원이 공급되면 상기 각 LED가 발광하여 점등되는 동작이 이루어 진다. 상기와 같은 LED 신호등은 직경이 30 센티미터 정도이고 높이가 15 센티미터 정도가 되기 때문에 부피가 크고 그에 따른 PCB가 커지며 기존 함체와 렌즈를 바꾸어야 하므로 가격의 저렴화 및 기존 백열 전구식은 전구만 교체하는데 비해 기존 함체를 바꾸어야하는 문제점이 있고 향후 수명이 다 될 때에 납이 있는 PCB폐기물이 다량 발생하는 문제점이 있다.1 is a cross-sectional view showing a structure of a LED signal lamp according to the prior art, (1) is an LED element that emits light when electricity is supplied (2) is a transparent or colored lens on the front of the case (3) represents a case (4 ) Shows a PCB that is mounted with multiple LEDs and connected in a circuit pattern. (5) is a control circuit unit for converting AC electricity supplied from an AC power source into a direct current electric current and supplying it to an LED element, (6) is a wire for supplying AC power, and (7) a support part for supporting a PCB and a control circuit part (7) to be. When the LED signal lamp as described above is supplied with power to the control circuit unit 5 from the outside, the respective LEDs emit light to be turned on. The LED traffic light is about 30 centimeters in diameter and 15 centimeters in height, so it is bulky and the PCB becomes larger and the existing enclosures and lenses need to be replaced. There is a problem that needs to be changed and there is a problem that a large amount of PCB waste with lead occurs when the end of life.

특히, LED 조명등으로 사용할 때에는 부피가 커져 장착 및 외관상 사용하기가 부적합한 문제점있다, 또한 부피에 비해 광량이 부족하여 조명등으로 사용하기에는 부적합한 문제점이 있다.In particular, there is a problem that the volume is too large when used as an LED lamp, and is unsuitable for use in appearance and appearance, and there is also a problem that the amount of light is insufficient compared to the volume, which is not suitable for use as a lamp.

따라서 본 발명은 상기한 문제점을 해결하기 위해 안출된 것으로, 그 목적은 다수의 LED 칩을 하이브리드 IC화한 발광부를 만들어 콤팩트하면서 다수의 LED칩을 작은 면적에 장착하여서 고광도의 하이브리드 IC형 LED 전등을 제공하는데 있다.Therefore, the present invention has been made to solve the above problems, the object is to make a light emitting unit that is a hybrid IC of a plurality of LED chips to provide a compact high-intensity hybrid IC type LED light by mounting a plurality of LED chips in a small area. It is.

도 1은 종래 기술에 의한 LED 신호등 구성도1 is a configuration diagram of a LED traffic light according to the prior art

도 2는 본 발명에 의한 하이브리드 IC형 LED 전등 구성도2 is a configuration diagram of a hybrid IC type LED light according to the present invention

도 3 은 본 발명에 의한 하이브리드 IC형 LED 전등 LED 발광부 구조도3 is a structural diagram of a hybrid IC-type LED lamp LED light emitting unit according to the present invention

도 4 은 본 발명에 의한 회로제어부 회로 구성도4 is a circuit diagram of a circuit control unit according to the present invention.

〈도면의 주요부분에 대한 부호의 설명〉<Explanation of symbols for main parts of drawing>

1 : LED 소자 2 : 렌즈1: LED element 2: lens

3 : 케이스 4 : PCB3: case 4: PCB

5 : 제어회로부 6 : 전선5: control circuit part 6: wire

7 : 지지부 10 : 금속판7 support portion 10 metal plate

20 : 하이브리드 IC기판 30 : 발광 반사면20: hybrid IC substrate 30: light emitting reflective surface

40 : LED칩 31 : 발광부40: LED chip 31: light emitting part

32 : 전원부 33 : 정류부32: power supply section 33: rectification section

34 : 전력소자부 35 : 전류감지부34: power device portion 35: current detection unit

36 : 연산부 37 : 제어부36: calculator 37: controller

38 : 광감지부 50: 렌즈부38: light sensing unit 50: lens unit

51 : LED 칩 52 : LED칩 발광 반사부51: LED chip 52: LED chip light emitting reflector

53 : 하이브리드 IC 기판 54 : 금소판53 hybrid IC substrate 54 gold plate

55 : 방열핀 56 : 방열판55: heat sink fin 56: heat sink

57 : 지지대 58 : 제어부57: support 58: control unit

59 : 전구 베이스 60 : 전선59: light bulb base 60: electric wire

상기와 같은 목적을 달성하기 위한 본 발명의 특징에 따르면, 하이브리드 IC기판상에 다수의 LED칩을 부착하고 칩 주위에 발광 반사면을 부착하며 LED칩이 부착된 위에 렌즈부를 부착하여 LED칩을 보호하고 하이브리드 IC 기판아래에 금속판을 부착한다. 금속판 밑에 방열핀이 부착된 방열판을 부착하고 지지대를 통해 회로제어부를 부착하고 그 하단에 소켓을 포함하여 구성되는 하이브리드 IC형 LED 전등을 제공한다.According to a feature of the present invention for achieving the above object, to protect the LED chip by attaching a plurality of LED chips on the hybrid IC substrate, a light emitting reflective surface around the chip attached to the lens portion on the LED chip attached And attach a metal plate under the hybrid IC substrate. It provides a hybrid IC type LED lamp that is configured to attach a heat sink with a heat sink fin under the metal plate, attach a circuit control unit through a support, and include a socket at the bottom thereof.

이때, 본 발명의 부가적인 특징에 따르면, 상기 발광부를 이루는 LED칩의 단단한 고정을 위해 덮개를 설치할 수 있다.At this time, according to an additional feature of the present invention, it is possible to install a cover for fixing the LED chip forming the light emitting portion.

이하, 첨부된 도면을 참조하여 본 발명의 실시예를 설명하면 다음과 같다.Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

도 2은 본 발명에 의한 하이브리드 IC형 LED 조명등 구조도이고 도 3은 본 발명에 의한 하이브리드 IC형 LED 조명등 LED 발광부 구조도이다.2 is a structural diagram of a hybrid IC type LED lighting lamp according to the present invention, and FIG. 3 is a structural diagram of a hybrid IC type LED lighting lamp LED light emitting part according to the present invention.

도 2의 (50)은 빛의 발산 및 LED 칩상에 먼지등이 부착하는 것을 방지하기 위한 투명 렌즈부이고 (51)은 발광을 위한 LED 반도체 칩을 나타내며 (52)는 LED 칩에서 발광이 될 때 이 빛을 전면으로 확산시키기 위한 LED 칩 발광 반사부로서 측면이 경사면으로 되어 있다.2, 50 is a transparent lens unit for preventing the emission of light and the adhesion of dust on the LED chip, 51 denotes an LED semiconductor chip for emitting light, and 52 denotes when the LED chip emits light. The LED chip light-emitting reflection part for diffusing this light to the front side has an inclined surface.

(53)은 하이브리드 IC 기판으로 LED 칩(51)을 상호 연결하는 회로 패턴이 부가되어 있다. (54)는 금속판으로 하이브리드 IC기판(53)의 하단이 부착되어 방열판으로 LED 칩 발광시 발생하는 열을 신속히 전달하는 역할을 한다.Reference numeral 53 is a hybrid IC substrate to which a circuit pattern for interconnecting the LED chips 51 is added. 54 is a metal plate attached to the lower end of the hybrid IC substrate 53 serves to quickly transfer the heat generated when the LED chip light emitting to the heat sink.

(56)는 방열판으로 방열핀(55)가 부착되어 있어 LED 칩에서 발생한 열을 신속히 대기로 방열할 수 있게 한다.The heat dissipation fins 55 are attached to the heat dissipation plate 56 to quickly dissipate heat generated from the LED chip into the atmosphere.

(57)은 지지대로서 방열판과 회로 제어부를 연결하고 지지하는 역할을 한다.Reference numeral 57 serves as a support for connecting and supporting the heat sink and the circuit control unit.

(58)은 회로제어부로 교류전원을 LED칩이 안전하게 작동할 수 있는 직류 전압으로 변환하여 LED칩을 구동하는 역할을 한다.58 is a circuit control unit that converts AC power into a DC voltage that the LED chip can safely operate to drive the LED chip.

(59)는 전구 베이스로 전구소켓에 장착하여 사용하기 위한 부분이고 (60)은전선으로 회로제어부(58)과 하이브리드 IC 기판(53)사이를 연결하여 LED칩에 필요한 전기를 공급하기 위한 부분이다.Reference numeral 59 denotes a bulb base for mounting on the bulb socket, and reference numeral 60 denotes a wire for connecting the circuit control unit 58 and the hybrid IC board 53 to supply the electricity required for the LED chip. .

도 3은 본 발명에 의한 하이브리드 IC형 LED 전등의 LED 발광부 구조도이다.3 is a structure diagram of the LED light emitting unit of the hybrid IC type LED lamp according to the present invention.

(10)은 금속판으로 LED 칩(도 3의 40)에서 발생한 열이 하이브리드 IC 기판을 통해 방열판으로 신속히 전달시키기 위해 금속판을 사용하고 금속으로는 가볍고 열전달 효율이 좋은 알루미늄 금속판을 주로 사용한다.Denoted at 10 is a metal plate, which uses a metal plate to quickly transfer heat generated from an LED chip (40 in FIG. 3) to a heat sink through a hybrid IC substrate, and mainly uses an aluminum metal plate having light and good heat transfer efficiency as a metal.

하이브리드 IC기판(도 3의 20)은 다수의 LED 칩(도 3의 40)을 장착하기 위한 회로 패턴이 부가되어 있는 기판으로 LED칩에서 발생한 열을 신속히 금속판(10)에 전달하기 위한 열저항을 낮출 수 있도록 박판으로 만든다.The hybrid IC substrate (20 in FIG. 3) is a substrate to which a circuit pattern for mounting a plurality of LED chips (40 in FIG. 3) is added. The hybrid IC substrate (20 in FIG. 3) has a thermal resistance for transferring heat generated from the LED chip to the metal plate 10 quickly. Laminate to lower.

발광 반사면(도 3의 30)은 LED칩에서 하이브리드 IC기판의 수평면으로 나오는 빛을 전방으로 반사하기 위해 평면은 원형이고 측면은 경사면이 되게 한다. LED칩(도 3의 40)은 발광 반사면의 중앙에 위치하게 하여 LED칩에서 나오는 빛이 전면으로 반사되도록 한다.The light emitting reflecting surface (30 in FIG. 3) has a flat surface and a sloping surface in order to reflect light emitted from the LED chip to the horizontal surface of the hybrid IC substrate to the front. The LED chip (40 in FIG. 3) is positioned at the center of the light emitting reflection surface so that the light emitted from the LED chip is reflected to the front side.

도 4는 본 발명의 회로 제어부 회로구성도이다.4 is a circuit configuration diagram of the circuit control unit of the present invention.

도 4를 참조하면, 발광부(31), 전원부(32), 브리지 정류부(33), 전력소자부(34), 전류 감지부(35), 연산부(36), 제어부(37), 주위밝기 감지부(38)를 포함한다.Referring to FIG. 4, the light emitting unit 31, the power supply unit 32, the bridge rectifying unit 33, the power device unit 34, the current sensing unit 35, the calculating unit 36, the control unit 37, and the ambient light detecting unit (38).

이때, 상기 발광부(31)은 다수의 LED칩을 모든 행과 열에서 극성이 동일 방향을 갖도록 M행*N열의 매트릭스 구조로 배열하되 동일행에서는 직렬 연결되고 동일 열에서는 병렬 연결되어 망상으로 이루어 진다.At this time, the light emitting unit 31 is arranged in a matrix structure of M rows * N columns so that a plurality of LED chips have the same direction in all rows and columns, but in the same row is connected in series, in the same column is connected in parallel to form a mesh Lose.

상기에서 전력소자부(34)는 상기 제어부(37)의 제어신호에 따라 상기 브리지 정류부(33)의 출력전압을 펄스폭변조하여 출력되는 전류의 세기를 변경시키고 상기 발광부(31)의 각 LED칩에 순방향전류가 흐르도록 인가한다.In this case, the power device unit 34 pulse-modulates the output voltage of the bridge rectifying unit 33 according to the control signal of the control unit 37 to change the intensity of the output current, and each LED chip of the light emitting unit 31. To forward current.

본 발명의 동작은 다음과 같다.The operation of the present invention is as follows.

먼저, 상기 전원부(32)의 교류전압은 상기 브리지 정류부(33)에서 전파 정류되어 전력소자부(34)로 공급되고, 상기 전력소자부(34)에서 펄스폭 변조된 전압에 의해 상기 발광부(31)의 각 LED칩에 순방향 전류가 흐르게 됨으로써 상기 발광부(31)가 점등된다. 이때, 상기 전류감지부(35)에서는 상기 발광부(31)로 공급되는 전류의 세기를 감지하고, 상기 연산부(36)에서는 상기 전류감지부(35)에서 감지된 전류의 세기를 일정주기 동안 계속적으로 입력받아 평균치를 구하여 상기 제어부(37)로 출력한다.First, the AC voltage of the power supply unit 32 is full-wave rectified by the bridge rectifying unit 33 and supplied to the power device unit 34, and the light emitting unit 31 is formed by a pulse width modulated voltage by the power device unit 34. The light emitting part 31 is turned on by forward current flowing to each LED chip of the. At this time, the current sensing unit 35 senses the intensity of the current supplied to the light emitting unit 31, and the calculating unit 36 continuously continuously measures the intensity of the current sensed by the current sensing unit 35 for a predetermined period. The average value is obtained and output to the control unit 37.

상기 동작이 이루어지는 동안 상기 주위 밝기 감지부(38)에서는 전등이 설치된 주위의 밝기를 소정의 레벨신호로 감지하고, 그 결과를 상기 제어부(37)로 출력시킨다. 그후, 상기 제어부(37)에서는 상기 연산부(36)에서 구해진 전류의 평균치를 입력받는 동시에 상기 주위밝기 감지부(38)의 주위 밝기 레벨신호를 입력받고, 그에 따라 상기 전력소자부(34)로 제어신호를 출력하여 상기 발광부(31)로 공급되는 전류의 세기를 조절함으로써 상기 발광부(31)의 광도를 변경한다.During the operation, the ambient light sensor 38 detects the brightness of the surroundings of the lamps as a predetermined level signal, and outputs the result to the controller 37. Thereafter, the control unit 37 receives an average value of the current obtained by the operation unit 36 and at the same time receives an ambient brightness level signal of the ambient brightness detecting unit 38, and accordingly a control signal to the power device unit 34. The brightness of the light emitting unit 31 is changed by controlling the intensity of the current supplied to the light emitting unit 31.

결국, 교통신호등으로 사용한 경우 주위의 밝기가 밝으면 상기 발광부(31)로 공급되는 전류의 세기를 높여 식별이 용이하도록 하고, 주위의 밝기가 어두우면 상기 발광부(31)로 공급되는 전류의 세기를 낮추어 전력소비를 줄이게 된다. 예를 들어 가로등이나 조명등의 경우는 이와 반대로 한다.As a result, when used as a traffic light, if the surrounding brightness is bright, the intensity of the current supplied to the light emitting part 31 is increased to facilitate identification, and if the ambient brightness is dark, the current supplied to the light emitting part 31 is reduced. Lowering the intensity reduces power consumption. For example, in the case of a street lamp or a lighting lamp, the opposite is reversed.

발광부의 LED칩에 전류가 공급되면 발광을 하는데 이때 LED 칩(도 2의 51)에서 나온 빛은 발광 반사부(도2의 52)에서 반사되어 렌즈부(도 2의 50)를 통해 전면으로 발산된다. 또한 하이브리드 IC 기판상에 다수의 집적된 LED 칩(도 2의 51)에서 발생된 열은 하이브리드 IC 기판과 방열판(56)으로 전달되어 최종적으로 대부분 방열핀(55)로 전달되어 대기중으로 방열된다.When the current is supplied to the LED chip of the light emitting part, the light is emitted. At this time, the light emitted from the LED chip (51 in FIG. 2) is reflected by the light emitting reflector (52 in FIG. 2) and is emitted to the front through the lens unit (50 in FIG. 2). do. In addition, heat generated from a plurality of integrated LED chips (51 in FIG. 2) on the hybrid IC substrate is transferred to the hybrid IC substrate and the heat sink 56 and finally, most of the heat is transmitted to the heat radiation fins 55 to radiate heat into the atmosphere.

기존 LED 신호등은 직경이 30 센티미터 정도이고 높이가 15 센티미터 정도가 되기 때문에 부피가 크고 그에 따른 PCB가 커지며 기존 함체와 렌즈를 바꾸어야 하므로 가격의 저렴화 및 기존 백열 전구식은 전구만 교체하는데 비해 기존 함체를 바꾸어야하는 문제점이 있고 향후 수명이 다 될 때에 납이 있는 PCB폐기물이 다량 발생하는 문제점이 있으나 본 발명의 LED 전등은 다수의 LED 칩을 하이브리드 IC화한 발광부를 만들어 콤팩트하면서 다수의 LED칩을 작은 면적에 장착하여서 고광도의 하이브리드 IC형 LED 전등을 제공하므로써 상기의 문제점을 해결한 작용효과가 있다.Existing LED traffic light is about 30 centimeters in diameter and about 15 centimeters in height, so it is bulky and the PCB becomes bigger and the existing enclosures and lenses need to be replaced. Although there is a problem that a large amount of PCB waste with lead occurs when the end of life is to be reached in the future, the LED lamp of the present invention is made of a light emitting unit that hybridizes a plurality of LED chips, while mounting a plurality of LED chips in a small area By providing a high brightness hybrid IC-type LED light, there is an effect of solving the above problems.

특히, LED 조명등으로 사용할 때에는 부피가 커져 장착 및 외관상 사용하기가 부적합한 문제점있고, 또한 부피에 비해 광량이 부족하여 조명등으로 사용하기에는 부적합한 문제점이 있으나 본 발명의 하이브리드 IC형 LED전구는 이를 해결하는 작용효과가 있다.In particular, when used as an LED lamp, there is a problem that it is unsuitable to be used in the installation and appearance due to the large volume, and there is also a problem that is not suitable for use as a lamp due to the lack of light compared to the volume, but the hybrid IC type LED bulb of the present invention has the effect of solving this problem There is.

Claims (3)

하이브리드 IC기판상에 다수의 LED칩을 부착하고 칩 주위에 발광 반사면을 부착하며 LED칩이 부착된 위에 렌즈부를 부착하여 LED칩을 보호하고 하이브리드 IC 기판아래에 금속판을 부착하며, 금속판 밑에 부착된 방열판을 부착하고 하단에 회로제어부를 부착하고 그 하단에 소켓을 포함하여 구성되는 것을 특징으로 하는 하이브리드 IC형 LED 전등.Attach a number of LED chips on the hybrid IC board, attach the light emitting reflecting surface around the chip, attach the lens part on the LED chip to protect the LED chip, attach the metal plate under the hybrid IC board, and attach it under the metal plate. The hybrid IC type LED light fixture, characterized in that the heat sink is attached, and the circuit control unit is attached to the bottom and the socket is configured at the bottom. 청구항 1에 있어서, 발광 반사면은 측면이 경사면으로 된 것을 특징으로 하는 하이브리드 IC형 LED 전등.The hybrid IC type LED lamp according to claim 1, wherein the light emitting reflection surface has an inclined surface. 청구항 1에 있어서 방열판 측면에 방열을 용이하게 하는 방열핀이 부착되어 있는 것을 특징으로 하는 하이브리드 IC형 LED전등.The hybrid IC type LED lamp of claim 1, wherein a heat dissipation fin for facilitating heat dissipation is attached to a side surface of the heat dissipation plate.
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