KR20080041735A - Planar heat producing body, electric heating board for floor heating, and electric heating board aggregate for floor heating - Google Patents

Abstract

A planar heat producing body (30) has parallel circuits (41-44) each formed by parallelly connecting heat producing resistor wires that produce heat by electricity. The parallel circuits are parallely extended while being adjacent to each other, and the adjacent parallel circuits are sequentially electrically connected in series to form a heater circuit. An area (105) where no heat producing resistor wire is placed and that extends in parallel to the parallel circuits is formed along at least one perimeter edge section of the planar heat producing body. Each parallel circuit is placed in a parallel circuit area having a width determined by (Ri/R) x W, where W is the overall width of the planar heat producing body including the area (105) having no heat producing resistor wire is placed in it, Ri is the electric resistance of each parallel circuit, and R is the total electric resistance of the heater circuit.

Description

Planar heating element, floor heating plate, and floor heating plate assembly {PLANAR HEAT PRODUCING BODY, ELECTRIC HEATING BOARD FOR FLOOR HEATING, AND ELECTRIC HEATING BOARD AGGREGATE FOR FLOOR HEATING}

The present invention relates to a planar heating element, a floor heating plate, and a floor heating plate assembly, and in particular, a layout of the heating resistance wire used for the planar heating element.

Recently, as a means of warming the inside of a building, a floor heating system that uses heat, conduction heat, and convection efficiently in addition to a stove, a fan heater, and an air conditioner has been attracting attention. Underfloor heating systems are able to make the interior uniform and warm in order to efficiently utilize the three heat transfer methods, and for the quiet and clean heating system, new future demand is expected to increase.

Although a floor heating system may be comprised from one sheet of heat-heating boards, it is usually comprised by the floor boards of several heat-heating boards connected with each other. As a heat generating means used for the floor heating board, for example, the planar heating element described in patent 3463898 is known.

1 is a cross-sectional view taken in a plane parallel to the main surface of the heat transfer board for floor heating of the prior art. A planar heating element 130 is formed on the top surface of the floor heating board 120. The planar heating element 130 includes a plurality of parallel circuits 141 to 144 formed by connecting a plurality of heat generating resistance wires 133 connected in parallel to each other by heating. Each of the parallel circuits 141 to 144 is sequentially and electrically connected in parallel with each other through electrodes 131a, 131d, 131b, 131e, and 131c which are parallel to each other and are parallel to each other. The heater circuit is constituted by being connected.

To install floor heating boards, the floor heating boards are laid one by one between joists or floors, and flooring is laid thereon. Nailing area is required to fix the floor heating board to the floor under the floor, or to fix the flooring floor or the like on the floor heating board. To this end, generally, the rear surface 122 of the planar heating element 130 is fixed to the twigs 122 along the outer circumference, so that the area where the twigs 122 are installed is the nailing region 105.

2 is a plan view illustrating an example of an end portion of a heat transfer board for floor heating. The planar heating element has a width in a direction orthogonal to the direction in which the parallel circuits 141 to 144 extend (hereinafter referred to as the installation direction x) (hereinafter referred to as the installation orthogonal direction y). have. However, as shown in FIG. 1, when the twigs 122 are disposed on the outer circumference of the planar heating element 130 to form the nailing region 105, the heating resistance line 133 may be disposed in the nailing region 105. (Hereinafter, it may be referred to as the non-installation area 105 in place of the nailing area.) For this reason, the area | region of the width | variety which does not contain the non-installation area | region 105 of the planar heating element 130 is divided into area | regions A141-A144 at equal intervals, and parallel circuit ( 141-144).

(Initiation of invention)

(Problem that invention tries to solve)

In such a prior art arrangement of the heating resistance wire, since the heating resistance wire cannot be disposed in the nailing region of the outer circumference which extends in parallel with the laying direction x of the planar heating element, the temperature of this area decreases and a cold zone is generated. easy to do. In particular, when a plurality of floor heating heating boards are arranged side by side, the range in which the heating resistance wire cannot be arranged is enlarged so that the nailing regions are arranged adjacent to each other. For this reason, a cold zone becomes wide and there exists a possibility that temperature fall may also expand.

(Means to solve the task)

An object of the present invention is to provide a planar heating element capable of suppressing a temperature drop in the non-installation region even when there is a non-installation region of the heating resistance wire.

Another object of the present invention is to provide a heat transfer board for floor heating and a heat transfer board assembly for floor heating using such a planar heating element.

The planar heating element of the present invention is a planar heating element having a plurality of parallel circuits in which a plurality of heat generating resistance wires are connected in parallel by energizing. Each parallel circuit constitutes a heater circuit by connecting parallel circuits which are adjacent to each other and extend in parallel to each other and are electrically connected in series. A non-installation region of the heat generating resistance line is provided along at least one peripheral edge of the planar heating element that extends in parallel with the parallel circuit. Each parallel circuit measures the full width of the planar heating element including the non-installation area in the direction orthogonal to the direction in which the parallel circuit extends, and sets the electrical resistance of each parallel circuit to Ri and the total electrical resistance of the heater circuit. When it is set as R, it is arrange | positioned in the parallel circuit area | region which has the width determined by (Ri / R) x '.

Each parallel circuit is arranged in a parallel circuit region of a width in which the full width of the planar heating element including the non-installation region is allocated in proportion to the resistance ratio of each parallel circuit, that is, the heat generation ratio. Therefore, in the parallel circuit area including the non-installation area, although the heating resistance wire cannot be provided in the non-installation area itself, by installing the heating resistance wire in other areas, the average heat generation amount per unit area of each parallel circuit area is matched. It becomes possible. In other words, heat generation from the non-installation region does not occur, but it is possible to suppress the temperature drop in the non-installation region by increasing the average amount of heat generated per unit area in the adjacent region.

It is preferable that each of the heating resistance wires constituting each of the parallel circuits is arranged in a heating resistance wire area having a width obtained by dividing the width of the parallel circuit area of each parallel circuit by the number of heating resistance wires of each parallel circuit.

The floor heating heating board of the present invention is a floor heating heating board in which the above-described surface heating element is disposed on the upper surface. The heating board for floor heating has a heat insulating board fixed to the backside of the planar heating element and a heat insulating material fixed to the part surrounded by the nail on the backside of the planar heating element and the backside of the planar heating element at least along the periphery. It has a resin reinforcement member including an electrical connection portion with a heating element. The reinforcing member is provided with a space | gap part which bends, deforms, and accommodates a power supply line.

The heating board assembly for floor heating of this invention is the heating board assembly for floor heating which several sheets of the above-mentioned floor heating board were connected. Adjacent floor heating boards are electrically connected to each other by the power lines extending between parallel heating circuit boards in parallel with parallel circuits and between the heating boards for both floor heating, and mechanical connection means such that each heating board is folded and folded. Connected by When opening the folded floor heating heating boards and laying the floor heating heating boards so as to be in contact with the periphery of the floor heating heating boards, the air gap can accommodate the edge of the power line.

1 is a cross-sectional view taken in a plane parallel to the main surface of the heat transfer board for floor heating according to the prior art.

2 is a plan view showing an example of an end portion of a heat transfer board for floor heating.

3 is a cross-sectional view taken along a plane parallel to the main surface of the heat transfer board for floor heating according to the embodiment of the present invention.

FIG. 4A is a cross-sectional view taken along a line A-A 'of the floor heating board shown in FIG. 3. FIG.

FIG. 4B is a cross-sectional view taken along the line B-B 'of the heat transfer board for floor heating shown in FIG.

5 is a schematic diagram illustrating a construction method of a heat transfer board assembly for floor heating.

FIG. 6 is a cross-sectional view cut into a plane parallel to the main surface showing the inside of the reinforcing member 10. FIG.

Fig. 7A is a plan view seen from the opposite side of the main surface on which the crack plate of the heat transfer board for floor heating shown in Fig. 3 is installed.

FIG. 7B is a partial cross-sectional view of the planar heating element taken along line AA ′ of FIG. 7A.

8 is a diagram for explaining a method of connecting a power supply line to a planar heating element.

FIG. 9 is a partial detailed view of the vicinity of a portion B in the same view of the planar heating element shown in FIG. 7A. FIG.

FIG. 10 is a partial detailed view of the vicinity of the portion B of the planar heating element shown in FIG. 7A for explaining the arrangement pattern of the respective heating resistance wires in the parallel circuit. FIG.

FIG. 11 is a partial detailed view of the planar heating element corresponding to the vicinity of the portion B of FIG. 7A when the width of the parallel circuit region is different. FIG.

Fig. 12 is a partial detailed view of the planar heating element corresponding to the vicinity of the portion B in Fig. 7A when the width of the parallel circuit region is different.

FIG. 13 is a graph showing the temperature distribution of two heat transfer boards for floor heating in Example 1. FIG.

FIG. 14 is a graph showing the temperature distribution of two floor heating plates in Example 2. FIG.

(The best form to carry out invention)

EMBODIMENT OF THE INVENTION Below, embodiment of this invention is described with reference to drawings. 3 is a cross-sectional view taken along a plane parallel to the main surface of the heat transfer board for floor heating according to the embodiment of the present invention. FIG. 4A is a cross-sectional view taken along the line A-A 'of the floor heating board shown in FIG. 3, and FIG. 4B is a cross-sectional view taken along the line B-B'.

The flooring floor to which the heat-heating board 20 for floor heating can be attached is not specifically limited, For example, a wooden flooring floor, a concrete flooring floor, a dry sound insulation double floor, etc. are mentioned. The flooring material which can be placed on the heat transfer board 20 for floor heating is not particularly limited, but a tatami for floor heating, a wood floor material for floor heating, plywood + carpet, and the like can be suitably used.

The planar heating element 30 is disposed on the upper surface of the heat transfer board 20 for floor heating. On the back surface of the planar heating element 30, a twig 22 is arranged along the periphery of the heat transfer board 20 for floor heating. The heat insulating material 21 and the resin reinforcement member 10 are fixed to the part enclosed by the twig 22 in the back surface of the surface heating element 30. As shown in FIG. The reinforcing member 10 includes an electrical connection portion between the power supply line 12 and the planar heating element 30. The upper surface of the planar heating element 30 is covered with a crack plate 24. The reinforcing sheet 25 is disposed on a part or the front side of the bottom surface of the heat transfer board 20. Hereinafter, the structure of each part is demonstrated in detail.

The heat insulating material 21 is used to suppress the heat generated from the planar heating element 30 from being transferred to the rear surface of the heat transfer board 20 for floor heating, and to effectively transfer the heat to the upper flooring material of the heat transfer board 20 for floor heating. As the heat insulating material 21, it is preferable that it is lightweight and has a high heat insulation effect, and has heat resistance with respect to the normal use temperature of the heat transfer board 20 for floor heating. The heat insulating material 21 is a synthetic material of, for example, foamed resin such as foamed polyurethane, foamed polyethylene, foamed polypropylene, wood fiber molded body such as hard wood fiber board or lightweight wood fiber board, polyester fiber or polyether ketone fiber. It is formed from a felt mat made of fibers or the like.

The twigs 22 are formed of a light and strong material such as wood, plywood, lightweight plastic, or the like. By providing the twigs 22, the strength of the whole heating board 20 for floor heating can be increased. The twigs 22 are arranged in a frame shape on the outer circumference of the floor heating board 20, whereby the weight of the entire floor heating board 20 is reduced to suppress deformation such as warping due to its own weight. Installation workability of the heat transfer board 20 for floor heating is improved.

The twig 22 also has a function of securing an area for fixing the heat transfer board 20 for floor heating to the floor surface. The heat transfer board 20 for floor heating is fixed to the ground floor by nailing, screwing, gluing, inserting, etc., for example. When fixing the heat transfer board 20 for floor heating, the area in which the twigs 22 are installed is used. By marking an area that can be nailed to the floor heating board 20, the electrical heating or the electrical components of the planar heating element 30 are adversely affected when the floor heating board 20 is fixed to the floor by nailing or the like. You can prevent it from spreading. The area | region where the remnant 22 of the planar heating element 30 is fixed becomes the non-installation area 105 in which the heating resistance wire (described later) cannot be provided.

The crack plate 24 uniformly disperses the heat generated in the planar heating element 30 in the inward direction of the plane and transmits it to the flooring material. The crack plate 24 is formed of a metal foil or plate such as aluminum or copper, for example. The crack plate 24 is, for example, an aluminum plate having a thickness of 40 to 150 μm, and is attached to the surface of the planar heating element 30. By providing the crack plate 24, dispersion of the temperature distribution of the planar heating element 30 can be reduced.

The reinforcing sheet 25 is fixed to the rear surface of the heat transfer board 20 for floor heating. The reinforcing sheet 25 is fixed to the lower surfaces of the reinforcing member 10, the heat insulating material 21, and the remnant 22 to improve the strength of the heat transfer board 20 for floor heating, and the heat transfer board 20 for floor heating. To protect the internal circuit. The reinforcing sheet 25 may be, for example, paper such as crepe paper, Warifu (registered trademark) such as polypropylene, polyethylene, or polyester, or warifu and laminate of paper, plastic, asphalt, and various waterproofing materials. It is formed from a plastic molded plate such as a sheet or a bakelite (registered trademark), or a metal plate such as tin or aluminum or stainless steel. The reinforcing sheet 25 may be formed of a composite material of such a material.

The shape of the reinforcement member 10 is kept in the thickness direction by the rib 13 which rose from the base 15. In the reinforcing member 10, the gap 14 is secured by the ribs 13. In the cavity 14, a power supply line 12 for supplying power to the planar heating element 30 is accommodated. Reinforcement to secure a space for the lead wires 12a to 12c (see FIG. 8) branched from the power supply line 12 to rise toward the electrodes 31a to 31c (see FIG. 7A) provided in the planar heating element 30. The penetrating blood 11a-11c which extends in the thickness direction is provided in the member 10. As shown in FIG.

By adjoining the peripheral parts 28 extending in the laying direction x, several heat transfer boards 20 for floor heating can be used adjacently. The configuration in which several heating boards for floor heating are connected is referred to herein as a heating board assembly 100 for floor heating. The power supply line 12 extends between the adjacent heat-heating boards 20 in the orthogonal direction y, and electrically connects the two heat-heating boards 20 for floor heating. The periphery 22c of the heating board 20 for floor heating is provided with a hole 22c and is connected to the hole 22c of the adjacent heating board 20 for connection with a connection strip 27. As a result, the heat transfer boards 20 for floor heating which are adjacent to each other are mechanically connected. An appropriate gap is secured by the connection strip 27 between adjacent floor heating boards 20 so that the floor heating boards 20 can be folded without folding. The space | interval of the heating boards 20 for floor heating can be adjusted with the length of the connection strip 27. As shown in FIG.

FIG. 5: is a schematic diagram explaining the construction method of the heat exchanger board assembly for floor heating. FIG. First, as shown in the upper left of the figure, the aggregate 100 is brought into the room in a state of being alternately folded to the connecting portion of the heat transfer board 20 for floor heating. Next, as shown in the upper right corner of the drawing, the aggregate 100 is stretched and expanded. Then, as shown in the lower left of the figure, the aggregate 100 is fully developed and spread on the floor surface. Then, the heating strips 20 connecting the floor heating plates 20 are pulled up, and the space between the floor heating plates 20 so as to be in contact with the periphery 28 of the floor heating plates. After filling, the connecting strip 27 is cut and removed. After the above steps, as shown in the lower right of the figure, the heat transfer boards 20 for floor heating are fixed in a state where they are bonded to each other, and the installation of the assembly 100 is completed.

As described above, in the state where the floor heating board 20 is folded, a gap is set between adjacent floor heating boards 20, and after fixing, the floor heating boards 20 are brought into close contact with the adjacent floor heating boards 20. Therefore, as shown in FIG. 6, the part of the power supply line 12 which arises when the heat-heating boards 20 for floor heating adhere | attached to the space | gap part 14 of the reinforcement member 10 is a power supply line 12. By bending it like a broken line and transforming it, there is enough room to store it.

The planar heating element 30 is composed of several heat generating resistance wires made of carbon fiber. The thickness of the planar heating element 30 is preferably 2 mm or less, more preferably 0.8 mm or less. As a precedent of the planar heating element 30, the fiber reinforced resin molded object disclosed by Unexamined-Japanese-Patent No. 8-207191 is mentioned, for example. The fiber reinforced resin molded body is a fiber reinforced prepreg sheet and a polyester film made of glass epoxy, after connecting the conductive fiber and the electrode to both ends of the mesh structure formed by joining the intersection points of the non-conductive fiber and the conductive fiber made of carbon fiber. It is formed by stacking a resin film for insulation such as.

Fig. 7A is a plan view of the heat transfer board for floor heating shown in Fig. 3 seen from the opposite side of the main surface on which the crack plates are provided. FIG. 7B is a partial cross-sectional view of the planar heating element taken along line AA ′ of FIG. 7A. 7B shows upside down. In Fig. 7A, the twigs and the heat generating resistance lines are not strictly shown, but are shown for convenience of explanation. The planar heating element 30 has a constant length, and has heating resistance wires 32a to 32e, 33a to 33e, 34a to 34e, and 35a to 35e which are linear and parallel to each other. In Fig. 7A, the planar heating element 30 coincides with the planar dimensions of the heat transfer board 20 for floor heating. The heat generating resistance wires 32a to 35e are fitted to the spherical fiber reinforced prepregs 2 and 4, and the resin film 1 is laminated on the fiber reinforced prepregs 2, and the cracked plate 24 is placed thereon. ) Are stacked. The resin film 5 is laminated on the fiber reinforced prepreg 4.

The heat generating resistance wires 32a to 35e generate heat by energizing. The heating resistance wires 32a to 32e are connected in parallel between the electrode 31a and the electrode 31d to form one parallel circuit 41 for connecting the electrode 31a and the electrode 31d. . The heating resistance wires 33a to 33e are connected in parallel between the electrode 31d and the electrode 31b to form one parallel circuit 42 for connecting the electrode 31d and the electrode 31b. The heat generating resistor lines 34a to 34e are connected in parallel between the electrode 31b and the electrode 31e to form one parallel circuit 43 for connecting the electrode 31b and the electrode 31e. The heating resistance wires 35a to 35e are connected in parallel between the electrode 31e and the electrode 31c to form one parallel circuit 44 for connecting the electrode 31e and the electrode 31c. In this way, each parallel circuit constitutes a heater circuit by connecting parallel circuits which are adjacent to each other and extend in parallel to each other and are sequentially connected electrically in series. An overheat prevention device (not shown), such as a thermostat, may be provided between the electrode 31a and the power supply line 12, and this may be incorporated in the heat transfer board 20 for floor heating.

The number of heat generating resistance wires constituting the parallel circuits 41 to 44 is not particularly limited, but about 3 to 12 are preferable. Although the number of parallel circuits is not particularly limited, however, it is preferable to configure four heater circuits by connecting four to eight parallel circuits in series.

In addition, instead of the structure which repeats between the both ends of the floor heating heat-transfer board 20 through the electrode 31d, 31e which is not connected to the power supply line 12, the heating resistance wire of a linear state is an electrode. It is also possible to employ a configuration in which the heating resistance wire itself is repeated without providing the 31d and 31e.

The heat generating resistance wires 32a to 35e are each made of carbon fibers having the same diameter. Carbon fiber is excellent in durability and is a suitable material for the heating resistance wires 32a to 35e. The heat generating resistance wires 32a to 35e may be formed of a nichrome wire or may be formed by coating a carbon-based conductive paint using a printing technique.

An electrode 31b serving as a central electrical connection portion is provided between a central position where the number of parallel circuits connected in series is equal to each other, that is, between the parallel circuit 42 and the parallel circuit 43. For this reason, the parallel circuits (one set of parallel circuits 41 and 42 and one set of parallel circuits 43 and 44) on both sides with the electrode 31b sandwiched end portions corresponding to the electrodes 31b. The electrical resistances between the electrodes 31a and 31c are the same.

In the floor heating heating board 20 according to the present embodiment, the entire parallel circuits 41 to 44 can be energized between the electrodes 31a and 31c as one series circuit (operation pattern 1). . Also, one set of parallel circuits 41 and 42 is energized as a series circuit between the electrodes 31a and 31b, and at the same time, one set of parallel circuits 43 and 44 is connected to the electrode 31b. It is also possible to energize as another series circuit between () and (31c) (operation pattern 2). The two operation modes can be easily switched by switching the connection of the electrode 31b to the power supply.

This operation mode switching method is effective when the floor heating heating board 20 is used at a different power supply voltage. Since the heat generation amount is proportional to the square of the voltage, if the power supply voltage is different, the heat generation amount of the heating board 20 for floor heating is largely undesirable. However, although the power supply voltage varies depending on the country, it can be largely divided into a 100 mA series and a 200 mA series. Therefore, it is sufficient that the amount of heat generated can be controlled to the same level with respect to both the source voltages.

When the resistance between the electrodes 31a and 31b and the resistance of the parallel circuit between the electrodes 31b and 31c are each R, the resistance of the planar heating element 30 in the driving pattern 1 is 2R. Since the calorific value can be found at Ｖ ² / R for the voltage V and the resistance R, when the operation pattern 1 is selected for a power supply voltage of 200 [kW], the calorific value is P = 200 ² / 2R = 20000 / R. On the other hand, in the operation pattern 2, since the circuits of the resistor R are arranged in two rows in parallel, the resistance value of the planar heating element 30 becomes 1 / {(1 / R) + (1 / R)} = R / 2. When operation pattern 2 is selected for a power supply voltage of 100 [kW], the heat generation amount is P = 100 ² / (R / 2) = 20000 / R, and theoretically, 100 [kW] power supply voltage and 200 [kW] The same amount of heat can be obtained with respect to the power supply voltage. Thus, in the case where the voltage applied is 100 [kW] and 200 [kW], the amount of heat generated can be made the same by simply changing the electrode connected to the power supply line.

In order to enable the operation pattern 2, it is necessary to use the electrode 31b as the central electrical connection portion, so that the electrode 31b is advantageously provided on the same side as the electrodes 31a and 31c. Therefore, the number of parallel circuits is preferably even, and the arrangement of the heating resistance wires in each of the parallel circuits and the parallel circuits, in order to further provide the electrical resistance of both sides of the central electrical connection portion, is arranged in the direction of laying the central electrical connection portion (x). It is preferable that the line symmetry is centered on the center line (c) extending by.

The electrodes 31a-31e are comprised, for example with metal foils, such as copper and aluminum. The connection parts 36a-36c connected to the power supply line 12 are provided in the electrodes 31a-31c, respectively.

Referring to Fig. 7B, the electrodes 31a to 31e are formed so as to cover the heating resistance wires 32a to 35e from one side (Fig. 7B shows only the electrode 31b. The same applies to the other members.). Metal wire meshes 3a to 3c are stacked on the electrodes 31a to 31c, respectively. The metal wire meshes 3a to 3c are composed of metal fibers, metal fiber fabrics, punched metals, expanded metals, metal mesh belts, and the like. The metal wire meshes 3a to 3c have an effect of fixing solder, which is a connecting means, when the lead wire 12a (see FIG. 8) connected to the power supply line 12 is connected to the electrodes 31a to 31c.

In the position near the electrodes 31a to 31c of the fiber-reinforced prepreg 4, the through blood 4a to 4c is formed in order to establish electrical connection between the power supply line 12 and the electrodes 31a to 31c. have. Penetrating blood (4a ~ 4c) has a diameter of about 5 ~ 50mm. In the resin film 5 laminated on the fiber-reinforced prepreg 4, penetrating bloods 5a to 5c having sizes including penetrating bloods 4a to 4c are formed.

8 is a diagram for explaining a method of connecting a power supply line to a planar heating element. First, the heat transfer for floor heating is performed such that the through blood 4a to 4c provided on the surface heating element 30 against the fiber-reinforced prepreg 4 oppose the through blood 11a to 11c provided on the reinforcing member 10, respectively. The board 20 is incorporated. In addition, only the through-holes 4a and 11a are shown in the figure, and the following description is given to the through-holes 4a and 11a. However, the through-bloods 4b, 4c, 11b, and 11c are shown. The same is true for. Next, the lead wire 12a connected to the power supply line 12 is connected to the electrode 31a by the solder 6 via the through blood 4a, 11a. The solder 6 is firmly connected to the electrode 31a by the fixing effect of the metal wire mesh 3a provided on the electrode 31a. It is also conceivable to connect the heating resistance wire through only the metal wire mesh 3a without providing the electrode 31a, but resin is impregnated in the fiber-reinforced prepreg 2 at the time of molding to cover the metal wire mesh 3a. There is a possibility to do it. Therefore, a configuration in which the electrode 31a is provided and the metal wire mesh 3a is laminated thereon is preferable.

After that, by filling the resin 7 in the through blood 11a provided in the reinforcing member 10, the lead wire 12a connected to the power supply line 12 is firmly connected to the planar heating element 30, thereby waterproofing. can do. Examples of the resin 7 filled in the penetrating blood 11a include thermosetting resins such as epoxy resins and silicone resins, and thermoplastic resins such as polypropylene.

Next, the arrangement pattern of the heating resistance wire will be described. FIG. 9 is a partial detailed view of the planar heating element shown in FIG. 7A near the portion B in the same view. Each of the parallel circuits 41 to 44 has a full width 에 in the orthogonal direction y of the planar heating element 30, the electrical resistance Ri of each of the parallel circuits 41 to 44 (but i = 41 to 44), With respect to the total electrical resistance R of the heater circuit (that is, the sum of the electrical resistances of the parallel circuits 41 to 44),

wi = (Ri / R) × Ｗ (Equation 1)

It is arrange | positioned in the parallel circuit area | regions A41-A44 which have the width | variety w41-w44 determined by this. The full width of the heat generating element 30 includes the width of the non-installation region 105.

First, as a simple case, consider the case where the widths w41 to w44 of the parallel circuit areas A41 to A44 are all the same. In this case, the electrical resistances R41 to R44 of the parallel circuits 41 to 44 are all the same as in Equation (1). Although the parallel circuit area | region A41 contains the non-installation area | region 105 of the heating resistance wire which arises by arrange | positioning the twig 22, the parallel circuit 41 cannot be arrange | positioned in the non-installation area | region 105. FIG. For this reason, the heating resistance wires 32a to 32e are arranged in the region of the width w41 'except for the non-installation region 105 in the parallel circuit region A41. That is, the heat generating resistor lines 32a to 32e are arranged at an array pitch smaller than that of the heat generating resistor lines 33a to 33e provided in the parallel circuit area A42. Although the electrical resistances R41 and R42 of the parallel circuits 41 and 42 are the same, the amount of heat generated in the parallel circuit area A41 and the amount of heat generated in the parallel circuit area A42 are the same. Similarly, the amount of heat generated in the parallel circuit area A43 and the amount of heat generated in the parallel circuit area A44 become the same, and consequently, the amount of heat generated in each of the parallel circuit areas A41 to A44 is the same. Since the widths w41 to w44 of the parallel circuit areas A41 to A44 are also the same, the average amount of heat generated per unit area of the parallel circuit areas A41 to A44 is the same. In this way, even if the parallel circuit areas A41 and A44 include an area where some of the heating resistance wires cannot be provided, the heating resistance wires are densely arranged to arrange the heating resistance wires so as to satisfy Expression (1). The heat generation of the heating element 30 can be equalized.

FIG. 10 is a partial detailed view of the vicinity of the portion B of the planar heating element shown in FIG. 7A for explaining the arrangement pattern of each of the heat generating resistance lines in the parallel circuit. All of the heat generating resistance wires which cannot be arranged because the heat generating resistance wire regions a11 to a45 and the non-installation region 105 overlap each other are arranged in the heat generating resistance wire region that can be arranged near the non-installation region. That is, a part of the heat generating resistance lines constituting each parallel circuit is arranged in the heat generating resistance line region having a width obtained by dividing the width of the parallel circuit region of each parallel circuit by the number of heat generating resistance lines of each parallel circuit. However, the remaining heat generating resistance wire which should be able to be allocated to the heating line area at least partially overlapping the non-installation area is arranged in the heating line area near the non-installation area. Specifically, the parallel circuit area A41 is divided into five areas A11 to A15, and the heating resistance wires 32b to 32e are disposed in the corresponding areas a12 to al5. However, since the heating resistance wire 32a cannot be disposed in the corresponding area a11, the heating resistance wire 32a is disposed together with the heating resistance wire 32b in the adjacent area a12 near the non-installation area 105. The same applies to the heat generating resistance line 35e of the parallel circuit area A44. In this arrangement pattern, the average amount of heat generated per unit area of the parallel circuit areas A41 to A44 is not only the same, but also the average amount of heat generated per unit area of the areas a13 to a15 and the parallel circuit area A44 of the parallel circuit areas A41. The average amount of heat generated per unit area of the areas a41 to a43 is the same as that of the parallel circuit areas A42 and A43, so that the heat generated by the planar heating element 30 can be evenly equalized. In the non-installation region 105, the required amount of heat can be supplied from the adjacent region a12, so that the temperature decrease can be minimized.

In addition, in this embodiment, although the non-installation area | region 105 of a heat generating resistance wire is provided along the periphery 28 of both sides extended in the laying direction x, the structure provided only in the periphery 28 of one side is also possible. In this case, in the region where the non-installation region is not provided, the heating resistance wire may be arranged at the same pitch as the center portion.

Next, when the widths w41 to w44 of the parallel circuit regions are different, first, the electrical resistances R41 to R44 are calculated by equation (1). The electrical resistances R41 to R44 are also different from the equation (1) in order that the electrical resistances R41 to R44 become a value proportional to the widths w41 to w44 of the corresponding parallel circuit areas A41 to A44. There are two ways to change the electrical resistance (R41 ~ R44). One method is to change the resistance value per unit length of each heating resistance wire for each of the parallel circuit areas A41 to A44. Specifically, it is conceivable to change the thickness of the heating resistance wire in each parallel circuit in whole or in part. For example, in the Example mentioned later, what is necessary is just to change the heat generating resistance wire of 3000 filament into heat generating resistance wire, such as 1000 filament or 6000 filament.

Another method is a method in which the number of the heating resistance wires is different for each of the parallel circuit areas A41 to A44. FIG. 11 is a diagram for explaining an arrangement pattern of heating resistance lines when the number of heating resistance wires is changed according to the width of the parallel circuit area when the widths of the parallel circuit areas are different. Partial detail view of the corresponding planar heating element. The ratio of the width w41 of the parallel circuit area A41 to the width w42 of the parallel circuit area A42 is 7: 4. Therefore, the resistance ratio of the resistance R41 of the parallel circuit 41 and the resistance R42 of the parallel circuit 42 is 7: 4 rather than equation (1). In order to realize this resistance ratio, as shown in the figure, four heating resistance wires having the same diameter are arranged in the parallel circuit area A41, and seven heating resistance wires having the same diameter as the four heating resistance wires in the parallel circuit area A42. I install it.

The above can also be changed as follows. That is, if the number of heat generating resistance lines in the parallel circuit area is reduced, the electrical resistance increases in inverse proportion to the number, resulting in a larger width of the parallel circuit area than in equation (1). In addition, since the number itself of the heating resistance wires is also reduced, the synergistic effect of the heating resistance wires makes it possible to secure a large area width of each of the heating resistance wires. As a result, the heating resistance wire can be arranged in the region including the non-installation region. In this arrangement pattern, the areas a11 to a14, b11 to b17, and c11 to c17 of the parallel circuit areas A41 to A44, respectively.

) and (d11 to d14) can be arranged a heat generating resistance wire.

As described above, in some regions adjacent to the non-installation region, it may be difficult to evenly arrange the heating resistance wires. However, in this embodiment, since the share width of each heating resistance wire can be increased by reducing the number of heating resistance wires in the parallel circuit area including the non-installation area, the interval between the heating resistance wires can be extended. For this reason, in this arrangement pattern, not only the average amount of heat generated per unit area of the parallel circuit areas A41 to A44 is the same, but also the average amount of heat generated per unit area of each area where the parallel circuit area is divided equally, so that the surface heating element The heat generation of 30 can be equalized further.

When the width of the twigs 22 is reduced, it is easy to arrange the heat generating resistance line 32a in the region a11, which is more effective. However, even when the heating resistance wire 32a cannot be arranged in the area a11, the same effect can be obtained by arranging two heating resistance wires together in an area adjacent to the non-installation area as shown in FIG. .

Example

(Example 1)

First, the planar heating element which consists of parallel circuits 41 and 44 which connected four heat generating resistance wires in parallel, and parallel circuits 42 and 43 which connected seven parallel connections was created. The planar heating element produced in this embodiment is the same as that shown in Fig. 7A, but the number and arrangement of the heating resistance wires constituting the parallel circuits 41 to 44 are as shown in Fig. 12.

First, the width of each parallel circuit area | region was calculated | required as Table 1 by Formula (1), and each heat generating resistance line was arrange | positioned so that parallel circuits 41-44 may be arrange | positioned in the corresponding parallel circuit area | regions A41-A44. As the heat generating resistance wire, carbon fiber (Tore T300 x 3000 filament) having a resistance value of 1 m 3 / m 3 was used. Among the areas where the parallel circuit areas A41 and A44 are divided into four, the areas a11 and d14 have a nailing area having a width of 30 mm, and there is no room for arranging the heating resistance wires. Two heat generating resistance wires were arrange | positioned at (d13). In the other areas, the heating resistance wires were arranged one by one.

Next, a heat generating resistance wire was sandwiched from the top and bottom by a 5 mm-thick glass fiber fabric, and a mesh-like fabric was fabricated by joining intersection points with thermoplastic resin. This rough cloth was cut | disconnected to length 1720mm, the parallel circuit which mutually adjoins mutually was sequentially connected by the copper foil tape of width 15mm, and the predetermined parallel circuit and the series circuit were formed. Thereafter, the fabric was sandwiched from above and below with a prepreg impregnated with a glass fiber fabric with an epoxy resin to form a laminate. An aluminum plate having a thickness of 100 μm and a PET film having a thickness of 100 μm are pasted on the laminate, and the alpet is placed so that the PET film is on the laminate side. Furthermore, a 50-micrometer-thick PET film is placed on the bottom of the laminate and heated under pressure to cure the epoxy resin. As a result, a planar heating element having a length of 1820 mm, a width of 455 mm, and a thickness of 0.5 mm in which the heating resistance wires were arranged in a straight and parallel length of 1690 mm was obtained.

Next, 30 mm in width and 8.5 mm in thickness were attached to the outer periphery of the surface of the planar heating element on which the aluminum plate was not attached. In addition, an insulation material made of expanded polypropylene (foaming ratio 12 times) having a thickness of 8.5 mm was attached to the part surrounded by the twigs. And the resin reinforcement member of FIG. 6 was attached to the connection part of the planar heating element, and the power supply line was attached to the electrode. Thereafter, crepe paper was attached to the portion of the remnants and the heat insulating material, and an aluminum plate having a thickness of 0.4 mm was attached to the portion of the reinforcing member, and a lid was formed to form a heat transfer board for floor heating. The two heating boards for floor heating are lined up on the floor under the floor with the aluminum plate of the surface heating element on the floor, and a 12 mm thick plywood simulated the flow is placed. Authorized. At that time, it controlled so that plywood surface temperature might be about 30 degreeC, and the temperature distribution of the width direction (the laying orthogonal direction (y)) of the plywood surface was measured.

As a result, as shown in FIG. 13, the temperature fall in the connection ring of the two floor heating boards was suppressed to about 1 degreeC, and the floor heating with few cold zones was realizable.

TABLE 1

Parallel circuit Electrical resistance of parallel circuits Width of parallel circuit area Area of exothermic resistance wire Width of heating resistance wire area (mm)  Parallel circuit 41, 44  64.64Ω  144.8 mm Zone a11, d11 36.2 Zone a12, d12 36.2 Zone a13, d13 36.2 Zone a14, d14 36.2   Parallel circuit 42, 43   36.94Ω   82.7 mm Zone b11, c11 11.8 Zone b12, c12 11.8 Zone b13, c13 11.8 Zone b14, c14 11.8 Zone b15, c15 11.8 Zone b16, c16 11.8 Zone b17, c17 11.8

(Example 2)

In the same manner as in Example 1, a planar heating element composed of parallel circuits 41 and 44 in which four heating resistance wires were connected in parallel and parallel circuits 42 and 43 in seven parallel connections was prepared. In this embodiment, the width of the twigs is set small to 15 mm. For this reason, as shown in Fig. 11, one heating resistance wire can be arranged in both the parallel circuit areas A41 and A44 divided into four and the parallel circuit areas A42 and A43 divided into seven. Other preparation methods and measurement methods are the same as in Example 1.

As a result, as shown in Fig. 14, the temperature drop in the link between the two heat transfer boards was further reduced to about 0.5 ° C, thereby realizing floor heating with almost no cold zone.

(Effects of the Invention)

As described above, according to the present invention, even when there is a non-installation region of the heating resistance wire, a planar heating element capable of suppressing a temperature drop in the non-installation region can be provided. Moreover, according to this invention, the heat-heating board for floor heating and the heat-heating board assembly which use such a planar heating element can be provided.

Claims (7)

It is a planar heating element having a plurality of parallel circuits in which a plurality of heat generating resistance wires are connected in parallel by heating. Each parallel circuit constitutes a heater circuit by connecting parallel circuits which are adjacent to each other and extend in parallel to each other and are sequentially connected electrically in series. A non-installation region of the heating resistance wire is provided along at least one peripheral edge of the planar heating element that extends in parallel with the parallel circuit, Each of the parallel circuits subtracts the full width of the planar heating element including the non-installation region in the direction orthogonal to the direction in which the parallel circuit extends, and sets the electrical resistance of each parallel circuit to Ri and the total electrical resistance of the heater circuit. When R is set to R, the planar heating element arranged in a parallel circuit region having a width determined by (Ri / R) × Ｗ. The heat generating resistance wire according to claim 1, wherein each heat generating resistance wire constituting each parallel circuit is arranged in a heat generating resistance wire area having a width obtained by dividing the width of the parallel circuit area of each parallel circuit by the number of the heat generating resistance wires of each parallel circuit. Planar heating element. The heat generating resistor line according to claim 1, wherein a part of the heat generating resistor lines constituting each parallel circuit is disposed in the heat generating resistor line region having a width obtained by dividing the width of the parallel circuit region of each parallel circuit by the number of the heat generating resistance lines of each parallel circuit. , And the remaining heat generating resistance wire to be allocated to the heat generating line region at least partially overlapping the non-installing region is disposed in the heating line region near the non-installing region. The method of claim 1, wherein some of the parallel circuit has a larger width than the other parallel circuit, The parallel circuit having the above-mentioned large width is a planar heating element which is composed of a smaller number of said heat generating resistance wires than said other parallel circuits. The method of claim 1, wherein the parallel circuit is provided in an even number, A central electrical connection is provided at a central position where the number of parallel circuits connected in series is the same; The planar heating element, wherein the parallel circuits on both sides of the central electric connection portion, are made to be energized as series circuits independent of each other and independent of each other between the central electric connection portion and the corresponding end portion. The planar heating element described in claim 1 is a heat transfer board for floor heating disposed on the upper surface, The heat transfer board is at least along the periphery, nailable remnants fixed to the back surface of the planar heating element, A heat insulating material fixed to a portion surrounded by the twigs on the back surface of the planar heating element, A resin reinforcing member fixed to the rear surface of the planar heating element and including an electrical connection portion between the power supply line and the planar heating element; Take it, The reinforcing member, the heating board for floor heating, having a gap portion for bending and deforming the power line to accommodate. The heating board assembly for floor heating according to claim 6 is connected to a plurality of heating board for floor heating, Adjacent said heating boards for floor heating are electrically connected by the said power line extending between both heating boards for floor heating between the peripheral parts which extend in parallel with the said parallel circuit and oppose each other, and each heating board overlaps, Connected by mechanical connecting means to be folded, When opening the folded floor heating heating boards and laying the floor heating heating boards so that the opposing peripheral portions of each floor heating heating boards come into contact with each other, the air gaps may accommodate the opening of the power line. Heating board assembly for floor heating.

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