KR20080020310A - Metal deposition method of lighting lamp case - Google Patents

Metal deposition method of lighting lamp case Download PDF

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KR20080020310A
KR20080020310A KR1020060083647A KR20060083647A KR20080020310A KR 20080020310 A KR20080020310 A KR 20080020310A KR 1020060083647 A KR1020060083647 A KR 1020060083647A KR 20060083647 A KR20060083647 A KR 20060083647A KR 20080020310 A KR20080020310 A KR 20080020310A
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metal
coating
lamp case
synthetic resin
deposition method
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KR1020060083647A
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KR100839644B1 (en
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정명철
서동석
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주식회사 이엠테크
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

A metal coating method of illumination lamp cases is provided to manufacture illumination lamp cases or working lamp protecting caps that are resistant to heat by thinly coating a metallic material on surfaces of illumination lamp cases or working lamp protecting caps in a vacuum chamber by using a sputtering method or a vacuum deposition method. In a method for coating a metallic material on a synthetic resin by using a deposition method that is capable of simultaneously performing sputtering and vacuum deposition in a chamber, a metal coating method of illumination lamp cases comprises forming a coating film of at least one metallic material selected from metal and metal alloy on surfaces of the illumination lamp cases. The metal includes Al, Ag, Cu, Ni, Cr, Ti, W, Mo, and stainless steel. The coating film of the metallic material has a thickness of 5 to 30 micrometers.

Description

조명등 케이스의 금속코팅방법{metal deposition method of lighting lamp case}   Metal deposition method of lighting lamp case

도 1 본 발명에 의한 배럴 증착형 진공증착장치의 개략도   1 is a schematic diagram of a barrel deposition vacuum deposition apparatus according to the present invention

도 2 스퍼터링 타겟의 단면도   2 is a cross-sectional view of the sputtering target

도 3 이바포레이션증착장치의 개략도   3 is a schematic view of the vapor deposition apparatus

<도면의 주요 부분에 관한 부호의 설명>   <Explanation of symbols on main parts of the drawings>

10 ; 스퍼터링장치 11, 12, 13 ; 스퍼터링 타겟     10; Sputtering devices 11, 12, 13; Sputtering target

14, 15, 16 ; 고전압 전원장치 17 ; 배럴     14, 15, 16; High voltage power supply 17; Barrel

18 ; 합성수지 모재 20 ; 이바포레이션장치      18; Synthetic resin substrate 20; Evaporation Device

21, 22, 23,24, 25, 26 ; 이바포레이션타겟     21, 22, 23, 24, 25, 26; Evaporation Target

30 ; 진공용기 31 ; 구동부      30; Vacuum vessel 31; Driving part

본 발명은 하나의 진공챔버를 사용하여 조명등 케이스 또는 작업등 보호망에 스퍼터링방법과 진공증착방법 등을 이용하여 금속물질을 코팅하여 열에 강한 조명등 케이스 또는 작업등 보호망을 제조하는 방법이다.      The present invention is a method of manufacturing a lamp case or work lamp protection net resistant to heat by coating a metal material using a sputtering method and a vacuum deposition method to the lamp case or work lamp protection net using a single vacuum chamber.

종래의 조명등 및 작업등의 케이스는 알루미늄, 스테인레스강 등 금속 재질로 사용하였으나, 매우 무겁고 생산원가가 비싸 작업현장에서 실제 사용하기가 불편하였다.Conventional lighting and work case is used as a metal material, such as aluminum, stainless steel, but very heavy and expensive production cost was inconvenient to actually use in the workplace.

그리고 PVC 등 합성수지의 조명등 케이스 또는 작업등 보호망은 철제에 비해 매우 가벼우나, 조명등에서 발산되는 열에 의해 휨현상 등이 발생되고 또한 열에 약하여 외부에서 약간의 충격 등을 가하면 부서지거나 파손되는 경향이 있어 장시간 사용할 수 없는 단점이 있었다.     In addition, the lighting case or work protection net of synthetic resin such as PVC is much lighter than steel, but warpage occurs due to the heat emitted from the lighting, and it is weak to heat, so it tends to break or break when a little impact is applied from the outside. There was a disadvantage.

특히, 야외용 조명등, 작업등의 경우 철제로 조명등 케이스 또는 작업등 보호망을 제작하는 경우에는 녹이 슬거나 부식 등의 우려가 많고 무거워 작업이 용이하지 못하는 문제점이 있었다.    In particular, in the case of outdoor lighting, such as work lamps, when manufacturing a light case or a work light protection net made of iron, there was a problem that there is a lot of rust or corrosion, etc.

본 발명은 하나의 진공 챔버를 사용하여 조명등 케이스 또는 작업등 보호망 등의 표면에 스퍼터링방법과 진공증착방법 등을 이용하여 금속물질을 얇게 코팅하 여 열에 강한 조명등 케이스 또는 작업등 보호망을 제공하는데 그 목적이 있다.     The present invention provides a lamp case or work lamp protection net resistant to heat by thinly coating a metal material using a sputtering method and a vacuum deposition method on the surface of the lamp case or work lamp protection net using a single vacuum chamber. There is this.

본 발명은 상기 종래의 문제점을 해결하기 위한 것으로 조명등 및 작업등의 케이스를 합성수지로 제작하여 스퍼터링방법과 진공증착법 등을 이용하여 스테인레스강, 은, 알루미늄, 니켈, 구리, 텅스텐, 탄탈륨 등의 금속 또는 금속합금을 하나 이상 선택하여 조명등 케이스 또는 작업등 보호망의 합성수지 표면에 금속물질을 얇게 코팅하는 것을 특징으로 한다.     The present invention is to solve the problems of the prior art by manufacturing a case of a lighting lamp and a work lamp made of synthetic resin, a metal or metal such as stainless steel, silver, aluminum, nickel, copper, tungsten, tantalum, etc. using a sputtering method and a vacuum deposition method Selecting one or more alloys is characterized in that a thin coating of a metallic material on the surface of the synthetic resin of the lamp case or work lamp protection net.

종래에는 무전해 도금법을 이용하여 모재에 금속피막을 형성하였는데 피막재료로써 촉매성이 강한 주기율표 Ⅷ족, 예를 들어 Ni, Co 등의 비철금속을 사용하였으나, 상기 무전해 도금법은 도금공정 중 도금액에 화학환원제를 첨가하여 사용함으로써 환경오염 문제를 야기시켰고, 도금액 속에 모재를 담궈 피막층을 형성하는 상기방법으로는 선택적인 단면 도금이 불가능하여 단면 도금을 실시해야 할 경우 도금면 이외의 다른 면은 마스킹(masking)하여 단면 도금을 실시해야 하므로 생산성이 저하되어 원가의 상승요인이 되었다. 특히, 상기 무전해 도금법에서는 합금류를 도금할 수 없어 이에 대체기술개발이 시급히 대두되게 되었다.     Conventionally, a metal film was formed on a base material by using an electroless plating method. As a coating material, a non-ferrous metal such as Ni, Co, etc. of the periodic table having strong catalytic properties was used. However, the electroless plating method is chemically applied to the plating solution during the plating process. The addition of a reducing agent caused environmental pollution, and the above method of forming a coating layer by immersing the base material in the plating solution is not possible. Since it is necessary to perform single-side plating, the productivity is lowered, which increases the cost. In particular, in the electroless plating method, alloys cannot be plated, and thus, alternative technology development has emerged urgently.

또한 최근 선진국에서는 진공증착기술이 크게 산업화되고 전자파 방해차단을 위한 여러 방법들이 연구되고 있으며, 이들 중 진공상태하에서 타겟의 금속입자를 방출시켜 모재 표면에 금속박막을 적층하는 일반증착법은 대전방지와 표면보호를 위해 개발된 피막 형성방법으로 작업압력이 10­³ torr영역이어서 타겟으로부터 방출된 증착입자가 진공실내의 스퍼터 가스와 충돌, 산란되는 효과가 커 모재 표면에 균일한 두께의 금속박막층을 형성하기 어려웠다.      In addition, in recent years, the vacuum deposition technology has been greatly industrialized and various methods for blocking electromagnetic interference have been studied. Among them, the general deposition method in which a metal thin film is laminated on the surface of the base material by releasing the metal particles of the target under vacuum conditions, is characterized by As the film formation method developed for the protection, the working pressure was 10³ torr, so that the deposited particles emitted from the target collided with and scattered by the sputter gas in the vacuum chamber. .

본 발명과 관련하여 적용된 증착방법에 대하여 구체적으로 살펴보면, 금속을 얇게 코팅하는 기술은 물리적인 방법을 이용하는 PVD(Physical vapour deposition)과 화학적 방법을 이용하는 CVD(Chemical vapour deposition)으로 분류할 수 있다. PVD는 CVD에 비해 작업조건이 깨끗하고, 진공상태에서 저항열이나 전자빔, 레이저빔 또는 플라즈마를 이용하여 고체상태의 물질을 기체상태로 만들어 기판상에 직접 코팅시키는 방법이다.    Looking at the deposition method applied in connection with the present invention in detail, the technique of coating a thin metal can be classified into physical vapor deposition (PVD) using a physical method and chemical vapor deposition (CVD) using a chemical method. Compared with CVD, PVD is a cleaner working condition, and is a method of directly coating a substrate in a solid state by using a heat of resistance, an electron beam, a laser beam, or a plasma in a vacuum state.

본 발명에서는 PVD방법을 이용하였으며, PVD방법 중에서 열증착(Evaporation)방법, 전기가열식 진공증착방법과 스퍼터링방법을 사용하였고, 진공증착법은 열증착방법과 전자빔 증착방법 중에서 열에 의한 증착법을 사용하였다.     In the present invention, the PVD method was used. Among the PVD methods, an evaporation method, an electric heating vacuum deposition method, and a sputtering method were used, and the vacuum deposition method was a thermal vapor deposition method or a thermal vapor deposition method.

즉 스퍼터링방법은 저온에서 증착과정을 수행하며, 증착물질이 직선운동을 하므로 플라즈마에 노출되지 않는 부위는 증착되지 않아 단면 피막이 용이하며, 피막 재료에 관계없이 전도성 피막형성이 가능하고 밀착성과 두께의 균일성이 뛰어난 금속피막층을 형성할 수 있다.     That is, the sputtering method performs the deposition process at low temperature, and since the deposition material moves in a straight line, the area not exposed to the plasma is not deposited, so that the cross-sectional film is easily formed, and the conductive film can be formed regardless of the coating material. It is possible to form a metal coating layer having excellent properties.

스퍼터링방법은 진공실내에 타겟과 합성수지 모재(18)를 대향되게 설치하고 타겟의 위쪽에 자석의 N극 및 S극이 교대로 오도록 배치하며, 타겟쪽에는 음극이, 합성수지 모재(18)쪽에는 양극이 오도록 회로를 구성한 자성 스퍼터링장치를 사용하여 전기를 흘려 보내면 플라즈마 방전이 일어나고 이온이 타겟을 타격하여 합성수지 표면에 증착된다.    In the sputtering method, the target and the synthetic resin base material 18 are installed in the vacuum chamber so as to face each other, and the N and S poles of the magnet are alternately placed on the upper side of the target. The negative electrode is on the target side, and the positive electrode is on the synthetic resin base material 18 side. Using a magnetic sputtering device configured as a circuit to send electricity, plasma discharge occurs and ions strike the target and are deposited on the surface of the synthetic resin.

도1에서 보는 바와 같이 본 발명은 원통형 배럴 내부에 자성 스퍼터링장치와 이바포레이션(Evaporation)증착장치(20)로 구성된다.    As shown in FIG. 1, the present invention includes a magnetic sputtering apparatus and an evaporation deposition apparatus 20 inside a cylindrical barrel.

상기 장치에 있어서 합성수지 모재(18)가 내주면에 부착되는 원통형 배럴(17)가 상기 배럴을 회전운동 시킬 수 있는 구동부(31)와, 상기 배럴 내부에 일정한 간격을 두고 스퍼터링을 위한 다수 개의 타겟(11)(12)(13)과, 상기 스퍼터링에 의한 타겟에 플라즈마를 발생시키기 위한 전압을 공급하는 고전압 전원장치와, Evaporation에 의한 다수 개의 타겟(21)(22)(23)(24)(25)(26)으로 구성된다.In the device, a cylindrical barrel 17 to which the synthetic resin base material 18 is attached to the inner circumferential surface of the driving unit 31 may rotate the barrel, and a plurality of targets 11 for sputtering at regular intervals inside the barrel. 12, 13, a high voltage power supply for supplying a voltage for generating a plasma to the target by sputtering, and a plurality of targets 21, 22, 23, 24, 25 by evaporation. It consists of 26.

상기 원통형 배럴증착형 스퍼터링장치로 스테인레스강 증착용 타겟(11)과 Ni증착용 타겟(12) 또는 Ti증착용 타겟(13)으로 구분하여 스테인레스 강판과 Ni강판 또는 Ti강판을 부착시킨다. 이 때 코팅의 두께에 따라 스퍼터링에 의한 타겟을 1개는 스테인레스강용, 1개는 Ni용, 1개는 Ti용 등으로 각각 사용할 수 있고 또한 여러 개의 타겟을 조합하여 사용할 수 있다. 또한 Evaporation에 의한 타겟으로 Cu용(21), Ag(24) 등 다수 개의 타겟을 사용할 수 있고, 여러 개의 타겟을 조합하여 사용할 수 있다.     The cylindrical barrel deposition type sputtering apparatus is divided into a stainless steel deposition target 11 and a Ni deposition target 12 or a Ti deposition target 13 to attach a stainless steel sheet and a Ni steel sheet or a Ti steel sheet. At this time, depending on the thickness of the coating, one target for sputtering may be used for stainless steel, one for Ni, one for Ti, and the like, and a combination of several targets may be used. In addition, a plurality of targets such as Cu 21 and Ag 24 may be used as targets by evaporation, and a plurality of targets may be used in combination.

진공증착방법 중에서 열증착(Evaporation)방법은 금속물질을 융점이상의 온도로 가열하면 금속물질이 녹아 증발을 일으키게 되며, 증발된 입자가 기판 즉 모재 위에 증착되는 방법으로 융점이 낮은 금속에 매우 유리한 방법이다.     Among the vacuum evaporation methods, the evaporation method is a method in which a metal material melts and evaporates when the metal material is heated to a temperature above the melting point. The evaporated particles are deposited on a substrate, that is, a base material. .

전기가열식 진공증착방법은 고융점 필라멘트, 바스켓 또는 보트(boat) 등의 열적소스가 필요하며, 특히 잘 사용하고 있는 열적 소스의 재료는 텅스텐, 몰리브덴, 탄탈륨, 스테인레스강, 알루미늄 등이 사용되며 이들 금속물질을 증발원에 놓고 전 류를 흘려 가열하여 물질을 증발시키는 방법이다.     The electric heating vacuum deposition method requires a thermal source such as a high melting point filament, a basket or a boat, and a particularly popular thermal source is tungsten, molybdenum, tantalum, stainless steel, aluminum, and the like. The material is placed in an evaporation source and heated to flow the current to evaporate the material.

한편 진공증착법을 이용하여 합성수지상에 금속물질을 코팅하는 방법에 있어서 조명 케이스 표면상에 먼지 등 이물질 등을 제거하기 위해 용제, 알카리, 에멜션, 전해액 등에 의해 깨끗하게 세척한다. 세척 후 1차 건조한 후 조명등 케이스에 밀착성이 좋게 하기 위해 합성수지를 프라이머 처리한다.     On the other hand, in the method of coating a metal material on the synthetic resin using a vacuum deposition method in order to remove foreign matters, such as dust on the surface of the lighting case clean with a solvent, alkali, emulsion, electrolyte solution and the like. After washing, after the first drying, the synthetic resin is primed to improve adhesion to the lamp case.

그리고 5 내지 20℃의 저온으로 2차 건조시킨 후 전기가열증착법을 이용하여 Al, Ag, Cu, Ni, Cr, Ti, W, Mo, 스테인레스강 중에서 하나 이상 금속물질을 5 내지 30마이크로미터로 금속피막을 형성한 후 3차 건조시킨다.After the secondary drying at a low temperature of 5 to 20 ℃ by using an electric heating evaporation method of at least one metal material of Al, Ag, Cu, Ni, Cr, Ti, W, Mo, stainless steel 5 to 30 micrometer metal After forming a film, it is made to dry 3rd.

이와 같이 건조가 끝나면 금속코팅이 완료된다.After the drying is completed, the metal coating is completed.

(실시예 1)   (Example 1)

본 발명은 열증착(Evaporation)방법으로 챔버 내의 공기압을 1 × 10­⁴Torr이하로 유지하면서 금속물질은 Ag, Cu, Al, W, 스테인레스강 등 하나 이상의 금속 또는 금속합금을 사용하고, 금속물질의 증착시간은 3 - 7분 동안으로 금속물질의 두께는 5 - 20마이크로미터로 적층한다. 그 다음에는 상기 진공증착과정에서 발생된 합성수지가 변형되는 것을 방지하기 위하여(챔버 내의 마스킹 지그가 꽂혀 있는 합성수지 사출물의 표면온도를 저하하기 위함) 배럴을 0. 5 - 1.5m/s 속도로 약 1- 3분간 공회전을 시킨다.    According to the present invention, a metal material is used as one or more metals or metal alloys such as Ag, Cu, Al, W, stainless steel while maintaining the air pressure in the chamber at 1 × 10 Pa or less by the evaporation method, and depositing the metal material. The time is 3-7 minutes and the thickness of the metal material is 5-20 micrometers. Then, to prevent deformation of the synthetic resin produced during the vacuum deposition process (to lower the surface temperature of the synthetic resin injection product in which the masking jig in the chamber is inserted), the barrel is moved at a speed of about 0.5 to 1.5 m / s. -Idle for 3 minutes.

(실시예 2)   (Example 2)

본 발명은 마그네트론 스퍼터링을 이용하여 접착력 강화를 위한 촉매물질인 프라이머로 얇은 막을 형성한 사출물을 마스킹 지그에 장착하고 마스킹 지그를 배럴(Barrel)에 장착한다. 배럴에 장착된 마스킹 지그를 진공흡입기를 사용하여 박막의 접착력을 떨어 뜨리고 불균일한 표면의 원인이 되는 먼지를 제거하는 공정을 수행한다. 먼지를 제거한 배럴은 금속박막을 형성하는 커다란 진공 챔버에 장착된다.     According to the present invention, a magnetron sputtering is used to mount an injection-molded product having a thin film as a primer, which is a catalyst material for enhancing adhesion, to a masking jig, and to mount a masking jig on a barrel. The masking jig mounted on the barrel uses a vacuum inhaler to reduce the adhesion of the thin film and to remove the dust causing the uneven surface. The dedusted barrel is mounted in a large vacuum chamber that forms a thin metal film.

진공펌프를 사용하여 챔버 내의 공기압을 대략 10­⁴Torr이하의 진공상태가 되도록 한다. 이렇게 하여 사출물상에 금속물질을 얇게 코팅하기 위한 준비작업은 완료된다.    A vacuum pump is used to bring the air pressure in the chamber to a vacuum of less than approximately 10­⁴Torr. In this way, preparation for thin coating of the metal material on the injection molding is completed.

접착력 강화를 위해 사용한 촉매물질인 프라이머를 적층한 플라스틱 사출물상에 금속박막을 형성하는 제1단계는 침투력이 뛰어나 밀착력이 우수하고 금속물질의 두께를 얇게 형성하는 스퍼터링방법을 사용하였다. 진공 챔버 내의 아르곤 가스의 량은 130 - 150 SCCM으로 하고 이때, 마그네트론에 공급되는 전력은 6Kw로 유지하고 진공도는 4 ×10­⁴ - 8 × 10­⁴Torr이하로 유지한다.    In the first step of forming a metal thin film on a plastic injection molded product laminated with a primer, which is a catalyst material used to enhance adhesion, a sputtering method of forming a thin metal material having excellent adhesion and excellent adhesion is used. The amount of argon gas in the vacuum chamber is 130-150 SCCM, at which time the power supplied to the magnetron is maintained at 6Kw and the degree of vacuum is maintained at 4 × 10 Pa-8 × 10 Pa Torr or less.

본 발명은 PVC 등 합성수지 사출물과 금속물질 사이의 접착력을 향상시키고 합성수지에 금속물질을 얇게 코팅시킴으로써 조명등 또는 작업등에서 발산되는 열에 강한 조명등 케이스 또는 작업등 보호망을 제공함으로써 기존의 철제, 알루미늄, 스테인레스강 등에 비해 생산성이 용이하고 원가가 훨씬 절감되는 효과가 있다. 즉 PVC등 합성수지 표면에 금속물질이 얇게 코팅되어 난반사가 이루어져 조명의 밝기가 더 밝은 효과를 얻을 수 있다.    The present invention improves the adhesive force between synthetic resin injection molding and metal materials such as PVC, and by coating a thin coating of the metallic material on the synthetic resin to provide a light protection case or work lamp protection net that is resistant to heat emitted from a lamp or a work lamp, such as existing steel, aluminum, stainless steel, etc. Compared to this, productivity is easy and cost is much reduced. In other words, the surface of the synthetic resin, such as PVC is coated with a thin metal material is diffused reflections can achieve a brighter light effect.

그리고 PVC 등 합성수지로 제작된 조명케이스 또는 작업등 보호망의 표면에 금속물질을 얇게 코팅하므로써 열에 강하고 부서지거나 파손되지 않아 수명이 오래갈 뿐만 아니라 매우 가볍고 작업성이 매우 용이한 조명등 케이스 또는 작업등 보호망을 얻을 수 있는 효과가 있다. In addition, by coating a thin layer of metal on the surface of a lighting case or work light protection net made of synthetic resin such as PVC, it is not resistant to heat, breakage or damage, so it lasts a long time and is very light and very easy to work with. There is an effect that can be obtained.

Claims (5)

하나의 챔버 내에서 스퍼터링과 진공증착 수단을 동시에 수행할 수 있는 증착법을 이용하여 합성수지상에 금속물질을 코팅하는 방법에 있어서,     In the method of coating a metal material on a synthetic resin using a deposition method that can perform the sputtering and vacuum deposition means in one chamber at the same time, 조명등 케이스 표면에 금속 또는 금속합금 중에서 하나 이상 선택하여 금속물질의 피막을 형성하는 조명등 케이스의 금속코팅방법 Metal coating method of a lamp case that forms a film of a metal material by selecting at least one of metal or metal alloy on the surface of the lamp case 제1항에 있어서 금속 또는 금속합금은 Al, Ag, Cu, Ni, Cr, Ti, W, Mo, 스테인레스강을 특징으로 하는 조명등 케이스의 금속코팅방법     The method of claim 1, wherein the metal or metal alloy is Al, Ag, Cu, Ni, Cr, Ti, W, Mo, metal coating method of the lamp case characterized in that the stainless steel. 제1항에 있어서 금속물질은 5 내지 30마이크로미터의 두께로 피막을 형성하는 것을 특징으로 하는 조명등 케이스의 금속코팅방법     The metal coating method of claim 1, wherein the metal material forms a film having a thickness of 5 to 30 micrometers. 진공증착법을 이용하여 합성수지 상에 금속물질을 코팅하는 방법에 있어서, 조명등 케이스 표면상에 이물질 등을 제거하기 위해 세척하는 단계, 상기 세척 후 건조시키는 단계, 상기 건조 후 조명등 케이스에 밀착성이 좋게 하기 위해 합성수지를 프라이머 처리하는 단계, 상기 처리 후 저온으로 2차 건조시키는 단계, 상기 건조 후 금속 또는 금속합금 중에서 하나 이상 선택하여 금속물질을 조명등 케이스에 증착하는 단계, 상기 금속피막을 증착한 후 3차 건조시키는 단계로 이루어지는 것을 특징으로 하는 조명등 케이스의 금속코팅방법      In the method of coating a metal material on the synthetic resin using a vacuum deposition method, the step of washing to remove foreign substances, etc. on the surface of the lamp case, the step of drying after washing, to improve adhesion to the lamp case after drying Primer treatment of synthetic resin, secondary drying at low temperature after the treatment, at least one metal or metal alloy after the drying, and depositing a metal material on a lamp case; and tertiary drying after depositing the metal film Metal coating method of the lamp case, characterized in that consisting of 제3항에 있어서 금속 또는 금속합금은 Al, Ag, Cu, Ni, Cr, Ti, W, Mo, 스테인레스강을 특징으로 하는 조명등 케이스의 금속코팅방법    The metal coating method of claim 3, wherein the metal or metal alloy is Al, Ag, Cu, Ni, Cr, Ti, W, Mo, stainless steel.
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