KR100325410B1 - A vacuum evaporation coating apparatus and coating method, and coating laminates - Google Patents

Abstract

The present invention relates to a vacuum deposition coating apparatus and a deposition coating method, and a coating laminate prepared by such an apparatus and method, and more particularly, to injection products (coated bodies) of electrical, electronic components, and communication devices that generate harmful electromagnetic waves. The present invention relates to a vacuum deposition coating apparatus and a deposition coating method used to form a conductive shield thin film layer to prevent harmful electromagnetic waves from leaking to the outside, and a coating laminate manufactured by the apparatus and method.

A specific configuration of the present invention is a vacuum deposition chamber (1) consisting of a fixed outer cylinder (10) and a rotatable inner cylinder (20), a plurality of injection molded product is mounted on the inner peripheral surface of the inner cylinder (20) of the vacuum deposition chamber (1) Two jig 21, an evaporator 23 for melting a coating material and a sputtering target 22 for coating the object to be coated.

Description

Vacuum deposition coating apparatus, coating method thereof and coating laminate {A VACUUM EVAPORATION COATING APPARATUS AND COATING METHOD, AND COATING LAMINATES}

The present invention relates to a vacuum deposition coating apparatus and a deposition coating method and a coating laminate prepared by the apparatus and method, and more specifically, by coating a conductive thin film layer on the injection of electrical, electronic components and communication devices generating harmful electromagnetic waves In order to prevent harmful electromagnetic waves from leaking to the outside, a vacuum deposition coating apparatus and a deposition coating method used to form a conductive shield thin film layer inside an existing injection molded product (coated body), and a coating laminate manufactured by the apparatus and method will be.

In general, as a method of coating a conductive thin film on an injection molded product (coated body), a method of mixing a conductive metal powder with a resin and spraying the coating is widely used. However, this method is not good workability, there is a problem in that the coating layer must be formed thick in order to obtain the required conductivity.

There is also a method of forming a film by sputtering, but this method has adhesion but there is a problem in that a large amount of heat is generated when coating a required thin film thickness, the substrate is warped or the film is swelled due to heat expansion, thereby destroying the film.

In addition, the method by the resistance heating method can be coated a large amount of a large amount of the injection molding, but this method also has a weak adhesion force has a problem in the strength of the conductive shield thin film.

Therefore, the present invention is to solve the problem that the adhesion of the coating is excellent, the coating film is robust, and the film is broken due to the distortion of the substrate.

Another object of the present invention is to provide a structure in which an evaporator and a sputter target can be simultaneously mounted in a chamber, thereby improving the coating efficiency.

Therefore, the present invention is a vacuum deposition chamber consisting of a fixed outer cylinder and a rotating inner cylinder, having a plurality of jig to be mounted on the inner peripheral surface of the inner cylinder, an evaporator capable of melting the coating material to coat the coated body And to provide a vacuum deposition coating apparatus having a sputtering target at the same time.

In addition, the present invention after mounting the substrate to be coated on the jig of the inner cylinder, vacuum evacuation of the vacuum deposition chamber, and reaches a constant vacuum state by rotating the inner cylinder equipped with the jig to etch the portion to be coated and at the same time double the sputtering target It is to provide a vacuum deposition method for coating by a perator.

In addition, the coating method by the evaporator to provide a vacuum deposition coating method for the deposition coating by melting the coating material by any method of resistance heating or electron beam method.

In another aspect, the present invention after mounting the substrate to be coated on the jig of the inner cylinder, vacuum evacuation of the vacuum deposition chamber, and when reaching a certain vacuum state by rotating the inner cylinder equipped with the jig to plasma or glow the part to be coated In a vacuum deposition method in which a discharged discharge zone is passed through an etching and coated with a sputtering target or an evaporator, the substrate is made of polycarbonate or plastic, an intermediate adhesive layer of resin or paint, and a main conductive thin film layer of copper or silver. The present invention provides a vacuum deposition coating laminate obtained by sequentially laminating a film protective thin film layer made of SUS or Ni.

1 is a plan view of the inside of the vacuum deposition coating apparatus of the present invention.

2 is a cross-sectional view showing a vacuum deposition coating laminate.

Figure 3 is an overall front view of the vacuum deposition coating apparatus of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Hereinafter, a structure, a manufacturing method, and a laminate thereof of a specific apparatus for achieving the present invention will be specifically described with reference to the accompanying drawings.

1 is a plan view of the inside of the vacuum deposition coating apparatus of the present invention, Figure 2 is a cross-sectional view showing a vacuum deposition coating laminate. Here, reference numeral 1 denotes a chamber of the vacuum deposition coating apparatus of the present invention, reference numeral 10 denotes an outer cylinder of the chamber and 20 denotes an inner cylinder.

The outer cylinder 10 of the chamber of the vacuum deposition coating apparatus is fixed and the inner cylinder 20 is rotatable. On the inner circumferential surface of the inner cylinder, a plurality of jig 21 for mounting a ready-made injection molded product (coated body) of ordinary resin material is provided.

Discharge means (24, 24 ') for generating a glow discharge or a plasma discharge across the outer cylinder (10) and the inner cylinder (20) are provided so as to receive a power supply from the power supply device (13) to form a discharge table. And a gas input port 11 for supplying the inert injection gases Ar, N ₂ and He necessary for the above-described plasma discharge or glow discharge, and on the other side of the outer cylinder, a vacuum exhaust means 12 for evacuating the vacuum. Equipped.

In addition, an evaporator 23 and a sputtering target 22 for melting and coating a coating material in a state where a ready-made injection molded product (coated body) is mounted on the jig 21 on the inner circumferential surface are provided.

The sputtering target 22 is attached to the fixing means 26.

Here, the evaporator 23 coats the coating material by melt-evaporating the coating material by resistance heating or electron beam method, and the sputtering target is sputtered by dispersing the coating material.

The resistance heating method uses a heating method using a current to flow through the resistor to generate Joule heat. Here, it can be seen that both a direct method of heating a current directly through an object and an indirect method of transferring heat from a heating element to a heated object by radiant convection conduction or the like can be adopted.

In the plasma or glow discharge, the plasma or glow discharge zone 25 is formed by the above-described inert injection gas and the high-voltage voltage spark supplied from the power supply device 13 between the discharge means 24 and 24 '. In this state, the inner cylinder 20 is rotated while etching is carried out through the above-described discharge zone on the coated portion of the coated body seated on the jig 21, and at the same time, the sputtering target 22 and / or the evaporer The coating material melted by the radar 23 is scattered or sputtered to form a multilayer conductive shielding film on the above-mentioned to-be-coated body.

Summarizing the coating process of the to-be-coated body as described above, after mounting the substrate (to-be-coated body) to be coated on the jig 21 of the inner cylinder 20, the vacuum deposition chamber 1 through the vacuum exhaust device 12 ), And when the chamber reaches a constant vacuum, the inner cylinder 20 equipped with the jig 21 is rotated so that the portion to be coated is etched in the plasma or glow discharge zone, and the sputtering The coating material melted or scattered from the target 22 or the evaporator 23 is uniformly coated on the coated body.

The above-described vacuum vapor deposition coating method is a substrate made of a polycarbonate or plastic material to be coated (injected product), an intermediate adhesive film layer of resin or paint, a main conductive thin film layer made of copper or silver, a film made of SUS or Ni. The coating laminated body in which the electroconductive film shield film in which the protective thin film layer was laminated | stacked was formed can be obtained.

3 is an overall front view of the vacuum deposition coating apparatus of the present invention, where 1 is a chamber in which the above-described coating process is performed, 41 is a high vacuum valve for evacuating the chamber and maintaining it in a high vacuum state. 42 is an oil diffusion high vacuum pump that diffuses oil, and 43 is a low vacuum pump.

The high vacuum pump and the diffusion pump is a device commonly used in a vacuum coating device, so the detailed description thereof will be omitted.

As described above, the present invention coats a conductive thin film layer on the injection of electrical, electronic components, and communication devices that generate harmful electromagnetic waves to prevent harmful electromagnetic waves from leaking to the outside. It is useful for coating a thin film, has good workability in coating a conductive thin film on the injection molding, and selectively or simultaneously operates both by providing an evaporator and a sputtering target, which are devices for coating, in a chamber. It is a useful invention that has all the advantages that can be coated.

Claims (5)

Having a vacuum deposition chamber 1 consisting of a fixed outer cylinder 10 and a rotatable inner cylinder 20, Ibe for forming a conductive shield thin film on the fixture mounted on the jig 21 by melting a plurality of jig 21 and the coating material on the inner peripheral surface of the inner cylinder 20 of the chamber (1) And a fixing means (26) on which the perlator (23), the sputtering target (22), and the sputtering target (22) are mounted, Discharge means (24, 24 ') for generating glow discharge or plasma discharge over the outer cylinder (10) and inner cylinder (20), and power supply means (13) for supplying power to the discharge means (24, 24'). And a gas supply means 11 for supplying an inert injection gas Ar or N ₂ or He for causing the plasma discharge or the glow discharge to one side of the outer cylinder 10, and a vacuum exhaust means 12 for evacuating the vacuum. Vacuum deposition coating apparatus characterized in that it comprises a). After mounting the substrate to be coated on the jig 21 of the inner cylinder 20, the vacuum deposition chamber 1 is evacuated by the vacuum evacuation means, and when the constant vacuum state is reached, the inner cylinder on which the jig 21 is mounted. (20) by rotating the portion to form the conductive shield thin film layer on the coated body while passing through the discharge zone 25 and at the same time forming a conductive shield thin film with the sputtering target 22 and the evaporator 23 Vacuum deposition method. The method of claim 2, Vacuum deposition coating method, characterized in that to form a conductive shield thin film layer on the coated body using the sputtering target 22, or to form a conductive shield thin film layer on the coated body by melting the coating material by the evaporator (23). . The method of claim 3, The coating material melting method using the evaporator (23), vacuum coating method characterized in that the coating material is melted by any method of resistance heating or electron beam method to form a conductive shield thin film layer on the coated object. After mounting the substrate to be coated on the jig 21 of the inner cylinder 20, the vacuum deposition chamber 1 is evacuated by the vacuum exhaust device, and when the constant vacuum state is reached, the inner cylinder on which the jig 21 is mounted. In the vacuum deposition coating method of rotating the part 20 to etch a portion to form a conductive shield thin film layer on the coated body, and simultaneously coating the coated body with the sputtering target 22 and the evaporator 23, A substrate 30 made of polycarbonate or plastic, an intermediate adhesion layer 31 of resin or paint, a main conductive thin film layer 32 made of copper or silver, and a film protective thin film layer 33 made of SUS or Ni Vacuum deposition coating laminate.