KR20080018096A - Light emitting diode package employing lead terminal with reflecting surface - Google Patents

Abstract

A light emitting diode package employing a lead terminal with a reflective surface is provided to improve the optical efficiency of the package by reflecting light emitted from an LED chip on a reflecting surface with high reflectivity. A LED package has an LED chip(57) mounted in a cavity to radiate light emitted from the LED chip in a viewing angle. A first lead terminal(51) has a lower portion(51b) with an LED chip mounting area, and at least one wing portion extending from the lower portion to form a reflective surface. A second lead terminal(53) is spaced apart from the first lead terminal, and has a lower portion and at least one wing portion extending from the lower portion to form a reflective surface. A package body(55) supports the first and second lead terminals and defines a cavity through which the LED chip mounting area of the first lead terminal and a part of the second lead terminal are exposed. The first and second lead terminals extend outside of the package body.

Description

LIGHT EMITTING DIODE PACKAGE EMPLOYING LEAD TERMINAL WITH REFLECTING SURFACE}

1 is a plan view for explaining a side light emitting diode package according to the prior art.

2 is a perspective view illustrating a side light emitting diode package according to the related art.

3 is a cross-sectional view taken along the line A-A of FIG. 1 to illustrate a side light emitting diode package according to the prior art.

4 is a plan view illustrating a side light emitting diode package according to an embodiment of the present invention.

FIG. 5 is a cross-sectional view taken along the line B-B of FIG. 4 to illustrate a side light emitting diode package according to an embodiment of the present invention.

6 is a perspective view simplified to explain the first lead terminals of the side light emitting diode package according to the embodiments of the present invention.

7 is a perspective view illustrating a first lead terminal of a side light emitting diode package according to another embodiment of the present invention.

8 is a schematic view illustrating a side light emitting diode package according to another embodiment of the present invention.

9 is a plan view illustrating a lead frame used to manufacture a side light emitting diode package according to another embodiment of the present invention.

10 is a plan view for explaining another embodiment of the lead frame.

11 is a schematic view illustrating a side light emitting diode package according to another embodiment of the present invention.

12 is a schematic diagram illustrating a side light emitting diode package according to another embodiment of the present invention.

The present invention relates to a light emitting diode package, and more particularly, to a light emitting diode package adopting a lead terminal having a reflective surface.

In general, a light source system using a light emitting diode chip is formed by mounting a light emitting diode (LED) chip in various types of packages according to the intended use. The side light emitting diode package is disposed on the side of the light guide plate to provide light in parallel to the light guide plate, and thus is mainly used for backlight illumination for various displays.

1 and 2 are a plan view and a perspective view for explaining a conventional side light emitting diode package, Figure 3 is a cross-sectional view taken along the cutting line A-A of FIG.

1 to 3, the side light emitting diode package includes a pair of lead terminals, that is, first and second lead terminals 11 and 13. The first and second lead terminals are formed from a lead frame made of a phosphor bronze plate, and the surface thereof is plated with silver (Ag) to increase light reflectance. The first and second lead terminals 11 and 13 are supported by the package body 15. The package body 15 is generally formed by insert molding lead terminals with polyphthalamide (PPA).

For convenience of description, the package body 15 may be divided into an upper package body 15a and a lower package body 15b based on the positions of the first and second lead terminals 11 and 13.

The upper package body 15a has a cavity 16 exposing the first and second lead terminals 11, 13. The first and second lead terminals 11, 13 are located on the bottom of the cavity 16, that is, on the lower package body 15b, and are spaced apart from each other in the cavity. In addition, the first and second lead terminals 11 and 13 protrude out of the package main body 15 to be electrically connected to an external power source. The lead terminals 11 and 13 protruding to the outside may have various shapes and may be bent into various shapes. 1 and 2 show lead terminals 11 and 13 that are bent laterally from the lower surface of the package body 15 for surface mounting.

The light emitting diode chip 17 is mounted on the first lead terminal 11 in the cavity 16 and electrically connected thereto, and is also electrically connected to the second lead terminal 13 by a bonding wire. The cavity 16 may be filled with the light transmissive resin 23, and phosphors may be contained in the light transmissive resin.

The conventional side light-emitting diode package provides an elongated cavity 16, and forms sidewalls, in particular, sidewalls 15w in the long axis direction to be inclined to widen the viewing angle in the long axis direction. Accordingly, a side light emitting diode package suitable for a backlight for a display can be provided, and a side light emitting diode package can be provided that emits white light by appropriate selection of a light emitting diode chip and a phosphor.

However, the side light emitting diode package according to the related art has a problem in that light emitted from the light emitting diode chip to the inner walls 15w is absorbed and scattered in the inner walls 15w of the package body having a low reflectance, thereby decreasing light efficiency. In addition, the inner wall of the package body of the PPA material is discolored by the light incident directly to the package body 15 from the light emitting diode chip, the light efficiency is further reduced as the use time is increased, and as a result, the service life is shortened.

In addition, since the package body 15 formed of a material such as PPA has poor heat dissipation performance, heat generated in the LED chip may not be easily released to the outside. As a result, while the light emitting diode chip is driven, the junction temperature of the light emitting diode chip increases, and the luminous efficiency decreases.

On the other hand, when the cavity 16 is filled with the light-transmissive resin 23 containing phosphors, the upper surface of the light-transmissive resin 23 is concave to reduce the light efficiency, so as to solve the amount of the light-transmissive resin 23 In the case of increasing, the translucent resin 23 protrudes above the upper surface of the package main body 15, and there is a risk of being damaged by external force. Therefore, a method of forming a limited wavelength converting material in the cavity 16 by doping a small amount of the liquid resin containing the phosphor on the light emitting diode chip has been studied, but the liquid resin flows because the bottom surface of the cavity 16 is flat. Therefore, it is difficult to form a convex shape wavelength conversion material.

The technical problem to be achieved by the present invention is to provide a light emitting diode package that can improve the luminous efficiency.

Another object of the present invention is to provide a light emitting diode package capable of alleviating discoloration of the inner wall of the package body due to light emitted from the light emitting diode chip.

Another object of the present invention is to provide a light emitting diode package which can easily form a wavelength conversion material by doping a liquid resin containing a phosphor.

The present invention provides a light emitting diode package employing a lead terminal having a reflective surface. The light emitting diode package according to the embodiments of the present invention is a light emitting diode package in which a light emitting diode chip is mounted in a cavity to emit light emitted from the light emitting diode chip within a predetermined direction, and the first lead terminals spaced apart from each other. And a second lead terminal. The first lead terminal has a bottom including a light emitting diode chip mounting region and at least one reflective surface formed by bending at the bottom. Meanwhile, a package main body supports the first and second lead terminals, and forms a cavity for exposing a portion of the second lead terminal, a light emitting diode chip mounting region, and a reflective surface of the first lead terminal. The first and second lead terminals each extend out of the package body. The first and second lead terminals are provided from a lead frame formed by processing a metal plate, and are generally plated with a material having high reflectance. Accordingly, the light emitted from the light emitting diode chip can be reflected on the reflecting surface having high reflectivity, thereby improving the light efficiency of the package, and preventing or mitigating discoloration of the package body by the light emitted from the light emitting diode chip. Can be.

In some embodiments of the present invention, the first lead terminal includes a stepped portion bent from the bottom portion and a first inclined surface forming the reflective surface between the bottom portion and the stepped portion. Accordingly, since the light emitted from the LED chip mounted in the LED chip mounting region is reflected from the first inclined surface, the light emission efficiency is improved, and light is blocked by the first inclined surface to prevent discoloration of the package body. do.

Meanwhile, the cavity may have an elongated shape. In this case, the first inclined surface of the first lead terminal may cross the long axis direction of the cavity, and may be terminated before meeting the inner walls of the package body in the short axis direction or meeting the inner walls. Accordingly, a side light emitting diode package may be provided.

In addition, the first lead terminal may further include a second inclined surface that is bent from the bottom and positioned to face the first inclined surface. Accordingly, discoloration of both inner walls of the package body can be prevented, and the light emitting efficiency of the LED package can be further improved.

In addition, the first lead terminal may further include third and fourth inclined surfaces formed by being bent from the bottom and adjacent to the first and second inclined surfaces. Accordingly, reflecting surfaces are formed around the LED chip to further improve luminous efficiency and further prevent color change of the package body.

The LED chip may be mounted in the LED chip mounting region of the bottom portion, and a bonding wire may connect the LED chip and the second lead terminal. In addition, a wavelength conversion material surrounds the light emitting diode chip. The wavelength conversion material contains a phosphor that converts the wavelength of light emitted from the light emitting diode chip. Accordingly, light of various colors may be realized by the combination of the LED chip and the phosphor, and in particular, white light may be realized.

The wavelength conversion material may be located within the bottom of the first lead terminal and the inclined surfaces. The wavelength conversion material may be formed by doping a liquid resin, and in this case, the wavelength conversion material may be prevented from protruding upward from the top surface of the package body since the wavelength conversion material is limited in the bottom and the inclined surfaces. In addition, the transparent molding part may fill the cavity to encapsulate the wavelength conversion material.

In some embodiments of the present invention, the first lead terminal has wings that are bent from the bottom to the top to form inclined surfaces. In this case, the reflective surface includes inclined surfaces formed by the wing parts. Accordingly, the reflection efficiency of the light emitted from the light emitting diode chip can be increased, thereby improving the luminous efficiency of the package, and preventing discoloration of the package body.

The package body may form an inner wall of the cavity together with the wings. Accordingly, the thickness of the side wall of the package body is reduced, and heat may be emitted through the wing parts, thereby improving heat dissipation performance of the LED package.

To form symmetrical bilateral reflecting surfaces, the wings may have a symmetrical structure about the bottom to which they are connected. However, the present invention is not limited thereto, and the wing portion connected to one side of the bottom portion may have a wider width than the wing portion connected to the opposite side. Accordingly, the distribution of light emitted from the package can be variously adjusted.

On the other hand, at least one of the wings may be wider as the distance from the bottom. Accordingly, when the inner wall located between the two reflective surfaces is inclined, a wider reflective surface may be formed by the wing portion having a wider width.

The outer surfaces of the wings may be covered by the package body, but are not limited thereto, and at least some of the outer surfaces of the wings may be exposed to the outside. The exposed wings further enhance the heat dissipation performance of the LED package.

On the other hand, the second lead terminal may have a bottom portion and wing portions that are bent from the bottom to the upper side to form slopes. The wing portions of the second lead terminal are respectively disposed in parallel to the wing portions of the first lead terminal. In this case, the package body may form an inner wall constituting the cavity together with the wing portions of the first and second lead terminals.

In addition, the cavity may have an elongated shape. In this case, both reflective surfaces formed by the wing portions of the first and second lead terminals may be disposed at both side surfaces thereof in the longitudinal direction of the cavity. Therefore, the wings may be disposed on the wide surfaces to increase the light reflection efficiency.

The light emitting diode chip is mounted in a light emitting diode chip mounting area at the bottom of the first lead terminal, and a bonding wire connects the light emitting diode to the second lead terminal. In addition, another bonding wire may electrically connect the light emitting diode and the first lead terminal.

Meanwhile, the wavelength conversion material may cover the light emitting diode. The wavelength converting material contains a phosphor to wavelength convert at least a part of the light emitted from the light emitting diode.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided as examples to ensure that the spirit of the present invention can be fully conveyed to those skilled in the art. Accordingly, the present invention is not limited to the embodiments described below and may be embodied in other forms. And, in the drawings, the width, length, thickness, etc. of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

4 is a plan view illustrating a side light emitting diode package according to an exemplary embodiment of the present invention, FIG. 5 is a cross-sectional view taken along the cutting line BB of FIG. 4, and FIG. 6 is a side light emitting diode according to embodiments of the present invention. Various first lead terminals applicable to a package are shown, and FIG. 7 shows a first lead terminal applicable to a side light emitting diode package according to another exemplary embodiment of the present invention.

4 and 5, the side light emitting diode package includes a pair of lead terminals, that is, first and second lead terminals 51 and 53. The first lead terminal 51 has a bottom portion 51b, a stepped portion 51a formed by bending from the bottom portion, and a first inclined surface 51c formed between the bottom portion and the stepped portion (see Fig. 6 (a)). ). The bottom portion 51b includes a light emitting diode chip mounting region. The second lead terminal 53 may be spaced apart from the first lead terminal 51 and positioned at the same level as the stepped portion 51a of the first lead terminal 51.

The first and second lead terminals 51 and 53 are formed from a lead frame manufactured by processing a metal plate such as a phosphor bronze plate, and in particular, the stepped portion 51a and the first inclined surface of the first lead terminal 51 ( 51c) is formed by bending a part of the lead frame. The first and second lead terminals 51 and 53 may be plated with Ag, Cu, Ni, Au, Al alloys, Mg alloys, or alloys of Al and Mg to improve reflectance.

Meanwhile, the first lead terminal 51 may be further bent from the bottom portion 51b and further include a second inclined surface 51d positioned to face the first inclined surface 51c (FIG. 6 (FIG. 6). b)). In addition, the first lead terminal 51 may further include an end portion 51e extending from the second inclined surface 51d and positioned in parallel with the stepped portion 51a (FIG. 6). (c)). The end 51e provides a smooth bottom surface to improve light reflectance.

The first and second lead terminals 51 and 53 are supported by the package body 55. The package body 55 may be formed by insert molding the lead terminals 51 and 53. For convenience, the package body 55 may be divided into an upper package body 55a and a lower package body 55b based on the positions of the stepped portions 51a and the second lead terminals 53 of the first lead terminal.

The package body 55 may have an elongated cavity 56 exposing the first and second lead terminals 51 and 53, and the bottom portion 51b of the first lead terminal is defined by the cavity 56. And the inclined surfaces 51c and 51d are exposed, and a part of the second lead terminal 53 is exposed. In addition, a part of the stepped part 51a of the first lead terminal may be exposed. Hereinafter, the longitudinal direction of the elongated cavity 56 is defined as the major axis direction and the direction perpendicular thereto is defined as the minor axis direction.

The first and second lead terminals 51 and 53 are spaced apart from each other in the cavity 56. In addition, the first and second lead terminals 51 and 53 extend through the side wall of the package body 55 to be electrically connected to an external power source, respectively. The lead terminals 51 and 53 extending to the outside may have various shapes and may be bent into various shapes. Here, lead terminals 51 and 53 which are bent to the side from the lower surface of the package body 55 for surface mounting are shown.

On the other hand, the bottom 51b of the first lead terminal is lowered toward the lower package body 55b, whereby a recess is formed in the bottom of the cavity 56. Meanwhile, the first inclined surface 51c of the first lead terminal crosses the major axis direction of the cavity 56 and terminates before meeting the inner walls of the package body 55 in the short axis direction or meeting the inner walls. do. That is, the first inclined surface 51c exposed by the cavity 56 is not continuous but intermittent. Therefore, the reflectance in the long axis direction can be increased without changing the directivity angle characteristic in the short axis direction, and it is possible to control light distribution in the long axis direction and the short axis direction separately. The second inclined surface 51d of the first lead terminal also crosses the major axis direction of the cavity 56 and terminates before meeting the inner walls of the package body 55 in the short axis direction or meeting the inner walls. That is, the second inclined surface 51d is formed symmetrically with the first inclined surface 51c, thereby obtaining a light distribution having symmetry.

The LED chip 57 is mounted in the LED chip mounting region of the bottom portion 51b, and is electrically connected to the second lead terminal 53 by the bonding wire 59. Therefore, the light emitted from the light emitting diode chip 57 to the inner wall 55w in the long axis direction of the package body 55 reaches the first lead terminal 51 before reaching the inner wall 55w of the package body 55. Is reflected by the first inclined surface 51c and the second inclined surface 51d. Since the first lead terminal 51 is plated with a metal having high reflectance, the first lead terminal 51 has a higher reflectance than a package body formed of plastic such as PPA. Therefore, since a part of the light emitted from the light emitting diode chip is reflected on the inclined surfaces 51c and 51d having a high reflectance, the luminous efficiency of the side light emitting diode package is improved. In addition, the amount of light directly incident on the inner wall of the package main body can be reduced, so that discoloration of the inner wall of the package main body 55 can be alleviated, and as a result, the package life can be extended.

On the other hand, in order to improve the reflectance in the short axis direction and to prevent discoloration of the inner wall of the package main body 55 in the short axis direction, the first lead terminals are respectively located in both the short axis directions of the cavity 56 from the bottom portion 51b. It may include extended wings 51f (see FIG. 7). The vanes are bent from the bottom to form third and fourth slopes, and the third and fourth slopes are exposed in the cavity 56. Since the wing parts 51f are separated from the first and second inclined surfaces 51c and 51d, they may be bent to have different inclination angles, so that the reflection characteristics in the short axis direction and the reflection characteristics in the long axis direction may be individually adjusted. Features of the wings will be described in detail later with reference to FIGS. 8 to 12.

Referring back to FIG. 5, a wavelength conversion material 63 containing phosphors may be formed on the light emitting diode chip 57. The wavelength converting material may be formed by doping a liquid resin containing a phosphor in a recess formed on the bottom 51b, and thus, the wavelength converting member 63 having a convex shape confined in the recess may be formed. have. In the conventional side-side light emitting diode package, it is difficult to form the wavelength conversion material by doping the liquid resin because the bottom surface is flat, but according to embodiments of the present invention, since the recess is formed in the cavity 56, it is limited in the cavity. The wavelength conversion material can be easily formed using a liquid resin.

The wavelength converting member 63 may be formed of, for example, epoxy or silicone resin, and may contain a phosphor for converting light emitted from the light emitting diode chip 57, for example, blue light into yellow light, thereby converting white light into light. Emitting side light emitting diode packages may be provided. The light emitting diode chip 57 and the phosphor may be variously selected, and thus light of various colors may be realized.

Meanwhile, the cavity 56 may be filled with the wavelength conversion material 53, and after the wavelength conversion material 53 is formed in the recess, the transparent molding part 57 is additionally formed in the cavity to form a cavity ( 56).

8 is a schematic diagram illustrating a side light emitting diode package according to another embodiment of the present invention. Where (a) is a plan view through the package body, (b) is a cross sectional view taken along the cut line CC of (a), and (c) is a cross sectional view taken along the cut line DD of (a) with dotted lines Indicated.

Referring to FIG. 8, the side light emitting diode package includes a pair of lead terminals, that is, first and second lead terminals 71 and 73. The first and second lead terminals 71 and 73 are formed from a lead frame made of a metal plate such as a phosphor bronze plate, and include Ag, Cu, Ni, Au, Al alloys, Mg alloys, or Al to improve reflectance. Alloys of Mg and the like can be plated.

The first lead terminal 71 includes a bottom portion 71a including a light emitting diode chip mounting region and wing portions 71w bent to face upward from the bottom portion to form inclined surfaces. The inclined surfaces form both reflective surfaces of the LED chip mounting region. Meanwhile, the second lead terminal 73 may include a bottom portion 73a and wing portions 73w that are bent to face upward from the bottom portion 73a to form inclined surfaces. The first and second lead terminals 71 and 73 may be spaced apart from each other, and the wing portions 71w and 73w may be disposed in parallel to each other to form the both reflective surfaces. Each of the wing portions 71w and 73w may have a symmetrical structure around the bottom portions 71a and 73a to which the wings 71w and 73w are connected, and thus, light distribution having symmetry may be obtained. However, the present invention is not limited thereto, and the wing portions 71w and 73w may be asymmetrical structures having different widths.

On the other hand, the package main body 75 is coupled to the first and second lead terminals 71 and 73 to support them. The package body 75 may be formed by insert molding the lead terminals 71 and 73. The package body 75 covers lower surfaces of the first and second lead terminals 71 and 73 and surrounds outer surfaces of the wing portions 71w and 73w. In addition, the package main body 75 fills a gap between the bottom portion 71a of the first lead terminal and the bottom portion 73a of the second lead terminal, and also between the wing portions 71w and the wing portions 73w. You can fill in the gaps. In addition, the package body 75 may cover top surfaces of the wing portions 71w and 73w.

The first and second lead terminals 71 and 73 extend to the outside of the package body 75 to be electrically connected to an external power source, respectively. The lead terminals 71 and 73 extending to the outside may have various shapes and may be bent in various shapes.

Meanwhile, the wing portions 71w and 73w of the first and second lead terminals may be disposed in parallel to each other to form both reflective surfaces, and the package body 75 may form an inner wall of the cavity together with the wing portions. have. In particular, the package body 75 forms inner walls 75w of both sides connecting the two reflective surfaces formed by the wing portions 71w and 73w. The inner walls 75w may be formed to be inclined as shown. Meanwhile, bottoms 71a and 73a of the first and second lead terminals 71 and 73 form a bottom surface of the cavity. Accordingly, the cavity is formed as shown in FIG. 8 (a).

On the other hand, the LED chip 77 is mounted in the LED chip mounting region of the first lead terminal 71 and is connected to the second lead terminal 73 by a bonding wire 79. The LED chip 77 may be connected to the first and second lead terminals 71 and 73 by two bonding wires 79, and electrically connected to the first lead terminal 71 by a conductive adhesive. It may be connected, and may be electrically connected to the second lead terminal 73 by one bonding wire 79. The first lead terminal 71 has a longer portion 71a than the second lead terminal 73 in order to mount the LED chip 77.

Meanwhile, a wavelength conversion material (not shown) may cover the light emitting diode 77. The wavelength converting material may be formed of, for example, epoxy or silicone resin, and contains at least a portion of light emitted from the light emitting diode by containing a phosphor that converts light emitted from the light emitting diode chip 77, for example, blue light into yellow light. Convert The light emitting diode chip 77 and the phosphor may be variously selected, and thus light of various colors may be realized. The wavelength conversion material may be located inside the cavity, or may be located above the cavity.

According to the present exemplary embodiment, since the lead terminals are disposed on the bottom surface and both sides of the cavity, the reflection efficiency of the light emitted from the light emitting diode chip 77 may be increased. In particular, in a side light emitting diode package having an elongated cavity, the wing parts may be formed on side surfaces formed in parallel in a long axis direction to form reflective surfaces over a large area. On the other hand, the wings 71w and 73w reduce the color change of the package main body 75 by light by reflecting light incident on the package main body 75. In addition, heat can be released through the wings to improve the heat dissipation performance of the package. In addition, when reducing the thickness of the package body 75 surrounding the outer surface of the wing portion, heat dissipation through the package body is promoted to further improve heat dissipation performance.

The first and second lead terminals 71 and 73 in this embodiment can be manufactured from a lead frame as shown in FIG. That is, the first lead terminal 71 and the second lead terminal 73 spaced apart from each other by punching or pressing a flat metal plate such as a phosphor bronze plate. The first and second lead terminals 71 and 73 have bottom portions 71a and 73a, respectively, and have wing portions 71w and 73w extending from both sides thereof. The wing portions 71w and 73w are bent upward to form both reflecting surfaces.

In the present exemplary embodiment, the first and second lead terminals 71 and 73 have rectangular wings 71w and 73w, but the present invention is not limited thereto. As shown in FIG. The first and second lead terminals 81 and 83 having the wing portions 81w and 83w that are wider as the distance from the bottom 81a or the bottom 83a may be used. The widened wings 81w and 83w may provide wider reflecting surfaces on both long sides when the inner walls 75w are inclined, for example, as shown in FIG. 8.

11 is a schematic view illustrating a side light emitting diode package according to another embodiment of the present invention. Where (a) is a plan view through the package body, (b) is a cross sectional view taken along the cut line CC of (a), and (c) is a cross sectional view taken along the cut line DD of (a) with dotted lines Indicated. For convenience, the light emitting diode and the bonding wire are omitted.

The light emitting diode package of FIG. 11 has substantially the same components as the side light emitting diode package described with reference to FIG. 8. However, there is a difference that the outer surfaces of the wing portions 71w and 73w are exposed to the outside of the package body 85. That is, in this embodiment, at least some of the outer surfaces of the wing portions 71w and 73w are exposed to the outside. Accordingly, heat generated in the package may be discharged to the outside through the wing parts, thereby improving heat dissipation efficiency.

12 are schematic views for explaining another side light emitting diode package of the present invention. Where (a) is a plan view through the package body, (b) is a cross sectional view taken along the cut line CC of (a), and (c) is a cross sectional view taken along the cut line DD of (a) with dotted lines Indicated. For convenience, the light emitting diode and the bonding wire are omitted.

The light emitting diode package of FIG. 12 has substantially the same components as the side light emitting diode package described with reference to FIG. 8. However, the bottom portion 91a of the first lead terminal 91, the bottom portion 93a of the second lead terminal 93, and the wing portions 91w and 93w are formed longer than the corresponding components of FIG. 8. The wings 91w and 93w constitute most of both sides of the package. Meanwhile, the package body 95 couples and supports the first and second lead terminals 91 and 93. The package body 95 covers lower surfaces of the first and second lead terminals 91 and 93 and fills gaps therebetween to join them. In addition, the package main body 95 is formed between both reflective surfaces formed by the wing parts 91w and 93w to form inner walls 95w. The inner walls 95w may be formed to be inclined.

According to the present embodiment, heat dissipation efficiency can be further improved by increasing the widths of the wings 91w and 93w to almost the width of the package main body 95.

In the embodiments of the present invention, the side light emitting diode package having an elongated shape cavity is illustrated and described by way of example, but the present invention is not limited to the side light emitting diode package, and various embodiments using the plastic package body and the lead frame are provided. It can also be applied to tangible packages, for example packages with circular or rectangular cavities.

On the other hand, in the embodiments of the present invention, when the wing portions are provided limited to the first lead terminal, the bottom of the second lead terminal may have a narrower width than the bottom surface of the cavity. The LED chip mounting region of the first lead terminal may extend to surround both sides of the bottom of the second lead terminal. Accordingly, the wing portions of the first lead terminal may implement both reflective surfaces having a large area.

According to embodiments of the present invention, by adopting a reflective surface formed by bending a part of the lead terminal, it is possible to provide a light emitting diode package that can improve luminous efficiency and reduce discoloration of the package body. In addition, by adopting a lead terminal having wings, it is possible to provide a reflective surface and to improve heat dissipation performance of the package. In addition, a light emitting diode package capable of easily forming a wavelength conversion material having a suitable shape by doping a liquid resin containing a phosphor may be provided.

Claims (9)

A light emitting diode package in which a light emitting diode chip is mounted in a cavity to emit light emitted from the light emitting diode chip within a predetermined direction angle. A first lead terminal having a bottom including a light emitting diode chip mounting region and at least one wing extending from the bottom to form a reflective surface; A second lead terminal spaced apart from the first lead terminal and having at least one wing portion extending from the bottom portion to form a reflective surface; And A package body supporting the first and second lead terminals and forming a cavity for exposing a portion of the second lead terminal and a light emitting diode chip mounting region of the first lead terminal; The first and second lead terminals are respectively extended to the outside of the package body. The method according to claim 1, At least one reflective surface is formed on each side of the chip mounting area by the wing parts of the first and second lead terminals. The method according to claim 1, Each of the vanes is bent from the bottoms to which it extends. The method according to claim 1, At least one light emitting diode chip mounted in the bottom chip mounting region; A bonding wire connecting the light emitting diode chip and the second lead terminal; And A light emitting diode package further comprising a wavelength conversion material surrounding the light emitting diode chip. The method according to claim 4, A light emitting diode package further comprising a transparent molding part filling the cavity to encapsulate the wavelength conversion material. The method according to claim 1, At least one of the wings is wider as it moves away from the bottoms from which it extends. The method according to claim 1, At least some of the outer surfaces of the wings are exposed to the outside. The method according to claim 1, The outer surface of the wings are covered by the package body. The method according to claim 1, The first and second lead terminals have at least one plating layer selected from the group consisting of Ag, Cu, Ni, Au, Al alloys, Mg alloys, or alloys of Al and Mg.

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