KR20080001330A - Tape carrier package, liquid crystal display device and the fabricating method thereof - Google Patents

Abstract

A TCP(Tape Carrier Package), an LCD(Liquid Crystal Display) and a manufacturing method thereof are provided to adjust a pitch of a TCP pad unit so as to compensate heat expansion of a bonding part bonded with an LC panel or variably design a pad width of an LC panel lower substrate, thereby easily minimizing misalignment when bonding the TCP with the LC panel. A TCP comprises a base film(241), an IC(Integrated Circuit) chip formed on the base film, and an output pad unit(244). The output pad unit is connected with the IC chip. Pad pitches of the output pad units are differently formed in one end of the base film. A pitch of an outer output pad unit of the base film is smaller than a pitch of a central output pad unit. In the output pad unit, each pad has the same width.

Description

Tape Carrier Package, Liquid Crystal Display device and the fabricating method

1 is a cross-sectional view of a portion of a conventional liquid crystal display.

2A and 2B are fragmentary plan views showing connection pad portions of a conventional liquid crystal panel lower substrate and TCP.

3A and 3B are partial sectional views showing a connection pad portion of a conventional liquid crystal panel lower substrate and TCP.

4 is a plan view showing a part of a liquid crystal display according to the present invention;

5A and 5B are enlarged partial plan views illustrating a connection pad portion 'A' of the liquid crystal panel lower substrate and the TCP according to the present invention in FIG. 4.

6A and 6B are partial sectional views showing a connection pad portion of a liquid crystal panel lower substrate and TCP according to the present invention;

<Description of Signs of Major Parts of Drawings>

210: lower substrate 211: input pad portion

220: upper substrate 240: TCP

241: base film 244: output pad portion

245: PCB

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device, and more particularly, to a tape carrier package that compensates for thermal expansion of a junction in mounting an integrated circuit. In addition, the present invention relates to a liquid crystal display device and a method of manufacturing the same for correcting misalignment using the tape carrier package.

A liquid crystal display device is a display element utilizing the optical anisotropy and polarization properties of a liquid crystal. Since the liquid crystal is thin and long in structure, the direction of the molecular arrangement can be controlled by artificially applying an electromagnetic field to the liquid crystal molecules having directionality and polarization in the molecular arrangement. Therefore, if the alignment direction is arbitrarily adjusted, light may be transmitted or blocked according to the alignment direction of the liquid crystal molecules by optical anisotropy of the liquid crystal, thereby displaying colors and images.

In particular, an active matrix liquid crystal display device, in which an active element is added to each pixel arranged in a matrix form and controls the operation of each pixel using the switching characteristics of the element, is characterized by the electro-optical effect of the liquid crystal. The memory function is implemented.

The active matrix liquid crystal display device displays a natural moving image using a thin film transistor (hereinafter, referred to as TFT) as a switching element.

In an active matrix type liquid crystal display, an image corresponding to a video signal is displayed on a pixel matrix in which pixels are arranged at intersections of gate lines and data lines. Each of the pixels includes a liquid crystal cell that adjusts the amount of transmitted light according to the voltage level of the data signal from the data line.

Such a liquid crystal display device is connected to data lines and gate lines, and includes a plurality of drive integrated circuits (D-ICs) for supplying data signals and scan signals to data lines and gate lines, respectively. Will be needed.

The D-ICs are interposed between a printed circuit board (hereinafter referred to as a "PCB") and a liquid crystal panel, and the data signals and the data lines of the liquid crystal panel in response to a control signal supplied from the PCB. Supply a scan signal.

As a method of mounting the D-ICs, a tape automated bonding method (hereinafter, referred to as "TAB") that can increase the effective area of a panel and has a relatively simple mounting process is most commonly used.

The TAB method is to bend or attach a tape carrier package (hereinafter referred to as "TCP") in which a D-IC is mounted and connected between the lower substrate of the liquid crystal panel and the PCB.

1 is a cross-sectional view of a portion of a conventional liquid crystal display.

As shown in FIG. 1, in the conventional liquid crystal display, the lower substrate 110 and the upper substrate 120 are joined to form a liquid crystal panel, and a backlight unit 130 for irradiating light to the liquid crystal panel is formed. have.

One end of the lower substrate 110 of the liquid crystal panel is connected to one end of the TCP 140 on which the D-IC 143 is mounted, and the other end of the TCP 140 is connected to the PCB 145 and is predetermined. The electrical signal of is applied.

2A and 2B are partial plan views illustrating a connection pad portion of a conventional liquid crystal panel lower substrate and TCP, and FIGS. 3A and 3B are cross-sectional views of FIG. 2.

2A and 3A, a pad portion 111 (hereinafter referred to as an “input pad portion”) 111 is formed at one end of gate lines and data lines formed on the lower substrate 110. The base film 141 of the TCP 140 bonded to one end of the 110 is formed with a pad part (hereinafter referred to as an output pad part) 144 to correspond to the input pad part 111.

2B and 3B, when the TCP 140 is adhered on the lower substrate 110 of the liquid crystal panel, the base film 141 having the adhesive portion of the TCP 10, 12, that is, the output pad portion 144, is formed. ) Is inflated by heat.

In detail, the TCP (10, 12) is an anisotopci conductive film (hereinafter referred to as "ACF") including a conductive ball 151 (150) interposed between the lower substrate (high temperature, high pressure environment) 110) is glued to the edge.

At this time, the base film 141 of the TCP 140 is expanded by heat. Therefore, the spacing between the pads formed on the output pad part 144 of the TCP 140 and the pads of the input pad part 111 formed on the lower substrate 110 are different. (X) is generated.

As a result, in the input pad unit 111 that is connected one-to-one corresponding to the output pad unit 144 of the TCP 140, the output pad and the input pad have a degree of misalignment X as they go outward. There is a problem in that a bad electrical short between the pads occur.

In the liquid crystal display device, the misalignment during TCP and liquid crystal panel bonding is corrected by adjusting the pad pitch of the TCP to compensate for thermal expansion of the junction bonded to the liquid crystal panel or by varying the pad width of the lower substrate of the liquid crystal panel. An object of the present invention is to provide a tape carrier package, a liquid crystal display device, and a manufacturing method of the liquid crystal display device.

In order to achieve the above object, a tape carrier package according to the present invention includes a base film; An integrated circuit chip formed on the base film; And an output pad part connected to the integrated circuit chip and having different pitches at one end of the base film.

In addition, in order to achieve the above object, the liquid crystal display according to the present invention, the upper substrate and the lower substrate is bonded to display an image, the liquid crystal panel having an input pad portion having a different width at one end of the lower substrate and; A printed circuit board applying a signal to the liquid crystal panel; And a tape carrier package connected to the input pad of the lower substrate and connected to one end of the printed circuit board.

Further, in order to achieve the above object, an embodiment of the manufacturing method of the liquid crystal display device according to the present invention, the upper substrate and the lower substrate is bonded to display an image, the liquid crystal panel having an input pad portion at one end of the lower substrate Preparing a; Preparing a tape carrier package having an output pad part corresponding to the input pad part one-to-one and having a different pitch; And pressing the output pad part of the tape carrier package on one end of the lower substrate to which the input pad part is formed.

In addition, another embodiment of the manufacturing method of the liquid crystal display device according to the present invention in order to achieve the above object, the upper substrate and the lower substrate is bonded to display an image, the width of one end of the lower substrate Preparing a liquid crystal panel on which another input pad portion is formed; Preparing a tape carrier package in which an output pad unit corresponding to the input pad unit is formed one to one; And pressing the output pad part of the tape carrier package on one end of the lower substrate to which the input pad part is formed.

Hereinafter, a tape carrier package and a liquid crystal display according to the present invention will be described in detail with reference to the accompanying drawings.

4 is a plan view illustrating a portion of a liquid crystal display according to the present invention.

As shown in FIG. 4, the lower substrate 210 and the upper substrate 220 are joined to form a liquid crystal panel, in which pixels are arranged at intersections of gate lines and data lines, respectively. In the matrix, an active area for displaying an image corresponding to a video signal is defined.

One end of the lower substrate 210 of the liquid crystal panel is connected to one end of the TCP 240 in which the D-IC 243 is mounted, and the other end of the TCP 240 is connected to the PCB 245 to be predetermined. The electrical signal of is applied.

In this case, the output pad unit 244 of the TCP 240 is connected to the input pad unit 211 of the liquid crystal panel lower substrate 210 in a one-to-one correspondence, and the input pad unit 211 is connected to the output pad unit ( The signal is applied from the signal 244 to the gate lines or the data lines formed in the active region.

The input pad unit 211 has a width different from that of the outer input pad 211a and the center input pad 211b corresponding to the output pad unit 244 of one TCP 240.

This is because the outer portion of the base film 241 of the TCP 240 is thermally expanded due to the high temperature generated when pressing the TCP 240 and the lower substrate 210, the position of the output pad unit 244 is the original position In order to compensate for this, the width of the outer input pads 211a of the input pad part 211 is greater than the width of the center input pads 211b.

5A and 5B are enlarged partial plan views illustrating a connection pad portion 'A' of the liquid crystal panel lower substrate and the TCP according to the present invention in FIG. 4, and FIGS. 6A and 6B are cross-sectional views of FIG. 5.

5A and 6A, in the liquid crystal display according to the present invention, an input pad part 211 is formed at one end of gate lines and data lines formed on the lower substrate 210 and the lower substrate 210. An output pad part 244 is formed on the base film 241 of the TCP 240 to be bonded to one end of the c) to correspond to the input pad part 211.

Comparing the central portion and the outer portion of the output pad portion 244 of the TCP 240, the widths W1 and W2 of the output pad portion 244 are the same, but the output pad portion 244a of the outer portion has a pitch P2. Is smaller than the pitch P1 of the output pad portion 244b of the center portion.

When the input pad portion 211 of the liquid crystal panel lower substrate 210 connected to the output pad portion 244 of the TCP 240 is connected, the pitch P3 and the outer portion of the input pad portion 211b of the center portion are viewed. The pitch P4 of the input pad part 211a is the same, but the width W4 of the input pad part 211a of the outer part is formed larger than the width W3 of the input pad part 211b of the center part.

Accordingly, the outer output pad portion 244a of the TCP 240 is densely formed, and the output pad portion 244b of the central portion is formed to have substantially the same pitch and width as the input pad portion 211.

In addition, the width W4 of the outer input pad part 211a of the lower substrate 210 is formed to be larger than the width W2 of the outer output pad part 244a of the TCP 240. Even if the base film 241 is stretched at the time of heat compression, the width of the input pad part 211a corresponding to the outer output pad 244a is wide so that it can be safely connected.

Accordingly, the size between the last pads in the first pad of the TCP 240 may be smaller than the size between the last pads in the first pad of the lower substrate 210 corresponding thereto.

5B and 6B, when the TCP 240 is bonded onto the lower substrate 210 of the liquid crystal panel, the base film 241 on which the adhesive portion of the TCP 240 is formed, that is, the output pad portion 244 is formed. It expands by heat, and thus the outer portion of the base film 241 is extended by thermal expansion.

Therefore, although the pad pitch was differently formed on the base film 241 before the adhesion, the pitch of the outer output pad portion 244a, which is densely formed, increases, so that the base film of the TCP 240 after the adhesion ( The spacing of the output pad portions 244 formed on the 241 is substantially the same.

In detail, the TCP 240 has a lower anisotropic conductive film (ACF) 250 including a conductive ball 251 interposed therebetween under a high temperature and high pressure environment. Is glued to the edge of the.

At this time, the base film 241 of the TCP 240 is expanded by heat. Therefore, the gap between the pads formed in the output pad part 244 of the TCP 240 and the pads of the input pad part 211 formed on the lower substrate 210 are almost equal to each other. There is an advantage that can be minimized.

Here, the configuration of the variable design of the pitch of the output pad unit 244 of the TCP 240, and the configuration of the variable design of the width of the input pad unit 211 of the lower substrate 210 is the manufacturing time of the liquid crystal display device Alternatively, at least one configuration may be manufactured.

That is, the liquid crystal display according to the present invention has a configuration in which the pitch of the output pad unit 244 of the TCP 240 is variably designed, and the input pad unit 211 of the lower substrate 210 has the same pitch and width. It can also be designed to In addition, the liquid crystal display according to the present invention is designed to have the same pitch and width of the output pad unit 244 of the TCP 240 and to variably design the width of the input pad unit 211 of the lower substrate 210. You can also have a configuration.

An embodiment of the method of manufacturing a liquid crystal display device having the above structure includes the steps of: bonding an upper substrate and a lower substrate to display an image, and preparing a liquid crystal panel having an input pad portion at one end of the lower substrate; Preparing a tape carrier package having an output pad part corresponding to the input pad part one-to-one and having a different pitch; And pressing the output pad portion of the tape carrier package to one end of the lower substrate on which the input pad portion is formed.

In another embodiment of the method of manufacturing a liquid crystal display device having the above structure, an upper substrate and a lower substrate are bonded to display an image, and an input pad portion having different widths is formed at one end of the lower substrate. Preparing a liquid crystal panel; Preparing a tape carrier package in which an output pad unit corresponding to the input pad unit is formed one to one; And pressing the output pad portion of the tape carrier package to one end of the lower substrate on which the input pad portion is formed.

That is, the configuration for variably designing the pitch of the TCP output pad section and the configuration for variably designing the width of the input pad section of the lower substrate may be manufactured by selecting at least one configuration at the time of manufacturing the liquid crystal display device.

As mentioned above, the present invention has been described in detail through specific embodiments, which are intended to specifically describe the present invention, and the tape carrier package and the liquid crystal display device according to the present invention are not limited thereto, and the present invention is within the spirit of the present invention. It is apparent that modifications and improvements are possible by those skilled in the art.

According to the present invention, a misalignment is easily performed when bonding TCP and a liquid crystal panel by adjusting the pad pitch of the TCP to compensate for thermal expansion of the junction bonded to the liquid crystal panel or by varying the pad width of the lower substrate of the liquid crystal panel. There is an effect to minimize the defect.

Claims (24)

A base film; An integrated circuit chip formed on the base film; And an output pad part connected to the integrated circuit chip and having pad pitches differently formed at one end of the base film. The method of claim 1, And a pitch of the outer output pad portion of the base film is smaller than a pitch of the central output pad portion. The method of claim 1, The output pad unit tape carrier package, characterized in that each pad is formed in the same width. A liquid crystal panel in which an upper substrate and a lower substrate are bonded to display an image, and an input pad portion having different widths is formed at one end of the lower substrate; A printed circuit board applying a signal to the liquid crystal panel; And a tape carrier package connected to an input pad of the lower substrate and connected to one end of the printed circuit board. The method of claim 4, wherein The liquid crystal panel is an input pad part corresponding to an output pad part of the tape carrier package, wherein the width of the outer input pad part is wider than the width of the center input pad part. The method of claim 4, wherein The pitch of the input pad portion is the same. The method of claim 4, wherein The tape carrier package may include an output pad part having a different pitch from one end of the base film. The method of claim 7, wherein The pitch of the outer output pad portion of the base film is formed smaller than the pitch of the center output pad portion. The method of claim 4, wherein And a conductive film formed between the tape carrier package and the lower substrate. Preparing a liquid crystal panel in which an upper substrate and a lower substrate are bonded to display an image, and an input pad part is formed at one end of the lower substrate; Preparing a tape carrier package having an output pad part corresponding to the input pad part one-to-one and having a different pitch; And pressing the output pad part of the tape carrier package on one end of the lower substrate on which the input pad part is formed. The method of claim 10, In the heat pressing step, The outer base film of the tape carrier package is thermally expanded, the manufacturing method of the liquid crystal display device. The method of claim 10, The input pad unit is formed in a different width (width) manufacturing method of the liquid crystal display device. The method of claim 10, The pitch of the said input pad part is the same, The manufacturing method of the liquid crystal display device characterized by the above-mentioned. The method of claim 10, The other end of the tape carrier package further comprises the step of connecting to the printed circuit board manufacturing method of a liquid crystal display device. The method of claim 10, The pitch of the outer output pad portion of the tape carrier package is smaller than the pitch of the center output pad portion. The method of claim 15, The output pad unit is a manufacturing method of the liquid crystal display device, characterized in that each pad is formed in the same width. Preparing a liquid crystal panel in which an upper substrate and a lower substrate are bonded to display an image, and an input pad portion having different widths is formed at one end of the lower substrate; Preparing a tape carrier package in which an output pad unit corresponding to the input pad unit is formed one to one; And pressing the output pad part of the tape carrier package on one end of the lower substrate where the input pad part is formed. The method of claim 17, In the heat pressing step, The outer base film of the tape carrier package is thermally expanded, the manufacturing method of the liquid crystal display device. The method of claim 17, The liquid crystal panel is an input pad part corresponding to an output pad part of the tape carrier package, wherein the width of the outer input pad part is wider than the width of the center input pad part. The method of claim 17, The pitch of the said input pad part is the same, The manufacturing method of the liquid crystal display device characterized by the above-mentioned. The method of claim 17, And the output pad part is formed to have a different pitch from each pad. The method of claim 17, The pitch of the outer output pad portion of the tape carrier package is smaller than the pitch of the center output pad portion. The method of claim 22, The output pad unit is a manufacturing method of the liquid crystal display device, characterized in that each pad is formed in the same width. The method of claim 17, The other end of the tape carrier package further comprises the step of connecting to the printed circuit board manufacturing method of a liquid crystal display device.

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