KR20100047590A - Chip on glass type liquid crystal display device - Google Patents

Abstract

PURPOSE: A chip on glass type liquid crystal display device is provided to make an adjacent driving integrated circuit to have the same ground level without directly connecting a driving integrated circuit directly connected to an FPC with an adjacent driving integrated circuit not directly connected to the FPC. CONSTITUTION: A top case(310) is coupled with a cover bottom and a support main. The top case surrounds the top edge of a liquid crystal panel. The 1 to n driving integrated circuits are connected in series along one edge of the first substrate. An FPC(Flexible Printed Circuit Board)(120) directly transfers a signal to the 1 to m driving integrated circuits. A conductor electrically connects the n driving integrated circuit to at least one of the top case or the cover bottom.

Description

CIO on type liquid crystal display device

The present invention relates to a liquid crystal display device, and more particularly, to a chip on glass (COG) type liquid crystal display device.

A liquid crystal display device displays an image using the optical anisotropy and polarization property of the liquid crystal. Since the liquid crystal has a thin and long molecular structure, the liquid crystal has directivity in the arrangement of molecules, and the direction of the molecular arrangement can be controlled by artificially applying an electric field to the liquid crystal.

Therefore, if the molecular arrangement direction of the liquid crystal is arbitrarily adjusted, the molecular arrangement of the liquid crystal is changed, and the polarization state of light is changed in the molecular arrangement direction of the liquid crystal due to optical anisotropy, thereby displaying an image.

Accordingly, a liquid crystal display device includes a liquid crystal panel in which a pair of first and second substrates having a transparent field generating electrode formed on a surface facing each other with a liquid crystal layer interposed therebetween, and a backlight for supplying light thereto. backlight), by controlling the electric field between the two field generating electrodes of the liquid crystal panel to artificially adjust the direction of the liquid crystal molecules to generate a difference in transmittance and to pass the light generated from the backlight through such a liquid crystal panel difference in the transmittance Is displayed to the outside to display various images.

The outer portion of the liquid crystal panel is configured to drive a driving unit, which is connected to a printed circuit board (PCB) on which components generating various control signals and data signals, a liquid crystal panel and a printed circuit board, and is connected to the liquid crystal panel. And a driving integrated circuit (IC) for applying a signal to the wiring line.

Chip on glass (COG) tape carrier package (TCP) chip on film (COF) The COG method has been widely used in recent years because the structure of the COG method is simpler than that of the TCP method and the COF method, and the ratio of the liquid crystal panel to the liquid crystal display device can be increased.

1 is a perspective view of such a COG type liquid crystal display device, wherein the liquid crystal panel 10 having the above-described configuration includes a first substrate 12 and a second substrate 14 between a liquid crystal layer (not shown). It is in a state of being joined when facing each other. In addition, a backlight (not shown) that is a dimming means is provided on the rear surface of the liquid crystal panel 10.

At this time, since the first substrate 12 has a larger area than the second substrate 14, two adjacent edges of the first substrate 12 are exposed to the outside when the first substrate 12 is bonded, although not clearly shown in the drawing. At these two edges, driving integrated circuits 15 and 17 are provided for applying signals to a plurality of gate lines and data lines.

The driving integrated circuits 15 and 17 are a plurality of gate and data driving integrated circuits, and each of the gate and data driving integrated circuits 15 and 17 is connected to a gate and data wiring (not shown) on the first substrate 12, respectively. Connected.

The gate and data driving integrated circuits 15 and 17 are connected to an external printed circuit board (not shown) through the FPC 20.

On the other hand, recently, in order to further shape the liquid crystal display by minimizing the size of the FPC 20, the signal lines 21 connected to the gate and data driving integrated circuits 15 and 17 are LOG (line on glass) method. This is a trend formed on the substrate 12.

Thus, the plurality of gate driving integrated circuits 15 are connected to each other by the LOG line 21 mounted on the substrate 12, and each data driving integrated circuit 17 is also connected to each other by the LOG line 21. The LOG line 21 is connected to the FPC 20.

That is, various signals of the printed circuit board (not shown) are transmitted to all the gates and the data driving integrated circuits 15 and 17 through the LOG line 21.

Here, the gate and data driver integrated circuits 15 and 17 are cascaded onto the substrate 12 via the LOG line 21 in order to minimize wiring.

However, when the driving integrated circuits 15 and 17 are cascaded, a problem occurs in that the power supply voltage output from the data driving integrated circuit 17 is dropped.

That is, when the data driving integrated circuit 17 is cascaded, the first and second data driving integrated circuits 17a and 17b are directly connected to the FPC 20 so that the FPC (not shown) is connected to the FPC (not shown). Although various signals are directly transmitted through 20, the third data driving integrated circuit 17c receives a signal from the second data driving integrated circuit 17b, and the fourth data driving integrated circuit 17d receives the second signal. The signal is received from the third data driving integrated circuit 17c which receives the signal from the data driving integrated circuit 17b.

Thus, even when a power supply voltage is applied through the FPC 20 from the printed circuit board (not shown), the data driving integrated circuit 17 located farther from the FPC 20 has a resistance and a LOG line 21 of the printed circuit board (not shown). Power supply voltage is dropped by the resistance of).

Therefore, the data drive integrated circuit 17d far from the FPC 20 has an instantaneous rise in the ground level as soon as the power supply voltage is applied, thereby outputting the data drive integrated circuits 17a and 17b directly connected to the FPC 20. This different phenomenon occurs.

In other words, the third and fourth data driving integrated circuits 17c and 17d may have a resistance with that of the printed circuit board (not shown), compared to the first and second data driving integrated circuits 17a and 17b directly connected to the FPC 20. Due to the difference in the resistance of the LOG line 21, the difference in the delivered power supply voltage is generated, which causes the brightness of the image to be changed by noise and source dim, thereby degrading display quality.

This problem is exacerbated by heat generated in the liquid crystal panel 10 itself when the liquid crystal panel 10 is driven for a long time.

The present invention has been made to solve the above problems, and a first object of the present invention is to provide a driving integrated circuit connected directly to the FPC and adjacent driving integrated circuits not directly connected to the FPC to have the same ground level.

Therefore, it is a second object of the present invention to provide a COG type liquid crystal display device which can prevent the display quality deterioration due to the luminance difference.

In order to achieve the object as described above, the present invention is covered covertum; A support main of the upper cover bottom; A backlight unit surrounded by the support main; A liquid crystal panel positioned on the backlight unit and including first and second substrates bonded to each other with a liquid crystal layer interposed therebetween; A top case assembled with the cover bottom and the support main and surrounding the top edge of the liquid crystal panel; First to nth driving integrated circuits connected in series with one edge of the first substrate; An FPC for directly transmitting a signal to the first to mth driving integrated circuits; And a conductor electrically connecting the nth driving integrated circuit to at least one of the top case and the cover bottom, wherein m and n are natural numbers, 1 <= m <n, and mth + And a 1 to n th driving integrated circuit receive a signal from the m th driving integrated circuit.

The first to nth driving integrated circuits may include a ground wiring, wherein the ground wiring connected to the nth driving integrated circuit is exposed, and the conductor is connected to the exposed ground wiring. do.

In addition, the FPC is characterized in that the cascade type, the conductor is a gasket (gasket) coated with a conductive material, the gasket is characterized in that it is electrically connected to the top case.

In this case, the conductor is a conductive tape, the conductive tape is characterized in that it is electrically connected to the top case or the cover bottom, the one side of the inner edge of the support main of the predetermined shape so that the gasket is extended and seated It is characterized in that the stepped seating portion is provided.

As described above, among the plurality of data driving integrated circuits cascaded according to the present invention, the fourth data driving integrated circuit which is not directly connected to the FPC but connected far from the FPC is grounded to the outside through the ground wiring and the conductor. In addition, the ground level of a plurality of data driving integrated circuits can be prevented from being different, and the ground level applied to the data driving integrated circuit far from the FPC may be caused by the resistance of the printed circuit board and the resistance of the LOG line. There is an effect that can be prevented.

Therefore, a difference in signal voltage occurs due to a difference in ground level, and thus, the brightness and the like of the image are changed by noise and source dim, thereby preventing the existing problem of deteriorating display quality. have.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

First Embodiment

FIG. 2A is a perspective view of a COG type liquid crystal display device according to a first embodiment of the present invention, and FIG. 2B is an enlarged view of region A of FIG. 2A.

As illustrated, the liquid crystal display device includes a liquid crystal panel in which a first substrate 112 and a second substrate 114 are bonded to each other with a liquid crystal layer (not shown) interposed therebetween, and a rear surface of the liquid crystal panel 100. The backlight (not shown) which is a dimming means is comprised by this.

Looking at this in more detail, the liquid crystal panel 100 plays a key role in image expression, and includes a first substrate 112 and a second substrate 114 bonded to each other with the liquid crystal layer interposed therebetween. .

In this case, under the premise of an active matrix method, although not shown in the drawings, a plurality of gate lines and data lines intersect with each other and a pixel is defined on an inner surface of the first substrate 112, commonly referred to as a lower substrate or an array substrate. Thin film transistors (TFTs) are provided at each intersection to correspond one-to-one to the transparent pixel electrodes formed in each pixel.

In addition, the inner surface of the second substrate 114 called the upper substrate or the color filter substrate may correspond to each pixel, for example, a color filter of red (R), green (G), and blue (B) color, and each of them. A black matrix covering the non-display elements such as gate lines, data lines, and thin film transistors is provided. In addition, a transparent common electrode covering them is provided.

In this case, the pad region is further provided in the first substrate 112 as compared with the second substrate 114, so that the area of two adjacent edges is larger. Accordingly, the driving integrated circuits 115 and 117 are configured to apply signals to a plurality of gate lines and data lines in two adjacent pad regions of the first substrate 112.

Such a structure is referred to as a chip on glass (COG) liquid crystal panel 100. The COG method uses an anisotropic conductive film (ACF) to drive driving circuits 115 and 117 on the first substrate 112. As a method of directly attaching the adhesive, the ratio of the liquid crystal panel 100 to the liquid crystal display device can be increased.

The driving integrated circuits 115 and 117 are a plurality of gate and data driving integrated circuits, and each of the gate and data driving integrated circuits 115 and 117 is a gate and data wiring (not shown) on the first substrate 112, respectively. Connected.

The gate and data driving integrated circuits 115 and 117 are connected to an external printed circuit board (not shown) through the FPC 120.

At this time, the plurality of gate and data driving integrated circuits 115 and 117 are cascaded by the LOG line 121.

Accordingly, the first and second data driving integrated circuits 117a and 117b are directly connected to the FPC 120 to receive various signals directly from the printed circuit board (not shown) through the FPC 120. The data driving integrated circuit 117c receives a signal from the second data driving integrated circuit 117b, and the fourth data driving integrated circuit 117d receives a signal from the second data driving integrated circuit 117b. 3 The signal is received from the data driving integrated circuit 117c.

Here, the LOG line 121 connecting the data driving integrated circuits 117 may include data power signals and a source enable signal supplied from a power supply such as a video signal, a power signal VDD, and a ground voltage signal GND. And a plurality of signal lines for supplying gate control signals supplied from the timing controller such as SOE, source shift cool signal SSC, and source start pulse SSP.

In this case, the plurality of data driving integrated circuits 117 are connected to the ground wiring 130 to which the ground voltage signal is applied from the power supply unit to maintain the coin position, and the data driving integrated circuit 117 by the static electricity generated during the manufacturing process. To prevent damage.

An insulating film (not shown) is coated on the pad area including the driving integrated circuits 115 and 117 to insulate the driving integrated circuits 115 and 117 and the wirings 121.

In addition, although not clearly shown in the drawings, the upper and lower alignment layers for determining the initial molecular alignment direction of the liquid crystal are interposed between the two substrates 112 and 114 of the liquid crystal panel 100 and the liquid crystal layer, and filled therebetween. Seal patterns are formed along edges of both substrates 112 and 114 to prevent leakage of the liquid crystal layer.

In this case, upper and lower polarizers (not shown) are attached to outer surfaces of the first and second substrates 112 and 114, respectively.

Accordingly, in the liquid crystal panel 100 having the above-described structure, when the thin film transistor selected for each gate line is turned on by the on / off signal transmitted through the scan, the signal voltage is transmitted to the corresponding pixel electrode through the data line. The arrangement direction of the liquid crystal molecules is changed by the electric field between the electrode and the common electrode, indicating a difference in transmittance.

Meanwhile, the present invention forms an exposed portion 210 which is not coated with an insulating film (not shown) on one side of the fourth data driving integrated circuit 117d farthest from the FPC 120 to form the fourth data driving integrated circuit ( Exposed ground wiring 130 connected to 117d.

In addition, the conductive elastic body 200 may be attached to the exposed ground wiring 130.

In this case, the ground wiring 130 has a larger area than the ground wiring (not shown) connected to the first to third data driving integrated circuits 117a, 117b, and 117c to secure a sufficient contact area with the conductive elastic body 200. It is preferable to configure so as to have a configuration, and to expose the ground wiring 130 connected to the fourth data driving integrated circuit 117d to the maximum.

Here, the conductive elastic body 200 is made of a gasket (gasket) has a characteristic that the shape of the gasket is deformed by pressing, such as a sponge, the conductive material is coated.

Accordingly, the fourth data driving integrated circuit 117d is grounded to the outside through the conductive elastic body 200 connected to the ground wiring 130 of the fourth data driving integrated circuit 117d.

As a result, the resistance of the printed circuit board (not shown) and the resistance of the LOG line 21 are increased in the fourth data driving integrated circuit 117d compared to the first to third data driving integrated circuits 117a, 117b, and 117c. This increase in resistance can prevent the ground level of the fourth data driving integrated circuit 117d from being raised.

That is, the data drive integrated circuit 117d far from the FPC 120 has an instantaneous rise in the ground level as soon as the power supply voltage is applied, thereby outputting the data drive integrated circuits 117a and 117b directly connected to the FPC 120. This change occurs, which is to prevent such a problem from occurring.

On the other hand, the external is a cover bottom (150 of FIG. 2) or a top case having a ground potential among the support main, cover bottom and top case for modularizing the liquid crystal display, and unnecessary external generated in the data driving integrated circuit 117. The charge can be easily discharged.

FIG. 3A is an exploded perspective view of a liquid crystal display device including a liquid crystal panel according to an exemplary embodiment of the present invention, and FIG. 3B is a schematic cross-sectional view of a portion of the modularized liquid crystal display module of FIG. 3A.

As illustrated, the liquid crystal display module includes a liquid crystal panel 100, a backlight unit 340, a support main 320, a cover bottom 330, and a top case 310.

First, as described above, the liquid crystal panel 100 plays a key role in image expression, and includes the first and second substrates 112 and 114 bonded to each other with the liquid crystal layer interposed therebetween.

In addition, first and second polarizing plates 119a and 119b for selectively transmitting only specific light are attached to outer surfaces of the first second substrates 112 and 114, respectively.

At this time, as mentioned above, the second substrate 114 of the liquid crystal panel is smaller than the first substrate 112 and partially exposes two adjacent edges of the first substrate 112, and the exposed two edges are COG type. Thus, the gate and data driving integrated circuits 115 and 117 are mounted.

The data driving integrated circuit 117 is connected to an external printed circuit board (not shown) through the FPC 120 to receive various driving signals from the printed circuit board (not shown).

Here, the fourth data driving integrated circuit 117d which is not directly connected to the FPC 120 but far from the FPC 120 may connect the ground wiring 130 and the conductive elastic body 200 of the fourth data driving integrated circuit 117d. Grounded through the outside.

That is, the first and second data driving integrated circuits 117a and 117b are directly connected to the FPC 120 to receive various signals directly from the FPC 120, but the third data driving integrated circuit 117c may be connected to the first and second data driving integrated circuits 117c. The signal is received from the second data driving integrated circuit 117b, and the fourth data driving integrated circuit 117d receives the signal from the third data driving integrated circuit 117c receiving the signal from the second data driving integrated circuit 117b. Will be delivered.

In this case, after exposing the ground wiring 130 connected to the fourth data driving integrated circuit 117d, the conductive elastic body 200 is attached to the exposed ground wiring 130.

The conductive elastic body 200 is connected to the top case 310 for modularizing the liquid crystal display device and grounded. That is, the fourth data driving integrated circuit 117d and the top case 210 are connected to each other through the conductive elastic body 200. By being electrically connected to each other, it is possible to prevent the output voltages of the plurality of data driving integrated circuits 117 from being different. We will discuss this in more detail later.

In addition, a backlight unit 340 for supplying light to the liquid crystal panel 100 is disposed on the rear surface of the liquid crystal panel 100.

The backlight unit 340 includes a lamp 341 arranged along at least one edge length direction of the support main 320, a white or silver reflecting plate 343 seated on the cover bottom 330, and the reflecting plate 343. ) Includes a light guide plate 345 seated thereon and a plurality of optical sheets 347 interposed thereon.

As the light source 341, a fluorescent lamp such as a cold cathode fluorescent lamp or an external electrode fluorescent lamp may be used.

The lamp guide 349 further includes a lamp guide 349 for guiding the lamp 341. The lamp guide 349 includes an upper, a lower surface, and an outer surface with an inner side opened toward the light guide plate 345. Around the top, bottom, and outside of the 341, the light is concentrated in the direction of the light guide plate 345 together with the protection of the lamp 341.

At this time, the light guide plate 345 spreads the light incident from the lamp 341 to the surface of the light guide plate 345 evenly while propagating the inside of the light guide plate 345 by a plurality of total reflections to provide a surface light source to the liquid crystal panel 100. do.

The light guide plate 345 may include a pattern of a specific shape on the rear surface to supply a uniform surface light source.

In addition, the reflector 343 is positioned on the rear surface of the light guide plate 345, and reflects light passing through the rear surface of the light guide plate 345 toward the liquid crystal panel 100 to improve the brightness of the light.

The plurality of optical sheets 347 on the light guide plate 345 include a diffusion sheet and at least one light collecting sheet, and diffuse or condense the light passing through the light guide plate 345 to provide a more uniform surface to the liquid crystal panel 100. Let the light source enter.

Accordingly, the light emitted from the lamp 341 is guided to the light guide plate 345 by the lamp guide 349, is then refracted toward the liquid crystal panel 100, and uniformly passes through the plurality of optical sheets 347. It is processed to a high quality of brightness and incident on the liquid crystal panel 100, so that the liquid crystal panel 100 displays an image to the outside.

The liquid crystal panel 100 and the backlight unit 340 are modularized through the top case 310, the support main 320, and the cover bottom 330, which covers the liquid crystal panel 100 and the backlight unit 340. The bottom 330 is formed in a rectangular plate shape by vertically bending the edge of a predetermined height.

The support main 320 seated on the cover bottom 330 and covering the edges of the liquid crystal panel 100 and the backlight unit 340 is formed of a synthetic resin mold and has a substantially rectangular frame shape. The one side edge inner surface is provided with a seating portion 321 of the stepped conductive elastic body 200 of a predetermined form.

That is, the conductive elastic body 200 attached to the ground wiring 130 of the fourth data driving integrated circuit 117d described above extends to the seating portion 321 of the support main 320.

The top case 310 coupled to the cover bottom 330 and the support main 320 is configured to cover the upper edge and the side of the liquid crystal panel 100.

In this case, the top case 310 covers the edge of the support main 320 and comes into contact with the conductive elastic body 200, whereby the fourth data driving integrated circuit 117d is grounded.

As a result, the fourth data driving integrated circuit 117d far from the FPC 120 has a printed circuit board (not shown) compared to the first to third data driving integrated circuits 117a, 117b, and 117c close to the FPC 120. The resistance of and the resistance of the LOG line 21 is increased, and it is possible to prevent the ground level of the fourth data driving integrated circuit 117d from being raised due to the increase in resistance.

This will be described in more detail with reference to FIGS. 4A to 4B.

4A shows experimental data before grounding the data drive integrated circuit 117d of FIG. 3A far from the FPC (120 in FIG. 3A), and FIG. 4B shows the data drive integrated circuit far from the FPC (120 in FIG. 3A) (FIG. 3A). 117d) is experimental data after grounding through the ground wiring (130 in FIG. 3A) and the conductive elastic body.

Referring to these experimental data, the data driving integrated circuit (Fig. 3A) where the ground voltage signal at the time when the source enable signal SOE is applied and when the source start pulse SSP is applied is far from the FPC (120 in Fig. 3A). 117d) depends on whether or not the ground.

That is, before grounding the data driving integrated circuit 117d of FIG. 3A, the power signal VDD and the ground voltage signal GND at the time when the source enable signal SOE is applied and when the source start pulse SSP is applied. Note that the potential difference between the circuits is 3.06V, but when the data driving direct circuit 117d of FIG. 3A is grounded, the potential difference between the power supply signal VDD and the ground voltage signal GND decreases to 2.04V.

Therefore, the data drive integrated circuit 117d far from the FPC 120 has an instantaneous rise in the ground level as soon as the power supply voltage is applied, thereby outputting the data drive integrated circuits 117a and 117b directly connected to the FPC 120. This change occurs, which can be prevented from occurring.

As a result, the brightness and the like of the image are changed by noise and source dim, thereby preventing the display quality from being degraded.

In this case, the top case may also be referred to as a top cover 310 or a case top, and the support main 320 may be referred to as a guide panel or a main support or a mold frame, and the cover bottom 330 is also called a bottom cover or a lower cover. It is also built.

Meanwhile, the backlight unit 340 having the above-described structure is called a side light method, and a plurality of lamps (not shown) may be arranged in a plurality of layers along an inner length direction of one edge of the support main 320. It is also possible to be arranged side by side along the inner longitudinal direction of both edges of the support main 320 facing each other.

In addition, a direct type in which a plurality of lamps (not shown) are arranged side by side on the upper front surface of the reflective plate 341 may be possible. In this case, the light guide plate 343 may be omitted.

Second Embodiment

FIG. 5 is a schematic cross-sectional view of a portion of a liquid crystal display module in which a liquid crystal panel according to a second embodiment of the present invention is modularized.

In this case, in order to avoid duplicate description, the same reference numerals are given to the same parts that play the same role as the description of FIGS. 3A to 3B described above, and only the characteristic contents described above will be described.

As illustrated, the reflective plate 343, the light guide plate 345, a lamp 341 provided on one side of the light guide plate 345, and a plurality of optical sheets 347 are stacked on the light guide plate 345 to form a backlight. Unit 340 is achieved.

In addition, the liquid crystal panel 100 in which the liquid crystal layer is interposed between the first and second substrates 112 and 114 and the backlight unit 340 is positioned thereon, and the first second substrates 112 and 114 are disposed thereon. On each outer surface of the polarizers 119a and 119b for selectively transmitting only specific light are attached.

The backlight unit 340 and the liquid crystal panel 100 have an edge surrounded by the support main 320, and the cover bottom 330 is coupled to the rear surface of the backlight unit 340 and the top case covering the upper edge and the side of the liquid crystal panel 100. The 310 is coupled to the support main 320 and the cover bottom 330.

At this time, as mentioned above, the second substrate 114 of the liquid crystal panel 100 is smaller than the first substrate 112 and partially exposes two adjacent edges of the first substrate 112, and the first substrate thereof. Gates and data driving integrated circuits 115 and 117 of FIG. 3A are mounted on two adjacent edges 112 at a COG method.

The data driving integrated circuit 117d is connected to an external printed circuit board (not shown) through an FPC (120 of FIG. 3A), and receives various driving signals from the printed circuit board (not shown).

Here, the fourth data driving integrated circuit 117d which is not directly connected to the FPC (120 of FIG. 3A) and is far from the FPC (120 of FIG. 3A) is connected to the ground wiring of the fourth data driving integrated circuit 117d (FIG. 2B). 130 and the outside of the conductive tape 400 is grounded.

At this time, the conductive tape 400 is made of a conductive material such as aluminum (Al), a plurality of wrinkles perpendicular to the longitudinal direction is formed has a form capable of shrinking and stretching.

That is, the conductive tape 400 is connected to an external component having a ground potential, such as the top case 310 and the cover bottom 330, which are coupled in front and rear with the liquid crystal panel 100 interposed therebetween, to form a plurality of data driving aggregates. The difference in the ground level of the circuit 117d can be prevented.

As a result, the brightness and the like of the image are changed due to noise and source dim, thereby preventing the display quality from being degraded.

The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.

1 is a perspective view of such a COG type liquid crystal display device.

2A is a perspective view of a COG type liquid crystal display device according to a first embodiment of the present invention.

FIG. 2B is an enlarged view of region A of FIG. 2A;

3A is an exploded perspective view of a liquid crystal display device including a liquid crystal panel according to an exemplary embodiment of the present invention.

FIG. 3B is a schematic cross-sectional view of a portion of the modular LCD module of FIG. 2A; FIG.

4a to 4b are experimental data for comparing before and after grounding of the data driving integrated circuit;

FIG. 5 is a schematic cross-sectional view of a partial cross section of a liquid crystal display module modularizing a liquid crystal panel according to a second embodiment of the present invention; FIG.

Claims (7)

Covertum; A support main of the upper cover bottom; A backlight unit surrounded by the support main; A liquid crystal panel positioned on the backlight unit and including first and second substrates bonded to each other with a liquid crystal layer interposed therebetween; A top case assembled with the cover bottom and the support main and surrounding the top edge of the liquid crystal panel; First to nth driving integrated circuits connected in series with one edge of the first substrate; An FPC for directly transmitting a signal to the first to mth driving integrated circuits; A conductor electrically connecting the nth driving integrated circuit to at least one of the top case and the cover bottom, And m and n are natural numbers, 1 <= m <n, and the m + 1 to nth driving integrated circuits receive signals from the mth driving integrated circuits. The method of claim 1, And the first to nth driving integrated circuits include ground wirings. The method of claim 1, And a ground wiring connected to the nth driving integrated circuit is exposed, and the conductor is connected to the exposed ground wiring. The method of claim 1, And the FPC is a cascade type liquid crystal display device. The method of claim 1, And the conductor is a gasket coated with a conductive material, and the gasket is electrically connected to the top case. The method of claim 1, And wherein the conductor is a conductive tape, and the conductive tape is electrically connected to the top case or the cover bottom. The method of claim 5, A COG type liquid crystal display device, characterized in that a stepped seating portion of a predetermined shape is provided on the inner side of one side edge of the support main so that the gasket is extended and seated.

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