KR102248646B1 - Flexible printed circuit board and display device comprising the same - Google Patents

Abstract

A flexible circuit board according to an embodiment of the present invention includes a substrate, first wires, and second wires. The first wirings are disposed on one surface of the substrate and are connected to the first wiring terminals, and the second wirings are disposed on the other surface of the substrate and are connected to the second wiring terminals. The first wiring terminals and the second wiring terminals are disposed on one surface of the substrate, and the second wirings pass through the substrate and are connected to the second wiring terminals.

Description

Flexible circuit board and display device including the same {FLEXIBLE PRINTED CIRCUIT BOARD AND DISPLAY DEVICE COMPRISING THE SAME}

The present invention relates to a COF package that can be applied to high resolution by reducing the pitch of wirings of a flexible circuit board, and to a display device including the same.

In general, a liquid crystal display device is driven by using the optical anisotropy and polarization properties of the liquid crystal. Since the liquid crystal has a thin and long structure, it has a directionality in the arrangement of molecules, and the direction of the molecular arrangement can be controlled by artificially applying an electric field to the liquid crystal. Therefore, if the direction of the molecular arrangement of the liquid crystal is arbitrarily adjusted, the liquid crystal has a direction The molecular arrangement is changed, and light is refracted in the direction of the molecular arrangement of the liquid crystal due to optical anisotropy, so that image information can be expressed.

The liquid crystal display device is attracting the most attention due to its excellent resolution and video realization ability of an active matrix structure in which a thin film transistor and pixel electrodes connected to the thin film transistor are arranged in a matrix manner. The liquid crystal display device is composed of a color filter substrate on which a common electrode is formed, an array substrate on which a pixel electrode is formed, and a liquid crystal interposed between the two substrates. In this liquid crystal display device, the common electrode and the pixel electrode are applied by an electric field applied vertically. As a method of driving a liquid crystal, it has excellent properties such as transmittance and aperture ratio.

Drive ICs (integrated circuits) of a liquid crystal display are mounted on a display panel and connected to data lines (or signal lines) or gate lines (or source lines). The data drive IC supplies a data signal to the data lines, and the gate drive IC sequentially supplies a scan signal (or gate pulse) synchronized with the data signal to the gate lines. As a method of mounting drive ICs on a display panel, a method of bonding a flexible circuit board on which a drive IC is mounted to a display panel, and a chip on glass (COG) method of directly bonding a drive IC onto a substrate are known. Flexible circuit boards for mounting drive ICs include COF (Chip on Film) or TCP (Tape Carrier Package). Among them, the flexible circuit board on which the drive IC is mounted in the COF method may be bonded to the substrate of the display panel with an anisotropic conductive film (ACF).

1 is a plan view showing a conventional display device, and FIG. 2 is a plan view showing a part of a flexible circuit board.

Referring to FIG. 1, a conventional display device 10 includes a display panel 40 to which a TFT array substrate 20 and a color filter array substrate 30 are bonded. The display panel 40 includes a display area 50 that is an active area (A/A) for displaying an image and other non-display areas 60. In the non-display area 60, the flexible circuit board 70 on which the drive IC 75 for applying the gate and data driving signals to the TFT array substrate 20 is mounted is connected to the PCB 80, respectively.

Referring to FIG. 2, the flexible circuit board 70 includes wirings 72 connecting the PCB 80 and the drive IC or connecting the TFT array board and the drive IC. The wirings 72 may be disposed on one surface of the polyimide substrate or may be disposed on both surfaces and connected through a contact hole. A wiring bump 73 is disposed at one end of the wirings 20 and a contact hole 74 is partially provided. In general, the wiring 72 has a width of about 12 μm and a pitch of 16 μm. In addition, when the contact hole 74 is provided in the wirings 72, the width of the contact hole 74 is about 74 μm.

However, in order to apply the flexible circuit board 70 to high resolution, the wirings 72 are required to be twice or four times or more, but there is a problem in that it is difficult to reduce the pitch of the wirings 72 due to technical limitations. Therefore, urgent efforts are required to apply the flexible circuit board to high resolution.

The present invention provides a flexible circuit board that can be applied to high resolution by reducing the pitch of wirings of the flexible circuit board, and a display device including the same.

In order to achieve the above object, a flexible circuit board according to an embodiment of the present invention includes a substrate, first wirings, and second wirings. The first wirings are disposed on one surface of the substrate and are connected to the first wiring terminals, and the second wirings are disposed on the other surface of the substrate and are connected to the second wiring terminals. The first wiring terminals and the second wiring terminals are disposed on one surface of the substrate, and the second wirings pass through the substrate and are connected to the second wiring terminals.

In addition, a flexible circuit board according to an embodiment of the present invention includes a substrate, first wirings, and second wirings. The substrate includes a wiring portion and a dummy portion. The first wirings are disposed on the wiring portion on one side of the substrate and connected to the first wiring terminals, and the second wirings are disposed on the wiring portion and the dummy portion on the other side of the substrate and are connected to the second wiring terminals. The first wiring terminals and the second wiring terminals are disposed on the wiring portion on one surface of the substrate, and the second wirings penetrate the substrate from the dummy portion on the other surface of the substrate and protrude from the dummy portion on the substrate surface to be connected to the second wiring terminals.

In addition, a display device according to an embodiment of the present invention includes a display panel, a flexible circuit board, and a PCB. In the display panel, the TFT array substrate and the color filter array substrate are bonded together, and the PCB is connected to one side of the flexible circuit board. The flexible circuit board includes a substrate, first wirings connected to the first wiring terminals and connected to the first wiring terminals, and second wirings arranged on the other surface of the substrate and connected to the second wiring terminals, and a first wiring terminal And the second wiring terminals are disposed on one surface of the substrate, and the second wirings pass through the substrate and are connected to the second wiring terminals.

In the present invention, a margin portion is formed at an edge of a flexible circuit board, and second wires pass through the contact hole to form contact portions protruding from a lower surface to an upper surface at the margin portion. In addition, the fourth wirings penetrate the contact hole in the driver IC portion of the flexible circuit board to form contact portions protruding from the lower surface to the upper surface. Accordingly, since the contact portions are formed in the margin portion or the driver IC portion of the flexible circuit board, it is possible to reduce the pitch of wiring lines from 75 μm to 14 μm by the contact portions in the conventional flexible circuit board. Therefore, there is an advantage that can be applied to a high-resolution model in which the number of wirings is increased several times by reducing the pitch of the wirings of the flexible circuit board.

1 is a plan view showing a conventional display device.
2 is a plan view showing a part of a flexible circuit board.
3 is a plan view showing a display device according to an exemplary embodiment of the present invention.
4 is a plan view showing a flexible circuit board according to an embodiment of the present invention.
5 is an enlarged view of area A of FIG. 4.
6 is a cross-sectional view taken along line II′ of FIG. 5.
7 is a cross-sectional view taken along line II-II' of FIG. 5;
Fig. 8 is an enlarged view of area B of Fig. 4;

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a plan view illustrating a display device according to an exemplary embodiment of the present invention. Hereinafter, a liquid crystal display device is illustrated and described as an example of a display device, but the present invention is not limited thereto, and can be applied to a flat panel display device such as an organic light emitting display device or an electrophoretic display device.

Referring to FIG. 3, a display device 100 according to an exemplary embodiment of the present invention includes a display panel 140 to which a TFT array substrate 120 and a color filter array substrate 130 are bonded. The display panel 140 includes a display area 110 and a non-display area 115. The display area 110 is an active area (A/A) in which an image is displayed by forming a liquid crystal layer between the thin film transistor array substrate and the color filter substrate. The color filter array substrate 115 of the display area 110 includes a black matrix and a color filter. A TFT in which data lines and gate lines (or scan lines) are formed by crossing each other on the TFT array substrate 110, and pixels are arranged in a matrix form in cell regions defined by data lines and gate lines. An array is formed. Each of the pixels in the display area 110 is connected to a TFT and driven by an electric field between the pixel electrode and the common electrode. The common electrode is formed on the color filter substrate in vertical electric field driving methods such as TN (Twisted Nematic) mode and VA (Vertical Alignment) mode, and horizontal electric fields such as IPS (In Plane Switching) mode and FFS (Fringe Field Switching) mode In the driving method, it is formed on the thin film transistor substrate together with the pixel electrode. The liquid crystal mode of the display area 110 may be implemented in any liquid crystal mode as well as the aforementioned TN mode, VA mode, IPS mode, and FFS mode.

As the display area 110, a transmissive liquid crystal display panel that modulates light from a backlight unit may be selected as a representative example. The backlight unit includes a light source, a light guide plate (or diffusion plate), a plurality of optical sheets, etc. that are lit according to a driving current supplied from the backlight unit driver. The backlight unit may be implemented as a direct type backlight unit or an edge type backlight unit. The light sources of the backlight unit may include any one of a hot cathode fluorescent lamp (HCFL), a cold cathode fluorescent lamp (CCFL), an external electrode fluorescent lamp (EEFL), a light emitting diode (LED), or two or more types of light sources. .

At the edges of the non-display area 115, a flexible printed circuit board (FPCB) 150 on which a drive IC for applying a driving signal to the TFT array substrate 120 is mounted is provided, and A printed circuit board (PCB) 160 for applying a driving signal to 150) is connected. A gate drive IC 152 for sequentially supplying a scan signal synchronized with a data signal to the gate lines is mounted on the flexible circuit board 150 located at the right edge of the non-display area 115. In addition, a data drive IC 154 for applying a data signal to the TFT array substrate 120 is mounted on the flexible circuit board 150 located at the lower edge of the non-display area 115.

The PCB 160 is mounted with a timing controller, a power supply unit, a gamma voltage generation unit, and the like that primarily process various signal information input from an external device to generate signals required for image expression. The PCB 160 connected to the flexible circuit board 150 on which the gate drive IC 152 is mounted generates a signal for applying a gate driving signal to the gate drive IC 152, and the data drive IC 154 is mounted. The PCB 160 connected to the flexible circuit board 150 generates a signal for applying a data driving signal to the data drive IC 154. Although not shown in the PCB 160, a connector for receiving and transmitting signal information, and a plurality of resistances and capacitances are mounted.

The flexible circuit board 150 is mounted with a data driver IC 154 that generates and outputs an image signal transmitted to the data line of the display panel 140 through a signal voltage transmitted from the PCB. In addition, in the flexible circuit board 150, the data driver IC 154 is mounted on the board in a flip chip bonding method, and both ends of the flexible circuit board 150 are anisotropic conductive films (ACF), which are conductive adhesive materials. They are attached to the display panel 140 and the PCB 160, respectively. In addition, a gate driver IC 152 is mounted on the flexible circuit board 150 and generates and outputs a scanning signal including a signal for turning on/off a thin film transistor (TFT) through a gate line. have. Accordingly, when the thin film transistor selected for each gate line is turned on by the on/off signal of the thin film transistor (TFT) scanned and transmitted to the gate line, the image signal of the data line is transmitted to the corresponding pixel electrode. The arrangement direction of liquid crystal molecules is changed by the electric field between the pixel electrode and the common electrode, indicating a difference in transmittance.

Hereinafter, a detailed look at the structure of the flexible circuit board according to an embodiment of the present invention described above is as follows. In the following, it should be noted that the flexible circuit board is described centering on the COF, but is not limited thereto.

FIG. 4 is a plan view showing a flexible circuit board according to an embodiment of the present invention, FIG. 5 is an enlarged view of area A of FIG. 4, and FIG. 6 is a cross-sectional view taken along line II′ of FIG. 5, 7 is a cross-sectional view taken along line II-II' of FIG. 5, and FIG. 8 is an enlarged view of area B of FIG. 4.

Referring to FIG. 4, for the flexible circuit board 150 according to an embodiment of the present invention, a flexible film package may be used. A flexible film package is a semiconductor package that is driven by directly attaching a semiconductor chip to a thin tape-type film and has a shape that can be bent to reduce a mounting area. A flexible substrate 200 is used as the flexible circuit board 150. Here, the substrate 200 may use polyimide, which is a material having excellent coefficient of thermal expansion (CTE) or durability. In addition, synthetic resins such as acrylic, polyether nitrile, polyethersulfone, polyethylene terephthalate, and polyethylene naphthalate may be used.

The flexible circuit board 150 includes a wiring part 220, a driver IC part 225 and a dummy part 230. The driver IC unit 225 is an area in which the sms driver IC 152 is mounted, and the wiring unit 220 is an area in which the wirings 210, 215, 270, and 275 extending from the driver IC 152 are extended. Output terminals 210OP and 215OP are formed at one end of the wiring unit 220 of the flexible circuit board 150, and input terminals 270IP and 275IP at the other end of the wiring unit 220 of the flexible circuit board 150 Can be formed. The output terminals 210OP and 215OP are bonded to the TFT array substrate of the display panel, and the input terminals 270IP and 275IP are bonded to the PCB. Each of the output terminals 210OP and 215OP extends to the input terminals 210IP and 215IP located in the driver IC unit 225, and each of the input terminals 270IP and 275IP is located in the drive IC unit 225. It extends to the output terminals 270OP and 275OP.

The wires 210 and 215 include first wires 210, second wires 215, third wires 270 and fourth wires 275. The first wires 210 and the third wires 270 are wires arranged on the upper surface of the substrate 200, that is, the surface on which the driver IC 152 is mounted, and the second wires 215 and the fourth wires Reference numerals 275 denote wirings arranged on the lower surface of the substrate 200, that is, on the opposite surface of the surface on which the first wirings 210 are located. The first wires 210 connect between the first wire input terminals 210IP of the driver IC part 225 and the first wire output terminals 210OP, and the second wires 215 are the driver IC part The second wiring input terminals 215IP of 225 and the second wiring output terminals 215OP are connected, and the third wirings 270 are the third wiring output terminals of the driver IC unit 225 ( 270OP) and the third wire input terminals 270IP, and the fourth wires 275 are the fourth wire output terminals 275OP and the fourth wire input terminals 275IP of the driver IC unit 225. ).

The dummy part 230 is an edge region of the flexible circuit board 150 surrounding the wire part 220 and is a region in which the second wires 215 and the fourth wires 275 extend. The dummy part 230 is an area that is not adhered to the display panel or the PCB, and the area where the input terminals 270IP and 275IP and the output terminals 210OP and 215OP of the wiring unit 220 are located are adhered to the display panel or PCB. It corresponds to the area to be used.

The flexible circuit board 150 will be described in more detail with reference to FIGS. 5 to 7.

5 and 7, the flexible circuit board 150 of the present invention includes a wiring part 220 and a dummy part 230. Among the edges of the wiring unit 220, a plurality of first wires 210 and third wires 270 are disposed on the upper surface of the substrate 200, and a first wire output terminal is disposed at the ends of the first wires 210 Fields 210OP are arranged. The first wiring output terminals 210OP are arranged in one row in the horizontal direction. In addition, among the edges of the wiring unit 220, a plurality of second wires 215 are disposed on the upper surface of the substrate 200, and second wire output terminals 215OP are disposed at the ends of the second wires 215 do. The second wiring output terminals 215OP are arranged in one row in the horizontal direction. Therefore, on the upper surface of the edge of the wiring unit 220, the first wiring output terminals 210OP of the first wirings 210 form a first row in the horizontal direction, and the second wiring output of the second wirings 215 As the terminals 215OP form a second row in the horizontal direction, a total of two rows of output terminals 210OP and 215OP are arranged. Further, referring to FIGS. 5 and 6, a plurality of second wires 215 are provided on the lower surface of the substrate 200 among the edges of the wiring unit 220 of the flexible circuit board 150 of the present invention. ) Is arranged extending toward the end.

Further, second wires 215 extending from the lower surface of the wire part 220 are disposed on the lower surface of the dummy part 230 of the flexible circuit board 150. The second wirings 215 pass through the flexible circuit board 150 through first contact holes CH1 formed in the flexible circuit board 150 and protrude upward. Further, on the upper surface of the dummy part 230, second wires 215 protruding from the upper surface of the flexible circuit board 150 are extended to and connected to the second wire output terminal 215OP located on the wire part 220. That is, the dummy part 230 of the flexible circuit board 150 corresponds to a margin area in which the second wires 215 disposed to extend on the lower surface of the flexible circuit board 150 return to the upper surface.

As illustrated in FIG. 5, first contact portions CNP1 are formed in which the second wirings 215 protrude from the lower surface of the flexible circuit board 150 to the upper surface through the first contact holes CH1. A predetermined number of first contact portions CNP1 of the second wirings 215 are arranged in a vertical direction (the direction in which the second wirings extend in the drawing) to form a first contact portion group 260. In addition, in a region adjacent to the first contact part group 260, the second wires 215 protrude from the lower surface of the flexible circuit board 150 to the upper surface through the first contact holes CH1 ( CNP1) is formed, and a predetermined number of first contact portions CNP1 of the second wires 215 are arranged in a vertical direction to form a second contact portion group 261. The first wirings 210 and the second wirings 215 are alternately arranged and do not overlap each other.

As described above, according to the present invention, a margin portion is formed on the flexible circuit board, and the second wires pass through the contact hole to form contact portions protruding from the bottom surface to the top surface in the margin portion. Since the contact portions are formed in the margin of the flexible circuit board, it is possible to reduce the pitch of the wiring lines from 75 μm to 14 μm by the contact portions in the conventional flexible circuit board. Therefore, there is an advantage that can be applied to a high-resolution model in which the number of wirings is increased several times by reducing the pitch of the wirings of the flexible circuit board.

Meanwhile, referring to FIG. 8, the driver IC unit 225 in which the driver IC of the flexible circuit board 150 shown in FIG. 4 is located will be described as follows.

Referring to FIG. 8, a plurality of first wires 210 and third wires 270 are disposed on the upper surface of the substrate 200 of the driver IC part 225 of the flexible circuit board 150, and the first wire First wire input terminals 210IP are disposed at ends of the fields 210. The first wiring input terminals 210IP are arranged in one row in the horizontal direction. In addition, a plurality of second wires 215 are disposed on the upper surface of the substrate 200 of the driver IC unit 225, and second wire input terminals 215IP are disposed at ends of the second wires 215. . The second wiring input terminals 215IP are arranged in one row in the horizontal direction. Accordingly, on the upper surface of the driver IC unit 225, the first wire input terminals 210IP of the first wires 210 form a first row in the horizontal direction, and the second wire input terminal of the second wires 215 By forming the second row in the horizontal direction, the input terminals 210IP and 215IP of two rows are disposed. In addition, a plurality of second wirings 215 are extended and disposed on the lower surface of the substrate 200 of the driver IC unit 225 of the flexible circuit board 150 of the present invention.

Further, second wires 215 extending from the wire part 220 are disposed on the lower surface of the driver IC part 225 of the flexible circuit board 150. The second wirings 215 pass through the flexible circuit board 150 through second contact holes CH2 formed in the flexible circuit board 150 and protrude upward. Further, second wires 215 protruding from the upper surface of the flexible circuit board 150 are extended to and connected to the second wire input terminal 215IP on the upper surface of the driver IC unit 225.

In addition, second contact portions CNP2 are formed in which the second wirings 215 protrude from the lower surface to the upper surface of the flexible circuit board 150 through the second contact holes CH2. A predetermined number of second contact portions CNP2 of the second wirings 215 are arranged in a vertical direction (the direction in which the second wirings extend in the drawing) to form a third contact portion group 280. In addition, in a region adjacent to the third contact part group 280, the second wires 215 protrude from the lower surface of the flexible circuit board 150 to the upper surface through the second contact holes CH2 ( CNP2) is formed, and a predetermined number of second contact portions CNP2 of the second wires 215 are arranged in a vertical direction to form a fourth contact portion group 281.

Meanwhile, a plurality of first wires 210 and third wires 270 are disposed on the upper surface of the substrate 200 of the driver IC part 225 of the flexible circuit board 150 and the third wires 270 Third wiring output terminals 270OP are disposed at the ends of. The third wiring output terminals 270OP are arranged in one row in the horizontal direction. In addition, among the driver IC unit 225, a plurality of fourth wires 275 are disposed on the upper surface of the substrate 200, and second wire output terminals 275OP are disposed at ends of the second wires 275. . The fourth wiring output terminals 275OP are arranged in one row in the horizontal direction. Accordingly, on the upper surface of the driver IC unit 225, the third wire output terminals 270OP of the third wires 270 form a first row in the horizontal direction, and the fourth wire output terminal of the fourth wires 275 The two rows of output terminals 270OP and 275OP are arranged by forming the second row in the horizontal direction. In addition, a plurality of fourth wirings 275 are extended and disposed on the lower surface of the substrate 200 of the driver IC unit 225 of the flexible circuit board 150 of the present invention.

Further, fourth wires 275 extending from the wire part 220 are disposed on the lower surface of the driver IC part 225 of the flexible circuit board 150. The fourth wirings 275 pass through the flexible circuit board 150 through third contact holes CH3 formed in the flexible circuit board 150 and protrude upward. Further, on the upper surface of the driver IC unit 225, fourth wirings 275 protruding from the upper surface of the flexible circuit board 150 are extended to and connected to the fourth wiring output terminal 275OP.

In addition, third contact portions CNP3 in which the fourth wirings 275 protrude from the lower surface of the flexible circuit board 150 to the upper surface through the third contact holes CH3 are formed. A predetermined number of third contact portions CNP3 of the fourth wirings 275 are arranged in a vertical direction (the direction in which the fourth wirings extend in the drawing) to form a fifth contact portion group 290. In addition, in a region adjacent to the fifth contact part group 290, the fourth wires 275 protrude from the lower surface of the flexible circuit board 150 to the upper surface through the third contact holes CH3. CNP3) is formed, and a predetermined number of third contact portions CNP3 of the fourth wirings 275 are arranged in a vertical direction to form a sixth contact portion group 291.

As described above, according to the present invention, a margin portion is formed at the edge of the flexible circuit board, and the second wires pass through the contact hole to form contact portions protruding from the bottom surface to the top surface in the margin portion. In addition, the fourth wirings penetrate the contact hole in the driver IC portion of the flexible circuit board to form contact portions protruding from the lower surface to the upper surface. Accordingly, since the contact portions are formed in the margin portion or the driver IC portion of the flexible circuit board, it is possible to reduce the pitch of wiring lines from 75 μm to 14 μm by the contact portions in the conventional flexible circuit board. Therefore, there is an advantage that can be applied to a high-resolution model in which the number of wirings is increased several times by reducing the pitch of the wirings of the flexible circuit board.

Although the embodiments of the present invention have been described above with reference to the accompanying drawings, the technical configuration of the present invention described above is in other specific forms without changing the technical spirit or essential features of the present invention by those skilled in the art. It will be appreciated that it can be implemented. Therefore, the embodiments described above are illustrative in all respects and should be understood as non-limiting. In addition, the scope of the present invention is indicated by the claims to be described later rather than the detailed description. In addition, all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts should be interpreted as being included in the scope of the present invention.

100: display device 110: display area
115: non-display area 120: TFT array substrate
130: color filter array substrate 140: display panel
150: flexible circuit board 160: PCB

Claims (15)

Board;
First wires disposed on one surface of the substrate and connected to first wire terminals; And
And second wires disposed on the other surface of the substrate and connected to second wire terminals,
The first wiring terminals and the second wiring terminals are disposed on one surface of the substrate,
The second wires are connected to the second wire terminals through the substrate,
The first wires and the second wires are alternately disposed along a horizontal direction, and a gap between the first and second wires adjacent to each other along the horizontal direction is smaller than a width of each of the first and second wires. Flexible circuit board.
The method of claim 1,
The first wirings and the first wiring terminals are formed integrally, respectively, and the second wirings and the second wiring terminals are formed integrally, respectively.
The method of claim 1,
The second wirings respectively pass through the substrate through contact holes, and the contact portions of the second wirings are disposed on one surface of the substrate corresponding to the contact holes.
The method of claim 3,
The contact portions of the second wiring are arranged in a vertical direction and are formed of a plurality of groups.
A substrate including a wiring portion and a dummy portion;
First wirings disposed on a wiring portion on one surface of the substrate and connected to first wiring terminals; And
Including; second wirings disposed on the wiring portion and the dummy portion of the other surface of the substrate and connected to the second wiring terminals,
The first wiring terminals and the second wiring terminals are disposed on a wiring portion on one surface of the substrate,
The second wirings are connected to the second wiring terminals by protruding from the dummy portion of the other surface of the substrate to the dummy portion of the one surface of the substrate through the substrate,
The first wires and the second wires are alternately disposed along a horizontal direction, and a gap between the first and second wires adjacent to each other along the horizontal direction is smaller than a width of each of the first and second wires. Flexible circuit board.
The method of claim 5,
The first wirings and the first wiring terminals are formed integrally, respectively, and the second wirings and the second wiring terminals are formed integrally, respectively.
The method of claim 5,
The second wirings respectively pass through the substrate through first contact holes, and the first contact portions of the second wirings are disposed on one surface of the substrate corresponding to the first contact holes.
The method of claim 7,
The first contact portions of the second wiring are arranged in a vertical direction and are formed of a plurality of groups.
The method of claim 5,
The first wiring terminal is a first wiring output terminal, and the second wiring terminal is a second wiring output terminal.
The method of claim 9,
The substrate further includes a driver IC unit,
First wires disposed in the driver IC unit on one side of the substrate and connected to first wire input terminals; And
And second wires disposed in the driver IC unit on the other side of the substrate and connected to second wire input terminals, and
The first wiring input terminals and the second wiring input terminals are disposed in a driver IC unit on one surface of the substrate,
The second wirings are connected to the second wiring input terminals by penetrating through the substrate from the driver IC portion on the other surface of the substrate and protruding from the driver IC portion on the one surface of the substrate.
The method of claim 10,
Each of the second wires passes through the substrate through second contact holes, and second contact portions of the second wires are disposed on one surface of the substrate corresponding to the second contact holes.
The method of claim 11,
The second contact portions of the second wiring are arranged in a vertical direction and are formed of a plurality of groups.
A display panel in which a TFT array substrate and a color filter array substrate are bonded together;
A flexible circuit board connected to one side of the display panel; And
Includes; a PCB connected to one side of the flexible circuit board,
The flexible circuit board includes a substrate, first wirings disposed on one surface of the substrate and connected to first wiring terminals, and second wirings disposed on the other surface of the substrate and connected to second wiring terminals, the First wiring terminals and the second wiring terminals are disposed on one surface of the substrate, and the second wirings pass through the substrate and are connected to the second wiring terminals,
The first wires and the second wires are alternately disposed along a horizontal direction, and a gap between the first and second wires adjacent to each other along the horizontal direction is smaller than a width of each of the first and second wires. Display device.
The method of claim 1,
The first wiring terminals have the same width as the first wirings, and the second wiring terminals have the same width as the second wirings.
The method of claim 5,
The first wiring terminals extend from one end of the first wirings, and the second wiring terminals overlap the second wirings disposed on a wiring portion of the other surface of the substrate.

Images