KR20070118694A - Gravure cylinder-use copper plating method and device - Google Patents

Abstract

Gravure cylinder-use copper plating method and device which can perform a uniform-thickness copper plating on a gravure cylinder over its entire length without causing defects such as rashes and pits regardless of the size of a gravure cylinder, can automatically control the concentration of copper plating solution, reduce the consumption of an additive, enable a short-time plating treatment, reduce power supply costs, and are easy to handle with good visibility. A hollow cylindrical gravure cylinder is gripped at the opposite longitudinal-direction ends, is placed in a plating tank filled with copper plating solution, and is energized so as to function as a cathode while rotated at a specified speed; a pair of long-box anode chambers that are vertically suspended slidably on the opposite sides of the gravure cylinder in the plating tank and incorporate insoluble anodes so energized as to function as anodes are allowed to come close to the opposite side surfaces of the gravure cylinder with specified intervals; and the outer peripheral surface of the gravure cylinder is copper plated.

Description

Gravure cylinder-use copper plating method and device

The present invention relates to a copper plating method and apparatus for a gravure cylinder for coating copper plating as a plate forming plate on the outer circumferential surface of a hollow gravure cylinder (also called a plate making roll) used for gravure printing. In particular, the present invention relates to a copper plating method and apparatus for a gravure cylinder which is coated with copper using an insoluble anode.

In gravure printing, micro recesses (cells) according to the plate making information are formed on the gravure cylinder to form a plate surface, the ink is filled in the cells, and transferred to the printed object. In general, a gravure cylinder is based on a cylindrical iron core or an aluminum core, and forms a plurality of layers such as an underlayer or a peeling layer on the outer circumferential surface of the substrate, and a copper plating layer for forming a plate thereon (plate material) To form. The copper plating layer is then formed with a laser exposure apparatus to form a cell according to the plate making information, and then plated (manufacturing of the plate surface) is completed by coating with chromium plating or the like in order to increase the crush force of the gravure cylinder.

Conventionally, as a method and apparatus for coating copper plating on the outer circumferential surface of a gravure cylinder, it is widely known to use a phosphorus-containing copper ball as a soluble anode, which is a pair of roll chucks on both ends of the gravure cylinder in the longitudinal direction. Copper ball (soluble anode) and gravure cylinder in the plating solution, which are held in a plating bath in which the plating solution is held, and the plating solution is stored so that it can be energized and can be energized. By flowing a current having a current density of about 10 to 15 A / dm 2 between the (cathode), copper is deposited on the outer circumferential surface of the gravure cylinder made of the cathode so that copper plating is performed (for example, Patent Document 1). And 2).

In general, however, the phosphorus-containing copper balls used in the copper plating method and apparatus for gravure cylinders contain phosphorus: 350 to 700 ppm and oxygen: 2 to 5 ppm, and the remainder is composed of copper and impurities, which are inevitably included in the plating. During processing, anode sludge occurs, which causes defects such as boots (microscopic projections) and pits (pinholes) on the outer circumferential surface of the gravure cylinder. Although high purity phosphorus-containing copper balls are used for semiconductor manufacturing and the like, they are expensive and are not employed for gravure cylinders. In addition, in order to prevent the phosphorus-containing copper balls in the copper plating solution from becoming too large, the copper ion concentration becomes high, and the plating solution is drawn and diluted regularly to prevent the proper plating process, and the copper solution concentration is adjusted to an appropriate copper ion concentration or the waste solution is treated. You also need to. In addition, since the current concentrates near both ends of the gravure cylinder, the main surface near both ends is plated thicker than the linear part, and a separate treatment is required to uniform the thickness of the plate due to post polishing. Done.

On the other hand, in addition to the method of using the phosphorus-containing copper ball as a soluble anode, a copper plating method using an insoluble anode is known. The copper plating method and apparatus for a gravure cylinder by this is known as an insoluble anode, for example, on the surface of a titanium plate. Using a coating of iridium oxide or the like, preparing a plating bath and a copper dissolving bath, dissolving a copper plating material (e.g., copper oxide or copper carbonate) in the dissolving bath and supplying it to the plating solution in the plating bath, It electrically energizes with the gravure cylinder to form and coat | covers copper plating (for example, refer patent document 3).

According to the above method and apparatus, no defects such as anode sludge are generated and defects such as boots and pit are not generated, but there is still a drawback that the main surfaces near both ends of the gravure cylinder are thickly plated. Therefore, in order to solve this problem, the insoluble anode positioned below the gravure cylinder in the plating tank is constituted by a lifting material, and the insoluble anode along the gravure cylinders of various sizes is placed close to the bottom surface of the gravure cylinder at a distance of 5 mm to 30 mm. This method prevents current concentration from occurring near both ends of the gravure cylinder, and enables plating of uniform thickness over the entire length of the gravure cylinder, and at the same time, the copper plating method for the gravure cylinder which can automatically adjust the copper concentration and sulfuric acid concentration of the plating liquid. And the device was previously proposed by the applicant (Patent Document 4).

However, according to the above proposal, there are the following problems. Since the insoluble anode is directly installed in the plating solution, the consumption of additives such as polishes and anti-pressing agents is considerably high. [For example, when insoluble copper balls are used as the soluble anode, the insoluble anode is installed in the plating solution. In one case, about 600cc / 1000AH]. It takes a long time for the plating process to get the current density of 15 ~ 20A / dm2 and the voltage of 10 ~ 15V to prevent the pressure, and it requires the power supply cost. Uniformity of the plating thickness is insufficient. Since the insoluble anode is located under the gravure cylinder, visibility is poor and operability is also bad.

Patent Document 1: Japanese Unexamined Patent Application Publication No. 57-36995

Patent Document 2: Japanese Patent Application Laid-Open No. 11-61488

Patent Document 3: Japanese Patent Application Laid-Open No. 2005-29876

Patent Document 4: Japanese Patent Application Laid-Open No. 2005-133139

Disclosure of the Invention

Problems to be Solved by the Invention

In view of the above problems, the present invention is capable of coating copper plating with a uniform thickness over the entire length of the gravure cylinder so as to prevent defects such as boots and pit irrespective of the size of the gravure cylinder and at the same time automatic concentration management of the copper plating solution. The present invention aims to provide a plating method and apparatus for a gravure cylinder which is capable of reducing the consumption of additives, enabling plating in a short time, reducing power supply cost, and being easy to handle and easy to handle.

Means to solve the problem

In the copper plating method for gravure cylinder of the present invention, the hollow gravure cylinder is held at both ends in a long life direction and is accommodated in a plating tank filled with a copper plating solution, and is energized to become a cathode while rotating at a predetermined speed. A pair of long-shaped anode chambers, which are insoluble in the slide material on both sides of the gravure cylinder and inside the gravure cylinder, and which are energized to become anodes, are gravure. It is characterized in that the copper plating is applied to the outer circumferential surface of the gravure cylinder by proximity to both sides of the cylinder at a predetermined interval.

In other words, the insoluble anode is installed in the anode chamber without being directly installed in the plating solution, and the anode chamber is provided in a state in which the anode chamber is provided on both sides of the gravure cylinder and provided with a slide type anode chamber provided with a slide material mechanism. Copper plating treatment is performed at. This makes it possible to coat copper plating with a more uniform thickness without reducing defects such as boots and pits, to reduce the consumption of additives, and to achieve uniform plating thickness in response to gravure cylinders of all sizes. Can be. The time required for the plating process and the power supply cost can be reduced, and since the anode chambers are located on both sides of the gravure cylinder, the visibility and operability are excellent.

It is appropriate to provide a cation exchange membrane on the side surface of the gravure cylinder side of the anode chamber, and the anode chamber preferably has a length equal to or greater than the total length of the longevity direction of the gravure cylinder. To coat copper with uniform thickness over the entire length of the gravure cylinder. The inside of the anode chamber is filled with an acidic electrolyte solution, and it is preferable to measure the amount of liquid in the anode chamber and to supply water when there is a shortage.

The copper plating solution contains copper sulfate, sulfuric acid, chlorine and additives, and the specific gravity and sulfuric acid concentration in the copper plating solution are measured, and water is supplied when the specific gravity is too high, and oxidizing agent 2 when the sulfuric acid concentration is too high. It is suitable to replenish copper powder. This eliminates the need for maintenance and maintenance of conventional copper plating solutions. In addition, the copper plating solution is preferably to remove impurities from the filter.

The said predetermined space | interval (space | interval which made the anode chamber close to the gravure cylinder side surface) is about 1 mm-50 mm, Preferably it is about 3 mm-40 mm, Most preferably, it is about 5 mm-30 mm. The narrower the interval, the narrower it is, the more preferable from the viewpoint of the uniformity of the plating thickness, but too narrow the risk of contact between the anode chamber and the gravure cylinder during the plating process.

The gravure cylinder plating apparatus of the present invention is a copper plating apparatus for gravure cylinders in order to coat copper on the outer circumferential surface of the gravure cylinder, the long life of the plating tank filled with the copper plating solution and the hollow gravure cylinder rotator can be energized at the same time A pair of long-phase images that hold both ends in directions and house the chuck means housed in the plating bath, and insoluble anodes which are carried on the slide material on both sides of the gravure cylinder in this plating bath and are energized to become anodes. It is characterized by including an anode chamber having a long shape.

It is appropriate to provide a cation exchange membrane on the side surface of the gravure cylinder side of the anode chamber, and the anode chamber preferably has a length equal to or greater than the total length of the longevity direction of the gravure cylinder. In addition, the inside of the anode chamber is filled with an acidic electrolyte solution, and it is preferable to further include a cathode chamber liquid supply mechanism for measuring the amount of liquid in the anode chamber and supplying water if the liquid volume is insufficient.

The copper plating solution contains copper sulfate, sulfuric acid, chlorine and additives, and the specific gravity and sulfuric acid concentration in the copper plating solution are measured, and when the specific gravity is too high, water is supplemented and the cupric oxide powder when the sulfuric acid concentration is too high. It is suitable to further provide a copper plating solution automatic management mechanism to compensate for this. It is preferable to further prepare a filter for removing impurities of the copper plating solution.

BRIEF DESCRIPTION OF THE DRAWINGS It is front explanatory drawing which shows an example of the principal part structure of the copper plating apparatus for gravure cylinder of this invention.

Fig. 2 is a plan explanatory view showing an example of a main part structure of the copper plating apparatus for gravure cylinder of the present invention.

Fig. 3 is an explanatory side view showing an example of a major part of the gravure cylinder copper plating apparatus of the present invention.

4 is a schematic explanatory diagram showing an example of the anode chamber in the present invention.

Fig. 5 is a schematic explanatory diagram showing an example of the basic configuration of a copper plating apparatus for a gravure cylinder of the present invention.

6 is a conceptual explanatory diagram showing an example of the copper plating solution automatic management mechanism in the present invention.

7 is a conceptual explanatory diagram showing an example of the anode chamber liquid supply mechanism in the present invention.

Explanation of the sign

2: copper plating device for gravure cylinder, 4: stand, 6: bearing, 8: cover, 10: plating tank, 11: exhaust duct, 12: recovery tank, 14: chuck means, 15: liquid Adapter: 16: Spindle, 18: Sprocket, 20: Anode chamber, 22: Lead bar, 23: Anode case, 24: Insoluble anode, 25: Mounting jig, 26: Cationic exchange membrane, 27: Mounting jig , 28: pressing flange, 30: geared motor, 31: mounting angle, 32, 33, 34, 35, 38: flat car, 39, 40: mounting bracket, 43, 44, 45, 46, 47, 48 : Sprocket, 50, 52: linear rail, 54, 55: guide member, 58, 59: attaching sol, 60, 62: rack, 70: storage tank, 80: filter, 86: heater, 88 : Heat exchanger, 90: automatic addition device, 100: copper plating solution automatic management mechanism, 102: melting tank, 104: powder supply device, 105: screw conveyor, 106: powder store hopper, 108: Pure water pressurization tank, 110: controller, 112: specific gravity sensor, 114: sulfuric acid sensor, 200: anode chamber liquid supply mechanism, 210: pure water tank, 212: buoy, 220: Pure pressurization tank, C, C _{1 ,} C ₂ , C ₃ : chain, D: cuprous oxide powder, F: copper plating solution, M: cylinder rotary motor, P ₁ , P ₂ , P ₃ , P ₄ : pump, R: Gravure cylinder, S: Acid electrolyte, V _T : Control valve, V _E : Electromagnetic valve, W: Pure water.

Embodiments of the present invention will be described below based on the accompanying drawings. However, the illustrated examples are illustrative only, and various changes can be made without departing from the technical spirit of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS It is front explanatory drawing which shows an example of the principal part structure of the copper plating apparatus for gravure cylinder of this invention. Fig. 2 is a plan explanatory view showing an example of a main part structure of the copper plating apparatus for gravure cylinder of the present invention. Fig. 3 is an explanatory side view showing an example of a major part of the gravure cylinder copper plating apparatus of the present invention. 4 is a schematic explanatory diagram showing an example of the anode chamber in the present invention. Fig. 5 is a schematic explanatory diagram showing an example of the basic configuration of a copper plating apparatus for a gravure cylinder of the present invention. 6 is a conceptual explanatory diagram showing an example of the copper plating solution automatic management mechanism in the present invention. 7 is a conceptual explanatory diagram showing an example of the anode chamber liquid supply mechanism in the present invention. In the figure, reference numeral 2 denotes a copper plating apparatus for a gravure cylinder of the present invention.

The gravure cylinder copper plating device 2 of the present invention is a device for coating copper plating on the outer circumferential surface of the hollow gravure cylinder R, the plating bath 10, the chuck means 14, a pair of anodes. The yarns 20 and 20 are provided (see FIGS. 1 to 5). About the plating tank 10 and the chuck means 14, it has the structure similar to the conventional apparatus (refer patent document 1-patent document 3), and the overlapping description is abbreviate | omitted, but the plating tank 10 is a copper plating liquid. It is a plating process tank filled with (F), and it can be immersed so that the gravure cylinder R may be fully molten in the copper plating liquid F. FIG. Around the plating tank 10, a recovery tank (first riser, 12) for recovering the overflowed copper plating solution F is provided (see FIGS. 2, 3, and 5). A storage tank 70 communicating with the recovery tank 12 and collecting the copper plating solution F is provided (see FIGS. 5 and 6). In the storage tank 70, a heater 86 and a heat exchanger 88 are installed in order to maintain the copper plating solution F at a predetermined liquid temperature (for example, about 40 ° C), and the impurities of the copper plating solution F are embedded. In order to remove the water, a pump P ₁ for pouring the copper plating solution F from the filter 80 or the storage tank 70 and circulating the plating bath 10 is provided (see FIGS. 5 and 6). The chuck means 14 is a roll chuck device (see Patent Documents 1 to 3) that grips both ends of the longevity direction of the gravure cylinder R and accommodates it in the plating bath 10. The chain (C) and the sprocket (18) are equipped with a spindle (16) and a liquidproof adapter (15) for preventing the entry of the copper plating solution (F), and the cylinder rotating motor (M) installed on the mount (4). It is fitted and rotated at a predetermined speed (e.g., about 120 rpm), and energized so that the gravure cylinder R becomes a cathode (see Fig. 5). In addition, the lid 8, the exhaust duct 11, etc. which are made of the opening and closing material above the plating bath 10 are appropriately provided (see FIGS. 1 and 5).

In the gravure cylinder copper plating apparatus 2 of the present invention, a pair of anode chambers 20 and 20 are slide type anodes in which the slide material is mounted on both sides of the gravure cylinder in the plating bath 10. It is a thread (FIGS. 1-5). The anode chambers 20 and 20 are long-shaped members having a length equal to or greater than the total length of the longevity direction of the gravure cylinder R (see FIGS. 2 to 5), as shown in FIG. 4. An acidic electrolyte solution S, such as an aqueous sulfuric acid solution, is filled in the positive electrode case 23, and an insoluble positive electrode 24 is embedded by the mounting jig 25. As the insoluble anode 24, a surface of a titanium plate coated with iridium oxide or the like is used, and the lead bar 22 is inserted to energize the anode. On the side of the gravure cylinder side of the anode chamber 20, a cation exchange membrane 26 is provided by the mounting jig 27 and the pressing flange 28.

Although the mechanism which makes a pair of anode chambers 20 and 20 a slide material from both sides of the gravure cylinder R is not specifically limited, An example is demonstrated based on FIGS. 1-3. The mount 4 is installed in the front outer side of (10), and the linear rails 50 and 52 are provided in the inner wall surface of the mount 4. In parallel with the linear rails 50 and 52, the racks 60 and 62 are installed to reciprocate by the forward and reverse rotation of the flat gears 35 and 38. 58), 59 are connected to the guide members 54, 55 to slidably engage the linear rails 50, 52. The ends of the lead bars 22 and 22 of the anode chambers 20 and 20 are respectively connected to the upper ends of the addition sols 58 and 59 (see FIGS. 1 to 3).

Mounting brackets 35 and 38 for causing the racks 60 and 62 to reciprocate are mounted so that the flat carriage 35 rotates on the same axis as the sprocket 45 on the outer wall surface side of the mount 4, respectively. It is fixed to the mount 4 at 40, and the other flat gear 38 is fixed to the mount 4 at the mounting bracket 39 so that it may rotate on the same axis as the sprocket 48 on the outer wall surface side of the mount 4. It is. Directly below the sprocket 45, the sprocket 44 is constructed to rotate on the same axis as the flat gear 34, and just below the other sprocket 48 is the sprocket 47. It is designed to rotate coaxially with. On the outer wall surface of the mount 4, a mounting angle 31 is fitted, and a geared motor 30 is provided, and a flat gear 32 is provided. The flat car 33 is designed to be rotated coaxially with the sprocket 43 so as to engage with the flat car 32, and the chain C ₁ is interposed between the sprockets 43 and 46, The chain C ₂ is interlocked between the sprockets 44 and 45, and the chain C ₃ is interposed between the sprockets 47 and 48. Accordingly, the flat gears 35 and 38 are reversed by the forward and reverse driving of the geared motor 30, and the racks 60 and 62 are reciprocated and interlocked with the anode chambers 20 and 20. The linear rails 50 and 52 can be slid accurately (see FIGS. 1 to 3).

As the space | interval which makes the anode chamber 20 adjoin the side surface of the glide cylinder R, it is about 1 mm-50 mm, Preferably it is about 3 mm-4 mm, Most preferably, it is about 5 mm-30 mm. From the standpoint of uniform plating thickness, it may be said that the closer the anode chamber 20 is to be closer, the better. However, if the remainder is too close, there is a risk that the anode chamber 20 and the gravure cylinder R come into contact during the copper plating process. Because there is.

It is preferable that the copper plating apparatus 2 for gravure cylinders of this invention is also provided with the copper plating liquid automatic management mechanism 10 and the anode chamber liquid supply mechanism 200 (refer FIG. 6 and FIG. 7). May be provided with a storage tank 70, the bottom of a collection of copper plating (F) in the plating bath 10, copper plating (F) will it performed the impurities removed by the filter 80, the pump (P ₁₎ It raises by so that it may supply to the plating bath 10. There is also auto-adding device 90 is provided with a pump (P ₄₎ to properly feed additives such as a brightening agent or a pressing agent is provided (see Fig. 6).

The automatic management mechanism 100 of the copper plating solution is a management mechanism for adjusting the copper concentration and sulfuric acid concentration of the copper plating solution F stored in the storage tank 70. Copper plating solution (F) is, for example, copper sulfate (CuSO ₄ · 5H ₂ O) concentration: 200 ~ 250g / L, sulfuric acid (H ₂ SO ₄ ) concentration: 50 ~ 70g / L, chlorine (C ₁ ) concentration: 50 ~ 200ppm and concentration of additives such as polish or anti-pressing agent: 1 ~ 10mL / L As copper plating is performed on gravure cylinder (R), copper ion concentration in copper plating solution (F) decreases and free sulfuric acid This increases. The copper ion concentration decreased therein is a copper plating solution automatic control mechanism so that the copper ion concentration can be adjusted by generating CuO + H ₂ SO ₄ → CuSO ₄ + H ₂ O by adding cupric oxide (CuO). 100) is introduced (see FIG. 6). This is preferable because the maintenance and repair of the conventional periodic copper plating solution F and the waste liquid treatment are unnecessary.

The copper plating solution automatic management mechanism 100 samples the copper plating solution F in the storage tank 70 by the controller 110 having the specific gravity sensor 112 and the sulfuric acid sensor 114 and dissolves the necessary adjustment in the dissolution tank 102. ), The copper plating solution F is poured after the adjustment by the pump P ₃ in the dissolution tank 102 and supplied to the storage tank 70. That is, the copper plating solution F in the storage tank 70 is pumped from the pump P ₂ , and the specific gravity of the copper plating solution F in the specific gravity sensor 112 and the sulfuric acid sensor 114 provided in the controller 110. When the copper concentration) and the sulfuric acid concentration are measured and it is determined that the specific gravity (copper concentration) is too high (for example, the concentration range exceeds 200 to 250 g / L), the controller 110 may use the dissolution tank in the pure pressurization tank 108. If the electronic valve V _E is controlled to supply water to the 102 and it is determined that the sulfuric acid concentration is too high (for example, the concentration range is exceeded from 50 to 70 g / L), the controller 110 controls the powder store hopper. In 106, the powder supply apparatus 104 provided with the screw conveyor 105 can be controlled to supply the cupric oxide D to the dissolution tank 102 (see FIG. 5). When the electromagnetic valve V _E is opened, the water supply amount is adjustable by opening and closing the control valve V _T. The copper plating solution automatic controller 100 configured as described above automatically manages the concentration adjustment of the copper plating solution F, for example, 200 to 250 g / L for the copper sulfate concentration and 50 to the sulfuric acid concentration. Can manage around 70g / L. In addition, although the case where a cupric oxide powder is used as a preferable powder was demonstrated as a preferable example, powders, such as copper carbonate and copper sulfate, may be sufficient.

In addition, the anode chamber liquid supply mechanism 200 measures the liquid amount of the acidic electrolyte solution S filled in the anode chamber 20 and supplies water in case of lack of liquid amount. The anode case 23 of the anode chamber 20 is filled with an acidic electrolyte S composed of sulfuric acid aqueous solution having a sulfuric acid concentration of 40 to 150 g / L or the like (see FIGS. 4 and 7) by the insoluble anode 24. Since water generates electrolyzed oxygen and water is consumed, water is automatically replenished. That is, the pure water tank 210 is installed in communication with the positive electrode case 23 of the anode chamber 20, and the pure water W is stored in the pure water tank 210, and the liquid level of the pure water W is buoy 212. Detected by When the drop of the liquid level is detected by the buoy 212, the pure water W is supplied from the pure water pressurizer 220 by controlling the electronic valve V _E (see FIG. 7). When the electromagnetic valve V _E is opened, the water supply amount is adjustable by opening and closing the control valve V _T. The anode chamber liquid supply mechanism 200 configured as described above can automatically maintain the required liquid amount with respect to the acidic electrolyte solution S in the anode chamber 20.

Although an Example is given to the following and this invention is demonstrated to it further more concretely, it cannot be overemphasized that these Examples are shown as an illustration, and are not interpreted limitedly.

In the following Examples 1 to 4, the following common configurations were used. Copper plating solution 220g / L, sulfuric acid concentration 60g / L, chlorine concentration 120ppm, additives Cosmo RS-MU (manufactured by Daehwa Special Co., Ltd.) 5mL / L, Cosmo RS-1 The copper sulfate plating liquid containing 2 mL / L was used for special sale. A cuprous oxide powder "soluble copper oxide (ES-CuO)" (Science Procurement Co., Ltd. product) was used as powder spread by the copper plating solution automatic control mechanism. As an insoluble anode in the anode chamber, a surface coated with iridium oxide or the like on the surface of the titanium plate was used. As an acid electrolyte filled in the anode chamber, a sulfuric acid solution having a sulfuric acid concentration of 100 g / L was used, and as a cation exchange membrane, "ceremione" (Note: Manufacturing and sales). The copper plating solution automatic management mechanism and the anode chamber liquid supply mechanism constitute the apparatus of the above-mentioned mechanism, and in the copper plating solution automatic management mechanism, the specific gravity sensor is "SG-1" (manufactured by Japan Aqua Co., Ltd.), sulfuric acid. DM-1 (manufactured by Japan Aqua Co., Ltd.) was used as the concentration sensor.

(Example 1)

As a gravure cylinder, a cylindrical base material of 450 mm circumference and 1100 mm circumference is used, and both ends of the gravure cylinder are chucked and mounted on the plating bath, and the anode chamber is attached to the gravure cylinder side by 20 mm by a computer controlled slide mechanism. In close proximity, the copper plating solution was overflowed to flake the gravure cylinder. The gravure cylinder was rotated at 120 rpm and copper plated at a liquid temperature of 40 ° C., a current density of 18 A / dm 2, and a voltage of 5.4 V to 80 μm. The time required for the plating treatment was about 20 minutes. The plating surface was free of boots and pits, and was able to be plated with a uniform thickness over the entire length of the gravure cylinder. In addition, the copper plating solution automatic management mechanism was able to operate normally and keep the composition of the copper plating solution in an appropriate range. The anode chamber liquid supply mechanism was able to operate normally and maintain the liquid level in the anode chamber at an appropriate amount. The consumption of additives was markedly reduced to 60 cc / 1000 AH.

(Example 2)

As a gravure cylinder, a cylindrical substrate of 600 mm circumference and 1100 mm circumference is used. The gravure cylinder is mounted on a plating bath, and the anode chamber is brought close to the gravure cylinder by 20 mm by a computer controlled slide mechanism to overflow the plating solution. The gravure cylinder was sunk. The rotation speed of the gravure cylinder was 120 rpm, and copper plating was carried out until it became 80 micrometers in thickness at 40 degreeC of liquid temperature, 18 A / dm <2> of electric currents, and the voltage of 6.0V. The plating time was about 20 minutes. The plating surface was free of boots and pits and was able to be plated with a uniform thickness over the entire length of the gravure cylinder. In addition, the copper plating solution automatic management mechanism was able to operate normally and keep the composition of the copper plating solution in an appropriate range. The anode chamber liquid supply mechanism was able to operate normally and maintain the liquid level in the anode chamber at an appropriate amount. The consumption of additives was markedly reduced to 60 cc / 1000 AH.

(Example 3)

As a gravure cylinder, a cylindrical base of 940 mm circumference and 1100 mm circumference is used, and both ends of the gravure cylinder are chucked and mounted in a plating bath, and the anode chamber is close to the gravure cylinder up to 20 mm by a computer controlled slide mechanism. The gravure cylinder was dripped to overflow the plating liquid. The rotation speed of the gravure cylinder was 120 rpm, and copper plating was carried out until it became 80 micrometers in thickness of 40 degreeC, the current density of 18 A / dm <2>, and the voltage of 7.7V. The plating time was about 20 minutes. The plating surface was free of boots and pits, and was able to be plated with a uniform thickness over the entire length of the gravure cylinder. In addition, the copper plating solution automatic management mechanism was able to operate normally and keep the composition of the copper plating solution in an appropriate range. The anode chamber liquid supply mechanism was able to operate normally and maintain the liquid level in the anode chamber at an appropriate amount. The consumption of additives was markedly reduced to 60 cc / 1000 AH.

(Example 4)

As a gravure cylinder, a cylindrical base of 450 mm circumference and 1100 mm in total length is used, and both ends of the gravure cylinder are chucked and mounted on the plating bath, and the anode chamber is close to the gravure cylinder up to 5 mm by a computer controlled slide mechanism. The copper plating solution was overflowed to melt the gravure cylinder. The rotation speed of the gravure cylinder was 120 rpm, and copper plating was carried out until it became 80 micrometers in thickness of liquid temperature of 40 degreeC, current density of 30 A / dm <2>, and voltage of 7.9V. The plating time was about 12 minutes. The plating surface was free of boots and pits and was able to be plated with a uniform thickness over the entire length of the gravure cylinder. In addition, the copper plating solution automatic management mechanism was able to operate normally and keep the composition of the copper plating solution in an appropriate range. The anode chamber liquid supply mechanism was able to operate normally and maintain the liquid level in the anode chamber at an appropriate amount. The consumption of additives was markedly reduced to 60 cc / 1000 AH.

According to the present invention, regardless of the size of the gravure cylinder, defects such as boots and pits do not occur, and copper plating of a more uniform thickness can be coated over the entire length of the gravure cylinder, and at the same time, the automatic concentration of the copper plating solution is achieved. There is a remarkable effect that it is possible to provide a copper plating method and apparatus for gravure cylinders that can be managed and reduced in consumption of additives, which can be plated in a short time and reduce power supply costs, and are easily visible and easy to handle.

Claims (13)

The hollow gravure cylinder is held at both ends of its long-life direction in a plating bath filled with a copper plating solution, energized to become a cathode while rotating at a predetermined speed, and slides on both sides of the gravure cylinder in the plating bath. A gravure cylinder is formed by placing a pair of long-shaped anode chambers made by insoluble anodes, which are immersed in the material and energized to become anodes, at predetermined intervals on both sides of the gravure cylinder. Copper plating method for a gravure cylinder, characterized in that the copper plating on the outer peripheral surface of the. The copper plating method for a gravure cylinder according to claim 1, wherein a cation exchange membrane is provided on a side surface of the anode chamber at the gravure cylinder side. The copper plating method for a gravure cylinder according to claim 1 or 2, wherein the anode chamber has a length equal to or greater than the total length of the longevity direction of the gravure cylinder. The copper plating for gravure cylinders according to any one of claims 1 to 3, wherein an acidic electrolyte solution is filled in the interior of the anode chamber, and the amount of liquid in the anode chamber is measured and water is supplied when there is insufficient. Way. The copper plating solution according to any one of claims 1 to 4, wherein the copper plating solution contains copper sulfate, sulfuric acid, chlorine, and an additive, and if the specific gravity is too high by measuring the specific gravity and sulfuric acid concentration of the copper plating solution, A copper plating method for gravure cylinders, characterized in that the cupric oxide powder is supplemented when the sulfuric acid concentration is too high and the sulfuric acid concentration is too high. The copper plating method for gravure cylinder according to any one of claims 1 to 5, wherein the copper plating solution is obtained by removing impurities with a filter. The copper plating method for a gravure cylinder according to any one of claims 1 to 6, wherein the predetermined interval is 1 mm to 50 mm. In the copper plating apparatus for gravure cylinders for coating copper plating on the outer circumferential surface of the gravure cylinder,  A chuck means for holding a copper plating solution filled with a plating bath and a hollow gravure cylinder, which are both rotatable and energized, and accommodated in the plating tank, and held in the plating bath, on both sides of the gravure cylinder. A copper plating apparatus for a gravure cylinder, comprising: a pair of long-shaped anode chambers formed by insulting an insoluble anode which is carried on a slide material and energized so as to be an anode. 9. The copper plating apparatus for gravure cylinders according to claim 8, wherein a cation exchange membrane is provided on the side surface of the anode chamber at the gravure cylinder side. The copper plating apparatus for gravure cylinders according to claim 8 or 9, wherein the anode chamber has a length equal to or greater than the total length of the longevity direction of the gravure cylinder. The anode chamber liquid supply mechanism according to any one of claims 8 to 10, wherein an acidic electrolyte solution is filled in the anode chamber, and the amount of the anode chamber is measured so that water is supplied when the liquid volume is insufficient. Gravure cylinder copper plating apparatus characterized in that it comprises. 12. The copper plating solution according to any one of claims 8 to 11, wherein the copper plating solution contains copper sulfate, sulfuric acid, chlorine, and an additive, and the specific gravity and sulfuric acid concentration of the copper plating solution are measured so that water is too high. A copper plating apparatus for gravure cylinders, further comprising a copper plating solution automatic management mechanism for replenishing the cupric oxide powder when the sulfuric acid concentration is too high and the sulfuric acid concentration is too high. The copper plating apparatus for a gravure cylinder according to any one of claims 8 to 12, further comprising a filter for removing impurities of the copper plating liquid.

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