JP2000017495A - Plating aperture for electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique capable of making the trial of a plating method most suitable to various characteristics of electronic parts. SOLUTION: This plating apparatus has a plating bath 1 which internally has anode parts 3a, 3b and jigs A, B which consist of energizing means to works 5 and posture holding means for the works 5 and are freely engageably and disengageably mounted at the plating bath 1 to immerse the works 5 into the plating bath 1. Plural types of the energizing means to constitute the works as cathode parts by using the clamping surfaces clamping the works as contact points or using the supporting parts with which the rear edge surfaces of the works are brought into contact by their own weights of the works as contact points or pressing parts pressing the top edge surfaces of the works as contact points are prepd. All of the jigs composed of the combination of the one type or plural types among the plural types are formed mountably at the magnetic part of the plating bath 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating apparatus for electronic parts, and more particularly to a plating apparatus for electronic parts capable of adopting a plating method matching various characteristics in a thin plate electronic part.

[0002]

2. Description of the Related Art As a conventional apparatus for plating an electronic component, particularly a device for plating a thin plate-shaped electronic component, for example, an IC lead frame (hereinafter referred to as a lead frame), a lead frame is housed in a basket and immersed in a plating tank. The plating apparatus is roughly classified into a plating apparatus configured as described above, and a plating apparatus configured to grip a lead frame edge immersed in a plating tank with a clip. A method of storing the lead frame in a basket is disclosed in, for example, JP-A-6-88293. This is such that the lead frame is placed and held on an M-shaped cathode contact portion provided at the bottom of the basket. In the case of this method, the cathode contact portion is substantially in point contact with the lead frame. A method of gripping with a clip is disclosed in, for example, Japanese Patent Laid-Open No. 5-31.
There is one disclosed in Japanese Patent No. 5505. In this method, one end of a lead frame is gripped by a clip and suspended in a plating tank in a suspended state. In the case of this method, the clip portion is in line contact or surface contact with the lead frame.

[0003]

In the case of the above-mentioned basket system, the contact area of the cathode contact portion is extremely small, and the contact pressure is obtained only by the own weight of the lead frame. Since the cathodic contact portion is discolored or burnt by the electrolytic corrosion, the current value that can be conducted cannot be increased, and the processing time is long. For this reason, the actual machine for securing the production amount is as long as several tens of meters, and there is a great problem in terms of the space efficiency of the factory. However, on the other hand, there is an advantage that the lead frame can be easily taken in and out, and an extremely thin lead frame can be held without being deformed. The clip method is not suitable for a lead frame which requires a lot of trouble to grip or has a small portion that can be gripped, but has an advantage that a relatively large current value can be conducted and the plating speed can be increased. By the way, there are various types of IC products in recent years, and new plating specifications may be required for the lead frames in some cases. In such a case, a test for determining the condition and a test for grasping the solution performance by changing various plating solutions are performed with the conventional apparatus. In this case, depending on the type of work,
There are cases where it is better to perform plating at a slow speed, and cases where it is better to perform plating with emphasis on the plating speed. However, the plating equipment used by companies is
Since the energization method employing either the basket method or the clip method is unique and has a single function, it is impossible to try other energization methods with each other. Introducing the above apparatus has a problem that it is impossible to try a plating method with a high current. It is a well-known fact that the distance between the anode and the cathode greatly affects the plating quality.However, the distance between the anode and the anode cannot be freely changed due to the size of the equipment. There was a problem that I couldn't even test with various settings. And these devices are for mass production,
Thus, there is a problem that there is no flexibility when changing the conditions for each small amount of work.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a plating apparatus capable of trying a plating method most suited to various characteristics of an electronic component. Is to do.

[0005]

Means for Solving the Problems (Solution 1) In order to achieve the above object, a plating apparatus for an electronic component according to claim 1 of the present invention comprises: a plating tank having an anode portion therein; Plating of an electronic component, comprising: a jig comprising: means for energizing a work to be energized so that the work is a cathode in a state where the work is immersed in a predetermined position; and a posture holding means for holding the work in a substantially vertical posture. In the apparatus, the contact surface may be a gripping surface on which the current-carrying means grips the work, a contact portion may be a support that contacts a lower edge surface of the work, or a pressing portion that presses an upper edge surface of the work may be a contact. A plurality of types of jigs are prepared, and any jig made of one of these types or a combination of a plurality of types is formed so as to be detachably attached to the mounting portion of the plating tank. And wherein the are.

According to a second aspect of the present invention, in the apparatus for plating an electronic component according to the first aspect of the present invention, the energization for gripping and energizing the workpiece and the support member supporting the lower edge surface of the workpiece. Means for holding the posture of the work.

According to a third aspect of the present invention, there is provided an electronic component plating apparatus according to the first or second aspect, wherein the jig presses an upper edge surface of the workpiece. It is characterized by having.

According to a fourth aspect of the present invention, in the plating apparatus for an electronic component according to any one of the first to third aspects, the anode part is provided with respect to a workpiece. And is formed so as to be relatively movable.

[0009]

According to the first aspect of the present invention, the jig having the holding surface holding the work as a contact point by the means for supplying current to the work and the lower edge surface of the work contact with one plating tank by its own weight. A jig having a supporting portion as a contact, a jig having a pressing portion pressing the upper edge surface of the work as a contact, or a jig having a plurality of the respective contacts can be replaced and used. . Therefore, if the current value is increased with a set of plating equipment, the cathode contact part of the lead frame may be discolored or burnt by electrolytic corrosion, or if the grip cannot be secured, the current value may be reduced. It is possible to immediately respond to various types of condition setting tests and plating solution performance comprehension tests, for example, when it is desired to increase the value of the plating solution, or to change the plating solution and try various current values.

According to the second aspect of the present invention, since the support member is provided, it is possible to easily carry in and position the workpiece.
The work can be held at an accurate position in the plating tank with respect to the anode portion, and uniform plating can be performed over the entire surface.

According to the third aspect of the present invention, by increasing the contact pressure of the contact, the work can be stabilized even in a flowing plating solution, and can be stably supplied even at a high current value. , And it is particularly useful for maintaining the posture. Therefore, the inclination of the work, which is a drawback of the basket type, can be prevented, and good plating can be performed.

According to the fourth aspect of the present invention, while the workpiece is held in various contact types, the distance of the anode portion is adjusted in various ways, plating is tried, and the best plating conditions can be determined even on the anode side. .

[0013]

Embodiments of the present invention will be described below in detail with reference to the drawings. First, a first embodiment will be described. FIG. 1 is an explanatory view showing an electronic component plating apparatus according to the present embodiment, and FIG. 2 is an explanatory view showing a basket type plating method.

In the figure, 1 is a plating tank, 2 is a plating solution, 3a,
Reference numeral 3b denotes an anode portion made of a pair of solder balls opposed to each other, and one set of this configuration is provided. Next, reference numeral 4 denotes a basket as a first plating jig A provided in the plating tank 1, which comprises a storage section 6 of a lead frame (work) 5, a hanging portion 7, and a fixing section 8. , The storage section 6
Bottom portion 9 serves as a cathode contact 10 when the work is stored and mounted. The fixing part 8 is provided at the anode part 3 in the plating tank 1.
It is provided so as to be fitted to the upper surface 11 on one side of the side walls orthogonal to a and 3b, and is connected to a cathode portion of a power supply (not shown). When the fixing portion 8 is fitted to the upper surface 11 of the side wall, the hanging portion 7 arranges the housing portion 6 at a position where the center of the lead frame 5 substantially coincides with the center of the anode portions 3a and 3b.

The operation of the system using the basket 4 will be described. In this method, the lower edge 5a of the lead frame 5 comes into contact with the cathode contact 10 by inserting the lead frame 5 into the storage section 6 of the basket 4. Therefore, the storage section 6 forms a means for supplying electricity to the lead frame 5 and a means for holding the posture. In this case, the lower edge surface 5a
Is suitable for plating a relatively large lead frame because the contact pressure is applied only by the weight of the lead frame 5. Further, it is possible to quickly respond to the plating process with a very simple procedure.

Next, a second embodiment will be described. FIG.
In the figure, reference numeral 15 denotes a clip provided as a second plating jig B provided in the plating tank 1, and an upper surface 11 of the side wall.
A horizontal portion 16 fixed in a bridging manner and connected to the cathode portion of the power supply; and a negative electrode contact 17 disposed at a predetermined pitch on the horizontal portion 16 and having a cathode contact 17 at the tip. The gripping portion 18 is urged so as to be pressed. In this case, the horizontal portion 16 and the grip portion 18 form a means for supplying electricity to the lead frame 5 and a posture holding means. The gripping portion 18 grips the upper edge of the lead frame 5 with the cathode contact 17 and fixes the horizontal portion 16 to the upper surfaces 11 of the side walls in a bridging manner. The lead frame 5 is arranged at a position substantially coincident with the center between the portions 3a and 3b. In the gripping method using the clip, the contact area of the contact with the lead frame is increased, and plating can be performed using a larger current value than the jig of the first embodiment.

Next, a third embodiment will be described with reference to FIG. In the present embodiment, a third plating jig C has a support portion 19 for supporting the lower edge surface 5a of the lead frame 5 in addition to the clip 15 of the second embodiment. In the drawing, reference numeral 20 denotes an auxiliary frame for disposing the support portion 19 in the plating tank 1. When the overhang portions 21 at both ends are placed on the upper surfaces 11 of the side walls, the mounting portion of the support portion 19 is connected to the plating tank. The horizontal portion 16, the grip portion 18 and the support portion 19 form a more secure energizing means and attitude holding means. In the gripping type using the clip, the contact area of the contact with the lead frame is increased, so that the plating can be performed using a larger current value than the jig of the second embodiment. Part 3
The distances to a and 3b can be accurately maintained throughout, and uniform plating can be performed on the entire surface. In this case, the gripper 18 may be moved up and down as appropriate so that the lead frame 5 is always vertical and the lower edge surface 5a can contact the support 19. Further, instead of the clip 15, only the support portion 19 may be a cathode contact, or both may be cathode contacts. In this case, as another example, clip 1
5 is disposed below the plating tank 1, the lower edge 5 a of the lead frame 5 is gripped and energized, and the upper edge 5 b
May be held down to hold the posture.

Next, a fourth embodiment will be described with reference to FIG. In the present embodiment, a fourth plating jig D has a holding means 22 for supporting the upper edge surface 5b of the lead frame 5 instead of the clip 15 of the third embodiment. In the figure, reference numeral 23 denotes an arm of the pressing means 22, one end of which is rotatably supported on the overhanging portion 21 of the auxiliary frame, and an air cylinder 24 is connected to the rear end thereof. The distal end of the arm 23 is used as a cathode contact 25 for pressing the upper edge surface 5b of the lead frame 5, and the pressing portion 22 and the support portion 19 form an energizing unit and a posture holding unit. In the method using the pressing means 22, the distance between the lead frame 5 and the anode portions 3a and 3b can be accurately maintained throughout, and uniform plating can be performed over the entire surface. In this case, only the support portion 19 may be a cathode contact instead of the holding means 22, or both may be cathode contacts. In this case, as another example, instead of the support portion 19, the clip 15 is disposed below the plating tank 1, the lower edge 5a of the lead frame 5 is gripped and energized, and the upper edge 5b is pressed by the pressing means 22. The posture may be held by pressing the button.

Next, a fifth embodiment will be described with reference to FIG. In the present embodiment, the anode portions 3a and 3b have the adjusting means 25 for adjusting the interval between the same electrodes facing each other in the plating tank 1. In the drawing, reference numeral 26 denotes an interval adjusting screw shaft, which is arranged orthogonally to the lead frame 5 to relatively move the anode portions 3a and 3b with respect to the surface of the lead frame 5 set in the plating tank 1, Reverse screw 26 on both ends
a and 26 b are screwed and turned with the knob 27. Reference numeral 28 denotes a support block screwed to the reverse screws 26a and 26b, which is slidably mounted on a rail 29 fixed to the plating tank 1 side. Numeral 30 denotes a screw shaft for adjusting the parallel position, which is arranged in parallel with the lead frame 5 and has both ends rotatably supported by the support blocks 28.
Screw with 1 32a and 32b are reverse screws provided on the screw shaft 30. Reference numeral 33 denotes a mounting block for the anode portions 3a and 3b, which is screwed to the reverse screws 32a and 32b and slidably mounted on the rotation preventing guide. The adjusting means 25 moves the anode portions 3a, 3b in the orthogonal and parallel directions with respect to the lead frame in the plating tank 1.
Therefore, it is possible to immediately respond to various types of condition setting tests and plating solution performance comprehension tests.

Although the embodiment has been described above, the specific configuration of the present invention is not limited to this embodiment, and even if there is a design change or the like within a range not departing from the gist of the invention. Included in the invention.

Basket shape, anode shape, holding means,
The shape of the support, the shape of the adjusting means, and the like can be arbitrarily set.

[0022]

As described above, in the apparatus for plating electronic parts according to the first aspect of the present invention, since the above-described configuration is adopted, the means for supplying electricity to the workpiece holds the workpiece in one plating tank. A jig that uses the gripping surface as a contact point, a jig that uses a support portion that contacts the lower edge surface of the work by its own weight as a contact, and a jig that uses a pressing portion that presses the upper edge surface of the work as a contact point. Alternatively, a jig having a plurality of the contacts can be replaced and mounted. Therefore, with a set of plating equipment, if the current value is increased, if the cathode contact part of the lead frame is discolored by electrolytic corrosion or a mark like burnt remains or if the gripping part can not be removed,
When it is desired to increase the current value, or to change the plating solution and try various current values, it is possible to immediately respond to various types of condition setting tests and plating solution performance comprehension tests. In addition, it is possible to perform tests corresponding to various workpieces, such as when performing plating where quality is not important, when slowly plating with emphasis on quality, and when performing high-speed plating with high current. Is obtained.

In the electronic component plating apparatus according to the second aspect of the present invention, since the above configuration is adopted, the work can be easily carried in and positioned by the support member, and the work can be accurately positioned in the plating tank with respect to the anode portion. And the entire surface can be plated uniformly.

According to the third aspect of the present invention, since the electronic component plating apparatus is configured as described above, by increasing the contact pressure of the contacts, the workpiece can be stabilized even in a flowing plating solution and stable even at a high current value. Can be supplied without causing discoloration or the like due to electrolytic corrosion of the contact portion, and is particularly useful for holding the posture. Therefore, it is possible to prevent inclination of the work, which is a drawback of the basket, and perform good plating. And the like.

In the electronic component plating apparatus according to the fourth aspect of the present invention, since the above-described configuration is adopted, the anode position can be fixed to a specific position and the position can be freely changed according to the design philosophy of the manufacturer, and the test can be performed. The effect of being able to determine the best plating method is to adjust the distance of the anode part in various ways while holding the workpiece in various contact types while trying to perform plating.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing an electronic component plating apparatus according to first and second embodiments of the present invention.

FIG. 2 is an explanatory view showing a basket-type plating method according to the first embodiment.

FIG. 3 is an explanatory diagram illustrating a gripping plating method according to a third embodiment.

FIG. 4 is an explanatory diagram showing a plating method of a fourth embodiment of a lead frame upper edge surface pressing type.

FIG. 5 is an explanatory view showing a plating method of an anode part distance adjusting type according to a fifth embodiment.

[Explanation of symbols]

 A first plating jig B second plating jig C third plating jig D fourth plating jig 1 plating tank 3a, 3b anode 4 basket 5 lead frame 5a under lead frame Edge 5b Upper edge of lead frame 10 Cathode contact 15 Clip 17 Cathode contact 18 Gripping part 19 Supporting part 22 Holding means 25 Anode adjusting means

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 23/08 H01L 23/08

Claims (4)

[Claims] 1. A plating tank having an anode part therein, a means for supplying electricity to a work for applying the work to a cathode while the work is immersed in a predetermined position in the plating tank, and the work being substantially vertical. A plating device for an electronic component, comprising: a jig composed of a posture holding means for holding a posture of the work; Is the contact point,
Alternatively, a plurality of types of preparing the work as a cathode portion with a pressing portion pressing the upper edge surface of the work as a contact point are provided, and any jig made of one type or a combination of a plurality of types of the plurality of types is used for the plating. An electronic component plating apparatus, which is formed so as to be detachably attached to a mounting portion of a tank. 2. The electronic component as claimed in claim 1, wherein a supporting member for supporting the lower edge surface of the work and an energizing means for gripping and energizing the work constitute a posture holding means for the work. Plating equipment. 3. The plating apparatus for electronic parts according to claim 1, wherein the jig has a pressing means for pressing an upper edge surface of the work. 4. The plating apparatus according to claim 1, wherein the anode is formed so as to be relatively movable with respect to the workpiece.