CN111501080A - Disordered electronic plating equipment based on electric field transformation - Google Patents
Disordered electronic plating equipment based on electric field transformation Download PDFInfo
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- CN111501080A CN111501080A CN202010457255.6A CN202010457255A CN111501080A CN 111501080 A CN111501080 A CN 111501080A CN 202010457255 A CN202010457255 A CN 202010457255A CN 111501080 A CN111501080 A CN 111501080A
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- plating
- electric field
- feed liquor
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/02—Heating or cooling
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
Abstract
The invention discloses disordered electronic plating equipment based on electric field transformation, which comprises a plating tank, wherein a base is arranged at the bottom of the plating tank, side frame mounting seats are arranged on two sides of the base, side frames are fixedly connected to the tops of the side frame mounting seats, slide rails are arranged at positions close to the inner sides of the side frames, inner sliding frames are arranged above the inner sides of the side frames, a plating electrode frame is arranged between the inner sliding frames, and an electrode mounting seat is fixedly connected to the bottom of the plating electrode frame through a connecting frame. This unordered electron plating equipment based on electric field conversion, the electric field of top can carry out the unordered conversion for the electron of inside produces a unordered motion and carries out the purpose of plating, and the speed of effectual improvement internal molecule and electron plating, unordered plating are difficult to destroy its whole constitution more, and the rapid heating improves the inside plating solution temperature of plating bath, the speed of effectual increase plating.
Description
Technical Field
The invention relates to the technical field of metal plating, in particular to disordered electronic plating equipment based on electric field transformation.
Background
The process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis is a process of attaching a layer of metal film on the surface of a metal or other material workpiece by using the action of electrolysis, thereby playing roles of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like;
for example, a device for plating a material with a metal material, which is disclosed in chinese patent No. cn201910403802.x, provides a device for plating a material with a metal material, and realizes electroplating of a metal workpiece by using a single power source, and the power source simultaneously drives the material to be conveyed, so that the degree of automation is high, and the equipment automatically electroplates the metal workpiece in sequence, thereby reducing the labor cost and facilitating production, popularization and use.
The existing plating device improves the plating efficiency by changing the feeding and discharging of the plating device without changing the plating electric field and the electron movement, the actual plating efficiency is different, and the plating effect is similar.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides disordered electronic plating equipment based on electric field transformation, and solves the problems that the plating efficiency is different from the actual plating efficiency and the plating effect is similar from the actual plating efficiency without changing the plating electric field and the electron movement.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides an unordered electron plating equipment based on electric field conversion, includes the plating pond, plating bottom of the pool portion is provided with the base, base both sides side is provided with limit side bearer mount pad, limit side bearer mount pad top fixed connection has the limit side bearer, the slide rail has been seted up to the inboard position of leaning on of limit side bearer, the inboard top of limit side bearer is provided with inside balladeur train, install the plating electrode frame between the inside balladeur train, plating electrode frame bottom is through link fixedly connected with electrode mount pad, electrode mount pad below middle part has still set up the installation slotted hole for the installation magnetic pole, the positive pole is installed to electrode mount pad below one side, one side that the positive pole was kept away from to electrode mount pad below is installed outer cathode and inner cathode, plating pond outer wall both sides are provided with electromagnetic field conversion equipment, the plating pond inboard corresponds being provided with movable electric field generator of the position of, the left side and the right side of the inner wall of the plating tank are provided with fixed electric field generators, the movable electric field generators and the fixed electric field generators can control switches through a control module, a random switch change rule is arranged in the module in advance, so that an electric field above the module is subjected to disordered change, electrons in the module generate disordered motion to plate, the bottom of the plating tank is provided with an induction coil, the induction coil can be used for two purposes, one induction coil is used for heating a metal rod after being electrified, an electrode in the induction coil can be used as the heating metal rod to rapidly heat, the temperature of plating solution in the plating tank is improved, molecular thermal motion is realized, the plating speed is improved, the plating solution is matched with rolling use, the plating speed is effectively increased, and the bottom of the plating electrode frame can also be provided with magnetic poles and is placed in the middle of, top telescoping device can promote plating electrode frame and magnetic pole about, evenly cuts magnetism induction line about the magnetic pole, forms a electric field district for the electron sequencing motion carries out the sequence plating to the material of plating, the centre of plating pond inboard bottom is provided with the feed liquor disk seat, the inside feed liquor pipe that is provided with of base, feed liquor disk seat and feed liquor pipe intercommunication, the one end that the feed liquor disk seat was kept away from to the feed liquor pipe extends to the base outside, when pouring into plating liquid, and the pressurization bubbler pressurization is bubbled and is made inside plating liquid bubble that rolls for inside plating liquid rolls, faster plating.
Preferably, the outer cathode is arranged on two sides of the inner cathode, the anode is an anode plate, and a plating solution hole is formed in a plate body of the anode.
Preferably, feed liquor valve seat top and avris all are provided with the hydrojet mouth, the inside pressurization bubbler that is provided with of feed liquor valve seat, the pressurization bubbler pressurization is bubbled and is made inside plating liquid bubble that rolls for inside plating liquid rolls.
Preferably, electromagnetic field conversion equipment includes the device shell, inside slide bar support and the transform cam of being provided with of device shell, the inside transform motor that is provided with of electromagnetic field conversion equipment, the transform cam is installed on the output shaft of transform motor, the inboard sliding connection of slide bar support has the carriage release lever, the inside carriage release lever outside that is located of slide bar support is provided with return spring, the carriage release lever outside is provided with the baffle, return spring is located between baffle and the device shell, the one end that the transform cam was kept away from to the carriage release lever rotates with movable electric field generator and is connected, the inside top of electromagnetic field conversion equipment is provided with control module, and the carriage release lever can promote movable electric field generator and carry out the position and remove, changes the trend of inside plating liquid for going on of plating work, effectual improvement plating.
Preferably, the upper part of the movable electric field generator is rotatably connected with the inner wall of the plating tank.
Preferably, the avris frame top is provided with the top telescoping device, the inside pneumatic cylinder that is provided with of top telescoping device, the pneumatic cylinder passes through hydraulic stem and inside balladeur train top fixed connection, plating electrode frame both ends are provided with the spliced pole frame, the plating electrode frame passes through spliced pole frame and inside balladeur train fixed connection.
Preferably, one side of the plating tank, which is far away from the liquid inlet pipe, is provided with an edge side liquid inlet pipe and a middle liquid inlet pipe, an outer discharge pipe is arranged below one side of the plating tank, which is far away from the liquid inlet pipe, and the outer sides of the middle liquid inlet pipe and the outer discharge pipe are provided with butting flanges.
Preferably, the plating electrode frame is internally provided with a positioning motor and a threaded rod, the positioning motor is rotatably connected with the threaded rod through a speed reducer, a movable sliding block is arranged on the outer side of the threaded rod and is slidably connected with an inner side chute of the plating electrode frame, and the bottom of the movable sliding block is fixedly connected with the electrode mounting seat through a connecting frame.
(III) advantageous effects
The invention provides a disordered electronic plating device based on electric field transformation. The method has the following beneficial effects:
when the plating solution is injected, the pressurizing bubbler pressurizes and bubbles the plating solution in the device, so that the plating solution in the device is rolled and bubbles the plating solution in the device, and the plating solution in the device is rolled and plated more quickly.
According to the disordered electronic plating equipment based on electric field transformation, the upper electric field can be subjected to disordered transformation, so that electrons in the equipment generate disordered motion for plating, the speed of plating internal molecules and electrons is effectively increased, and the overall structure of the equipment is more difficult to damage due to disordered plating;
the disordered electronic plating equipment based on the electric field transformation rapidly heats and improves the temperature of the plating solution in the plating tank, thereby enabling the molecules to move thermally, improving the plating speed, and effectively increasing the plating speed by matching with the rolling use of the plating solution.
The disordered electronic plating device based on the electric field transformation can also form an electric field area in the plating tank, so that electrons move in a sequencing way to carry out sequential plating on the plated materials;
according to the disordered electronic plating equipment based on electric field transformation, the moving rod can push the movable electric field generator to move in position, the moving direction of the internal plating liquid is changed, plating operation is quickened, and plating efficiency is effectively improved.
Drawings
FIG. 1 is a schematic structural view of the present invention as a whole;
FIG. 2 is a schematic view of the plating cell of the present invention separated from the plating electrode holder;
FIG. 3 is a schematic view of the construction of a plating tank according to the invention;
FIG. 4 is a schematic diagram of a structure of a plating electrode holder according to the present invention;
FIG. 5 is a schematic view of the interior of a coated electrode holder according to the present invention;
FIG. 6 is a schematic structural diagram of an electric field transformation device according to the present invention;
FIG. 7 is a schematic top view of the overall apparatus of the present invention.
In the figure: the plating device comprises a plating tank 1, a base 2, side frames 3, an internal sliding frame 4, a plating electrode frame 5, a 51-position-adjusting motor, a threaded rod 52, a speed reducer 53, a movable sliding block 54, an electrode mounting seat 6, a top telescopic device 7, a connecting column rod frame 8, an electric field conversion device 9, a shell 91, a sliding rod support 92, a conversion cam 93, a return spring 94, a movable rod 95, a 96 control module 10 external discharge pipes, a liquid inlet valve seat 11, a liquid inlet pipe 12, an induction coil 13, a movable electric field generator 14, a fixed electric field generator 15, an anode 16, an external cathode 17, an internal cathode 18, a connecting frame 19, a plating liquid perforation 20, a liquid inlet pipe 21 side and a liquid inlet pipe 22 in the middle.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-7, the present invention provides a technical solution: an unordered electronic plating device based on electric field conversion comprises a plating tank 1, wherein the bottom of the plating tank 1 is provided with a base 2, side frame mounting seats are arranged on two sides of the base 2, side frames 3 are fixedly connected to the tops of the side frame mounting seats, slide rails are arranged at positions close to the inner sides of the side frames 3, inner carriages 4 are arranged above the inner sides of the side frames 3, a plating electrode frame 5 is arranged between the inner carriages 4, the bottom of the plating electrode frame 5 is fixedly connected with an electrode mounting seat 6 through a connecting frame 19, a mounting groove hole is further formed in the middle of the lower part of the electrode mounting seat 6 and used for mounting a magnetic pole, an anode 16 is arranged on one side of the lower part of the electrode mounting seat 6, an outer cathode 17 and an inner cathode 18 are arranged on one side of the lower part of the electrode mounting seat 6, which is far away from the anode 16, electromagnetic field conversion devices 9 are arranged on two sides, the left side and the right side of the inner wall of the plating tank 1 are provided with fixed electric field generators 15, the movable electric field generators 14 and the fixed electric field generators 15 can control switches through a control module, random switch change rules are arranged in the module in advance, so that an electric field above the module is subjected to disorder change, electrons in the module generate disorder movement to perform the plating purpose, the bottom of the plating tank 1 is provided with an induction coil 13, the induction coil 13 can be used for two purposes, one induction coil is used for heating an electrode in the induction coil after being electrified, the electrode in the induction coil can be used as a heating metal rod to rapidly heat the metal rod, the temperature of plating solution in the plating tank is improved, molecular thermal movement is realized, the plating speed is improved, the plating solution is matched with the rolling use, the plating speed is effectively increased, and the other effect is that magnetic poles can be further arranged, top telescoping device 7 can promote about plating electrode holder 5 and the magnetic pole, evenly cut magnetic induction line about the magnetic pole, form an electric field district, make the electron sequencing motion, carry out the sequence plating to the material of plating, the centre of 1 inboard bottom in plating bath is provided with feed liquor disk seat 11, 2 inside feed liquor pipes 12 that are provided with of base, feed liquor disk seat 11 and feed liquor pipe 12 intercommunication, the one end that feed liquor disk seat 11 was kept away from to feed liquor pipe 12 extends to 2 outsides of base, when pouring into plating liquid, pressurization bubbler pressurization bubbling makes inside plating liquid bubble that rolls, make inside plating liquid roll, the faster plating.
The outer cathode 17 is arranged at two sides of the inner cathode 18, the anode 16 is an anode plate, and the plate body of the anode 16 is provided with plating solution through holes 20.
Liquid spraying openings are formed in the upper side and the side of the liquid inlet valve seat 11, a pressurizing bubbler is arranged inside the liquid inlet valve seat 11, and the pressurizing bubbler pressurizes and foams to enable the plating liquid inside to roll and foam, so that the plating liquid inside rolls.
Electromagnetic field conversion equipment 9 includes device shell 91, the inside slide bar support 92 and the conversion cam 93 that is provided with of device shell 91, the inside conversion motor that is provided with of electromagnetic field conversion equipment 9, conversion cam 93 is installed on the output shaft of conversion motor, slide bar support 92 inboard sliding connection has the carriage release lever 95, slide bar support 92 is inside to be located the carriage release lever 95 outside and be provided with return spring 94, the carriage release lever 95 outside is provided with the baffle, return spring 94 is located between baffle and device shell 91, the one end that translation cam 93 was kept away from to carriage release lever 95 rotates with activity electric field generator 14 to be connected, the inside top of electromagnetic field conversion equipment 9 is provided with control module 96, carriage release lever 95 can promote activity electric field generator 14 to carry out the position and move, change the trend of inside plating liquid, accelerate the going on of.
The upper part of the movable electric field generator 14 is rotatably connected with the inner wall of the coating pool 1.
The top of the side frame 3 is provided with a top telescopic device 7, a hydraulic cylinder is arranged inside the top telescopic device 7, the hydraulic cylinder is fixedly connected with the top of the inner sliding frame 4 through a hydraulic rod, connecting column rod frames 8 are arranged at two ends of the plating electrode frame 5, and the plating electrode frame 5 is fixedly connected with the inner sliding frame 4 through the connecting column rod frames 8.
One side of the plating tank 1, which is far away from the liquid inlet pipe 12, is provided with an edge side liquid inlet pipe 21 and a middle liquid inlet pipe 22, the lower side of one side of the plating tank 1, which is far away from the liquid inlet pipe 12, is provided with an outer discharge pipe 10, and the outer sides of the middle liquid inlet pipe 22 and the outer discharge pipe 10 are both provided with butting flanges.
A positioning motor 51 and a threaded rod 52 are arranged in the plating electrode frame 5, the positioning motor 51 is rotationally connected with the threaded rod 52 through a speed reducer 53, a movable sliding block 54 is arranged on the outer side of the threaded rod 52, the movable sliding block 54 is slidably connected with a sliding groove on the inner side of the plating electrode frame 5, and the bottom of the movable sliding block 54 is fixedly connected with the electrode mounting seat 6 through a connecting frame 19.
When the plating device is used, plating solution is injected into the liquid inlet valve seat 11 through the liquid inlet pipe 12 in the plating tank 1, liquid spraying ports are formed above and on the side of the liquid inlet valve seat 11, and when the plating solution is injected, the pressurizing bubbler pressurizes and foams to enable the plating solution in the plating tank to roll and foam, so that the plating solution in the plating tank rolls uniformly and is plated more quickly;
the side frames 3 at two sides of the plating tank 1 are provided with plating electrode frames 5 through the internal sliding frame 4, the plating electrode frames 5 can move along with the up-and-down movement of the internal sliding frame 4, and drive the anode 16, the outer cathode 17 and the inner cathode 18 below the plating electrode frames 5 to move up and down, the anode 16 adopts an anode plate, the anode plate is provided with plating solution through holes 20 for passing plating solution, the cathode is provided with three cathode bars, and the anode and the cathode are arranged correspondingly;
the induction coil 13 is arranged at the lower position in the plating tank 1, the induction coil 13 can be used for two purposes, one induction coil is used for heating a metal rod which is used as an internal electrode after the induction coil is electrified, and the purposes of rapidly heating and improving the temperature of plating solution in the plating tank can be achieved, so that molecular heat moves, the plating speed is improved, and the plating speed is effectively increased by matching with the rolling use of the plating solution;
the other function is that the bottom of the plating electrode frame 5 can be provided with a magnetic pole which is arranged in the middle of the induction coil 13, the top expansion device 7 can push the plating electrode frame 5 and the magnetic pole to move up and down, the magnetic pole uniformly cuts magnetic induction lines up and down to form an electric field area, so that electrons move in a sequencing way to sequentially plate the plated materials;
the movable electric field generator 14 and the fixed electric field generator 15 are arranged in the plating tank 1, the movable electric field generator 14 and the fixed electric field generator 15 can be controlled to be switched through a control module, and a random switch conversion rule is arranged in the module in advance, so that an electric field above the module is subjected to disorder conversion, and electrons in the module generate disorder movement to perform plating;
the inside conversion motor of electromagnetic field conversion equipment 9 drives conversion cam 93 and rotates, and conversion cam 93 can promote movable rod 95 and remove, and when conversion cam 93 return, return spring 94 will return movable rod 95 again, and movable electric field generator 14 can be pushed to the movable rod 95 and the position removes, changes the trend of inside plating liquid for going on of plating work, effectual improvement plating efficiency.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. The term "comprising", without further limitation, means that the element so defined is not excluded from the group consisting of additional identical elements in the process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A disordered electronic plating apparatus based on electric field transformation comprising a plating cell (1), characterised in that: plating bath (1) bottom is provided with base (2), base (2) both sides side is provided with limit side bearer mount pad, limit side bearer mount pad top fixed connection has limit side bearer (3), the slide rail has been seted up to limit side bearer (3) inboard position of leaning on, limit side bearer (3) inboard top is provided with inside balladeur train (4), install between inside balladeur train (4) and plate electrode frame (5), plating electrode frame (5) bottom is through link (19) fixedly connected with electrode mount pad (6), anode (16) are installed to electrode mount pad (6) below one side, outer cathode (17) and inner cathode (18) are installed to one side that anode (16) were kept away from to electrode mount pad (6) below, plating bath (1) outer wall both sides are provided with electromagnetic field conversion device (9), plating bath (1) inboard position that corresponds electromagnetic field conversion device (9) is provided with movable electric field generator (14) The utility model discloses a plating bath, the plating bath (1) inner wall left and right sides is provided with fixed electric field generator (15), plating bath (1) bottom is provided with induction coil (13), the centre of plating bath (1) inboard bottom is provided with feed liquor disk seat (11), base (2) inside is provided with feed liquor pipe (12), feed liquor disk seat (11) and feed liquor pipe (12) intercommunication, the one end that feed liquor disk seat (11) were kept away from in feed liquor pipe (12) extends to the base (2) outside.
2. A disordered electronic plating apparatus based on electric field transformation according to claim 1 and characterised in that: the outer cathode (17) is arranged on two sides of the inner cathode (18), the anode (16) is an anode plate, and a plating solution through hole (20) is formed in the plate body of the anode (16).
3. A disordered electronic plating apparatus based on electric field transformation according to claim 1 and characterised in that: feed liquor valve seat (11) top and avris all are provided with the hydrojet mouth, feed liquor valve seat (11) inside is provided with the pressurization bubbler.
4. A disordered electronic plating apparatus based on electric field transformation according to claim 1 and characterised in that: electromagnetic field conversion equipment (9) is including device shell (91), inside slide bar support (92) and the conversion cam (93) of being provided with of device shell (91), the inside conversion motor that is provided with of electromagnetic field conversion equipment (9), conversion cam (93) are installed on the output shaft of conversion motor, slide bar support (92) inboard sliding connection has carriage release lever (95), inside being located carriage release lever (95) outside of slide bar support (92) is provided with return spring (94), the carriage release lever (95) outside is provided with the baffle, return spring (94) are located between baffle and device shell (91), the one end that conversion cam (93) were kept away from in carriage release lever (95) rotates with movable electric field generator (14) to be connected, the inside top of electromagnetic field conversion equipment (9) is provided with control module (96).
5. A disordered electronic plating apparatus based on electric field transformation according to claim 4 wherein: the upper part of the movable electric field generator (14) is rotationally connected with the inner wall of the plating tank (1).
6. A disordered electronic plating apparatus based on electric field transformation according to claim 1 and characterised in that: the plating electrode rack is characterized in that a top telescopic device (7) is arranged at the top of the side frame (3), a hydraulic cylinder is arranged inside the top telescopic device (7), the hydraulic cylinder is fixedly connected with the top of the inner sliding frame (4) through a hydraulic rod, connecting column rod racks (8) are arranged at two ends of the plating electrode rack (5), and the plating electrode rack (5) is fixedly connected with the inner sliding frame (4) through the connecting column rod racks (8).
7. A disordered electronic plating apparatus based on electric field transformation according to claim 1 and characterised in that: one side that feed liquor pipe (12) was kept away from in coating pond (1) is provided with avris feed liquor pipe (21) and middle part feed liquor pipe (22), the below of one side that feed liquor pipe (12) was kept away from in coating pond (1) is provided with outer calandria (10), middle part feed liquor pipe (22) and outer calandria (10) outside all are provided with flange.
8. A disordered electronic plating apparatus based on electric field transformation according to claim 1 and characterised in that: plating electrode frame (5) inside is provided with positioning motor (51) and threaded rod (52), positioning motor (51) are rotated with threaded rod (52) through speed reducer (53) and are connected, threaded rod (52) outside is provided with removal slider (54), remove slider (54) and the inboard spout sliding connection of plating electrode frame (5), remove slider (54) bottom through link (19) and electrode mount pad (6) fixed connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010457255.6A CN111501080B (en) | 2020-05-26 | 2020-05-26 | Disordered electronic plating equipment based on electric field transformation |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010457255.6A CN111501080B (en) | 2020-05-26 | 2020-05-26 | Disordered electronic plating equipment based on electric field transformation |
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| CN111501080A true CN111501080A (en) | 2020-08-07 |
| CN111501080B CN111501080B (en) | 2021-08-06 |
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| JP2000017495A (en) * | 1998-06-30 | 2000-01-18 | Rix Corp | Plating aperture for electronic parts |
| CN1353779A (en) * | 1999-04-13 | 2002-06-12 | 塞米用具公司 | System for electrochemically processing workpiece |
| CN104258998A (en) * | 2014-08-19 | 2015-01-07 | 阮海生 | Method and device for producing inhomogeneous electric field and dust particle filtration system |
| WO2016088286A1 (en) * | 2014-12-01 | 2016-06-09 | 株式会社 東芝 | Photoelectrode and method for manufacturing same, and photoelectrochemical reaction device using same |
| CN109112593A (en) * | 2018-10-10 | 2019-01-01 | 江苏师范大学 | A kind of magnetorheological-jet stream the electro-deposition method and its device of plane machining |
| CN208844220U (en) * | 2018-09-21 | 2019-05-10 | 深圳市鑫六福珠宝有限公司 | A kind of modularization electroplating machine |
| CN110938857A (en) * | 2018-09-21 | 2020-03-31 | 深圳市鑫六福珠宝有限公司 | Modularization electroplating machine |
| CN111005055A (en) * | 2020-01-04 | 2020-04-14 | 焦作大学 | Multi-source synchronous frequency oscillation type electrodeposition processing device and processing method |
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2020
- 2020-05-26 CN CN202010457255.6A patent/CN111501080B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000017495A (en) * | 1998-06-30 | 2000-01-18 | Rix Corp | Plating aperture for electronic parts |
| CN1353779A (en) * | 1999-04-13 | 2002-06-12 | 塞米用具公司 | System for electrochemically processing workpiece |
| CN104258998A (en) * | 2014-08-19 | 2015-01-07 | 阮海生 | Method and device for producing inhomogeneous electric field and dust particle filtration system |
| WO2016088286A1 (en) * | 2014-12-01 | 2016-06-09 | 株式会社 東芝 | Photoelectrode and method for manufacturing same, and photoelectrochemical reaction device using same |
| CN208844220U (en) * | 2018-09-21 | 2019-05-10 | 深圳市鑫六福珠宝有限公司 | A kind of modularization electroplating machine |
| CN110938857A (en) * | 2018-09-21 | 2020-03-31 | 深圳市鑫六福珠宝有限公司 | Modularization electroplating machine |
| CN109112593A (en) * | 2018-10-10 | 2019-01-01 | 江苏师范大学 | A kind of magnetorheological-jet stream the electro-deposition method and its device of plane machining |
| CN111005055A (en) * | 2020-01-04 | 2020-04-14 | 焦作大学 | Multi-source synchronous frequency oscillation type electrodeposition processing device and processing method |
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|---|---|
| CN111501080B (en) | 2021-08-06 |
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