JPH08104998A - Plating device of thin type substrate - Google Patents

Abstract

PURPOSE: To form a plating layer nearly uniform over the entire surface of a thin type substrate by inserting this thin type substrate into the aperture of a frame, mounting a dummy plate bored with plural holes in the lower part of the frame, immersing both plates into a plating liquid and oscillating the plates. CONSTITUTION: The frame 1 is provided, in its central part, with the aperture 2 for the substrate so as to comply with the size of the thin type substrate which is a member to be plated. Both right and left ends of the one surface of the aperture 2 of the frame 1 are provided with substrate fixtures 3 having spacings to allow the insertion of the thin type substrate. The dummy plate 4 bored with plural pieces of the holes 5 of a prescribed size is mounted at the lower end of the frame 1. The thin type substrate is mounted in the aperture 2 of the frame 1 by this constitution, is immersed perpendicularly into the plating bath and is subjected to plating under oscillation. At this time, the oscillation in the plating bath is facilitated by the dummy plate 4 having the holes 5 and the uniform plating layer is formed on the thin type substrate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating apparatus for thin substrates such as printed circuit boards and the like, and more particularly to a method for performing swing plating of a thin substrate according to the swing motion of the plating apparatus. The present invention relates to a thin board plating apparatus capable of forming a uniform plating layer by reducing variations in plating thickness and forming four or more high-density conductor patterns between pins of a printed board.

[0002]

2. Description of the Related Art A conventional swing plating method for a thin printed circuit board or the like is, for example, as shown in FIG. 4, at the center of a metal frame 1, a printed circuit board or the like, which is a member to be plated, is placed. An opening 2 for plating is provided in accordance with the size of the thin board, and a plating frame in which a thin board which is a member to be plated is inserted and mounted between the frame 1 and the board fixing metal fitting 3 is used. This was suspended and supported in a plating bath, and desired plating, for example, copper plating, was performed on the surface of a thin substrate such as a printed circuit board while rocking. However, when the conventional swing plating apparatus having the above-mentioned structure is used and the plating is performed while immersing in a plating bath in the vertical direction and swinging, there occurs a phenomenon that the current density on the lower side of the thin substrate increases. The thickness of the plating layer formed on the lower side of the thin substrate becomes larger than that on the upper side of the thin substrate, resulting in a large variation in the thickness of the plating layer formed on the thin substrate. By using this thin substrate with a large variation in plating thickness, for example, the distance between IC pins (2.54 mm)
When etching is performed to form a high-density conductor pattern through which more than one signal line is passed, there is a problem in that a defect in the conductor pattern such as disconnection or line thinning occurs, which results in low product yield.

[0003]

SUMMARY OF THE INVENTION The object of the present invention is to solve the above-mentioned problems in the prior art, and in swing plating of a thin substrate such as a printed circuit board, variations in plating are small and the surface of the thin substrate is small. It is possible to form a plating layer having a substantially uniform film thickness on the
An object of the present invention is to provide an oscillating plating apparatus capable of forming a uniform plating layer capable of forming a high-density conductor pattern in which four or more signal lines are passed between the pins.

[0004]

In order to achieve the above-mentioned object of the present invention, the thin substrate plating apparatus of the present invention has a structure as set forth in the claims. That is, as described in claim 1, an opening is formed in the central portion according to the size of the thin substrate which is the member to be plated, and the thin substrate can be removably mounted in the opening. At least a metal frame having a structure and a dummy plate to which a thick plating layer which is easily deposited on the lower side of the thin substrate is attached to the lower part of the metal frame due to the current density during swing plating. The dummy plate is provided with a plurality of holes for reducing the resistance of the plating bath during swing plating.
Further, as described in claim 2, the thin substrate is a printed circuit board, and the metal frame or the dummy plate is nickel,
This is a plating apparatus for a thin substrate made of chromium or a stainless steel alloy material containing these as main components. Further, as described in claim 3, using the plating apparatus for a thin substrate according to claim 1 or claim 2, the metal substrate is provided on the upper part of the frame.
It is a plating apparatus for a thin substrate provided with a detachable support device for suspending and swinging in a plating bath. Further, as described in claim 4, the supporting device of the detachable structure which suspends and swings in the plating bath in claim 3 is a clamp type supporting device.

[0005]

According to the thin substrate plating apparatus of the present invention, an opening is formed in the central portion according to the size of the thin substrate which is the member to be plated. And a metal frame having a structure in which the thin substrate can be detachably mounted, and a metal frame is deposited on the lower part of the metal frame on the lower side of the thin substrate due to the current density during swing plating. At least a dummy plate to which a thick plating layer is attached is provided, and the dummy plate is provided with a plurality of holes for reducing the resistance of the plating bath during rocking. Since the thickness of the thin substrate is set so that a thick plating layer adheres to the thin substrate, the current density is substantially constant in the thin substrate portion, and the plating thickness is substantially uniform and uniform plating can be formed. Further, even if the plating operation for the thin substrate is performed in the same line as the plating process for the thick substrate, uniform plating with little variation can be performed, so that the plating line can be rationalized. Further, as described in claim 2, the thin substrate is a printed circuit board,
Since the metal frame or dummy plate is used as a plating device for thin substrates made of chromium, nickel, or a stainless steel-based alloy material containing them as a main component, it has good corrosion resistance,
It is economical because it does not contaminate the thin substrate or the plating bath and can be used any number of times by dissolving and washing the deposited plating layer of copper or the like after swing plating. Further, as described in claim 3, since a supporting device having a detachable structure for suspending and supporting and swinging in a plating bath is provided on an upper part of a metal frame for supporting the thin substrate, Since the thin substrate can be plated efficiently, and the supporting device of the clamp mechanism, which has a simple structure and is inexpensive, is used as described in claim 4, attachment / detachment of the member to be plated is extremely easy. It can be carried out smoothly and the plating efficiency can be improved.

[0006]

Embodiments of the present invention will be described below in more detail with reference to the drawings. FIG. 1 is a perspective view showing a metal frame body for holding a thin laminated substrate provided with a dummy plate of the present invention, and FIG. 2 is a view showing a thin laminated substrate attached to the metal frame body of FIG. FIG. 3 is a perspective view showing a state, and FIG. 3 shows a clamp type supporting device for vertically suspending and supporting the thin laminated substrate mounted on the metal frame body shown in FIG. 2 in a plating bath. As shown in FIG. 1, an opening 2 is formed in a central portion of a stainless steel frame 1 in accordance with the size of a plating area of a thin laminated substrate 6 such as a printed board which is a member to be plated. Opening 2
Substrate fixing metal fittings 3 having a gap into which the thin laminated substrate 6 can be inserted are provided at both left and right ends of one surface. And
A dummy plate 4 made of stainless steel having a plurality of holes 5 of a predetermined size is attached to the lower end of the frame body 1.
The reason for providing the plurality of holes 5 in the dummy plate 4 is that the thin laminated substrate 6 which is a member to be plated is mounted on the frame body 1 and vertically immersed in a predetermined plating bath of copper or the like to form a thin laminated body. Board 6
This is for reducing the resistance of the plating bath and making it easier to swing in the plating bath when plating is performed by swinging. Next, as shown in FIG. 2, a thin laminated substrate 6 which is a member to be plated is mounted, and this is mounted on, for example, two clamping plates 7 as shown in FIG.
The thin laminated substrate 6 and the frame 1 are supported by
The clamp type supporting tool 11 having a structure of sandwiching was subjected to rocking plating by vertically immersing and supporting it in a predetermined copper plating bath. As a result, a thick plating layer was formed on the lower part of the dummy plate 4, but on the thin laminated substrate 6, a copper plating layer having a substantially uniform thickness was obtained over the entire surface. Then, when a conductor pattern is formed by etching,
It was possible to form a fine and high-density conductor pattern for passing four or more signal lines between the pins (2.54 mm) of the IC.

[0007]

As described above, according to the thin substrate plating apparatus of the present invention, a dummy plate having a plurality of holes is used to facilitate swing plating in a desired plating bath. Moreover, since the dummy plate is placed under the thin substrate with the highest current density, it is possible to form a plating layer of almost uniform thickness on the thin substrate that is the member to be plated, and to perform etching. Between IC pins (2.54mm)
It is possible to form a fine and high-density conductor pattern that allows four or more signal lines to pass therethrough.

[Brief description of drawings]

FIG. 1 is a perspective view showing a configuration of a frame body and a dummy plate of a plating apparatus for a thin substrate illustrated in an embodiment of the present invention.

FIG. 2 is a perspective view showing a state in which a thin laminated substrate is mounted on the frame of the thin substrate plating apparatus shown in FIG.

FIG. 3 is a schematic diagram showing a state in which a frame body of a plating apparatus equipped with the thin laminated substrate shown in FIG. 2 is suspended by a clamp type support.

FIG. 4 is a perspective view showing a configuration of a conventional plating jig for a thin laminated substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Frame 2 ... Opening 3 ... Board fixing metal fitting 4 ... Dummy board 5 ... Hole 6 ... Thin laminated board (printed board) 7 ... Clamping board 8 ... Leaf spring 9 ... Support point 10 ... Clamp tab 11 ... Clamp Type support

Claims (4)

[Claims] 1. A metal body having a structure in which an opening is formed in a central portion according to the size of a thin substrate which is a member to be plated, and the thin substrate can be removably mounted in the opening. A frame,
At the bottom of the metal frame, at least a dummy plate to which a thick plating layer, which is likely to be deposited, is attached to the lower side of the thin substrate due to the current density during swing plating is disposed, and the dummy plate is shaken. A plating apparatus for thin substrates, comprising a plurality of holes for reducing the resistance of a plating bath during dynamic plating. 2. The thin substrate plating apparatus according to claim 1, wherein the thin substrate is a printed circuit board, and the metal frame or the dummy plate is made of a stainless alloy material. 3. A support device having a detachable structure for suspending and swinging in a plating bath is provided on an upper portion of a metal frame, using the thin substrate plating device according to claim 1 or 2. A thin substrate plating apparatus characterized by being provided. 4. The thin substrate plating apparatus according to claim 3, wherein the detachable support device for suspending and swinging in a plating bath is a clamp type support device.