KR20070101735A - Bonding device of fpd glass substrate in which lower lift pin is improved - Google Patents

Bonding device of fpd glass substrate in which lower lift pin is improved Download PDF

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Publication number
KR20070101735A
KR20070101735A KR1020060033261A KR20060033261A KR20070101735A KR 20070101735 A KR20070101735 A KR 20070101735A KR 1020060033261 A KR1020060033261 A KR 1020060033261A KR 20060033261 A KR20060033261 A KR 20060033261A KR 20070101735 A KR20070101735 A KR 20070101735A
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South Korea
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glass substrate
plate
bonding
lift
cushion
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KR1020060033261A
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Korean (ko)
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김영길
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코닉시스템 주식회사
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Priority to KR1020060033261A priority Critical patent/KR20070101735A/en
Publication of KR20070101735A publication Critical patent/KR20070101735A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/50Protective arrangements
    • G02F2201/503Arrangements improving the resistance to shock

Abstract

A bonding device of FPD(Flat Panel Display) glass substrate in which a lower lift pin is improved is provided to provide a plurality of lower lift cushion pins and a cushion installed in an upper surface of a curve surface, thereby uniformly attaching an front surfaces of an upper glass substrate and a lower glass substrate without damaging a glass substrate. A bonding device of FPD(Flat Panel Display) glass substrate in which a lower lift pin is improved comprises the following parts: a plurality of lower lift cushion pins(27) which is installed near the border of a lower substrate for vertically moving a lower glass substrate while supporting a bottom of an outermost line of the lower glass substrate; and a cushion(25) installed on the curve surface which is made through a process that an upper end of the lower lift cushion pin is curved into an inside direction of a low substrate.

Description

하부 리프트 핀이 개선된 FPD 유리기판 합착장치{Bonding device of FPD glass substrate in which lower lift pin is improved}Bonding device of FPD glass substrate in which lower lift pin is improved
도 1은 종래의 LCD 유리기판 합착장치를 설명하기 위한 도면;1 is a view for explaining a conventional LCD glass substrate bonding device;
도 2 및 도 3은 도 1의 장치에 의할 경우 상부유리기판(14)이 휘어지는 문제점을 설명하기 위한 도면들;2 and 3 are views for explaining the problem that the upper glass substrate 14 is bent when the device of FIG.
도 4는 본 발명에 따른 LCD 유리기판 합착장치를 설명하기 위한 도면;4 is a view for explaining the LCD glass substrate bonding device according to the present invention;
도 5는 도 4의 밀폐관(29)을 설명하기 위한 도면이다. FIG. 5 is a view for explaining the hermetic pipe 29 of FIG. 4.
<도면의 주요부분에 대한 참조번호의 설명><Description of reference numbers for the main parts of the drawings>
10: 상판 12, 22: 정전척10: top plate 12, 22: electrostatic chuck
13: ITO막 14: 상부유리기판13: ITO film 14: upper glass substrate
16: 상부 리프트 핀 20: 하판16: upper lift pin 20: lower plate
24: 하부유리기판 25: 쿠션24: lower glass substrate 25: cushion
26: 하부 리프트 핀 27: 하부 리프트 쿠션 핀26: lower lift pin 27: lower lift cushion pin
27a: 절곡부 29: 밀폐관27a: bend portion 29: hermetic tube
30: 진공챔버30: vacuum chamber
본 발명은 FPD 유리기판 합착장치에 관한 것으로서, 특히 대면적 유리기판의 합착에 적합한 FPD 유리기판 합착장치에 관한 것이다. The present invention relates to a FPD glass substrate bonding apparatus, and more particularly, to a FPD glass substrate bonding apparatus suitable for bonding large area glass substrates.
LCD(Liquid Crystal Display)나 PDP(Plasma Display Panel) 등의 FPD(Flat Panel Display)는 두개의 유리기판을 합착하여 만든다. 그러나 유리기판이 대형화되면서 유리기판을 들어올릴 때 유리기판이 자체 무게에 의해 휘어져서 합착이 유리기판 전면적에 걸쳐 균일하게 이루어지지 않는 문제가 발생하고 있다. Flat Panel Display (FPD) such as LCD (Liquid Crystal Display) or Plasma Display Panel (PDP) is made by joining two glass substrates together. However, as the glass substrate is enlarged, the glass substrate is bent by its own weight when the glass substrate is lifted, and thus the bonding is not uniformly made over the entire glass substrate.
도 1은 종래의 LCD 유리기판 합착장치를 설명하기 위한 도면이다. 도 1을 참조하면, 진공챔버(30) 내에 상판(10)과 하판(20)이 설치된다. 상부유리기판(14)이 반송수단(미도시)에 의하여 상판(10)과 하판(20) 사이에 이송되어오면 상부 리프트 핀(16)이 내려와 상부유리기판(14)의 윗면을 흡착하여 올라간다. 그러면 상부유리기판(14)의 윗면이 상판(10)의 밑면에 닿게 되고 이 때 상부유리기판(14)은 상판(10)의 밑면에 설치된 정전척(12)과 진공홀(미도시)의 정전기력 및 진공흡입력에 의하여 상판(10)에 흡착된다. 1 is a view for explaining a conventional LCD glass substrate bonding device. Referring to FIG. 1, the upper plate 10 and the lower plate 20 are installed in the vacuum chamber 30. When the upper glass substrate 14 is transferred between the upper plate 10 and the lower plate 20 by a conveying means (not shown), the upper lift pin 16 descends to absorb the upper surface of the upper glass substrate 14. Then, the upper surface of the upper glass substrate 14 comes into contact with the bottom of the upper plate 10, at which time the upper glass substrate 14 is electrostatic force of the electrostatic chuck 12 and the vacuum hole (not shown) installed on the lower surface of the upper plate 10. And the upper plate 10 by the vacuum suction input.
상부유리기판(14)이 상판(10)에 흡착되었으면 동일한 반송수단 또는 다른 반송수단에 의하여 하부유리기판(24)이 상판(10)과 하판(20) 사이에 이송되어 온다. 그러면 하부 리프트 핀(26)이 상승하여 하부유리기판(24)을 넘겨받아 천천히 하강하면서 하부유리기판(24)을 하판(20)에 올려놓는다. 하판(20)에도 상판(10)과 마찬 가지로 진공홀(미도시)과 정전척(22)이 설치되어 있다.When the upper glass substrate 14 is adsorbed on the upper plate 10, the lower glass substrate 24 is transferred between the upper plate 10 and the lower plate 20 by the same conveying means or other conveying means. Then, the lower lift pin 26 is raised to take over the lower glass substrate 24 and lower the lower glass substrate 24 to the lower plate 20. Like the upper plate 10, the lower plate 20 is provided with a vacuum hole (not shown) and an electrostatic chuck 22.
도 2 및 도 3은 도 1의 장치에 의할 경우 상부유리기판(14)이 휘어지는 문제점을 설명하기 위한 도면들이다. 도 2를 참조하면, 유리기판(14, 24)이 대형화 되면서 상부유리기판(14)이 상판(10)에 완전히 밀착되지 못하고 자체 무게에 의하여 가장자리 부분이 밑으로 쳐지게 된다. 그러면 도 3에서와 같이 상부유리기판(14)이 하부유리기판(24)에 평평한 상태로 합착되는 것이 아니라 참조부호 A로 표시한 바와 같이 밑으로 쳐진 가장자리 부분이 먼저 하부유리기판(24)에 닿게 되어 균일한 합착이 이루어지지 않게 된다. 2 and 3 are diagrams for explaining the problem that the upper glass substrate 14 is bent in the case of the device of FIG. Referring to FIG. 2, as the glass substrates 14 and 24 are enlarged, the upper glass substrate 14 is not completely adhered to the upper plate 10, and the edge portion is struck down by its own weight. Then, as shown in FIG. 3, the upper glass substrate 14 is not bonded to the lower glass substrate 24 in a flat state, but the lower edge portion of the lower glass substrate 24 first touches the lower glass substrate 24 as indicated by reference A. FIG. As a result, no uniform bonding is achieved.
따라서 본 발명이 이루고자 하는 기술적 과제는, 상부유리기판과 하부유리기판이 균일하게 합착되도록 하는 FPD 유리기판 합착장치를 제공하는 데 있다. Therefore, the technical problem to be achieved by the present invention is to provide an FPD glass substrate bonding apparatus for uniformly bonding the upper glass substrate and the lower glass substrate.
상기 기술적 과제를 달성하기 위한 본 발명에 따른 FPD 유리기판 합착장치는, 상판에 상부유리기판의 윗면을 흡착시키고, 하판에 하부유리기판의 밑면을 흡착시켜, 상기 상부유리기판의 아랫면과 상기 하부유리기판의 윗면을 합착시키는 FPD 유리기판 합착장치로서,  FPD glass substrate bonding apparatus according to the present invention for achieving the above technical problem, the upper surface of the upper glass substrate to the upper plate, the lower surface of the lower glass substrate by adsorbing the lower plate, the lower surface and the lower glass of the upper glass substrate FPD glass substrate bonding apparatus for bonding the upper surface of the substrate,
상기 하부유리기판의 최외곽을 밑에서 지지하면서 상기 하부유리기판을 승하강 시키도록 상기 하판의 테두리 근방 복수군데에 하부 리프트 쿠션 핀이 설치되 며, 상기 하부 리프트 쿠션 핀의 위 끝단은 상기 하판의 안쪽으로 절곡되며 상기 절곡면 상에는 쿠션이 설치되는 것을 특징으로 한다. Lower lift cushion pins are installed at a plurality of locations near the edge of the lower plate while supporting the outermost portion of the lower glass substrate from below, and the upper end of the lower lift cushion pin is inside the lower plate. It is bent and characterized in that the cushion is installed on the bent surface.
상기 상판과 하판은 진공챔버 내에 설치되는 것이 바람직하며, 이 때 상기 하부 리프트 핀은 상기 진공챔버의 저면을 관통하여 상하운동 가능하도록 설치된다. Preferably, the upper plate and the lower plate are installed in the vacuum chamber, and the lower lift pin is installed to be able to move up and down through the bottom surface of the vacuum chamber.
상기 진공챔버의 저면에는 관통홀이 형성되고, 상기 관통홀에는 밀폐관이 삽입되며, 상기 하부 리프트 핀은 상기 밀폐관에 삽입되는 것이 바람직하다. Preferably, a through hole is formed in a bottom surface of the vacuum chamber, a closed tube is inserted into the through hole, and the lower lift pin is inserted into the closed tube.
이하에서, 본 발명의 바람직한 실시예를 첨부한 도면들을 참조하여 상세히 설명한다. 아래의 실시예는 본 발명의 내용을 이해하기 위해 제시된 것일 뿐이며 당 분야에서 통상의 지식을 가진 자라면 본 발명의 기술적 사상 내에서 많은 변형이 가능할 것이다. 따라서, 본 발명의 권리범위가 이러한 실시예에 한정되는 것으로 해석돼서는 안 된다. Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in detail. The following examples are only presented to understand the content of the present invention, and those skilled in the art will be capable of many modifications within the technical spirit of the present invention. Therefore, the scope of the present invention should not be construed as being limited to these examples.
도 4 및 도 5는 본 발명에 따른 LCD 유리기판 합착장치를 설명하기 위한 도면이다. 여기서, 종래기술과 동일한 참조번호는 동일기능을 수행하는 구성요소를 나타낸다. 도 4를 참조하면, 본 발명은 도 1에서와 달리 하부 리프트 쿠션 핀(27)이 더 설치되는 것을 특징으로 한다. 하부 리프트 쿠션 핀(27)은 하판(20)의 테두리 근방에 복수군데 설치되어 하부유리기판(24)의 최외각을 밑에서 지지한다. 하판(20)의 가운데 부분에는 도 1에서와 같은 하부 리프트 핀(26)이 설치되어 있지만 도시를 생략하였다. 4 and 5 are views for explaining the LCD glass substrate bonding apparatus according to the present invention. Here, the same reference numerals as in the prior art denote components that perform the same function. 4, the present invention is characterized in that the lower lift cushion pin 27 is further installed, unlike in FIG. The lower lift cushion pins 27 are installed in plural places near the edge of the lower plate 20 to support the outermost angle of the lower glass substrate 24 from below. In the center portion of the lower plate 20 is provided with a lower lift pin 26 as shown in FIG.
하부 리프트 쿠션 핀(27)이 단순한 핀 형태로 되어 있으면 하부유리기판(24)의 최외각을 면접촉하여 지지하기 어렵기 때문에 위 끝단은 하판(20)의 안쪽으로 절곡되는 절곡부(27a)를 이루도록 하고, 절곡부(27a)의 상면에는 쿠션(25)을 설치한다. If the lower lift cushion pin 27 is in the form of a simple pin, it is difficult to support the outermost surface of the lower glass substrate 24 by surface contact, so that the upper end of the lower lift cushion pin 27 is bent inward of the lower plate 20. A cushion 25 is provided on the upper surface of the bent portion 27a.
쿠션(25)이 없다면 하부유리기판(24)은 하부 리프트 쿠션 핀(27)의 위로 미는 힘에 비례하여 힘을 받게 된다. 따라서 도 3과 같은 상태에서 하부유리기판(24)을 밀어올려 상부유리기판(14)과 하부유리기판(24)의 전면이 골고루 닿도록 하면 먼저 닿는 하부유리기판(24)의 가장자리 부분에 궁극적으로 과도하게 미는 힘이 작용하게 된다. 그러면 상부유리기판(14)의 밑면에 형성되어 있는 ITO막(13) 등이 손상되기 쉽다. 따라서 이를 방지하기 위하여 절곡부(27a)의 상면에 쿠션을 설치하여 하부유리기판(24)을 밀어올리는 힘에 완충성을 부여하는 것이다. If the cushion 25 is not present, the lower glass substrate 24 is forced in proportion to the pushing force of the lower lift cushion pin 27. Accordingly, when the lower glass substrate 24 is pushed up so that the front surfaces of the upper glass substrate 14 and the lower glass substrate 24 are evenly contacted, the edge portion of the lower glass substrate 24 that reaches first is ultimately touched. Excessive pushing force is at work. Then, the ITO film 13 or the like formed on the bottom surface of the upper glass substrate 14 is likely to be damaged. Therefore, in order to prevent this, by installing a cushion on the upper surface of the bent portion (27a) is to give a cushioning force to the force pushing up the lower glass substrate (24).
하부 리프트 쿠션 핀(27)은 진공챔버(30)의 저면을 관통하여 상하운동 가능하도록 서보모터(28)에 연결되어 설치된다. 진공챔버(30)에 하부 리프트 쿠션 핀(27)이 바로 관통하도록 설치되면 진공챔버(30)의 실링이 제대로 이루어지지 않으므로, 도 5와 같이 진공홀(30)의 관통홀에 먼저 밀폐관(29)을 삽입하고, 하부 리프트 쿠션 핀(27)을 밀폐관(29)에 삽입 설치하는 것이 바람직하다. The lower lift cushion pin 27 is connected to the servo motor 28 so as to vertically move through the bottom of the vacuum chamber 30. If the lower lift cushion pin 27 is installed to penetrate the vacuum chamber 30 directly, the sealing of the vacuum chamber 30 is not properly performed. As shown in FIG. 5, the sealing tube 29 is first formed in the through hole of the vacuum hole 30. ) Is inserted, and the lower lift cushion pin 27 is preferably inserted into the sealed tube 29.
상술한 바와 같이 본 발명에 의하면, 유리기판에 손상을 주지 않으면서 상부유리기판과 하부유리기판의 전면을 균일하게 합착시킬 수 있게 된다. As described above, according to the present invention, the front surface of the upper glass substrate and the lower glass substrate can be uniformly bonded without damaging the glass substrate.

Claims (3)

  1. 상판에 상부유리기판의 윗면을 흡착시키고, 하판에 하부유리기판의 밑면을 흡착시켜, 상기 상부유리기판의 아랫면과 상기 하부유리기판의 윗면을 합착시키는 FPD 유리기판 합착장치에 있어서,In the FPD glass substrate bonding apparatus for adsorbing the upper surface of the upper glass substrate to the upper plate, and adsorbing the lower surface of the lower glass substrate to the lower plate, and joining the lower surface of the upper glass substrate and the upper surface of the lower glass substrate,
    상기 하부유리기판의 최외곽을 밑에서 지지하면서 상기 하부유리기판을 승하강 시키도록 상기 하판의 테두리 근방 복수군데에 하부 리프트 쿠션 핀이 설치되며, 상기 하부 리프트 쿠션 핀의 위 끝단은 상기 하판의 안쪽으로 절곡되며 상기 절곡면 상에는 쿠션이 설치되는 것을 특징으로 하는 FPD 유리기판 합착장치. Lower lift cushion pins are installed in a plurality of places near the edge of the lower plate while supporting the outermost portion of the lower glass substrate from below, and the upper end of the lower lift cushion pin is inward of the lower plate. FPD glass substrate bonding apparatus is bent and the cushion is installed on the bent surface.
  2. 제1항에 있어서, 상기 상판과 하판은 진공챔버 내에 설치되고 상기 하부 리프트 핀은 상기 진공챔버의 저면을 관통하여 상하운동 가능하도록 설치되는 것을 특징으로 하는 FPD 유리기판 합착장치. The FPD glass substrate bonding apparatus of claim 1, wherein the upper plate and the lower plate are installed in the vacuum chamber, and the lower lift pin is installed to be able to move up and down through the bottom surface of the vacuum chamber.
  3. 제2항에 있어서, 상기 진공챔버의 저면에는 관통홀이 형성되고, 상기 관통홀에는 밀폐관이 삽입되며, 상기 하부 리프트 핀은 상기 밀폐관에 삽입되는 것을 특징으로 하는 FPD 유리기판 합착장치. The FPD glass substrate bonding apparatus of claim 2, wherein a through hole is formed in a bottom surface of the vacuum chamber, a sealed tube is inserted into the through hole, and the lower lift pin is inserted into the sealed tube.
KR1020060033261A 2006-04-12 2006-04-12 Bonding device of fpd glass substrate in which lower lift pin is improved KR20070101735A (en)

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