KR20070100245A - 단일-기판 처리 동안에 기판으로부터 미소량의 액체를제거하는 장치 및 방법 - Google Patents

단일-기판 처리 동안에 기판으로부터 미소량의 액체를제거하는 장치 및 방법 Download PDF

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Publication number
KR20070100245A
KR20070100245A KR1020077012549A KR20077012549A KR20070100245A KR 20070100245 A KR20070100245 A KR 20070100245A KR 1020077012549 A KR1020077012549 A KR 1020077012549A KR 20077012549 A KR20077012549 A KR 20077012549A KR 20070100245 A KR20070100245 A KR 20070100245A
Authority
KR
South Korea
Prior art keywords
substrate
jig
capillary material
contact
floor
Prior art date
Application number
KR1020077012549A
Other languages
English (en)
Korean (ko)
Inventor
앨런 월터
Original Assignee
아크리온 테크놀로지즈 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아크리온 테크놀로지즈 인코포레이티드 filed Critical 아크리온 테크놀로지즈 인코포레이티드
Publication of KR20070100245A publication Critical patent/KR20070100245A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/08—Drying solid materials or objects by processes not involving the application of heat by centrifugal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molecular Biology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
KR1020077012549A 2004-11-03 2005-11-03 단일-기판 처리 동안에 기판으로부터 미소량의 액체를제거하는 장치 및 방법 KR20070100245A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US62472704P 2004-11-03 2004-11-03
US60/624,727 2004-11-03

Publications (1)

Publication Number Publication Date
KR20070100245A true KR20070100245A (ko) 2007-10-10

Family

ID=36407465

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077012549A KR20070100245A (ko) 2004-11-03 2005-11-03 단일-기판 처리 동안에 기판으로부터 미소량의 액체를제거하는 장치 및 방법

Country Status (5)

Country Link
EP (1) EP1812763A1 (ja)
JP (1) JP2008519443A (ja)
KR (1) KR20070100245A (ja)
CN (1) CN101107490A (ja)
WO (1) WO2006055308A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5581923B2 (ja) * 2010-09-10 2014-09-03 トヨタ自動車株式会社 半導体ウエハを支持する支持具及び支持具を用いて半導体ウエハを支持する方法
KR102255195B1 (ko) * 2013-04-16 2021-05-25 삼성디스플레이 주식회사 필름 건조 장치 및 필름 건조 방법
JP6376778B2 (ja) * 2014-03-04 2018-08-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7030039B2 (en) * 1994-10-27 2006-04-18 Asml Holding N.V. Method of uniformly coating a substrate
US6823880B2 (en) * 2001-04-25 2004-11-30 Kabushiki Kaisha Kobe Seiko Sho High pressure processing apparatus and high pressure processing method
US6742279B2 (en) * 2002-01-16 2004-06-01 Applied Materials Inc. Apparatus and method for rinsing substrates

Also Published As

Publication number Publication date
JP2008519443A (ja) 2008-06-05
WO2006055308A1 (en) 2006-05-26
CN101107490A (zh) 2008-01-16
EP1812763A1 (en) 2007-08-01

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