KR20070098120A - Apparatus for loading wafer and spinner used the same - Google Patents

Abstract

A wafer loading apparatus and a spinner including the same are provided to increase productivity and yield by suppressing a breakdown of a wafer due to ejection of the wafer. A rotatory power unit(251) generates rotatory power by using a supply voltage applied from the outside. A first pulley(252) is formed to be rotated at an end of the rotatory power unit. A second pulley(253) is formed at a constant distance from the first pulley in order to be connected to the first pulley. A belt is formed to transmit the rotatory power of the first pulley to the second pulley. An arm body is fixed to a part of the belt in order to support the wafer and to move the wafer in one direction. A belt tension sensor(256) is formed to sense tension of the belt at a lateral surface of the belt. A control unit determines a degree of tension of the belt by using a sensing signal of the belt tension sensor in order to output an interlock control signal to the rotatory power unit.

Description

Apparatus for loading wafer and spinner used the same}

1 is a perspective view showing a spinner installation according to the prior art.

2 is a perspective view showing the wafer loading apparatus of FIG.

Figure 3 is a perspective view schematically showing a spinner installation according to the present invention.

4 is a perspective view showing in detail the wafer loading apparatus of FIG.

5 is a perspective view of the belt and the belt tension detection sensor of FIG.

Explanation of symbols on the main parts of the drawings

200: spinner installation 210: spin coater

220: side rinse unit 230: wafer cassette loader

240: indexer arm 250: wafer loading device

260: baking device

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to semiconductor fabrication equipment, and more particularly, to a wafer loading apparatus for transferring the wafer for applying and coating photoresist on a wafer, and a spinner apparatus having the same.

In general, in order to manufacture a semiconductor device, the steps of forming a semiconductor circuit on a wafer are repeated several times, each step is a growth and deposition process of a predetermined thin film, a photo indexing the semiconductor circuit using a photo-resist (photo-resist) Photolithography process, an etching process of removing portions not applicable to the semiconductor circuit using the photoresist as a mask film, and an ion implantation process of implanting desired impurities in each step .

Here, the photolithography process is a core technology of the semiconductor manufacturing process and determines the size of the fine pattern of the semiconductor circuit, and the number of times of performing the photolithography process almost determines the production cost in the entire semiconductor manufacturing process.

In addition, the photolithography process is a step of coating and baking a photoresist on a wafer using a photo spinner equipment, a step of selectively exposing the photoresist to a light source such as ultraviolet light using an exposure equipment, and the light source And developing the photoresist of the portion exposed by the step.

In this case, the photoresist coating, baking and developing processes are mainly performed in the photo spinner installation.

Hereinafter, a photo spinner according to the related art will be described with reference to the accompanying drawings.

1 is a perspective view showing a photo spinner installation according to the prior art.

As shown in FIG. 1, the photo spinner device according to the related art has a wafer cassette loader 130 and a wafer cassette loader (130) for loading a wafer cassette on which a plurality of wafers are mounted, although the specific shape thereof is different for each manufacturer. An index arm 140 for taking out the wafer from the wafer cassette loaded in 130, a spin coater 110 for applying the photoresist, and an edge of the wafer after application of the photoresist. A side rinse device 120 for performing a cleaning process for the vicinity, a bake device 160 for curing the photoresist after the side rinse, and transferring the wafer between each device. It comprises a wafer loading device 150.

Here, since the spin coater 110 of the photoresist coating process and the side rinse apparatus 120 of the side rinse process are basically the same structure, the photoresist is coated on the same spin coater 110 and the side rinse process is performed. It can also be done.

In addition, the wafer loading apparatus 150 is a wafer transfer for transferring the wafer, and the apparatus for transferring the wafer between the spin coater 110, the side rinse apparatus 120, or the baking apparatus 160 by supporting the wafer. to be. For example, when the wafer loading apparatus 150 transfers the wafer to the spin coater 110, after the photoresist coating process is taken out of the spin coater 110, the wafer may be transferred to the spin coater. It may be configured to have a plurality of arm body (155 of FIG. 2) to support a plurality of wafers for delivery to 110. In this case, as the number of the arm bodies 155 increases in the wafer loading apparatus 150, transfer efficiency of the wafer may be improved.

2 is a perspective view illustrating the wafer loading apparatus 150 of FIG. 1, wherein the wafer loading apparatus 150 includes a rotational power unit 151 for generating rotational power using a power supply voltage applied from the outside and the rotational power. The first pulley 152 is formed to rotate at the end of the portion 151, and the second pulley 153 is formed at a predetermined distance from the first pulley 152 to rotate in conjunction with the first pulley 152 And a belt formed along the outer circumferential surfaces of the first pulley 152 and the second pulley 153 and transmitting the rotational power of the first pulley 152 to the second pulley 153. 154 and an arm body 155 fixed to a portion of the belt 154 to support the wafer and to move back and forth in the rotational direction of the belt 154.

In addition, the power supply voltage applied to the rotational power unit 151 is applied to the arm body 155 to move forward to the lower portion of the wafer to support the wafer and to support the wafer. It further comprises a control unit for outputting a control signal to control.

Here, the rotary power unit 151 may use a rotational power corresponding to a predetermined rotational speed so that the arm body 155 moves forward and backward a predetermined distance by using the voltage voltage controlled by the control signal output from the control unit. Create For example, the rotary power unit 151 includes a stepping motor driven by the power supply voltage.

The first pulley 152 allows the belt 154 to linearly move using the rotational power generated by the rotational power unit 151. At this time, the circumference and rotational speed of the first pulley 152 in contact with the belt 154 is an important factor for determining the linear movement distance of the belt 154.

The second pulley 153 designates a movement distance of the belt 154 at a predetermined distance corresponding to the first pulley 152. At this time, the distance between the first pulley 152 and the second pulley 153 defines the distance that the arm body 155 is moved forward and backward.

The belt 154 is bound by the first pulley 152 and the second pulley 153 and rotated with an endless track while the arm body 155 by the rotational power transmitted from the first pulley 152. ) Is formed to have a predetermined tension to move forward and backward.

For example, the belt 154 is made of a rubber material having excellent flexibility to minimize rotational loss by the first pulley 152 and the second pulley 153, the rotational power generated by the stepping motor It includes a timing belt formed to be accurately controlled.

However, the wafer loading apparatus 150 according to the related art has the following problems.

In the conventional wafer loading apparatus 150, when the tension of the belt 154 that advances and retracts the arm body 155 increases, the forward and backward movement of the arm body 155 may not be able to teach the wafer at the correct position. Rather, since the wafer is separated from the arm body 155 and may be broken, there is a disadvantage in that the production yield falls.

An object of the present invention for solving the above problems, even if the tension of the belt 154 for advancing the arm body 155 is increased to prevent teaching defects caused by poor forward and backward of the arm body 155 and The present invention provides a wafer loading apparatus capable of increasing or maximizing production yield by preventing the wafer from being broken due to the wafer being separated from the arm body 155.

Wafer loading device according to an aspect of the present invention for achieving the above object, the rotary power unit for generating a rotational power using a power supply voltage applied from the outside; A first pulley configured to rotate at an end of the rotary power unit; A second pulley formed at a predetermined distance from the first pulley and formed to rotate in conjunction with the first pulley; A belt formed along the outer circumferential surfaces of the first pulley and the second pulley and configured to transmit the rotational power of the first pulley to the second pulley; An arm body fixed to a part of the belt to support the wafer and move forward and backward in one direction; A belt tension sensor configured to sense tension of the belt at a side of the belt connected between the first pulley and the second pulley; And determining the tension degree of the belt by using a detection signal output from the belt tension detection sensor, and when the tension degree of the belt is out of a set range, the rotational power so that the wafer is no longer transferred by the arm body. And a control unit for outputting an interlock control signal to the unit.

Another aspect of the present invention is a wafer cassette loader for loading a wafer cassette on which a plurality of wafers are mounted; An index arm for taking out a plurality of the wafers mounted on the wafer cassette loaded on the wafer cassette loader; A spin coater for applying a photoresist on the wafer taken out from the index arm; A baking device for baking the photoresist applied from the spin coater; A rotational power unit configured to transmit the wafer between the bake, the spin coater, and the index arm, and to generate rotational power using a power voltage applied from the outside; a first pulley configured to rotate at an end of the rotational power unit; A second pulley formed at a predetermined distance from the first pulley and formed to rotate in conjunction with the first pulley, and having an endless track along an outer circumferential surface of the first pulley and the second pulley and the second pulley; A belt formed to transmit the rotational power of the first pulley, an arm body fixed to a portion of the belt to support the wafer and moving forward and backward in one direction, and the belt connected between the first pulley and the second pulley. Belt tension detection sensor formed to detect the tension of the belt from the side, and the detection signal output from the belt tension detection sensor And a control unit for determining the degree of tension of the belt, and outputting an interlock control signal to the rotating power unit so that the wafer is no longer transferred by the arm body when the tension degree of the belt is out of a set range. Spinner equipment including a wafer loading device.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, embodiments of the present invention may be modified in many different forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. Embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Accordingly, the shape and the like of the elements in the drawings are exaggerated to emphasize a more clear description, and the elements denoted by the same reference numerals in the drawings means the same elements. In the following description of the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

3 is a perspective view schematically showing a spinner installation according to the present invention, FIG. 4 is a detailed perspective view showing the wafer loading apparatus 250 of FIG. 3, and FIG. 5 is a belt tension detection sensor 256 and a belt tension of FIG. 4. Detection sensor 256 is a perspective view showing a tension detection sensor.

3 to 5, the spinner facility 200 according to the present invention includes a wafer cassette loader 230 for loading a wafer cassette on which a plurality of wafers 270 are mounted, and the wafer cassette loader 230. An index arm 240 for taking out the plurality of wafers 270 from the wafer cassette loaded on the wafer), a spin coater 210 for applying or coating photoresist on the wafer 270, and applying the photoresist. A side rinse apparatus 220 for removing photoresist at the edge of the wafer 270 with respect to one wafer 270, a baking apparatus 260 for performing a baking process on the wafer 270, and the wafer alignment In the stage 240, the spin coater 210, the side rinse apparatus 220, or the baking apparatus 260, the wafer 270 is transferred to each other, and the arm body 255 supporting the wafer is moved forward and backward. Shaping It is configured to include a wafer loading device 250 having a belt tension detection sensor 256 tension detection sensor formed to detect the tension of the belt tension detection sensor 256 at the side of the belt tension detection sensor 256.

Although not shown, when the wafer is to be transferred to each of the constituent elements, a control signal is output so that the belt tension sensor 256 rotates forward and backward the arm body 255 supporting the wafer, Belt tension sensor 256 Determines the degree of tension of the belt tension sensor 256 using the detection signal output from the tension sensor, and if the tension degree of the belt tension sensor 256 is out of the set range. And a control unit for outputting an interlock control signal to the rotary power unit 251 so that the wafer can no longer be transferred by the arm body 255.

The spin coater 210, the side rinse apparatus 220, and the baking apparatus 260 are referred to as spinner units, and each photoresist coating and baking process of the wafer 270 loaded by the wafer transfer 250 is performed. This is going on. For example, the spin coater 210 may rotate the wafer at a high speed of about 2000 rpm to coat the photoresist applied on the wafer to have a uniform thickness on the entire upper surface of the wafer. In addition, the side rinse apparatus 220 is basically formed to have a shape similar to that of the spin coater 210, and is formed to remove the photoresist coated on the outer circumferential surface of the wafer.

The baking device 260 is a device for fixing the photoresist to the wafer 270 by evaporating solvent or moisture contained in the photoresist applied by the spin coater 210, The wafer 270 loaded or unloaded by the arm body 255 may flow in and out. Of course, the baking device 260 is designed to have an externally sealed structure to prevent the photoresist from reacting with external light (for example, ultraviolet light). Although not shown, the baking device 260 is formed with at least three support pins to horizontally position the wafer 270 loaded by the main arm 253, and is lowered by the support pins. A baking plate is formed to heat or bake the wafer 270 to a predetermined temperature. In this case, the wafer 270 supported by the support pin should be horizontally positioned, and thus the photoresist applied on the wafer 270 may be fixed on the wafer 270 with a uniform thickness without being oriented to one side. have.

The wafer loading apparatus 250 is called a wafer transfer, and transfers the wafer taken out from the index arm 240 to the spin coater 210, the side rinse apparatus 220, or the baking apparatus 260. . In this case, the wafer loading apparatus 250 may include an arm body 255 that is moved back and forth to load the wafer into the spin coater 210, the side rinse apparatus 220, or the baking apparatus 260. At least one belt tension sensor 256 is driven to advance the arm body 255 forward and backward. The belt tension detection sensor 256 may increase or shorten its life according to the surrounding environment and the loading operation. In particular, the tension of the belt tension sensor 256 is an important factor that greatly affects the forward and backward distance of the wafer supported and transported by the arm body 255. When the tension of the belt tension detection sensor 256 is increased, the teaching failure of the wafer and breakage of the wafer due to the wafer detachment from the arm body 255 may be caused.

Accordingly, the spinner device according to the present invention includes a wafer loading device 250 having a belt tension detection sensor 256 tension detection sensor for detecting a tension of the belt tension detection sensor 256. It is possible to prevent the teaching failure of the wafer transferred from the wafer and the breakage of the wafer, thereby improving the production yield.

As shown in FIGS. 3 to 4, the wafer loading apparatus 250 may include a rotary power unit 251 that generates rotational power using a power voltage applied from the outside, and a rotation power unit 251 of the rotary power unit 251. A first pulley 252 formed to rotate at an end, a second pulley 253 formed at a predetermined distance from the first pulley 252 and formed to rotate in conjunction with the first pulley 252, and the first A belt tension sensor 256 having an endless track along the outer circumferential surfaces of the pulley 252 and the second pulley 253 and configured to transfer the rotational power of the first pulley 252 to the second pulley 253. And an arm body 255 fixed to a part of the belt tension sensor 256 to support the wafer and moving forward and backward in one direction, and connected between the first pulley 252 and the second pulley 253. The belt tension sensor at the side of the belt tension sensor 256 The belt tension sensor 256 of the belt tension sensor 256 is formed by using a tension sensor and a tension signal of the belt tension sensor 256. When the tension degree of the belt tension detection sensor 256 is out of a set range, the interlock control is performed on the rotational power unit 251 so that the wafer is no longer transferred by the arm body 255. It includes a control unit for outputting a signal.

Here, the rotation power unit 251 may generate a rotational power having a precise rotation speed by using the power supply voltage that is controlled and applied by the control signal output from the control unit. For example, the rotary power unit 251 includes a stepping motor. The stepping motor may be referred to as a digital actuator that rotates or moves linearly at a predetermined angle. In general, when the rotary motion is called a stepping motor, when the linear motion is called a linear stepping motor. The step motor is mainly adopted in the same part as the joint mechanism of the industrial robot, because the rotor rotates by an angle per one input pulse given from the outside, which is suitable for automatic control. In addition, since the output shaft rotates only in proportion to the number of pulse signals, unlike the DC motor, the feedback of the position is unnecessary, and since the self supporting torque is formed, it has its own positioning capability even without a brake mechanism. For example, a step motor that rotates once per 200 pulses basically rotates the motor shaft by 1.8 degrees (360 degrees / 200 pulses) per step. Therefore, the rotation angle of the motor is controlled according to the number of pulses given to the motor. In other words, positioning control of an open loop can be performed. In addition, since the rotational speed is controlled by the pulse frequency (digital signal) and the driving circuit is also digitally operated, it is a motor that can be easily combined with a microprocessor. Actuators that can be categorized as stepping motors have been in use for more than 60 years, but only after being combined with logic devices in drive systems have emerged as an effective and economical alternative to DC servomotors used for high speed motion control. The following summarizes the characteristics of the stepping motor. 1) The rotation angle is determined in proportion to the number of input pulse signals. 2) The rotation speed is proportional to the input pulse rate (pulse frequency). 3) If a permanent magnet is used in the rotor, self-holding torque (detent torque) occurs even in the non-magnetic state. 4) High torque, high speed response, small size and light weight. 5) Small angle, high accuracy, low price. 6) Since there is no damage caused by mechanical friction by brush of DC motor, no repair is required. Such a stepping motor generally has a 5-phase stator, which is commonly used for precision equipment. When comparing the step angles of 4-phase and 5-phase motors, the 4-phase is 1.8 degrees when the number of rotors is 50, and the 5-phase is 0.72. It is also. The stepping motor is also referred to as a step motor, a pulse motor, a stepper motor, and the like, which may be regarded as a complementary motor or a stepping motor. In this case, Bojin represents the motion image of the motor, moving step by step. There are many characteristics of the stepping motor, but its maximum characteristic is the rotational characteristic by pulse power. In particular, the rotation angle proportional to the input pulse and the rotation speed proportional to the input frequency can be configured as an open loop control system. Therefore, using these properties, it is possible to construct a positioning device without a feedback system using digital signals. The features of stepping motors are further enumerated: hepatic ultrafast driving, continuous rotation, forward, reverse, shift, micro step driving, and the like. Among these, intermittent drive is the most proud feature of the stepping motor. By using this property, one step drive per day can be easily realized. In addition, to realize this with another motor, a temporary reduction mechanism must be additionally installed. In addition, micro step driving is a unique technology of stepping motors, and when used together, ultra fine step angle rotation can be realized (0.0072 degrees). In the case of continuous rotation driving, the optimum rotation angle can be precisely regulated according to the total number of input pulses. Can be. Accordingly, the rotation power unit 251 may generate a rotational power having a precise rotation speed by using the power supply voltage controlled and applied by the control signal output from the control unit.

The first pulley 252 is formed to extend from the central axis of rotation of the rotary power unit 251 to protrude toward one side of the rotary power unit 251. The first pulley 252 is formed such that a guide in which the belt tension detection sensor 256 is guided surrounds the belt tension detection sensor 256. In addition, the outer circumferential surface of the first pulley 252 is a surface in which the inner circumferential surface of the belt tension detection sensor 256 is in contact, and according to the shape of the inner circumferential surface of the belt tension detection sensor 256 of the belt tension detection sensor 256. When the inner circumferential surface is flat, it is formed to have a round circle, and the inner circumferential surface of the belt tension sensor 256 may be formed to have a gear shape when a plurality of grooves are formed at regular intervals. At this time, the product of the circumference and the rotational speed of the first pulley 252 defines the linear movement distance of the belt tension sensor 256. For example, the first pulley 252 generally has an outer diameter larger than the outer diameter of the central axis of rotation of the stepping motor.

The second pulley 253 is formed to have a predetermined distance to face the first pulley 252. In this case, the distance between the second pulley 253 and the first pulley 252 defines the distance that the arm body 255 is moved forward and backward as a linear movement distance of the belt tension sensor (256). In addition, the second pulley 253 may be formed to have a different size and radius than the first pulley 252, the arm body 255 is connected to the belt tension sensor 256 is advanced In order to maintain horizontality, the second pulley 253 and the first pulley 252 should be formed to have a radius of the same or similar size. Of course, it is obvious that the outer circumferential surface of the second pulley 253 should be formed to have the same or similar shape as the outer circumferential surface of the first pulley 252.

The belt tension sensor 256 has a predetermined tension and connects the first pulley 252 and the second pulley 253, along the first pulley 252 and the second pulley 253. It is rotated to have an endless track. In this case, the center of the first pulley 252 and the center of the second pulley 253 is the belt tension detection sensor 256 rotated by the first pulley 252 and the second pulley 253. Defines the center of the ellipse represented by. For example, the belt tension sensor 256 is moved in a linear direction between the first pulley 252 and the second pulley 253, and the first pulley 252 and the second pulley 253 It is formed of a rubber material having excellent elasticity so that the direction of movement in a circular direction along the outer circumferential surface can be easily changed. The rubber material is generally easy to be used as the material of the belt tension sensor 256 because the coefficient of friction between the outer surface of the first pulley 252 and the second pulley 253 of the metal or plastic material is large on a flat surface. Can be used. In addition, the belt tension sensor 256 includes a timing belt formed to have a groove or irregularities protruding or recessed at regular intervals on the inner circumferential surface of the belt tension sensor 256 in order to accurately control the movement distance.

However, the belt tension detection sensor 256 formed of the rubber material may shorten the life according to the surrounding environment and excessive loading, and the elasticity is changed to increase the tension of the belt tension detection sensor 256. Can be. In this case, since the arm body 255 connected to the belt tension sensor 256 cannot be moved to the correct position, a teaching failure of the wafer supported and transported to the arm body 255 may be caused. have.

Accordingly, the wafer teaching failure is previously detected by using the belt tension sensor 256 tension sensor configured to detect the tension of the belt tension sensor 256 at the lower end of the belt tension sensor 256. It can be prevented.

In this case, the belt tension sensor 256 tension sensor is in the middle between the first pulley 252 and the second pulley 253 to easily detect the tension stretch of the belt tension sensor 256. Formed. In addition, the belt tension sensor 256, the tension sensor is a contact sensor for detecting the tension stretch of the belt tension sensor 256, or the belt tension sensor through the contact with the belt tension sensor 256 It comprises a non-contact sensor for detecting the tension stretch of the belt tension sensor 256 without contact with (256). First, the contact sensor includes a touch sensor that senses that the belt tension detection sensor 256 is touched by stretching the tension of the belt tension detection sensor 256 below the belt tension detection sensor 256. . In addition, the non-contact sensor is composed of a photo sensor, the photo sensor is a light source for generating a predetermined incident light by using a power source voltage applied from the outside, and the belt tension sensor 256 to the incident light generated by the light source Or an incident part incident to the lower predetermined position of the belt tension sensor 256, a light receiving part receiving the incident light incident from the incident part or the reflected light reflected by the belt tension sensor 256; It includes a switching unit for converting the incident light or the reflected light received by the light receiving unit into a predetermined electrical detection signal.

Accordingly, the wafer transfer device according to the present invention includes a belt tension sensor 256 tension sensor for detecting the tension of the belt tension sensor 256 for advancing and moving the arm body 255 for supporting and moving the wafer; Belt tension detection sensor 256 Using the detection signal output from the tension detection sensor to determine the degree of tension of the belt tension detection sensor 256 is increased, the tension of the belt tension detection sensor 256 is above the set range If it is determined to increase, the control unit outputs an interlock control signal to prevent the wafer from being transferred anymore, even though the tension of the belt tension detection sensor 256 is increased, causing forward and backward movement of the arm body 255 to be caused. Since it is possible to prevent the teaching failure and to prevent the wafer breakage caused by the wafer detached from the arm body 255 It is possible to increase or maximize the yield of acid.

In addition, the description of the above embodiment is merely given by way of example with reference to the drawings in order to provide a more thorough understanding of the present invention, it should not be construed as limiting the present invention. In addition, for those skilled in the art, various changes and modifications may be made without departing from the basic principles of the present invention.

As described above, according to the present invention, the belt tension sensor detects the tension of the belt for advancing and moving the arm body supporting and moving the wafer, and the tension of the belt using the detection signal output from the belt tension sensor. If the tension is determined and the tension of the belt is determined to increase beyond the set range, the arm is provided with a control unit for outputting an interlock control signal so that the wafer can no longer be transferred, even if the tension of the belt is increased. It is possible to prevent the teaching failure caused by poor forward and backward movement of the body, and to prevent the breakage of the wafer caused by detachment of the wafer from the arm body, thereby increasing or maximizing production yield.

Claims (4)

A rotating power unit generating a rotating power by using a power voltage applied from the outside; A first pulley configured to rotate at an end of the rotary power unit; A second pulley formed at a predetermined distance from the first pulley and formed to rotate in conjunction with the first pulley; A belt formed along the outer circumferential surfaces of the first pulley and the second pulley and configured to transmit the rotational power of the first pulley to the second pulley; An arm body fixed to a part of the belt to support the wafer and move forward and backward in one direction; A belt tension sensor configured to sense tension of the belt at a side of the belt connected between the first pulley and the second pulley; And The rotational power unit is configured to determine the tension of the belt by using the detection signal output from the belt tension sensor, and to prevent the wafer from being transferred by the arm body any more when the tension of the belt is out of a set range. And a controller for outputting an interlock control signal to the wafer loading apparatus. The method of claim 1, And the sensor measures a distance of the wafer from the front surface or a plurality of specific portions of the wafer. The method of claim 1, The sensor is a spinner installation, characterized in that using the wafer non-contact method or contact method. A wafer cassette loader for loading a wafer cassette on which a plurality of wafers are mounted; An index arm for taking out a plurality of the wafers mounted on the wafer cassette loaded on the wafer cassette loader; A spin coater for applying a photoresist on the wafer taken out from the index arm; A baking device for baking the photoresist applied from the spin coater; And A rotational power unit which transfers the wafer between the bake, spin coater, and the index arm, and generates rotational power using a power voltage applied from the outside, a first pulley configured to rotate at an end of the rotational power unit; A second pulley formed at a predetermined distance from the first pulley and formed to rotate in conjunction with the first pulley, and having a crawler along the outer circumferential surfaces of the first pulley and the second pulley and having the first pulley on the second pulley; A belt formed to transmit the rotational power of the pulley, an arm body fixed to a portion of the belt to support the wafer and moving forward and backward in one direction, and a side surface of the belt connected between the first pulley and the second pulley A belt tension detection sensor configured to detect tension of the belt and a detection signal output from the belt tension detection sensor And a control unit for determining the tension degree of the belt and outputting an interlock control signal to the rotational power unit so that the wafer is no longer transported by the arm body when the tension degree of the belt is out of a set range. A spinner installation comprising a wafer loading device.

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