KR20070097946A - Economical conductive sheet - Google Patents

Abstract

An economical conductive material is provided to realize improved cost efficiency and productivity, and to impart high conductivity and improved durability and reliability while showing electron wave-absorbing/shielding and far infrared ray- absorbing/emitting property. An economical conductive material having conductivity in all directions comprises a sheet-like substrate(1) formed of a flexible polymer, perforated holes or cutting slits formed on a predetermined position of the substrate, an upper surface conductive layer and a lower surface conductive layer formed over the upper and lower surfaces of the substrate, and an interconnection conductive layer(19) for electrically connecting the upper/lower surface conductive layers with each other. In the conductive material, at least one of the upper/lower surface conductive layers comprises a thin film(100) formed by physical vapor deposition, at least a part of the thin film a conductive resin layer formed on the upper(outer) surface thereof, and at least a part of the conductive resin layer is physically and integrally connected to the interconnection conductive layer. The thin film functioning as an element for forming the surface conductive layer is at least partially formed in advance of (at least a part) of the conductive resin layer included as an element of the interconnection conductive layer.

Description

Entry type conductive material {economical conductive sheet}

1 is a cross-sectional view of a sheet-like substrate having holes (or cutting slit) drilled at designated locations

Fig. 2 is a cross-sectional view of a hole formed in a sheet-like substrate and a deposited thin film layer formed on the second substrate and the second substrate.

3 is a cross-sectional view of a conductive material in which a connection conductive layer is formed within the entire thickness range of a substrate including a deposited thin film by coating a conductive resin on the inner surface of the perforated hole of the perforated substrate after the deposited thin film layers are formed on both surfaces of the sheet type substrate.

4 shows a second substrate bonded to both surfaces of a sheet-type substrate, a deposition thin film layer formed on the surface thereof, and a connection conductive layer formed on the inner side of the perforation hole, wherein the connection conductive layer formed of the conductive resin is formed of the second substrate. Cross section of the conductive material formed within the entire thickness range of the substrate including the deposited thin film formed on the surface thereof

5 is a cross-sectional view of a conductive material integrated such that the laminated thin film formed on both surfaces of the sheet-like substrate and the connection conductive layer formed on the inner surface of the perforation hole and the conductive resin layer formed entirely on the outer surface of the deposited thin film are electrically and physically connected to each other.

6 is a cross-sectional view of a conductive material integrated such that the deposited thin film formed on both surfaces of the sheet-like substrate and the connection conductive layer formed on the inner surface of the perforated hole and the conductive resin layer partially formed on the outer surface of the deposited thin film are electrically and physically connected;

FIG. 7 is a cross-sectional view of a conductive material including a second substrate bonded to both surfaces of a sheet-type substrate, a deposited thin film layer formed on the surface thereof, and a hole formed therein, the thickness of which is thinned around the hole;

8 is a conductive material comprising a second substrate bonded to both surfaces of a sheet-like substrate, a deposited thin film layer formed on the surface thereof, and a perforation hole, wherein the thickness of the substrate is thinned around the perforation hole. A cross-sectional view of the conductive material in which a connection conductive layer and a surface conductive layer are further formed as conductive resin layers on the inner surface of the hole and the entire outer surface of the deposited thin film layer.

9 is a conductive material comprising a second substrate bonded to both surfaces of a sheet-like substrate, a deposited thin film layer formed on the surface thereof, and a perforation hole, wherein the thickness of the substrate is thinned around the perforation hole. A cross-sectional view of a conductive material in which a connection conductive layer and a surface conductive layer are additionally formed with a conductive resin layer around the inner surface of the hole and a portion of the outer surface of the deposited thin film layer, that is, the recessed thin film portion compared to the surroundings.

1; sheet-like substrate 2; second substrate 3; punched hole formed in the designated place of the substrate (or cutting slit (hereinafter referred to collectively referred to as a punched hole)) 5; punched hole formed in the second substrate 7; punched formed in the deposition film Hole 9; side 11 of the deposited thin film perforated hole; outer surface 13 of the deposited thin film; inner surface 15, 16 of the perforated hole of the second substrate; conductive resin layer partially formed (as an element of the surface conductive layer) on the outer surface of the deposited thin film 17, 19; hole 21 remaining after the connection conductive layers 21, 121, 125 are formed; connection conductive layers 23, 24 bonded only to the end of the cut side of the deposition thin film formed on the surface of the second substrate; and on the outer surface of the deposition thin film (one of the surface conductive layers) Entirely formed conductive resin layer)

100; evaporation thin film 121,125; connection conductive layer formed on the inner surface of the drilled hole 123,127 while leaving a hole in the inner side; connection conductive layer 200 formed while filling the entire punched hole without leaving a hole inside; Deposition thin film layer formed on the recessed portion relatively thinner than the surrounding substrate thickness

The present invention relates to an entry type conductive material used as an electronic component or material. In recent years, electronic products have tended to have various components integrated in a small space according to the trend of light and short. Especially when there is a high frequency oscillation circuit and when a high frequency signal processing lead is arranged, absorption shielding of electromagnetic waves becomes an essential factor. For example, in the case of a mobile phone or a flat panel display device, high frequency interference between electronic components should be prevented and emission to the outside should also be thoroughly prevented.

In order to accomplish this task, an electromagnetic wave absorber or an electromagnetic wave shielding material according to a known technique is often developed and used. As the most common form of such a component, a conductive fabric and electromagnetic gaskets using the same are commercially available.

However, the conductive fabric and the electromagnetic gasket using the same have a problem that the manufacturing method is complicated and the product shape is extremely limited in the shape of the product and the production cost is expensive, and the product is made of a very thin gasket or a minute shape product. It is true that it is very difficult.

In order to solve some of these problems, namely, the unit price problem, US Patent 6,541,698 granted to Stanley R, forms a thin film by dry deposition on one side of a thin film having a myriad of very fine protrusions. By manufacturing the electromagnetic gasket according to the known technology using the proposed method to lower the production cost than the product by the conductive fabric. However, this is a simple coating on the cross section of the film by physical vapor deposition (pvd) method, and because it is not energized at all in the vertical direction of the cross section of the film, it gives only two-dimensional conductivity, so the production cost is low, but the ease of manufacture or the variety of products Esau still has limitations.

In particular, in the case of a gasket manufactured using a conductive fabric (nonwoven fabric) according to the known art, many processes and production machines are required to produce a specific shape. In order to solve this problem, it is possible to conduct electricity in all directions of up, down, left, and right, and to propose conductive materials having a constant thickness and a method of simply cutting them into a desired shape. In Korean Patent No. 10-0471194, which can be considered as an invention that realizes this, the sponge material is provided as a conductive sheet that can be provided with a metal layer by an electroless plating method and can be energized in up, down, left and right directions. However, in the case of this product, a plating process causing serious pollution is involved, and furthermore, the elasticity of the product and very complicated and low productivity are a big problem.

In another invention, Korean Patent 10-0478830 proposes a method of making a conductive sheet that can be energized up and down by making a plurality of holes in a foamed resin sheet and coating it with a conductive resin and drying it. Price and energy efficiency, such as product cost, remain, which is a problem that prevents the popularization of this product.

In addition, there are various inventions and proposals, but there is no configuration that solves the problems of the prior arts. Therefore, there is still a need for the development of a conductive material having no pollution problem, low production cost, flexibility and elasticity, and improved reliability of up, down, left and right conduction.

In order to solve this problem, a synthetic sheet having a plurality of perforations or cutting slits (hereinafter referred to as holes) is prepared in a flexible sheet, and the upper and lower surfaces of the sheet and the upper and lower surfaces are formed. The upper and lower surface conductive layers and the connection conductive layers are uniformly coated on the sides of the perforated holes by physical vapor deposition, thereby providing a connection conductive layer evenly coated on the sides of the holes to electrically connect the surface conductive layers coated on the upper and lower surfaces. Upper and lower surface conductive layers are electrically connected to each other; A conductive material having a conduction function in all directions of up, down, left and right and a coating method thereof may be proposed.

But these products also have serious problems by default. That is, some of the phenomena caused by the limitations of the physical vapor deposition method, the most significant of which is the poor step coverage (phenomena) of the biggest problem of the physical vapor deposition method. Physical vapor deposition is different from resin coating by electroless plating or deeping method, but it is well coated on the side facing the coating source, but on the side or back side not facing each other. It is difficult to make. Of these problems, the coating on the back side can be solved by placing additional coating sources on the corresponding back side. However, the method of coating on the inner side of narrow and deep drill holes still remains a major problem barrier. As such, the thickness ratio of the thin film deposited on the side and side facing the coating source is called step coverage. The closer the thickness ratio is to 100%, the better the step coverage. To improve step coverage, the average degree of freedom of gases and vapors in the interior is reduced by lowering the degree of vacuum (close to atmospheric pressure) in the vacuum chamber (regardless of the type of physical deposition method) that performs the physical deposition. It is essential to shorten the mean free path or to apply a bias voltage to the substrate itself. However, in most cases, the substrate to be coated is a non-conductor supplied continuously. Therefore, the bias voltage application method should be used, except that it is impossible to realize, and a method of making the average free stroke short. However, through the in-depth analysis of the results of repeated experiments carried out by the inventors and known research reports, the following defects were found. In other words, this method can evenly coat the inner side of the narrow and deep drill hole, but it encounters a large barrier due to various qualitative problems described below. As described above, when the coating is performed in such a way as to reduce the average free stroke, the deposition material starting from the coating source is more likely to collide with other gases (or vapors) while flying at a certain path. In other words, the possibility of mixing with other substances or compounding with active molecules increases the adverse effect on the purity. The form of the above-mentioned compound is mainly in the form of oxidation or nitriding. This results in the inclusion of the metal oxide or metal nitride as impurities in the metal thin film layer. That is, the electrical conductivity of the metal conductive layer is reduced. In addition, as a result of the incorporation of the impurities (mainly dielectric), the thin film follows the characteristics of the dielectric, and exhibits a low strength and a brittle characteristic. In addition, as the deposition material collides with other gases, a considerable amount of kinetic energy is lost, so that the adhesion and the film density of the physically deposited thin film on the coated substrate are inevitably deteriorated. That is, not only fragile, but also desorption occurs from the substrate to be coated or the thin film itself loses its continuity, resulting in a fatal defect as a conductive material. In addition, as the number of depositing materials collides with other molecules increases, the amount of scattering increases, thus increasing the amount of materials deposited on the inner wall of the vacuum chamber without being coated on the substrate to be coated. Naturally, the coating speed is lowered and the production cost is increased. As mentioned above, it was concluded that if the step coverage was improved by the general method, that is, the method of reducing the average free stroke, it would not be very helpful in solving the present problem.

An object of the present invention is to completely solve all the above problems and to provide a highly reliable conductive material. In other words, it is possible to significantly lower the product cost by increasing the productivity, to provide high conductivity, and to provide a high-end type conductive material and a method of manufacturing the same, improving durability and reliability.

Still another object of the present invention is to provide a conductive material having improved durability and abrasion resistance, and a diffusion type conductive material having both a function of absorbing and blocking electromagnetic waves and absorbing or emitting far infrared rays.

Still another object of the present invention is to provide a diffusion type conductive material that can be used as a planar heating element.

The present invention solves all the problems and irrationalities of the above-described proposed techniques through the unique configuration specially proposed for realizing the present invention in the substrate and the conductive layer of the popular type conductive material.

To this end, a first aspect of the present invention provides a sheet-like substrate made of a flexible polymer material, a perforation hole or a cutting slit formed at a designated position of the sheet-like substrate. And electrically connecting the upper and lower surface conductive layers to each other in a state where they are formed in the trademark surface conductive layer and the lower surface conductive layer respectively formed on the upper and lower surfaces of the substrate, and in the drilling hole (or cutting slit; hereinafter referred to as the punching hole). In the spread type conductive material having a conductive function in all directions up, down, left and right, including a connection conductive layer, the connection conductive layer is formed of at least a conductive resin, at least one of the upper and lower surface conductive surfaces is physical And a thin film formed by physical vapor deposition, wherein at least one of the deposited thin film layers The portion has a conductive resin layer formed on its upper (outer side) surface, at least a portion of which is physically integrally connected to the connection conductive layer, and at least a portion of the deposited thin film layer as the surface conductive layer element. ) Is provided in a preliminary type conductive material, characterized in that formed in time earlier than (at least a portion of) the conductive resin layer included as an element of the connection conductive layer.

The reason why the connection conductive layer includes the conductive resin is to connect and connect the trademark surface conductive layer and the lower surface conductive layer electrically disconnected from both surfaces of the substrate in an easy and economical manner. The reason why at least one of the lower surface conductive layers includes the deposited thin film layer formed by physical vapor deposition is to greatly reduce the amount of conductive resin consumed when the surface conductive layer is formed of the conductive resin only by forming the deposited thin film. . The reason for forming the conductive resin layer on the upper surface of the deposited thin film layer and physically integrating at least a portion thereof with the connection conductive layer is to improve the configuration of contacting only inside the cut side of the deposited thin film layer as shown in FIGS. 3 and 4. A method for reinforcing the strength of the deposited thin film against physical force exerted on the surface conductive layers to make a satisfactory electrical connection between the surface conductive layers, wherein at least a portion of the deposited thin film layer as the surface conductive layer element is formed in the connection conductive layer. The reason for forming in time ahead of (at least a portion of) the conductive resin layer included as an element is that at least a portion of the connection conductive layer is formed on the top (outer side) of the deposition thin film layer to bond the connection conductive layer and the deposition thin film layer. It is more firm and at the same time improved adhesion to the substrate, so that each of the conductive layers Prevented from being peeled off from, and is a way to improve the conductive material in durability and conductive properties. The reason for the at least partial clue is that the thin film layer or the connecting conductive layer may be formed in multiple stages. Of course, even after the connection conductive layer is first formed, the conductive thin film can be provided up, down, left, and right (forward direction) even if the deposition thin film layer is formed on the upper (outer side) surface. However, this structure does not provide satisfactory results in particular in the adhesion of the deposited thin film and the adhesion between the substrate. In addition, when the connection conductive layer is first formed, a physical deposition process must be performed directly on the substrate on which the connection conductive layer is formed in advance. That is, the advantages obtained by using the second substrate are not obtained. In this regard, the deposited thin film layer must be formed before at least a portion of the conductive resin layer formed of the connection conductive layer element to provide an economical diffusion type conductive material.

This configuration can be realized in a wide variety of forms, the simplest of which is the structure as shown in FIG. However, in this case, it cannot be satisfied because the effect of reducing the amount of conductive resin applied to the surface is not large. As an attempt to reduce the amount of the conductive resin, a method of applying the conductive resin only on the deposited thin film layer formed around the perforation hole may be proposed as shown in FIG. 6. That is, the thickness of the connection conductive layer (conductive resin layer) formed on the upper surface (outside) of the deposition thin film layer formed near the perforation hole as in another embodiment of the present invention is the conductive resin layer included in the surface conductive layer of the surface on which the deposition thin film layer is formed. Among them, a diffusion type conductive material is provided that is at least 5 nm thicker than the average thickness of the conductive resin layer formed on the upper surface (outside) of the deposited thin film layer. This configuration can be expected to reduce the amount of conductive resin consumed to the surface conductive layer to some extent, but requires a very complicated process in the realization method, and its productivity is also not satisfactory. Of course, this configuration does not necessarily include the conductive resin in the surface conductive layer. In other words, the surface conductive layer may be composed of a purely deposited thin film.

Therefore, as another embodiment of the present invention, there is provided a diffusion type conductive material, characterized in that the substrate thickness in the vicinity of the perforation hole is formed 5nm or more thinner than the maximum thickness of the conductive material substrate. In such a configuration, the conductive resin layer applied on the deposited thin film layer 200 formed in the perforation hole portion has a thickness thicker than that of the conductive resin layer applied to other portions, as shown in FIG.

In the same configuration as that of the first embodiment of the present invention, that is, at least the connection conductive layer includes a conductive resin, even if the upper and lower surface conductive layers are separated from each other, with the help of the conductive resin that is the material of the connection conductive layer. Received can achieve the object of the present invention. Therefore, a configuration that can significantly increase the productivity in the physical deposition step in which the unit cost specific gravity is largely proposed in the following aspects. That is, in the diffusion type conductive material having the first aspect of the present invention, the base material is a diffusion type conductive material characterized by a structure that can be divided into a first layer and a second layer. The second layer is hereinafter referred to as second substrate.

The base material of the said electrically-conductive material is the thing of most in thickness unit. In order to efficiently perform the physical vapor deposition process, the substrate is wound in a web form and loaded into a vacuum container to make the inside of the vacuum container into a vacuum atmosphere, and then perform a physical vapor deposition process. (Here, the physical vapor deposition process and the vacuum web coating process of winding the long substrate in the form of a web and depositing it in a vacuum container are well known by a known technique and are commonly used techniques, and thus detailed description thereof will be omitted.) The time is so long that the length of substrate that can be loaded per batch is directly related to productivity. Here, the thinner the thickness of the substrate, the more wound the substrate can be put in a limited space. However, the substrate has a very limited selection area in consideration of impact absorption and elasticity. Thus, the substrate of the entry type conductive material is composed of at least two layers, one of which is as thin as possible (and thus much wound to a much longer length—resulting in deposition on a longer length film in one batch) A physical vapor deposition film is formed directly on the substrate by injecting a synthetic resin film and then performing a physical vapor deposition process on the surface thereof, and then bonding the resultant 'synthetic resin film with a deposited thin film' to at least one side of the substrate. The same result can be realized and this method can contribute greatly to the cost reduction. Here, it is not necessary to limit the second substrate 2 formed of the synthetic resin film to be thinner than the sheet sheet substrate 1. Just because the substrate of the entry type conductive material is divided into two or more layers is valuable because it can improve the productivity in performing the physical deposition process. In another aspect of the present invention, the diffusion type conductive material further includes a second base material 2 on at least one of upper and lower surfaces of the base material, and the second base material is at least one. A diffusion type conductive material is provided, characterized in that a deposited thin film (as an element of the surface conductive layer) is formed on a surface by a physical vapor deposition method. Here, it is preferable that a bonding force of more than van der Waals force acts between the substrate 1 and the second substrate 2. The second substrate is not meant to be a substrate or an auxiliary substrate that is input later than the first substrate in time, and is merely used as a word for dividing the two layers when the substrate can be divided into two or more layers.

In the method of manufacturing a diffusion type conductive material according to the present invention, the following manufacturing method is provided in order to solve various unreasonable points which occur when trying to form the physical vapor deposition thin film on a thick substrate and to improve productivity. In other words, preparing the second substrate, forming a deposition thin film on at least one surface of the second substrate by a physical vapor deposition method, and the structure including the second substrate on at least one surface (from the top / bottom) Forming (or laminating) the sheet-like substrate 1, forming a perforation hole (or cutting slit) at a designated position (each or simultaneously) of the substrate 1 and the second substrate; And spreading the conductive resin into at least a portion of the perforated hole and the deposited thin film layer to harden the conductive resin.

In order to make the entry type conductive material of the present invention into a product having various functions, the following conductive materials are provided.

That is, the substrate is provided with a diffusion type conductive material, characterized in that it comprises at least one selected from the electromagnetic wave absorber, thermal conductor, far-infrared radiation. In addition, a diffusion type conductive material is provided, which is characterized in that the (conductive) adhesive layer is further added to at least one side. Such a structure will help to more easily apply the conductive material to a specific required place.

In addition, there is provided a diffusion type conductive material, comprising a protrusion protruding from the surface on at least one of the upper and lower surfaces as a configuration to greatly improve the wear resistance. This configuration serves to primarily protect the upper and lower surface conductive layers when the conductive material causes friction with other surfaces.

The diffusion type conductive material of the present invention may be used as a planar heating element. In this aspect, the conductive material is provided with a diffusion type conductive material, characterized in that the specific resistance of the conductive resin included in the connection conductive layer is at least two times higher than that of the surface conductive layer for use as a surface heating element.

In addition, when the diffusion type conductive material of the present invention is used as a planar heating element, in order to prevent the magnetic fields generated naturally due to the flow of current to cancel each other, the diffusion type conductive material (the magnetic field offset purpose of the surface heating element or the electrical conductivity of the conductive material For the purpose of improvement), a diffusion type conductive material is provided, which is composed of a structure in which two or more conductive materials are laminated. In the case of the magnetic field offset purpose, the purpose of preventing the magnetic field may be realized by using wirings in which current directions flowing in the connection conductive layers of even layers existing in the cross-section of the laminated conductive material are balanced with each other and flow in opposite directions. Aspects included in the specification or drawings of the present invention have been shown the embodiments thereof, in addition to this can be provided on the basis of the technical spirit of the present invention of various types of popular conductive material.

The spread type conductive material according to the present invention may be used as an electromagnetic shielding film, film, sheet or gasket or cushioning material and is a material of an electronic product requiring a conductive function in all directions up, down, left and right, or a planar heating element (preventing magnetic field generation) It can be used as a cheaper and more economical way to provide a more versatile and improved reliability of the diffusion type conductive material to replace the expensive conductive foaming material or conductive fabrics and conductive non-woven fabrics especially planar heating element.

Claims (10)

A sheet-shaped substrate made of a flexible polymer material, a perforation hole or cutting slit formed at a designated position of the sheet-shaped substrate, and formed entirely on the upper and lower surfaces of the substrate, respectively. An upper and lower surface comprising a trademark conductive layer, a lower surface conductive layer, and a connection conductive layer electrically connecting the upper and lower surface conductive layers to each other in a state formed in the perforation hole (or cutting slit; hereinafter referred to as the perforation hole). In a conductive material having a conduction function in all the left and right directions, the connection conductive layer is formed of at least a conductive resin, and at least one of the upper and lower surface conductive surfaces is a deposited thin film formed by physical vapor deposition. and a thin film layer, wherein at least a portion of the deposited thin film layer has conductive water formed on its upper surface. A layer, wherein at least a portion of the conductive resin layer is physically integrally connected with the connection conductive layer, and at least a portion of the deposited thin film layer as the surface conductive layer element is included as an element of the connection conductive layer. A diffusion type conductive material, characterized in that formed earlier in time than at least a portion of the resin layer The thickness of the connection conductive layer (conductive resin layer) formed on the upper surface (outside) of the deposition thin film layer formed near the perforation hole in claim 1 is the upper surface of the deposition thin film layer among the conductive resin layer included in the surface conductive layer of the surface on which the deposition thin film layer is formed. Supply type conductive material, characterized in that at least 5nm thicker than the average thickness of the conductive resin layer formed on the (outside) The diffusion type conductive material of claim 1, wherein the substrate thickness in the vicinity of the perforation hole is 5 nm or more thinner than the maximum thickness of the conductive material substrate. The diffusion type conductive material of claim 1, wherein the substrate comprises at least one selected from an electromagnetic wave absorber, a thermal conductor, and a far infrared ray radiator. The diffusion type conductive material according to any one of claims 1 to 3, wherein the (conductive) adhesive layer is additionally added to at least one surface of the conductive material. The diffusion type conductive material according to any one of claims 1 to 3, wherein at least one of the upper and lower surfaces includes a protrusion protruding from the surface. The diffusion type conductive material of claim 1, wherein the conductive material has at least twice the specific resistance of the conductive resin included in the connection conductive layer for use as a surface heating element, compared to the specific resistance of the surface conductive layer. The diffusion type conductive material according to claim 1, wherein the conductive material is formed by stacking two or more of the conductive materials (for the purpose of canceling the magnetic field of the surface heating element or improving the electrical conductivity of the conductive material). 4. The method of claim 1, wherein the supplementary conductive material further comprises a second substrate 2 on at least one of upper and lower surfaces of the substrate, and the second substrate is physically deposited on at least one surface. The diffusion type conductive material characterized in that the deposited thin film is formed (as an element of the surface conductive layer) by The method of claim 1, further comprising the steps of preparing a second substrate and forming a deposited thin film on at least one surface of the second substrate by a physical vapor deposition method, and the second substrate Forming (or foaming) the sheet-shaped substrate 1 on the second substrate (in the upper / lower surface) on at least one side of the substrate 1; Forming a perforation hole (or cutting slit) at a predetermined position of the second substrate and the second substrate, and applying the conductive resin to at least a portion of the perforation hole and the deposited thin film layer so as to be hardened. Supply type conductive material manufacturing method characterized in that it comprises a

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