KR20070078833A - Heat conductivity and brightness enhancing structure for light-emitting diode - Google Patents

Abstract

A heat conductivity and brightness enhancing structure for light-emitting diode is provided to enhance the efficiency and lifetime of a light-emitting diode lamp by improving heat conductivity and brightness of a light emitting diode. A heat conductivity and brightness enhancing structure for light-emitting diode includes a bracket having a cathode leg support(11) and a bowl(12A) formed on an upper end of the cathode leg support. A light-emitting chip is loaded in the inside of the bowl. A depressed part is formed on the lowest part of the bowl to store an adhesive. The depressed part is opened to the light-emitting chip. The depressed part has a diameter or an area smaller than a bottom surface of the light-emitting chip. The depressed part is filled with the adhesive. Only one depressed part is formed under the light-emitting chip.

Description

Heat conductivity and brightness enhancing structure for light-emitting diodes

The present invention relates to an improved thermal conductivity and brightness enhancement structure for light emitting diodes. An improved bowl structure is formed over the upper end of the cathode leg support, thereby improving thermal radiation and light focus effects. Therefore, the brightness, quality, reliability, and service life of the light emitting diode are remarkably improved to save energy.

Conventional light emitting diode brackets have a cathode contact pin made of metal plate and an anode contact pin made of another metal plate. A depression is formed at the upper end of the cathode contact pin, in which the chip is fixed. Such structures include Taiwan Patent Publication No. 506626 "Light Emitting Diode Structure", Taiwan Patent Publication No. 488616 "Light Emitting Diode Bracket", Taiwan Patent Publication No. 486153 "Light Emitting Diode Bracket", and Taiwan Patent Publication No. 441860 "Light Emitting" Diode bracket structure.

Taiwan Patent Publication No. 506626 discloses a light emitting diode structure wherein at least one light emitting diode chip is disposed on an upper end of a cathode contact pin. The light emitting diode chip is connected to the upper end of the anode contact pin through the conductive wire. The upper ends of the cathode and anode contact pins are packaged into a gum body. This light emitting diode structure is characterized in that the rubbery body is a cylindrical body with a convex top surface.

Taiwan Patent Publication No. 488616 discloses a light emitting diode bracket. The conductive metal plates are successively punched to form multiple bracket units connected to each other and arranged at equal intervals. Each bracket unit has a connecting portion and a central portion opposite thereto. The connecting part serves to connect with the conductive wire. The central portion has a rest seat, which extends towards the connecting portion to secure the chip on the rest seat. The two ends of the connecting portion and the central portion further extend outwardly to form first, second, third and fourth contact pins for connecting with the circuit. When acting, the heat generated by the chip is rapidly released through the contact pins to improve the thermal radiation efficiency of the light emitting diodes.

Taiwan Patent Publication No. 486153 discloses a light emitting diode bracket. The conductive metal plates are successively punched to form multiple bracket units connected to each other and arranged at equal intervals. Each bracket unit has a first contact pin and a second contact pin opposite each other. A first contact point is formed at the upper end of the first contact pin for connection with the first conductive wire. An upper end of the second contact pin is formed with a recess for fixing the chip therein. This bracket is characterized in that the second contact point further extends from the outer side to the upper side in order to connect with the second conductive wire. The other ends of the first and second conductive wires may each be connected to a chip.

Taiwan Patent Publication No. 441860 discloses a light emitting diode bracket structure formed integrally with a metal material such as copper or iron. The container structure is formed on the upper portion of the bracket. The bottom of the container has a flat rest surface for seating the light emitting chip thereon. The inclined wall surface extends obliquely upward from the periphery of the resting surface to reflect the light beam of the chip upwards. This bracket structure is characterized in that at a height higher than the seated chip, the inclined wall surface converges vertically towards the upper end of the container to form a light focal portion.

In all these prior arts, the bracket top of a conventional LED lamp is packaged in a transparent body. Moreover, the bottom portion of the container is completely covered by an adhesive adhesive (eg, silver adhesive, white adhesive, and insulating adhesive) that is about 20 micrometers to 100 micrometers thick to attach the LED chip. The transparent fuselage and adhesive adhesive prevent the generated heat from conducting or dissipating. When emitted, different LED chips with different outputs will produce proportionally different calories. Whether heat can be rapidly conducted and dissipated is important for the light emitting effect of the light emitting diode. However, the adhesive adhesive painted on the bottom and the resin (A, B gum) packaged on the top and side portions tightly wrap the chip in a large sealed body. As a result, the efficiency and service life of the light emitting diode lamp deteriorate. Accordingly, Applicants have attempted to provide an improved thermal conductivity and brightness enhancement structure for light emitting diodes to solve such problems.

It is therefore an object of the present invention to provide an improved thermal conductivity and brightness enhancement structure for light emitting diodes.

In order to achieve the above object, according to the present invention, a bowl structure formed on the upper end of the cathode contact pin is improved to reduce the contact area of the adhesive applied between the chip and the bottom of the container. The depth of the adhesive is about 20 micro to 100 micro. The area is about 5% to 95% of the bottom area of the chip and preferably about 15% to 35% of the bottom area of the chip. At least one recess is formed on the bottom portion of the container. The recess has an area smaller than the bottom surface of the chip. The recess may be round, square, rectangular, lozenge, or the like. The adhesive is filled in the recesses for adhering the at least one chip so that the bottom face of the chip is in direct contact with the other part of the bottom of the container without the adhesive. Therefore, when the light emitting chip is turned on, the heat generated by the chip can be directly conducted to the cathode leg support to improve the heat radiation effect.

Moreover, at least one column hole is formed from the support of the container to the outside of the bracket via the cathode leg support. By the circumferential hole, during the baking process, the low melting point adhesive is melted into the liquid state and consumed from the circumferential hole. Thus, when the light emitting chip is turned on, convection between the internal air and the external cold air occurs immediately through the circumferential hole, dissipating heat directly and more rapidly. Thus, the bracket with the container design can achieve a high efficiency heat radiation effect.

It is another object of the present invention to provide the above thermal conductivity and brightness enhancement structure for a light emitting diode. The container structure is formed with multiple levels of concave faces to provide multiple focusing and multiple refractive effects. Moreover, the area of the light beam is doubled and the projection length of the light beam is also doubled. By such a multi-stage container design, high efficiency optical physics effects can be achieved.

Another object of the present invention is to provide the above-described thermal conductivity and brightness enhancement structure for a light emitting diode, wherein the bracket may have lateral thermal radiation vanes or no thermal radiation vanes. Alternatively, the bottom of the bracket can be wholly or partially attached to the metal film of the printed circuit board. Alternatively, the bottom of the bracket is also partially attached to the metal film of the printed circuit board, which is partially suspended / column and has a column passed through the printed circuit board with circumferential holes (through holes and blocked holes). ) Is partially formed. The spatial pattern of the bracket can vary according to different applications and different requirements of different environments.

The invention will be best understood from the following description and the annexed drawings.

The present invention can be applied to the light emitting diode can exhibit an improved heat dissipation effect.

1 to 2D, the thermal conductivity and brightness enhancement structure for the light emitting diodes of the present invention comprises a first bracket 10A (having two thermal radiation vanes), a second bracket 10B; four thermal radiations. First vessel 12A, second vessel 12B, third at the upper end of the third bracket (10C; no thermal radiation vanes) or other type of cathode leg support 11 The container 12C or the fourth container 12D is provided. The light emitting chip 15 is seated in any one of the first to fourth containers.

At least one recess 121 is formed in the lowest portion of the first container 12A, the second container 12B, the third container 12C, or the fourth container 12D. The recess 121 has a diameter or area smaller than the bottom surface of the light emitting chip (preferably 15% to 35% smaller than the bottom surface of the chip). In a preferred embodiment, the recess has a diameter or area that is about 5% to 95% smaller than the bottom surface of the chip. The recess 121 may be circular, square, rectangular, rhombus, or the like. The cross-sectional depth of the recess can be determined as necessary. Thus, an adhesive adhesive (for example, a silver adhesive, a white adhesive, an insulation adhesive, or the like, or a conventional thermally conductive metal adhesive material such as aluminum, copper, silver, tin, etc.) is provided in the recess 121. Can be filled in. The adhesive material can be a solid, liquid or paste without the problem of poor thermal radiation present in conventional adhesives. The adhesive serves to attach one or more chips 15 without being loosened or displaced. The adhesive can resist the pulling force in the bond. With the exception of the bottom portion of the chip 15 corresponding to the recess 121, the bottom area of the chip 15 is free of adhesives and can be in direct contact with the bottom of the container. Preferably, at least 50% of the bottom area of the chip 15 is in direct contact with the bottom of the container. Therefore, when the light emitting chip 15 is turned on, heat can be directly conducted to the first bracket 10A, the second bracket 10B, or the third bracket 10C through the contact portion without the adhesive.

1C, 1E, 1G, 1J, 1L, and 1N, the circumferential hole 14 is formed as a closed hole 142 of the circumference facing the bottom. A thin wall is maintained between the vessel and the blind hole 142. The heat generated by the chip 15 is first conducted to the cathode leg support 11 and the circumferential blocked hole 142 and then dissipated in a convection manner. Therefore, the heat radiation effect is further improved.

1B-1E and 6B-6D, in a preferred embodiment, the circumferential hole 14 is cathode through the first bracket 10A, the second bracket 10B or the third bracket 10C. The first bracket 10A and the second bracket (12A) from the recesses 121 of the first container 12A, the second container 12B, the third container 12C, or the fourth container 12D of the leg support 11. 10B) or to the bottom of third bracket 10C. Thus, the cathode leg support 11 becomes a cavity bracket having a circumferential hole 14. By means of the circumferential hole 14, when baked after the packaging step during the process, the low melting point adhesive melts into the liquid state and is emptied from the circumferential hole 14. Thus, the entire recess 121 is opened outward. When the light emitting chip 15 is turned on, convection of air is immediately generated to dissipate heat directly. In the unused state, impurities are prevented from being captured by the outside air and entering the bracket to affect the light emitting chip 15. Thus, the bracket with the design of the container can achieve a high efficiency heat radiation effect.

2A-2D, in a preferred embodiment, the first vessel 12A, the second vessel 12B, the third vessel 12C or the fourth vessel 12D of the cathode leg support 11 is It is designed with multiple concave portions 17 (see FIG. 1H). This helps to align the chips. In addition, an appropriate amount of adhesive may be added depending on the size of the chip to improve adhesion. There is a step of one or more concave faces. For example, FIG. 2A shows the first vessel 12A in one stage, FIG. 2B shows the second vessel 12B in two stages, and FIG. 2C shows the third vessel 12C in three stages. 2d shows a fourth stage 12D in multiple stages (four stages). Thus, the structure of the first to fourth containers provides multiple focusing and multiple refractive effects. Moreover, the area of the light beam is doubled and the protruding length of the light beam is also doubled. By two, three, and multiple stage container designs, high efficiency photophysical effects can be achieved to enhance illumination.

With reference to the individual features, the bracket of the invention can have two thermal radiation vanes 13 and four thermal radiation vanes 13 according to different requirements. Two or more fixing posts 16 may be disposed below the bottom of any one of the first to third brackets to be inserted into the printed circuit board. If there is no circumferential hole 14 in the cathode leg support 11, the bracket is full. The bottom surface of such a bracket is completely attached to and in contact with the conductive metal film of the printed circuit board to achieve a better heat radiation effect. Another type of cathode leg support 11 is formed with several circumferential holes 14 and has a cavity structure 18. Such brackets are common. Such brackets are connected with the conductive metal film of the printed circuit board by various measures. Some of these are partially attached to the printed circuit board (as shown in FIGS. 1B and 1F). Some of these are partially attached to the printed circuit board (as shown in FIGS. 1C and 1G) and partially suspended. Some of these are partially attached to the printed circuit board (as shown in FIGS. 1D and 1H), partially suspended and partially passed through the printed circuit board along the circumference 141. The cavity bracket can achieve the best heat radiation effect.

A first container 12A, a second container 12B, a third container 12C for accommodating an adhesive (including a metal and a nonmetal) to attach the light emitting chip 15 to the at least one recess 121. Or in the fourth container 12D. This can eliminate the disadvantage that the adhesive inhibits heat conduction. Moreover, the circumferential hole 14 or the circumferential blocked hole 142 under the recess 121 further communicates with the outside to further achieve heat dissipation effect by air convection. Furthermore, the multi-level concave surfaces of the first container 12A, the second container 12B, the third container 12C, or the fourth container 12D, and the first bracket 10A (with two thermal radiation vanes) The various spaces of the second bracket 10B (with four thermal radiation vanes) and the third bracket 10C (without any thermal radiation vanes), as well as parts of through or closed holes or cavities therein; By this, the heat radiation effect can be effectively improved. Therefore, the brightness, quality, reliability, and service life of the light emitting diode can be significantly improved.

The above embodiments are only used to explain the present invention, but are not intended to limit the scope thereof. Various modifications of the above embodiments can be made without departing from the spirit of the invention.

1 is a perspective view of the bracket of the present invention, which is formed of a first stage container and two thermal radiation vanes.

1A is a perspective cross-sectional view according to FIG. 1, showing the internal structure for the bracket of FIG. 1.

FIG. 1B is a perspective cross-sectional view according to FIG. 1 showing the internal structure of the bracket of FIG. 1 with a columnar hole. FIG.

FIG. 1C is a perspective cross-sectional view according to FIG. 1B, wherein the circumferential hole is blocked.

FIG. 1D is a perspective cross-sectional view according to FIG. 1, showing the internal structure of FIG. 1, which has a circumferential hole and part of a cavity. FIG.

FIG. 1E is a perspective cross-sectional view according to FIG. 1D in which part of the cavity is not in communication with the recess through the circumferential hole. FIG.

FIG. 1F is a perspective cross-sectional view according to FIG. 1, showing the internal structure of the bracket of FIG. 1, which has a circumferential hole, a portion of a cavity, and a circumference formed with a hole in the cavity.

1G is a perspective cross-sectional view according to FIG. 1F, wherein the circumferential hole is a blocked hole.

1H shows concentric recesses formed in the container of the present invention.

1I is a perspective cross-sectional view of the bracket with multiple internal circumferential holes.

FIG. 1J is a perspective cross-sectional view according to FIG. 1I, wherein the circumferential holes are blocked holes. FIG.

1K is a perspective cross-sectional view of the bracket with multiple inner circumferential holes and part of the cavity.

FIG. 1L is a perspective cross-sectional view according to FIG. 1K wherein the part of the cavity is not in communication with the recess through the circumferential hole. FIG.

1M is a perspective cross-sectional view of a bracket having multiple circumferential holes, a cavity portion, and circumferences with circumferential holes formed therein.

FIG. 1N is a perspective cross-sectional view according to FIG. 1M, wherein the circumferential holes are blocked holes. FIG.

2 is a plan view of the bracket of FIG. 1 after being packaged.

FIG. 2A is a planar cross-sectional view taken along line A-A of FIG. 2.

2B is a plan sectional view of the bracket of the present invention, which has a two stage container.

Fig. 2C is a plan sectional view of the bracket of the present invention, which has a three stage container.

Fig. 2D is a plan sectional view of the bracket of the present invention, which has a four stage container.

3 is a perspective view according to FIG. 1, wherein the bracket additionally has a fixing post.

4 is a perspective view of the bracket of the present invention, which has a one-stage container and four heat radiation vanes.

4A is a top view of the bracket of FIG. 4 after being packaged.

4B is a plan sectional view taken along the line A-A of FIG. 4A.

FIG. 5 is another perspective view of FIG. 4, wherein the bracket additionally has a fixing post.

Fig. 6 is a perspective view of the bracket of the present invention, which has a container in one stage and no wings for thermal radiation.

6A is a perspective cross-sectional view according to FIG. 6, showing the internal structure of the bracket of FIG. 6.

FIG. 6B is a perspective view according to FIG. 6, showing the internal structure of the bracket of FIG. 6, which has a circumferential hole. FIG.

FIG. 6C is a perspective cross-sectional view according to FIG. 6 showing another feature of the internal structure. FIG.

FIG. 6D is a perspective cross-sectional view according to FIG. 6 showing another feature of the internal structure. FIG.

FIG. 7A is a top view of the bracket of FIG. 6 after packaged. FIG.

FIG. 7B is a plan sectional view taken along the line A-A of FIG. 7A.

FIG. 7C is a plan sectional view taken along line A-A of FIG. 7A, wherein the bracket has a container in two stages.

FIG. 7D is a plan sectional view taken along the line A-A of FIG. 7A, wherein the bracket has a three stage container. FIG.

FIG. 7E is a plan view taken along the line A-A of FIG. 7A, wherein the bracket has a container in four stages.

<Brief Description of Major Codes in Drawings>

12A. First container 12B. Second container

12C. 3rd container 12D. Fourth container

15. Light emitting chip 121. Main part

42. Blind holes in circumference

17. recess 14. Column hole

Claims (15)

A thermal conductivity and brightness enhancement structure for a light emitting diode, comprising: a bracket having a cathode leg support; a container formed on an upper end of the cathode leg support to seat a light emitting chip therein; The thermally conductive and brightness enhancing structure has at least one recess formed in the bottom portion of the container to receive the adhesive therein, the recess opening toward the chip, and the recess having a diameter or area smaller than the bottom face of the chip, Thereby, during the processing of the process, the adhesive is filled into the recesses to preliminarily attach the chip, and only one recess is present below the chip. The method of claim 1, A column hole is formed out of the bracket from at least one recess of the container via the cathode leg support, The container is formed with a step of at least one concave side. The thermal conductivity and brightness enhancement structure for a light emitting diode. The method of claim 1, A column blind hole is formed outside the leg support with a certain thickness from a portion below the at least one recess of the container in the cathode leg support, The container is formed with a step of at least one concave side. The thermal conductivity and brightness enhancement structure for a light emitting diode. The method of claim 1, A circumferential hole is formed outward of the bracket from at least one recess of the container through the cathode leg support, A thermally conductive and brightness enhancing structure for a light emitting diode, wherein the container is formed with concave portions concentric with the recess. The method of claim 1, A circumferential blocked hole is formed outside the leg support with a certain thickness from a portion below the at least one recess of the container in the cathode leg support, A thermally conductive and brightness enhancing structure for a light emitting diode, wherein the container is formed with concave portions concentric with the recess. The method according to any one of claims 1 to 5, And at least one cathode leg support of the bracket is formed with heat radiation vanes. The method according to any one of claims 1 to 5, The bottom surface of the bracket is entirely attached to the conductive metal film of the printed circuit board, the thermal conductivity and brightness enhancement structure for the light emitting diode. The method of claim 6, The bottom surface of the bracket is entirely attached to the conductive metal film of the printed circuit board, thermal conductivity and brightness enhancement structure for the light emitting diode. The method according to any one of claims 1 to 5, The bottom surface of the bracket is partially attached to the conductive metal film of the printed circuit board, thermal conductivity and brightness enhancement structure for the light emitting diode. The method of claim 6, The bottom surface of the bracket is partially attached to the conductive metal film of the printed circuit board, thermal conductivity and brightness enhancement structure for the light emitting diode. The method according to any one of claims 1 to 5, A bottom surface of the bracket is partially attached to and partially suspended from a conductive metal film of a printed circuit board. The method according to any one of claims 1 to 5, The bottom surface of the bracket is partly attached to the conductive metal film of the printed circuit board, partially suspended, and thermally conductive for the light emitting diode, in which columns formed through the printed circuit board have a circumferential hole, and Brightness enhancement structure. The method of claim 6, The bottom surface of the bracket is partly attached to the conductive metal film of the printed circuit board, partially suspended, and thermally conductive and brightness enhancing structure for the light emitting diode, in which the circumferences are formed partially with circumferential holes passing through the printed circuit board. . The method according to any one of claims 1 to 5, A thermal conductivity and brightness enhancement structure for a light emitting diode, wherein at least two fixing posts are disposed below the bottom surface of the bracket for insertion in a printed circuit board. The method of claim 6, A thermal conductivity and brightness enhancement structure for a light emitting diode, wherein at least two fixing columns are disposed below the bottom surface of the bracket for insertion in a printed circuit board.

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