KR20070078513A - Camera module package - Google Patents

Abstract

A camera module package is provided to minimize an assemblage clearance of the camera module package and reduce impurity standard by interval setup between an image sensor and an IR(Infrared Ray) cutoff filter by fixing a filter frame to an upper surface of a PCB(Printed Circuit Board) in the package assemblage of a flip-chip bonding type and safely receiving the IR cutoff filter in the filter frame. At least one or more lenses(11a) are mounted in a lens barrel(11), and a male screw part is formed in an outer circumference surface of the lens barrel(11). A female screw part is formed in an inner circumference surface of a housing(12) so that the lens barrel(11) is combined. An external side of a filter frame(14) is closely inserted into an internal side of a lower end of the housing(12), and a filter safety-receiving part(14a) is formed in a central part of the filter frame(14). An IR cutoff filter(15) is safely received in the filter frame(14). A lower surface of the filter frame(14) is closely combined to a PCB(13), and an image sensor(16) is attached to a lower surface of the PCB(13).

Description

Camera Module Package {CAMERA MODULE PACKAGE}

1 is an assembled perspective view of a conventional COF-type camera module package.

2 is a cross-sectional view of a conventional COF-type camera module.

3 is an assembled perspective view of the camera module package according to the present invention.

4 is a cross-sectional view of the camera module package according to the present invention.

<Explanation of symbols for the main parts of the drawings>

11.barrel 12.housing

13. Printed Circuit Board 14. Filter Frame

15. Infrared cut filter 16. Image sensor

The present invention relates to a camera module package in which the housing and the barrel are integrally formed, and more particularly, when the assembly of the flip chip bonding package is assembled, the filter frame is fixed to the upper surface of the printed circuit board and the infrared cut filter is mounted inside the frame. The present invention relates to a camera module package which minimizes assembly tolerances of the camera module package and allows foreign material specifications to be alleviated by setting a gap between the image sensor and the infrared cut filter.

Nowadays, portable terminals such as mobile phones and PDAs are being used as a multi-convergence with music, movies, TV, and games as well as simple telephone functions with the development of the technology. The camera module is the most representative. The camera module is being changed from the existing 300,000 pixels (VGA level) to the high pixel center of 7 million pixels and is being changed to implement various additional functions such as auto focusing (AF) and optical zoom (OPTICAL ZOOM).

In general, the camera module (CCM: COMPACT CAMERA MOUDULE) is compact and is applied to various IT devices such as a camera phone, a PDA, a smartphone, and a portable mobile communication device such as a toy camera (TOY CAMERA). Increasingly, devices equipped with small camera modules are gradually being released to meet various consumer tastes.

Such a camera module is manufactured using an image sensor such as a CCD or a CMOS as a main component, and collects an image of an object through the image sensor and stores it as data in a memory in the device, and the stored data is stored in the LCD or PC in the device. The image is displayed through a display medium such as a monitor.

Conventional camera module image sensor packaging methods include a flip-chip (Chip On Flim) method, a wire on board (COB) method, a chip scaled package (CSP) method, and the like. Among them, a COF package method and a COB package method are widely used.

The packaging structure of the COF method among the package methods of the image sensor for the camera module will be briefly described with reference to the drawings shown below.

1 is an assembled perspective view showing an assembly state of a conventional COF camera module package, Figure 2 is a cross-sectional view of a conventional COF camera module.

As shown in the drawing, the conventional camera module package 1 includes a housing 2 in which an image sensor 3 for converting an image signal input through a lens into an electrical signal is supported on a bottom thereof, and a subject on the image sensor 3. The lens group (4) for collecting the video signal of the, and the lens group (4) is constituted by a sequential combination of the barrel (5) stacked in multiple stages.

At this time, a mounting board (FPCB) 6 having chip parts of C (CONDENSOR) and R (RESISTANCE), which are electrical components for driving the image sensor 3 made of CCD or CMOS, is attached to the lower portion of the housing 2. ) Is electrically coupled.

The conventional camera module package 1 configured as described above has an anisotropic conductive film (ACF: ANISOTROPIC) between the substrate 6 and the image sensor 3 in a state where a plurality of circuit components are mounted on the mounting substrate FPCB 6. Insert a CONDUCTIVE FILM (not shown) or NCP (NON-CONDUCTIVE PASTE), apply heat and pressure, and fix it so that it is energized, and attach the IR filter 7 to the opposite side.

At this time, the image sensor 3 is attached to the bottom surface of the substrate 6 in the state that the anisotropic conductive film is inserted, and the thermosetting adhesive is applied to each side of the image sensor 3 by curing, so that the image sensor 3 Ensure fixation and lateral protection.

Further, as described above in the state in which the barrel 5 in which the plurality of lens groups 4 are built and the housing 2 are temporarily coupled by screwing, the pre-assembled mounting substrate 6 is provided with the housing 2. The bottom of the adhesive is fixed by a separate adhesive.

On the other hand, after fixing the mounting substrate 6 to which the image sensor 3 is attached and the housing 2 to which the barrel 5 is coupled, the subject (resolution chart) is placed at a predetermined distance in front of the barrel 5. The focus adjustment of the camera module 1 is performed by adjusting the vertical feed amount by the rotation of the barrel 5 screwed to the housing 2, thereby adjusting the lens group 4 and the image sensor ( 3) focusing is done.

Focus adjustment is performed by adjusting the distance between the lens group 4 and the image sensor 3, and the camera module package is ready for shipment by adhesively fixing the housing 2 and the barrel 5 in a state where the focus is adjusted. Is done.

Since the COF-type camera module package having such a structure does not need a space to attach a wire to the upper surface of the image sensor above all, the package area is reduced and the height of the barrel can be reduced, thereby making it possible to reduce the thickness of the camera module. .

In addition, since a thin film or a flexible printed circuit board is used, a reliable package that can withstand external shocks is possible, and the manufacturing process is relatively simple. In addition, the COF method can meet the trend of high-speed processing, high density, and multiple pinning due to miniaturization and reduction of resistance.

However, the conventional COF camera module package 1 has an infrared cut filter 7 directly on the image sensor 3 attached to the bottom of the printed circuit board 6 with the printed circuit board 6 therebetween. ) Is directly seated, and it is pointed out that the image defect is sensitive to the fine foreign matter dropped on the infrared cut filter 7.

In addition, the housing 2 is closed by the outer peripheral surface tolerance (0 to -0.08 mm) of the infrared cut filter 7 which is tightly coupled to the inner peripheral surface with respect to the tolerance (0.01 to 0.05 mm) of the inner peripheral surface of the lower end of the housing 2. When combined surrounding the outer circumferential surface of the infrared cut filter 7, the assembly tolerance is generated from a minimum of 0.01 mm to a maximum of 0.13 mm.

Therefore, an assembly tolerance in which the infrared cut filter 7 optical axis is shifted with respect to the optical axis of the lens group 4 is equal to or larger than the allowable value (about 0.05 mm with respect to the optical axis) of the tilt amount of the optical cut off of the infrared cut filter 7. When it occurs, there is a disadvantage that the entire housing (2) in which the infrared cut filter (7) or the lens group 4 is built to move to match the optical axis to match the optical axis of the lens group (4) has a disadvantage.

Accordingly, the present invention has been made to solve the above-mentioned disadvantages and problems in the conventional camera module package, the filter frame is mounted on the infrared cut filter mounted on the printed circuit board in the flip chip bonding camera module package. Interposed therebetween, the lower inner surface of the housing is closely coupled to the outer surface of the filter frame, thereby minimizing the assembly tolerance of the housing and the infrared cut filter to prevent distortion of the optical axis and formed between the image sensor and the infrared cut filter. An object of the present invention is to provide a camera module package which reduces foreign material defects caused by loosening of foreign material standards by a predetermined interval.

The object of the present invention, an optical unit consisting of a lens barrel and at least one lens mounted lens housing coupled to the lens barrel, the filter frame is tightly coupled to the inner bottom surface of the housing and provided with a filter seat in the center; It is achieved by providing a camera module package including an infrared cut filter seated inside the filter frame and a printed circuit board to which the bottom of the filter frame is tightly coupled and an image sensor is attached to the bottom.

The optical unit is inserted into the lower end of the lens barrel equipped with a plurality of lenses through the upper opening of the housing, and is tightly coupled by screwing the female and male threads formed on the inner and outer peripheral surfaces of each member. At this time, the focus of the camera module is adjusted by adjusting the distance between the lens and the image sensor coupled to the lower portion by the rotation of the lens barrel screwed to the upper portion of the housing.

In addition, the housing should be mounted therein an infrared cut filter for blocking the infrared rays of the incident light incident through the lens barrel, the infrared cut filter is mounted inside the rectangular filter frame provided with a filter seating portion to the housing It is inserted and mounted inside.

In this case, as the outer surface of the filter frame is in close contact with the inner surface of the lower end of the housing, no assembly tolerance is generated or only a minimum assembly tolerance occurs, and the filter seat and the outer frame have the shape of the infrared cut filter. It is preferable that it is comprised in the same form.

In addition, the filter frame is attached to the bottom surface of the printed circuit board by the image sensor is attached to the bottom by flip chip bonding and the exposed area of the image sensor is punched in the center, the filter frame is larger than or equal to the exposed area of the printed circuit board. The central aperture of is formed.

Accordingly, the infrared cut filter is fixed to the filter frame on the upper surface of the printed circuit board, so that the infrared cut filter is separated from the image sensor of the bottom surface of the printed circuit board by the height of the filter seat formed in the filter frame from the image sensor. Accordingly, there is a technical feature that it is possible to reduce the assembly failure rate by loosening the allowable standard for the foreign material falling on the infrared cut filter upper surface.

Matters relating to the operational effects including the technical configuration of the above-described object of the camera module package of the present invention will be clearly understood by the detailed description with reference to the following drawings in which preferred embodiments of the present invention are shown.

First, Figure 3 is an assembled perspective view of the camera module package according to the present invention, Figure 4 is a cross-sectional view of the camera module package according to the present invention.

As shown, the camera module package 10 of the present invention is coupled to the barrel 11 and the housing 12 by the female and male threads formed on the inner and outer circumferential surface, the image sensor ( The printed circuit board 13 to which the 16 is attached in a flip chip manner is tightly coupled.

In this case, a filter frame 14 having a center portion of the filter seat 14a on which the infrared cut filter 15 is seated is adhesively fixed to the upper surface of the printed circuit board 13, and the filter frame 14 is infrared The cut filter 15 is inserted into the lower end of the housing 12 in a seated state.

The outer surface of the filter frame 14 is inserted to be in close contact with the inner surface of the housing 12, the filter frame 14 is managed by injection molding as the outer tolerance is managed to 0.01mm or less, thereby the housing ( Considering that the lower end inner side tolerance of 12) is -0.01 mm to 0.05 mm, the maximum tolerance is managed within 0.07 mm, whereby the deviation of the optical axis can be significantly reduced as compared with the prior art.

The filter frame 14 has a plurality of lenses 11a stacked on the lens barrel 11 by forming a filter seating portion 14a on which the edge portion of the infrared cut filter 15 is seated on the inner surface of the central hole 14b. An infrared cut filter 15 is mounted to block the infrared rays included in the external incident light incident through the. At this time, the filter seat 14a is preferably formed in the same shape and size as the infrared cut filter 15 so that each side of the infrared cut filter 15 is matched.

On the other hand, the printed circuit board 13 having the filter frame 14 mounted on the upper surface of the printed circuit board 13 has an image sensor 16 on the bottom surface of which incident light incident through the exposed area drilled in the center is collected and converted into an electrical image signal. Tightly coupled to allow electrical connection.

The filter frame 14 fixed to the upper portion of the printed circuit board 13 may be adhered onto the printed circuit board 13 by an adhesive or the like, and may include an exposed area perforated on the printed circuit board 13. The through holes 14b are formed to have substantially the same size and penetrate the incident light.

The filter frame 14 having such a configuration is preferably injection molded of the same material as the housing 12 in order to improve the housing 12 and its assembly satisfaction.

As described above, the camera module package 10 of the present invention has the optical structure of the lens barrel 11 in which the plurality of lenses 11a are coupled in multiple stages on the housing 12 by screwing. A printed circuit board 13 formed of a unit and having an image sensor 16 flip-chip bonded to a bottom surface of the exposed area and a filter frame 14 on which an infrared cut filter 15 is seated on the top surface thereof so as to coincide with an optical axis. Package manufacturing is completed by closely coupling the bottom surface of the housing 12 of the optical unit to the outside of the filter frame 14 on the).

At this time, the inner surface of the lower end of the housing 12 and the outer surface of the filter frame 14 are closely coupled, and the filter frame 14 when the bottom surface of the housing 12 and the upper surface of the printed circuit board 13 are bonded. An adhesive may be applied on the bond interface to enhance bond bond strength with the housing 12.

In addition, the filter frame 14 is chamfered or rounded at the upper edge portion, so that the housing 12 can be easily assembled at the upper portion of the filter frame 14 and prevents contact with the edge portion. It helps to reduce the occurrence.

In addition, as the adhesive is applied to the outer circumferential surface of the infrared cut filter 15 inserted into the filter frame 14, the filter may be generated at the edge of the infrared cut filter 15 as it is mounted on the filter seat 14a. Foreign matter is reduced by adhesive application.

Preferred embodiments of the present invention described above are disclosed for the purpose of illustration, and various substitutions, modifications, and changes within the scope without departing from the spirit of the present invention for those skilled in the art to which the present invention pertains. It will be possible, but such substitutions, changes and the like should be regarded as belonging to the following claims.

As described above, the camera module package of the present invention is an infrared cut filter for blocking the infrared rays included in the incident light incident through the lens group of the camera module is assembled in the housing in a state seated on the filter frame, and the housing and The assembly tolerance of the infrared cut filter is minimized to prevent distortion of the optical axis, and as the foreign material specification is relaxed by the gap formed between the image sensor attached to the bottom of the printed circuit board and the infrared cut filter on the upper part, the assembled product There is an advantage that the defect of foreign matter is reduced.

Claims (5)

A lens barrel having at least one lens mounted therein and having a male thread formed on an outer circumferential surface thereof; A housing having a female thread on an inner circumferential surface of the lens barrel to be coupled thereto; A filter frame having an outer surface in close contact with the inner bottom surface of the housing and having a filter seating portion at a central portion thereof; An infrared cut filter seated inside the filter frame; A printed circuit board on which the bottom of the filter frame is tightly coupled, and an image sensor is attached to the bottom of the filter frame; Camera module package comprising a. The method of claim 1, The filter frame, the camera module package, characterized in that the central through hole of the same size or larger than the exposed area formed on the printed circuit board. The method of claim 1, The filter seating unit is a camera module package, characterized in that formed in the same shape and size as the infrared cut filter so that each side of the infrared cut filter. The method of claim 1, The filter frame is a camera module package, characterized in that the injection molding of the same material as the housing to improve the assembly satisfaction with the housing. The method of claim 1, The filter frame, the camera module package, characterized in that the upper edge portion is chamfered or rounded.

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