KR20070076115A - Method for manufacturing electro luminescence device - Google Patents

Abstract

A method for manufacturing an electro luminescence device is provided to extend a lifespan by preventing a side of a solid sealant from being exposed to oxygen or moisture by forming an auxiliary solid sealant on an upper edge of a mother glass substrate or a cap. A method for manufacturing an electro luminescence device includes the steps of: preparing a mother glass substrate having a plurality of electro luminescence devices(S401); forming an auxiliary solid sealant on an edge of the mother glass substrate(S402); preparing a cap having a solid sealant(S403); adhering the mother glass substrate and the cap(S404); and scribing the mother glass substrate having the cap for obtaining each electro luminescence device(S405).

Description

Method for manufacturing electroluminescent device {Method for Manufacturing Electro luminescence device}

1 is a cross-sectional view of an active matrix organic electroluminescent device of a conventional top-mission method.

2 is a method diagram schematically showing a method of manufacturing the organic electroluminescent device shown in FIG.

3A and 3B are diagrams for illustrating an example of bubbles generated during fabrication of the organic electroluminescent device shown in FIG.

4 is a flowchart sequentially illustrating a method of manufacturing an electroluminescent device as a first embodiment according to the present invention.

5A to 5E are diagrams illustrating a method of manufacturing the electroluminescent device shown in FIG. 4.

FIG. 6 is a plan view illustrating an auxiliary solid sealant formed at an edge of an upper surface of a mother glass substrate in the modified embodiment of FIG. 5B; FIG.

7 is a flowchart sequentially illustrating a method of manufacturing an electroluminescent device as a second embodiment according to the present invention.

8A to 8E are diagrams illustrating a method of manufacturing the electroluminescent element shown in FIG.

FIG. 9 is a modified embodiment of FIG. 8B and illustrates a method of fabricating an EL device. FIG.

FIG. 10 is a modified embodiment of FIG. 4 and illustrates a method of sequentially manufacturing an electroluminescent device. FIG.

FIG. 11 is a modified embodiment of FIG. 7 and illustrates a method of sequentially manufacturing an electroluminescent device. FIG.

* Description of the main parts of the drawings *

502 electroluminescent element 504 mother glass substrate

506: secondary solid sealant 508: solid sealant

510: cap

The present invention relates to a method of manufacturing an electroluminescent device.

Recently, various flat panel displays have been developed to reduce weight and volume, which are disadvantages of cathode ray tubes. Such flat panel displays include liquid crystal displays (hereinafter referred to as "LCDs"), field emission displays (FEDs) plasma display panels (hereinafter referred to as "PDPs") and electrophoresis. There is a luminescence (EL) display device. In order to improve the display quality of such a flat panel display device and to attempt to make a large screen, researches are being actively conducted.

Among flat panel displays, PDP is attracting attention as the most advantageous display device because of its simple structure and manufacturing process, but it is light and simple, but has a high luminous efficiency, low luminance, and high power consumption. On the other hand, active matrix LCDs with thin film transistors ("TFTs") as switching elements are difficult to screen due to the use of semiconductor processes, but demand is increasing as they are mainly used as display elements in notebook computers. have. However, LCDs are difficult to make large areas and consume large power consumption due to the backlight unit. In addition, the LCD has a large optical loss and a narrow viewing angle due to optical elements such as a polarizing filter, a prism sheet, and a diffusion plate.

In contrast, EL display devices are classified into inorganic EL devices and organic EL devices according to the material of the light emitting layer, and are self-luminous devices that emit light by themselves and have a high response speed and high luminous efficiency, luminance, and viewing angle. There is this. Such an organic light emitting diode (OLED), which is an EL element using organic materials among the EL display elements, has a low DC driving voltage, thin film thickness, uniformity of emitted light, easy pattern formation, and light emission comparable to other light emitting devices. It has the advantages of efficiency, all color light emission in the visible region, and is a technical field that is very actively researched for application to display elements.

The organic EL device has a bottom emission method and a top emission method depending on the direction in which light is emitted. In addition, the organic EL device is classified into a passive matrix organic organic light emitting diode (PMOELD) and an active matrix organic organic light emitting diode (AMOELD) according to a driving method. do.

Herein, the active matrix organic electroluminescent device of the top emission method among the organic electroluminescent devices is as follows.

1 is a cross-sectional view of an active matrix organic electroluminescent device of a conventional top emission method.

As shown in FIG. 1, the organic electroluminescent device 100 includes an array substrate 101 having a driving thin film transistor including a gate electrode 101a, an interlayer insulating layer 101b, and source / drain electrodes 101c and 101d. Is formed so that the source / drain electrodes 101c and 101d connected to the source / drain regions of the driving thin film transistor are exposed, and the drain / drain regions of the source / drain regions are Contact holes are formed to expose the surface of the drain electrode 101d line connected to the region.

In addition, the anode electrode 103 is formed on the above-described flat film 102 so as to be electrically connected to the drain electrode 101d of the driving thin film transistor through a contact hole, and is partially formed on the flat film 102. And an insulating film 104 made of nitride or oxide is formed on a part of the anode electrode 103.

In addition, the organic light emitting layer 105 is formed on the above-described anode electrode 103 and the insulating film 104, and the transparent cathode common electrode 106 is formed on the organic light emitting layer 105.

In addition, when the encapsulation process is carried out so that the cap 108 formed with the solid sealant 107 is mounted in order to protect against oxygen or moisture infiltration, the active matrix organic electroluminescent device of the top emission method Is produced.

Here, a method of fabricating an active matrix organic electroluminescent device of the conventional top-mission method is as shown in FIG. 2.

FIG. 2 is a method diagram schematically illustrating a method of manufacturing the organic electroluminescent device shown in FIG. 1.

As shown in FIG. 2, an array substrate (101 in FIG. 1), a flat film (102 in FIG. 1), an anode electrode (103 in FIG. 1), an insulating film (104 in FIG. 1), on which a conventional driving thin film transistor is formed, The mother glass substrate 201 and the solid state sealant 204 on which the plurality of organic electroluminescent elements 202 including the organic emission layer (105 in FIG. 1) and the transparent cathode common electrode (106 in FIG. 1) are formed When the formed cap 203 is bonded, the material of the organic EL device 202 and the material of the solid state sealant 204 have different coefficients of thermal expansion, and thus, as shown in FIGS. 3A and 3B, during the encapsulation process. Bubbles 302 can be generated between the organic electroluminescent element 202 and the solid sealant 204 that have been fired.

When pressure is applied in the vacuum chamber by using a liquid or gas to remove the bubbles 302, moisture existing in the liquid or gas may condense and the side surface of the solid sealant 204 may be exposed to moisture. I can penetrate moisture. Accordingly, the lifespan of the organic EL device is shortened and the production yield as the display device is lowered.

In order to solve the above problems, the present invention forms an auxiliary solid sealant on the top surface of the mother glass substrate or the edge of the cap surface during the encapsulation process, thereby preventing the side surface of the solid sealant from being exposed to oxygen or moisture, thereby It is an object of the present invention to provide an extension of the life of a light emitting device.

Another object of the present invention is to provide an improvement in the production yield as a display element when fabricating an electroluminescent element.

The present invention for solving the above problems is to form a solid sealant on any one of a mother glass substrate or a cap formed with a plurality of electroluminescent elements to be separated from the outside of the solid sealant The method may further include forming an auxiliary solid sealant on a portion of a glass substrate or a cap, and bonding the cap to a mother glass substrate on which a plurality of EL devices are formed.

According to another feature of the invention, the auxiliary solid sealant is characterized in that at least one is formed.

According to another feature of the invention, the thickness of the auxiliary solid sealant is characterized in that it is the same as the thickness when the plurality of electroluminescent elements and the solid state sealant are bonded.

According to another feature of the invention, the auxiliary solid sealant is characterized in that it is formed in any shape of bending or bending.

According to another feature of the invention, after the step of bonding, cutting to obtain each unit electroluminescent device is further characterized in that it is added.

According to another feature of the invention, the electroluminescent device comprises an organic light emitting layer.

Hereinafter, with reference to the accompanying drawings will be described embodiments of the present invention in more detail.

<First Embodiment>

4 is a flowchart sequentially illustrating a method of manufacturing an electroluminescent device as a first embodiment according to the present invention. First, in the method of manufacturing the EL device according to the present invention, a solid state sealant is formed on a portion of a mother glass substrate or a cap on which a plurality of EL devices are formed to form an outer side of the solid state sealant. An auxiliary solid sealant is further formed on any part of the mother glass substrate or the cap so as to be spaced apart from the mother glass, thereby preventing the penetration of oxygen or moisture.

Here, the method of manufacturing an electroluminescent device according to one embodiment of the present invention forms an auxiliary solid sealant on an edge portion of an upper surface of a mother glass substrate on which a plurality of electroluminescent devices are formed, thereby preventing the penetration of oxygen or moisture. Such a method of manufacturing the EL device according to the present invention will be described with reference to FIG. 4.

As shown in FIG. 4, first, in the method of manufacturing the EL device according to the present invention, a mother glass substrate on which a plurality of EL devices are formed is prepared (S401), and an auxiliary solid sealant is formed on an edge of the mother glass substrate. (S402). At this time, the auxiliary solid sealant is formed to be spaced apart from the outside of the solid sealant formed in the cap at a predetermined interval.

Thereafter, a cap on which the solid state sealant is formed is prepared (S403), and the mother glass substrate on which the plurality of electroluminescent elements are formed and the cap on which the solid state sealant is formed are bonded (S404).

Finally, a process of cutting the mother glass substrate on which the cap is formed to obtain each unit EL device is performed (S405).

Here, the method of manufacturing the EL device according to the present invention will be described in more detail with reference to FIGS. 5A to 5D.

5A to 5D are method diagrams showing a method of manufacturing the electroluminescent element shown in FIG. 4.

First, as shown in FIG. 5A, a mother glass substrate 504 having a plurality of electroluminescent elements 502 is prepared first, and a mother glass substrate having a plurality of electroluminescent elements 502 as shown in FIG. 5B. An auxiliary solid sealant 506 is formed at the edge of 504.

In this case, at least one auxiliary solid sealant 506 is formed to be spaced apart from the plurality of EL devices 502 at predetermined intervals. This is present in the liquid or gas when pressure is applied in the vacuum chamber using liquid or gas to remove bubbles generated when the plurality of electroluminescent elements 502 and the solid state sealant 508 are joined later. This is to minimize the exposure of the side surface of the solid sealant 508 due to moisture condensation.

Although not shown, the auxiliary solid sealant 506 is formed in a bent shape using a predetermined pattern mask, and the thickness of the auxiliary solid sealant 506 is a plurality of electroluminescent elements 502 and the solid state sealant 508 are bonded together. It is preferable that it is formed to be the same as the thickness when it becomes.

Thereafter, as shown in FIG. 5C, a cap 510 having a solid sealant 508 is prepared, and a mother glass substrate 504 having a plurality of EL devices (not shown) is formed as shown in FIG. 5D. The cap 510 on which the solid sealant 508 is formed is bonded. At this time, the auxiliary solid sealant 506 is formed to be spaced apart from the outside of the solid sealant 508 formed in the cap 510 at a predetermined interval.

Finally, as illustrated in FIG. 5E, the mother glass substrate 504 on which the cap 510 is formed is cut into lines A ′ to obtain respective unit electroluminescent elements 502.

Here, the above-described plurality of EL devices 502 may be an organic light emitting layer that emits light using an organic material, but the present invention is not limited thereto, and may be an inorganic light emitting layer that emits light using an inorganic material.

On the other hand, it is possible to minimize the exposure of the side surface of the solid-state sealant to water by different methods of manufacturing the electroluminescent device according to the present invention. Looking at the method of manufacturing the electroluminescent device according to the present invention in detail with reference to FIG. same.

FIG. 6 is a plan view illustrating an auxiliary solid sealant formed on an edge of an upper surface of a mother glass substrate in the modified embodiment of FIG. 5B.

As shown in FIG. 6, in the method of manufacturing the EL device according to the present invention, the auxiliary solid sealant 506 is curved to an edge portion of the mother glass substrate 504 on which the EL devices 502 are formed. To form. Since the method of manufacturing the EL device does not use a predetermined pattern mask as compared with the method of manufacturing the EL device described with reference to FIG. 5B, the work speed for bonding may be increased.

In the method of manufacturing the EL device according to the present invention, since the auxiliary solid sealant 506 is formed at the edge portion of the mother glass substrate 504 on which the plurality of EL devices 502 are formed, the solid state sealant 508 Since the side surface is sealed by the auxiliary solid sealant 506, it is possible to prevent exposure to oxygen or moisture. Accordingly, the lifetime of the electroluminescent element is extended and the production yield as the display element is improved.

On the other hand, it is possible to minimize the exposure of the side surface of the solid-state sealant to water by differently manufacturing the electroluminescent device according to the present invention. Looking at the method of manufacturing the electroluminescent device according to the present invention in detail Same as

Second Embodiment

7 is a flowchart sequentially illustrating a method of fabricating an electroluminescent device as a second embodiment according to the present invention. First, in the method of manufacturing the EL device according to the present invention, an auxiliary solid sealant is formed on an edge portion of an upper surface of a cap on which a solid sealant is formed to prevent penetration of oxygen or moisture. Such a method of manufacturing the EL device according to the present invention will be described with reference to FIG. 7.

As shown in FIG. 7, a method of manufacturing an EL device according to the present invention first prepares a cap in which a solid sealant is formed (S701), and forms an auxiliary solid sealant on an edge portion of the cap. (S702). At this time, the auxiliary solid sealant is formed to be spaced apart from the outside of the solid sealant formed in the cap at a predetermined interval.

Thereafter, a mother glass substrate on which a plurality of electroluminescent elements are formed is prepared (S703), and a cap on which a solid sealant is formed and a mother glass substrate on which a plurality of electroluminescent elements are formed are bonded (S704).

Finally, a process of cutting the mother glass substrate on which the cap is formed to obtain each unit EL device is performed (S705).

Here, a method of manufacturing the EL device according to the present invention will be described in more detail with reference to FIGS. 8A to 8E.

8A to 8E are method diagrams showing a method of manufacturing the electroluminescent element shown in FIG. 7.

First, as shown in FIG. 8A, a cap 510 having a solid sealant 508 is prepared, and as shown in FIG. 8B, an auxiliary solid sealant is formed at an edge of the cap 510 having the solid sealant 508 formed therein. 506 is formed.

At this time, the auxiliary solid sealant 506 is formed at least one to be spaced apart from the outside of the solid sealant 508 at a predetermined interval. This is present in the liquid or gas when pressure is applied in the vacuum chamber using liquid or gas to remove bubbles generated when the solid state sealant 508 and the plurality of electroluminescent elements 502, which will be described later, are bonded. This is to minimize the exposure of the side surface of the solid sealant 508 due to moisture condensation.

Although not shown, the auxiliary solid sealant 506 is formed in a bent shape using a predetermined pattern mask, and the thickness of the auxiliary solid sealant 506 is a plurality of electroluminescent elements 502 and the solid state sealant 508 are bonded together. It is preferable that it is formed to be the same as the thickness when it becomes.

Thereafter, as illustrated in FIG. 8C, a mother glass substrate 504 on which a plurality of EL devices 502 are formed is prepared, and as shown in FIG. 8D, a cap 510 having a solid sealant (not shown) is formed; The mother glass substrate 504 on which the plurality of electroluminescent elements 502 are formed is bonded.

Finally, as illustrated in FIG. 8E, the mother glass substrate 504 on which the cap 510 is formed is cut into lines A ′ and A ′ to obtain respective unit electroluminescent elements 502.

Here, the above-described plurality of EL devices 502 may be an organic light emitting layer that emits light using an organic material, but the present invention is not limited thereto, and may be an inorganic light emitting layer that emits light using an inorganic material.

On the other hand, the method of manufacturing the electroluminescent device according to the present invention can be minimized by minimizing the exposure of the side surface of the solid-state sealant to moisture, which will be described in detail with reference to FIG. 9. Same as

FIG. 9 is a modified embodiment of FIG. 8B and is a plan view illustrating an auxiliary solid sealant formed at an edge portion of an upper surface of the solid sealant.

As shown in FIG. 9, in the method of manufacturing the EL device according to the present invention, the auxiliary solid sealant 506 is formed in a curved shape at an edge portion of an upper surface of the cap 510 on which the solid sealant 508 is formed. Since the method of manufacturing the EL device does not use a predetermined pattern mask than the method of manufacturing the EL device described with reference to FIG. 8B, the work speed for bonding may be increased.

In the method of manufacturing the EL device according to the present invention, since the auxiliary solid sealant 506 is formed at the edge portion of the upper surface of the cap 510 on which the solid sealant 508 is formed, the side surface of the solid sealant 508 is an auxiliary solid phase. Since the sealant 506 is sealed, it is possible to prevent exposure to oxygen or moisture. Accordingly, the lifetime of the electroluminescent element is extended and the production yield as the display element is improved.

In addition, in the method of manufacturing the EL device according to the present invention for convenience of description, the auxiliary solid sealant 506 is formed on the edge portion of the cap 510 or the edge portion of the mother glass substrate 504, and then the cap ( Although the solid sealant 508 is formed on the 510 as described above, the present invention is not limited thereto. As shown in FIGS. 10 and 11, an auxiliary solid sealant is formed at an edge portion of a mother glass substrate or an edge portion of a cap. It is also possible to simultaneously form and to form a solid sealant in the cap.

The present invention is not limited thereto, and a plurality of electroluminescent elements are formed on a mother glass substrate, and a solid state sealant is formed on the plurality of electroluminescent elements to form an auxiliary solid sealant to be spaced apart from the outside of the solid state sealant at a predetermined interval. It is also possible.

In addition, in the method for manufacturing the EL device according to the present invention for convenience of description, it has been described by showing that the secondary solid-state sealant is formed and bonded to each of the edge portion of the cap or the edge portion of the mother glass substrate, but the present invention is In order to further prevent exposure to oxygen or moisture, two or more auxiliary solid sealants may be densely formed at the edge portion of the cap or the edge portion of the mother glass substrate, and at the edge portion of the cap or the edge portion of the mother glass substrate, respectively. The auxiliary solid sealant may be formed in two or more densely each one.

Those skilled in the art to which the present invention pertains will understand that the present invention can be implemented in other specific forms without changing the technical spirit or essential features. Therefore, the above-described embodiments are to be understood as illustrative and not restrictive in all respects, and the scope of the present invention is indicated by the appended claims rather than the foregoing description, and the meaning and scope of the claims and All changes or modifications derived from the equivalent concept should be interpreted as being included in the scope of the present invention.

According to the method for manufacturing the electroluminescent device of the present invention made as described above, the following effects can be obtained.

First, by forming an auxiliary solid sealant on the top surface of the mother glass substrate or the edge of the cap surface, by preventing the side surface of the solid sealant from being exposed to oxygen or moisture, there is an effect of extending the life of the electroluminescent device.

Second, when the electroluminescent device is manufactured, there is another effect of improving the production yield as a display device.

Claims (6)

The mother glass substrate or the cap is formed so as to be spaced apart from the outside of the solid state sealant by forming a solid sealant on any one of a mother glass substrate or a cap in which a plurality of EL devices are formed. Further forming an auxiliary solid sealant in any one of the caps, and And bonding the cap to the mother glass substrate on which the plurality of electroluminescent elements are formed. The method of claim 1, At least one auxiliary solid-state sealant is formed. The method of claim 2, The thickness of the auxiliary solid state sealant is the same as the thickness when the plurality of electroluminescent elements and the solid state sealant is bonded. The method of claim 3, wherein The auxiliary solid-state sealant is a method of manufacturing an electroluminescent device, characterized in that formed in any one of bending or bending. The method of claim 1, After the bonding step, the step of cutting to obtain each unit electroluminescent device is further characterized in that the manufacturing method of the electroluminescent device. The method according to any one of claims 1 to 5, The electroluminescent device is a method of manufacturing an electroluminescent device comprising an organic light emitting layer.

Images