KR20070070736A - Apparatus for transferring substrate using hydroplaning - Google Patents

Abstract

An apparatus for transportation of substrate using hydroplaning phenomenon is provided to generate a hydroplaning film on a stage to stably fix the substrate to the stage and to inhibit severe vibration of the substrate, thereby improving precision in line scribing and cutting of the substrate by fabricating the hydroplaning stage and a conveyor for transporting the stage. The apparatus includes: hydroplaning stages(35,45) having hydroplaning film on the surface thereof; and first and second conveyor parts(30,40) to transport the hydroplaning stage. The stage consists of a planar structure that has a plurality of outlets to discharge liquid for the hydroplaning and a hollow part installed inside the stage to feed the liquid to the outlet, which is connected to a feeding line for supplying the liquid to the hollow part. The feeding line has a pump to feed the liquid at a pre-setup pressure to the hollow part.

Description

Apparatus for Transferring Substrate Using Hydroplaning}

1 is a perspective view for explaining a substrate transfer means in a conventional substrate cutting device.

2 is a front view for explaining another conventional substrate transfer means.

Figure 3 is a front view for explaining a substrate transfer apparatus using the water film phenomenon according to the present invention.

Figure 4 is a plan view (A) and a front cross-sectional view (B) for explaining the first embodiment of the table in the present invention.

5 is a plan view (A) and a front cross-sectional view (B) for explaining the second embodiment of the table in the present invention.

Explanation of symbols on the main parts of the drawings

30: first moving part 35: first stage

40: second moving part 45: second stage

50: rotating part 51: suction plate

52: rotating head 53: vacuum pump

60: first wheel 62: second wheel

65 substrate holder 70 substrate

81, 91: upper plate 82, 92: lower plate

83, 93: side plate 85: outlet

95: discharge slit 86, 96: supply line

87, 97: pump 88, 98: water tank

The present invention relates to a substrate transfer apparatus using a water film phenomenon, and more particularly, to a transfer apparatus for moving a substrate relative to a wheel of a scriber in a cutting apparatus for cutting a substrate.

In general, a glass substrate used as a substrate such as a display is produced in a large size, and then cut into sizes according to the use.

The process for cutting brittle material such as the glass substrate is a scribe (Scribe) process for forming a cutting line on the surface of the substrate using a diamond tool having a hardness higher than the glass substrate, and the cutting line formed on the glass substrate It consists of a break process to press and cut to the center.

The scribing process is a process of forming a crack at the cut position of the glass substrate by using a wheel, which is a cutting tool, and the brake process is performed by placing a brake bar made of a material that does not form a scratch on the glass substrate to the crack and then applying a suitable force. When the instantaneous pressure is applied, the crack is cut while extending in the thickness direction of the glass substrate.

Here, the scribing process must transfer the substrate to the scribe wheel to form a scribe line on the substrate.

The transfer of such glass substrates is carried out in the sheet glass cutting tool and trimming apparatus of Patent Publication No. 10-2003-10503 published on February 5, 2003, and Patent Publication No. 10-2004 published on January 31, 2004. The belt feeder used in the cutting device of -10045 is used.

That is, the conventional conveying apparatus shown in FIG. 1 transfers to the trimming apparatus consisting of the cutting part 13, the support part 14, the positioning part 15, etc. in order to trim the glass substrate 16, The said glass substrate In order to convey the 16 to the trimming device, a conveying belt 11 having a flat belt structure is used, and the conveyance of the glass substrate 16 in the trimming device is performed by a plurality of work belts 12 having a flat belt structure. )

In addition, another conventional conveying apparatus shown in FIG. 2 transfers the glass substrate 20 using the belt type conveyor 21, and transfers the glass substrate 20 to the conveyor 21 of the cutting device from the A position to the B position. In the state in which the glass substrate 20 is fixed by using the 25, a scribe line is formed and cut using the support part 22, the pressing part 23, and the cutting part 24, and the other part of the glass substrate 20 is used. The substrate 20 is rotated on the conveyor 20 by using the transfer device 26 and the sucker 27 installed on the conveyor 21 for the process of the side, and the subsequent work is performed.

Since the transfer apparatus of the conventional belt structure made as described above is transported in a state in which the substrate is mounted on the belt, the substrate is also vibrated by vibrations due to the rotation and movement of the belt, thereby making it difficult to accurately cut the substrate.

In addition, there is a problem that takes a lot of process time because the feed rate can not be increased due to the vibration as described above.

An object of the present invention is to provide a substrate transfer apparatus using a water film phenomenon to form a water film on the stage for moving the substrate for substrate cutting to stably fix the substrate.

The present invention, the water film stage is formed on the surface of the water film to achieve the above object; And it provides a substrate transfer apparatus comprising a moving unit for moving the water film stage.

The water film stage has a flat structure, and a plurality of discharge ports for discharging liquid for forming a water film are formed on an upper surface thereof, and a hollow part for supplying liquid to the discharge hole is formed therein to supply liquid to the hollow part. It is characterized in that the connection, the supply line is characterized in that it further comprises a pump for supplying a liquid at a predetermined pressure.

The water film stage has a flat structure, and a plurality of outlets for discharging liquid or gas are formed on an upper surface thereof, and a hollow portion for supplying liquid or gas to the outlet is formed therein, and supplies liquid or gas to the hollow portion. The supply line is connected, characterized in that the supply line comprises at least one of a pump for supplying a liquid at a predetermined pressure, and a compressor for supplying a gas at a predetermined pressure, the supply line is It characterized in that it further comprises a switching means for selecting any one of the pump and the compressor.

The outlet is made of a plurality of circles arranged at equal intervals of four, or characterized in that made of a plurality of slit type arranged at two equal intervals.

The present invention is characterized in that it further comprises a rotating device for rotating the water film stage.

And, the present invention is characterized in that it further comprises a cleaner for removing the foreign matter on the upper surface of the water film stage.

The cleaner may be at least one selected from a vacuum cleaner for removing the foreign substances by vacuum suction or a wiper cleaner for pushing and removing the foreign substances.

The present invention made as described above has the advantage of stably fixing the substrate to be moved on the scribe device or cutting device.

(Example)

The substrate transfer apparatus using the water film phenomenon according to the present invention will be described in detail with reference to the accompanying drawings showing a preferred embodiment of the present invention.

Figure 3 is a front view for explaining a substrate transfer apparatus using the water film phenomenon according to the present invention, Figure 4 is a plan view (A) and a front cross-sectional view (B) for explaining a first embodiment of the table in the present invention 5 is a plan view A and a front sectional view B for explaining the second embodiment of the table in the present invention.

In order to explain the substrate transfer apparatus using the water film phenomenon according to the present invention, a scriber for forming a scribe line for cutting the substrate 70 will be described with reference to FIG. 3.

In FIG. 3, according to the present invention, the first stage 35 and the second stage 45 on which the substrate 70 is placed on its upper surface, and the first stage 35 and the second stage 45 are respectively. First and second moving parts 30 and 40 for reciprocating transfer in both directions, and first wheels 60 and second for forming scribe lines on upper and lower surfaces of the substrate 70. It is composed of a wheel (62) and a rotating part (50) installed on the second stage (45) to lift and rotate the substrate (70) placed on the second stage (45).

Here, in FIG. 3, two stages for transferring the substrate 70 are described as an example. However, in some cases, only one stage may be configured. At this time, the rotating unit 50 is installed on the stage consisting of only one.

The rotating unit 50 rotates 90 degrees after vacuum lifting the substrate 70 by the adsorption plate 51 and lifts it. The lifting device and the rotating device for this purpose are the rotating heads on which the adsorption plate 51 is mounted. 52). In addition, a vacuum pump 53 for forming a vacuum pressure, that is, a negative pressure, is connected to the suction plate 51 to the rotating head 52.

The first stage 35 and the second stage 45 have two types of structures, as shown in the plan view A and the cross-sectional view B of each stage shown in FIGS. 4 and 5.

That is, the first stage 35 and the second stage 45 are the upper plate (81, 91) and the lower plate (82, 92), and the upper plate (so that the hollow portion 84, 94 is formed therein) 81, 91 and side plates (83, 93) for sealing the side cross-sections of the lower plate (82, 92), the upper plate (81, 91) is formed of a plurality of spaced at four equal intervals Outlet 85 or a plurality of slits 95 formed in a slit shape and arranged at two equal intervals are formed.

In addition, supply lines 86 and 96 for supplying a liquid (for example, water) for forming a water film to the hollow portions 84 and 94 formed in the first stage 35 and the second stage 45. ) Is connected, and the supply lines 86 and 96 receive liquids from the water tanks 88 and 98 through the pumps 87 and 97 and supply them to the hollow portions 84 and 94.

The first stage 35 and the second stage 45 configured as described above are installed in the first moving part 30 and the second moving part 40, respectively, and the first moving part 30 and the second moving part 40 are provided. The moving unit 40 has a function of reciprocating the first stage 35 and the second stage 45, respectively.

The first moving part 30 or the second moving part 40, in addition to the reciprocating movement function as described above, the rotary device for rotating the first stage 35 and the second stage 45 respectively installed on the upper (Not shown) may be included to rotate the substrate 70 by 90 degrees immediately after the scribe line forming or cutting process is completed once so that subsequent processes may be performed.

In order to contact the substrate 70 to the first stage 35 or the second stage 45 configured as described above, the pump to form a water film on the first stage 35 and the second stage 45. (87, 97) is operated to supply the liquid in the water tanks (88, 98) into the hollows (84, 94) and to discharge it to the outlet (85) or the slit (95) to provide the upper surfaces (81, 91). To form a water film on the surface.

When the substrate 70 is placed on the first stage 35 and the second stage 45 where the water film is formed as described above, the lower surface of the substrate 70 is the first stage 35 and the second stage 45. Since the first moving part 30 and the second moving part 40 are driven to be in close contact with the upper part of the upper side of the substrate), the substrate 70 remains in the first stage 35 and the second stage 45 even when vibration occurs. It can be stably fixed to the phase.

As described above, when the adhesion between the first stage 35 and the second stage 45 and the substrate 70 is formed and a close film is formed between the two plates, a vacuum is formed between the plates. It is using the phenomenon that the contact with each other.

On the other hand, after the substrate 70 is placed on the first stage 35 and the second stage 45 as described above, after the scribe process or the cutting process, the substrate 70 is formed with a water film. In order to separate from the 1st stage 35 and the 2nd stage 45, it does not separate easily from each other by the water film | membrane as mentioned above.

To this end, in the present invention, by operating the pump (87, 97) to form a pressure higher than atmospheric pressure between the substrate 70 and the first stage 35 and the second stage 45 to easily separate each other To do it.

At this time, the separation of the substrate 70 may use the adsorption plate 51 of the rotating unit 50.

In particular, the present invention is a fragment of the substrate 70 derived from the cutting process when the cutting process of the substrate 70 is performed on the first stage 35 and the second stage 45 in which the water film is formed as described above. It can prevent that it is scattered by the liquid which forms this water film.

In addition, in the present invention, if there is a foreign material having a volume such as substrate fragments on the first stage 35 and the second stage 45 configured as described above, the substrate 70 is not adhered by the water film, so that the first A cleaner (not shown) for cleaning the surfaces on the stage 35 and the second stage 45 is further included.

The cleaner is preferably composed of a vacuum cleaner for removing the foreign matter by vacuum suction, a wiper cleaner for pushing out the foreign matter, or two mixing methods.

In addition, in order to easily separate the substrate 70 in which the process is completed in the first stage 35 and the second stage 45, the pumps 87 and 97 are operated in the above description so that the substrate 70 is operated. However, the separation of the liquid by supplying the liquid between the first stage 35 and the second stage 45 to overcome the atmospheric pressure applied to the surface of the substrate 70 has been described. After connecting a switching valve (not shown) to the lines 86 and 96, and connecting an air compressor (not shown), the pump 87 only during the scribe line forming process or the cutting process for the substrate 70. 97 is supplied through the liquid, and when the substrate 70 is separated from the first stage 35 and the second stage 45, the switching valve is switched to the air compressor and supplied by the air compressor. By supplying the compressed air between the substrate 70 and the first stage 35 and the second stage 45 to overcome the atmospheric pressure applied to the surface of the substrate 70 while at the same time forming a liquid film Removal to more easily separate the substrate 70.

The present invention made as described above forms a water film on the stage to move the substrate for cutting the substrate to stably fix the substrate, thereby forming a precise scribe line for the substrate by suppressing excessive vibration of the substrate by the moving means Or the effect of enabling cutting.

Claims (11)

A water film stage on which a water film is formed; And A moving unit for moving the water film stage; Substrate transfer apparatus comprising a. The liquid film stage of claim 1, wherein the water film stage has a flat structure, and a plurality of discharge ports for discharging liquid for forming a water film are formed on an upper surface thereof, and a hollow part for supplying liquid to the discharge holes is formed therein. Substrate transport apparatus characterized in that the supply line for supplying a liquid is connected. The substrate transport apparatus of claim 2, wherein the supply line further comprises a pump for supplying a liquid at a predetermined pressure. The liquid film stage of claim 1, wherein the water film stage has a flat structure, and a plurality of outlets for discharging liquid or gas are formed on an upper surface thereof, and a hollow portion for supplying liquid or gas to the outlet is formed therein, Substrate transport apparatus characterized in that the supply line for supplying a liquid or gas is connected. The substrate transfer apparatus of claim 4, wherein the supply line includes at least one of a pump for supplying liquid at a predetermined pressure and a compressor for supplying gas at a predetermined pressure. 6. The substrate transport apparatus of claim 5, wherein the supply line further comprises a switching means for selecting any one of the pump and the compressor. 5. The substrate transport apparatus of claim 2 or 4, wherein the outlet is formed of a plurality of circles arranged at four equal intervals. 5. The substrate transport apparatus of claim 2 or 4, wherein the outlet has a plurality of slit shapes arranged at two equal intervals. The substrate transfer apparatus of claim 1, further comprising a rotating device for rotating the water film stage. The substrate transfer apparatus of claim 1, further comprising a cleaner for removing foreign matter from the upper surface of the water film stage. The substrate transport apparatus of claim 10, wherein the cleaner is at least one selected from a vacuum cleaner for removing the foreign matter by vacuum suction or a wiper cleaner for pushing out the foreign matter.

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