KR20070067954A - Liquid epoxy resin composition for underfill - Google Patents
Liquid epoxy resin composition for underfill Download PDFInfo
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- KR20070067954A KR20070067954A KR1020050129530A KR20050129530A KR20070067954A KR 20070067954 A KR20070067954 A KR 20070067954A KR 1020050129530 A KR1020050129530 A KR 1020050129530A KR 20050129530 A KR20050129530 A KR 20050129530A KR 20070067954 A KR20070067954 A KR 20070067954A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/44—Amides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5006—Amines aliphatic
- C08G59/5013—Amines aliphatic containing more than seven carbon atoms, e.g. fatty amines
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
Abstract
Description
본 발명은 에폭시 수지 조성물에 관한 것으로서, 더욱 상세하게는 구동 직접회로(Integrated circuit IC) 등의 전자부품을 회로기판에 실장하는 칩 온 보드(Chip on Board; COB) 공정의 봉지재로 사용되는 액상 봉지용 에폭시 수지 조성물에 관한 것이다.The present invention relates to an epoxy resin composition, and more particularly, a liquid phase used as an encapsulant in a chip on board (COB) process for mounting electronic components such as an integrated circuit IC on a circuit board. It relates to the epoxy resin composition for sealing.
최근, 휴대 전화기, 노트북 컴퓨터, 벽걸이 텔레비전 등 전자기기의 경량화, 소형화, 박형화 추세에 따라, 극소형 패키지 부품의 사용이 증가하고 있다. IC 등의 반도체 공정으로 제조된 칩을 인쇄회로기판에 실장하는 일련의 포장 과정을 패키징(packaging)이라 하는데, 이때 외부에서의 물리·화학적 충격으로부터 반도체 소자를 보호하기 위하여 플라스틱 재질로 몰딩을 실시한다. 이와 같은 패키징 방법으로, 종래에는 유리섬유강화 인쇄회로기판 위에 회로를 형성하고, IC를 실장한 다음, 금재질의 와이어로 회로를 연결하고, 에폭시 수지로 덮는 글로브탑 공정이 일 반적으로 사용되었으나, 이러한 글로브탑 공정은 고가의 금을 회로에 사용하기 때문에 제조비용이 증가하는 문제점 및 IC 패키지가 크기 때문에, 패키지 부품의 경박단소화가 어려운 문제점이 있다. In recent years, the use of ultra-small package parts has been increasing in accordance with the trend of lighter, smaller, and thinner electronic devices such as mobile phones, notebook computers, and wall-mounted televisions. A series of packaging processes in which chips manufactured by semiconductor processes such as ICs are mounted on a printed circuit board is called packaging, in which molding is made of plastic material to protect semiconductor devices from external physical and chemical shocks. . As such a packaging method, conventionally, a glove top process of forming a circuit on a glass fiber reinforced printed circuit board, mounting an IC, connecting the circuit with a gold wire, and covering with an epoxy resin was generally used. Since the globe top process uses expensive gold in a circuit, there is a problem in that manufacturing cost increases and an IC package is large.
상기 문제점을 해결하기 위하여, 최근에는 솔더 볼(solder ball)을 사용하여, 인쇄회로기판 상부와 IC를 연결한 후, 그 사이를 에폭시 수지로 채우는 칩 온 보드(Chip on Board; COB) 언더필 공정이 개발되었다. COB 공정에서의 기판과 IC 사이의 갭(gap)은 일반적으로 100m 이하이며, 갭은 점점 줄어들어 수십 m에 도달할 것으로 기대된다. 이러한 COB 언더필 공정에 있어서, 상기 글로브탑 공정에서 사용되는 봉지재인 다량의 무기 충진제와 용제로 이루어진 글로브탑 수지를 봉지재로 사용할 경우, 충진성 및 침투성이 불량하여, 불균일한 경화가 발생된다. 따라서, 충진성, 침투성이 우수하고, 균일한 경화가 이루어질 수 있는 COB 공정용 봉지재의 개발이 시급하다. In order to solve the above problem, recently, a chip on board (COB) underfill process is performed in which a solder ball is used to connect an upper portion of a printed circuit board to an IC and then fill the gap with an epoxy resin therebetween. Developed. In the COB process, the gap between the substrate and the IC is typically less than 100m, and the gap is expected to shrink gradually to reach tens of meters. In such a COB underfill process, when a glove top resin composed of a large amount of an inorganic filler and a solvent used in the glove top process is used as an encapsulant, filling properties and poor permeability are poor, resulting in uneven curing. Therefore, it is urgent to develop a COB process encapsulant that is excellent in fillability and permeability and can be uniformly cured.
따라서, 본 발명의 목적은 침투성 및 충진성(언더필성)이 우수하고, 넓은 칩면의 전체 범위에 걸쳐 균일하게 경화될 수 있는 액상 봉지용 에폭시 수지 조성물을 제공하는 것이다. Accordingly, an object of the present invention is to provide an epoxy resin composition for liquid encapsulation that is excellent in permeability and filling (underfill) and can be uniformly cured over the entire range of a wide chip surface.
본 발명의 다른 목적은 열경화 시간이 짧고, 열경화시 휘발성분 및 기포의 발생이 적어, 생산성 및 작업성이 우수한 액상 봉지용 에폭시 수지 조성물을 제공하는 것이다. Another object of the present invention is to provide an epoxy resin composition for liquid encapsulation having a short thermal curing time, less generation of volatile components and bubbles during thermal curing, and excellent productivity and workability.
본 발명의 또 다른 목적은 부적합한 작업 또는 사용자의 실수에 의하여 IC와 인쇄회로기판의 연결이 떨어졌을 때, 이를 수리할 수 있는 액상 봉지용 에폭시 수지 조성물을 제공하는 것이다.Still another object of the present invention is to provide an epoxy resin composition for liquid encapsulation that can be repaired when the connection between the IC and the printed circuit board is dropped due to improper operation or user error.
상기 목적을 달성하기 위하여, 본 발명은 분자당 2개 이상의 글리시딜기를 함유하는 액상 에폭시 수지(A) 100중량부; 분자당 2개 이상의 글리시딜기를 함유하는 비스페놀A-프로필렌 옥사이드형(BPA-PO) 에폭시 수지(B) 10 내지 100중량부; 분자당 1개 이상의 글리시딜기를 함유하는 반응성 희석제(C) 10 내지 50중량부; 및 상기 에폭시 수지 및 반응성 희석제 혼합물(A+B+C) 100중량부에 대하여 변성 지방족 폴리아민 경화제(D) 20 내지 100중량부를 포함하는 액상 봉지용 에폭시 수지 조성물을 제공한다. 상기 액상 봉지용 에폭시 수지 조성물은 25℃에서의 점도가 2,000 내지 10,000cps이고, 100℃에서의 겔화 시간(gel-time)이 300초 이하이며, 25℃에서의 가사 시간(pot life)이 24시간 이상이다. In order to achieve the above object, the present invention is 100 parts by weight of a liquid epoxy resin (A) containing two or more glycidyl groups per molecule; 10 to 100 parts by weight of a bisphenol A-propylene oxide type (BPA-PO) epoxy resin (B) containing two or more glycidyl groups per molecule; 10 to 50 parts by weight of a reactive diluent (C) containing one or more glycidyl groups per molecule; And 20 to 100 parts by weight of the modified aliphatic polyamine curing agent (D) based on 100 parts by weight of the epoxy resin and the reactive diluent mixture (A + B + C). The epoxy resin composition for liquid encapsulation has a viscosity of 2,000 to 10,000 cps at 25 ° C., a gel-time at 300 ° C. of 300 seconds or less, and a pot life at 25 ° C. for 24 hours. That's it.
이하, 본 발명을 더욱 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in more detail.
본 발명에 따른 액상 봉지용 에폭시 수지 조성물은 분자당 2개 이상의 글리시딜기를 함유하는 액상 에폭시 수지(A) 100중량부; 분자당 2개 이상의 글리시딜기를 함유하는 비스페놀A-프로필렌 옥사이드형(BPA-PO) 에폭시 수지(B) 10 내지 100중량부; 분자당 1개 이상의 글리시딜기를 함유하는 반응성 희석제(C) 10 내지 50중 량부; 및 상기 에폭시 수지 및 반응성 희석제 혼합물(A+B+C) 100 중량부에 대하여 변성 지방족 폴리아민 경화제(D) 20 내지 100중량부를 포함한다.Liquid sealing epoxy resin composition according to the present invention 100 parts by weight of the liquid epoxy resin (A) containing two or more glycidyl groups per molecule; 10 to 100 parts by weight of a bisphenol A-propylene oxide type (BPA-PO) epoxy resin (B) containing two or more glycidyl groups per molecule; 10 to 50 parts by weight of a reactive diluent (C) containing one or more glycidyl groups per molecule; And 20 to 100 parts by weight of the modified aliphatic polyamine curing agent (D) based on 100 parts by weight of the epoxy resin and the reactive diluent mixture (A + B + C).
본 발명에 따른 상기 액상 에폭시 수지(A)는 상온에서 액상이며, 분자당 2개 이상의 글리시딜기를 함유하는 이관능형(di-functional) 또는 다관능형(multi- functional) 에폭시 수지로서, 경화 가능한 액상 에폭시 수지를 광범위하게 사용할 수 있다. 상기 액상 에폭시 수지(A)로는 비스페놀 Ａ형 에폭시 수지, 비스페놀 Ｆ형 에폭시 수지 등을 예시할 수 있고, 이들을 단독 또는 혼합하여 사용할 수 있다. 상기 비스페놀 A형 에폭시 수지의 구체적인 예로는 에피코트 YL-980(자판에폭시 주식회사제), RE-310(일본화약제), DER-332(다우케미칼제), 830CRP(대일본 잉크주식회사제) 등을 예시할 수 있으며, 상기 비스페놀 F형 에폭시 수지의 구체적인 예로는 에피코트 YL-983U(자판에폭시 주식회사제), RE-304(일본화약제), RE-404(일본화약제) 등을 예시할 수 있다.The liquid epoxy resin (A) according to the present invention is a liquid at room temperature, a di- or multi-functional epoxy resin containing two or more glycidyl groups per molecule, and a curable liquid Epoxy resins can be widely used. As said liquid epoxy resin (A), bisphenol-A epoxy resin, bisphenol F-type epoxy resin, etc. can be illustrated, These can be used individually or in mixture. Specific examples of the bisphenol A epoxy resin include Epicoat YL-980 (manufactured by Japan Epoxy Co., Ltd.), RE-310 (manufactured by Nippon Kayaku Co., Ltd.), DER-332 (manufactured by Dow Chemical), 830CRP (manufactured by Japan Nippon Ink Co., Ltd.), and the like. Specific examples of the bisphenol F-type epoxy resin may include epicoat YL-983U (manufactured by JAPAN Epoxy Co., Ltd.), RE-304 (Japanese chemicals), RE-404 (Japanese chemicals), and the like. .
비스페놀 A형 에폭시 수지에 프로필렌 옥사이드가 부가된 상기 비스페놀A-프로필렌 옥사이드형(BPA-PO) 에폭시 수지(B)는 경화물의 유연성을 증가시켜, 낙하 충격시 IC와 인쇄회로기판의 탈락을 방지하기 위한 것으로서, 분자당 2개 이상의 글리시딜기를 함유하는 이관능형 또는 다관능형 비스페놀 A형 에폭시 수지에 2개 이상의 프로필렌 옥사이드가 부가된 에폭시 수지를 광범위하게 사용할 수 있으며, 구체적인 예로는 EP-4000S, EP-4000SS, EP-4003S, EP-4010S, EP-4011S(이상 아사히 덴카 주식회사제) 등을 예시할 수 있다. The bisphenol A-propylene oxide type (BPA-PO) epoxy resin (B), in which propylene oxide is added to the bisphenol A type epoxy resin, increases the flexibility of the cured product to prevent the IC and the printed circuit board from falling off during a drop impact. As the bifunctional or polyfunctional bisphenol A epoxy resin containing two or more glycidyl groups per molecule, epoxy resins in which two or more propylene oxides are added can be widely used. Specific examples thereof include EP-4000S and EP-. 4000SS, EP-4003S, EP-4010S, EP-4011S (above Asahi Denka Corporation make), etc. can be illustrated.
상기 비스페놀A-프로필렌 옥사이드형(BPA-PO) 에폭시 수지(B)의 첨가량은 상기 액상 에폭시 수지(A) 100중량부에 대하여 10 내지 100중량부가 바람직하고, 20 내지 60중량부이면 더욱 바람직하다. 상기 비스페놀A-프로필렌 옥사이드형(BPA-PO) 에폭시 수지(B)의 첨가량이 10중량부 미만이면 최종 조성물의 유연성이 낮을 우려가 있고, 100중량부를 초과하면 경화물의 반응속도가 늦어질 우려가 있다. 10-100 weight part is preferable with respect to 100 weight part of said liquid epoxy resins (A), and, as for the addition amount of the said bisphenol A-propylene oxide type (BPA-PO) epoxy resin (B), it is more preferable if it is 20-60 weight part. If the addition amount of the bisphenol A-propylene oxide type (BPA-PO) epoxy resin (B) is less than 10 parts by weight, the flexibility of the final composition may be low, and if it exceeds 100 parts by weight, the reaction rate of the cured product may be slowed. .
본 발명에 따른 상기 반응성 희석제(C)는 조성물의 점도를 조절하기 위한 것으로서, 분자당 1개 이상의 글리시딜기를 함유하는 화합물을 광범위하게 사용할 수 있으며, 예를 들면 알킬모노글리시딜에테르, 부틸페닐글리시딜에테르, 알킬페놀모노글리시딜에테르, 폴리글리콜디글리시딜에테르, 알킬디글리시딜에테르 등을 단독 또는 혼합하여 사용할 수 있다. 구체적으로 상기 반응성 희석제(C)중 분자당 1개의 글리시딜기를 갖는 단관능형 화합물은 YED-111E, YED122(이상 자판에폭시 주식회사제), ED-501, ED-502, ED-509S, ED-529, ED-518(이상 아사히덴카 주식회사제) 등이 있으며, 분자당 2개의 글리시딜기를 갖는 이관능형 화합물은 YED-216(자판에폭시 주식회사제), ED-503, ED-506, ED-523T, ED-515(이상 아사히덴카 주식회사제) 등이 있고, 분자당 3개 이상의 글리시딜기를 갖는 다관능형 화합물은 YED205(자판에폭시 주식회사제), ED-505R(아사히덴카 주식회사제) 등을 예시할 수 있다. The reactive diluent (C) according to the present invention is for controlling the viscosity of the composition, it is possible to use a wide range of compounds containing at least one glycidyl group per molecule, for example, alkyl monoglycidyl ether, butyl Phenylglycidyl ether, alkylphenol monoglycidyl ether, polyglycol diglycidyl ether, alkyl diglycidyl ether, etc. can be used individually or in mixture. Specifically, the monofunctional compound having one glycidyl group per molecule in the reactive diluent (C) is YED-111E, YED122 (manufactured by Zadok Epoxy Co., Ltd.), ED-501, ED-502, ED-509S, ED-529. , ED-518 (above Asahi Denka Co., Ltd.) and the like, and bifunctional compounds having two glycidyl groups per molecule include YED-216 (manufactured by Keyboard Epoxy Co., Ltd.), ED-503, ED-506, ED-523T, The polyfunctional compound which has ED-515 (above Asahi Denka Co., Ltd.) etc., and has three or more glycidyl groups per molecule can illustrate YED205 (made by Keyboard Epoxy Co., Ltd.), ED-505R (made by Asahi Denka Co., Ltd.), etc. have.
상기 반응성 희석제(C)의 첨가량은 상기 액상 에폭시 수지(A) 100중량부에 대하여 10 내지 50중량부가 바람직하고, 20 내지 40중량부이면 더욱 바람직하다. 상기 반응성 희석제(C)의 첨가량이 10중량부 미만이면 조성물의 점도가 충분히 저하되지 않을 우려가 있고, 50중량부를 초과하면 경화물의 기계적 물성 저하가 발생될 우려가 있다. 10-50 weight part is preferable with respect to 100 weight part of said liquid epoxy resins (A), and, as for the addition amount of the said reactive diluent (C), it is more preferable if it is 20-40 weight part. If the amount of the reactive diluent (C) added is less than 10 parts by weight, the viscosity of the composition may not be sufficiently lowered. If it is more than 50 parts by weight, the mechanical properties of the cured product may be lowered.
본 발명에 따른 상기 변성 지방족 폴리아민 경화제(D)는 가열에 의해 경화되는 잠재성 경화재로서, 상기 에폭시 수지 및 반응성 희석제 혼합물(A+B+C)을 80℃에서 30분 이내에 95%이상 반응시킬 수 있는 것이 바람직하다. 상기 지방족 폴리아민 경화제(D)는 아민 화합물, 이미다졸 화합물, 변성 아민 화합물 및 변성 이미다졸 화합물 등을 단독 또는 혼합하여 사용할 수 있고, 구체적으로는 EH-4070S, EH-4357S(이상 아사히덴카 주식회사제) 등을 예시할 수 있다. The modified aliphatic polyamine curing agent (D) according to the present invention is a latent curing material which is cured by heating, and the epoxy resin and the reactive diluent mixture (A + B + C) can be reacted by 95% or more within 30 minutes at 80 ° C. It is desirable to have. The aliphatic polyamine curing agent (D) may be used alone or in combination of amine compounds, imidazole compounds, modified amine compounds and modified imidazole compounds, specifically, EH-4070S, EH-4357S (above Asahi Denka Co., Ltd.) Etc. can be illustrated.
상기 변성 지방족 폴리아민 경화제(D)의 첨가량은 상기 에폭시 수지 및 반응성 희석제 혼합물(A+B+C) 100중량부에 대하여 20 내지 100중량부가 바람직하고, 30 내지 80중량부이면 더욱 바람직하다. 상기 변성 지방족 폴리아민 경화제(D)의 첨가량이 20중량부 미만이면 반응시간이 늦어져 30분 이내에 충분한 반응에 도달할 수 없고, 100중량부를 초과하면 가사시간이 짧아지고, 미반응 경화제가 잔류하여 기계적 물성이 저하될 우려가 있다.20-100 weight part is preferable with respect to 100 weight part of said epoxy resin and reactive diluent mixture (A + B + C), and, as for the addition amount of the said modified aliphatic polyamine hardening | curing agent (D), it is more preferable if it is 30-80 weight part. If the amount of the modified aliphatic polyamine curing agent (D) is less than 20 parts by weight, the reaction time is delayed and sufficient reaction cannot be reached within 30 minutes, and if it is more than 100 parts by weight, the pot life is shortened, and the unreacted curing agent remains and mechanically There is a possibility that the physical properties are lowered.
본 발명에 따른 상기 액상 봉지용 에폭시 수지 조성물은 25℃에서의 점도가 2,000 내지 10,000cps로서, 저점도이고, 100℃에서의 겔화 시간이 300초 이하, 바람직하게는 100초 내지 200초이며, 25℃에서의 가사 시간이 24시간 이상인 것이 바 람직하다. 상기 액상 봉지용 에폭시 수지 조성물의 점도가 2,000cps 미만일 경우, 경화반응이 늦어지는 문제가 있고, 10,000cps 초과할 경우 칩과 기판사이의 갭에 에폭시 수지 조성물이 침투하는 시간이 길어지거나, 갭을 완전히 충진시키지 못할 우려가 있다. 상기 겔화 시간이 300초를 초과할 경우, 작업 생산성이 저하될 우려가 있고, 또한 가사 시간이 24시간 미만인 경우, 수지 작업중 점도가 급격히 증가하여 칩과 기판사이의 갭에 에폭시 수지 조성물이 침투하는 시간이 길어지거나, 갭을 완전히 충진시키지 못할 우려가 있다.The epoxy resin composition for liquid encapsulation according to the present invention has a viscosity of 2,000 to 10,000 cps at 25 ° C., a low viscosity, and a gelation time at 100 ° C. of 300 seconds or less, preferably 100 to 200 seconds, 25 Preferably, the pot life at < RTI ID = 0.0 > If the viscosity of the liquid-encapsulating epoxy resin composition is less than 2,000cps, there is a problem that the curing reaction is slow, and if the viscosity exceeds 10,000cps, the time for the epoxy resin composition to penetrate the gap between the chip and the substrate is long, or the gap is completely There is a risk of filling. If the gelation time exceeds 300 seconds, there is a fear that the work productivity is lowered, and if the pot life is less than 24 hours, the viscosity during the resin operation increases rapidly, the time that the epoxy resin composition penetrates into the gap between the chip and the substrate This may be long or may not completely fill the gap.
또한, 본 발명에 따른 상기 액상 봉지용 에폭시 수지 조성물은 필요에 따라, 통상의 무기물 충전제, 실란 커플링제, 소포제, 안료, 염료, 경화 촉진제 등의 첨가제를 더욱 포함할 수 있다. 본 발명에 따른 액상 봉지용 에폭시 수지 조성물은 공지된 통상의 방법으로 상기 각 성분들을 충분히 혼합하여 제조할 수 있으며, 예를 들면 진공 상태에서 공자전 믹서, 만능 혼합기 등을 이용하여 상기 각 성분을 균일하게 혼합하여 제조할 수 있다. 상기의 방법으로 제조된 본 발명에 따른 에폭시 수지 조성물은, 열경화성 일액형 에폭시 수지 조성물로서, 인쇄회로기판 위에 플립 칩 등을 COB 패키징 방법으로 실장할 때 사용하는 봉지재로 특히 유용하다. In addition, the epoxy resin composition for liquid encapsulation according to the present invention may further include additives such as conventional inorganic fillers, silane coupling agents, antifoaming agents, pigments, dyes, curing accelerators, and the like. The epoxy resin composition for liquid encapsulation according to the present invention may be prepared by sufficiently mixing the respective components by a known conventional method, for example, uniformizing the respective components using a co-rotating mixer, a universal mixer, etc. in a vacuum state. Can be prepared by mixing. The epoxy resin composition according to the present invention prepared by the above method is a thermosetting one-component epoxy resin composition, and is particularly useful as an encapsulant used when mounting flip chips or the like on a printed circuit board by a COB packaging method.
이하, 실시예 및 비교예를 통하여 본 발명을 더욱 구체적으로 설명하나, 본 발명이 하기 실시예에 의하여 한정되는 것은 아니다. Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to the following Examples.
[실시예 1] 액상 봉지용 에폭시 수지조성물 제조 Example 1 Preparation of Epoxy Resin Composition for Liquid Encapsulation
비스페놀 F형 에폭시 수지(자판에폭시사제, 상품명: 에피코트 YL-983U 80중량부, BPA-PO형 에폭시 수지(아사히덴카 주식회사제, 상품명:EP-4000S) 20중량부, 일관능성 반응성 희석제(아사히덴카 주식회사제, 상품명:ED-509S) 10중량부, 변성 지방족 폴리아민 경화제(아사히덴카 주식회사제, 상품명:EH-4357S) 40중량부 및 실란 커플링제(일본 유니카사제, 상품명:A-187) 2중량부를 혼합하여 액상 봉지용 에폭시 수지 조성물을 제조하였다.Bisphenol F type epoxy resin (made by keyboard epoxy company, brand name: Epicoat YL-983U 80 weight part, 20 weight part of BPA-PO type epoxy resin (made by Asahi Denka Co., Ltd., brand name: EP-4000S), a consistent functional reactive diluent (Asahi Denka) Corporation, brand name: ED-509S) 10 parts by weight, 40 parts by weight of a modified aliphatic polyamine curing agent (manufactured by Asahi Denka Co., Ltd., brand name: EH-4357S) and 2 parts by weight of a silane coupling agent (manufactured by Nippon Unicar Company, brand name: A-187) Mixing to prepare an epoxy resin composition for liquid encapsulation.
[실시예 2] 액상 봉지용 에폭시 수지 조성물 제조 Example 2 Preparation of an epoxy resin composition for liquid sealing
비스페놀 A형 에폭시 수지(대일본 잉크주식회사제, 상품명: 에피클론 830CRP 70중량부, BPA-PO형 에폭시 수지(아사히덴카 주식회사제, 상품명: EP-4003S) 30중량부, 일관능성 반응성 희석제(아사히덴카 주식회사제, 상품명: ED-509S) 15중량부, 변성 지방족 폴리아민 경화제(아사히덴카 주식회사제, 상품명: EH-4357S) 50중량부 및 실란 커플링제(일본 유니카사제, 상품명:A-187) 2중량부를 혼합하여 액상 봉지용 에폭시 수지 조성물을 제조하였다.Bisphenol A type epoxy resin (manufactured by Japan Nippon Ink Co., Ltd., brand name: Epiclone 830CRP 70 parts by weight, BPA-PO type epoxy resin (manufactured by Asahi Denka Co., Ltd., product name: EP-4003S) 30 parts by weight, monofunctional reactive diluent (Asahi Denka) 15 parts by weight of a manufactured, trade name: ED-509S), 50 parts by weight of a modified aliphatic polyamine curing agent (manufactured by Asahi Denka Co., Ltd., trade name: EH-4357S) and 2 parts by weight of a silane coupling agent (manufactured by Nippon Unicar Company, trade name: A-187) Mixing to prepare an epoxy resin composition for liquid encapsulation.
[비교예 1] 액상 봉지용 에폭시 수지 조성물 제조 Comparative Example 1 Preparation of an epoxy resin composition for liquid sealing
비스페놀 A형 에폭시 수지(자판에폭시사제, 상품명:에피코트 YL-980) 80중량부, BPA-PO형 에폭시 수지(아사히덴카 주식회사제, 상품명:EP-4010S) 20중량부, 일관능성 반응성 희석제(아사히덴카 주식회사제, 상품명:ED-509S) 10중량부, 변성 지방족 폴리아민 경화제(아사히덴카 주식회사제, 상품명:EH-4357S) 10중량부 및 실란 커플링제(일본 유니카사제, 상품명:A-187) 1중량부를 혼합하여 액상 봉지용 에폭시 수지 조성물을 제조하였다.80 weight part of bisphenol A type epoxy resin (made by keyboard epoxy company, brand name: Epicoat YL-980), 20 weight part of BPA-PO type epoxy resin (product made by Asahi Denka Co., Ltd., brand name: EP-4010S), a monofunctional reactive diluent (Asahi) Ten parts by weight of Tenka Corporation, brand name: ED-509S, 10 parts by weight of a modified aliphatic polyamine curing agent (manufactured by Asahi Denka Co., Ltd., brand name: EH-4357S) and 1 weight of silane coupling agent (manufactured by Nippon Unicar Company, brand name: A-187) The parts were mixed to prepare an epoxy resin composition for liquid encapsulation.
[비교예 2] 액상 봉지용 에폭시 수지 조성물 제조 Comparative Example 2 Preparation of an epoxy resin composition for liquid sealing
비스페놀 F형 에폭시 수지(자판에폭시사제, 상품명:에피코트 YL 983U) 70중량부, BPA-PO형 에폭시 수지(아사히덴카 주식회사제, 상품명:EP-4000S) 30중량부, 변성 지방족 폴리아민 경화제(아사히덴카 주식회사제, 상품명:EH-4357S) 110중량부 및 실란 커플링제(일본 유니카사제, 상품명:A-187) 2중량부를 혼합하여 액상 봉지용 에폭시 수지 조성물을 제조하였다.70 weight part of bisphenol F-type epoxy resin (made by keyboard epoxy company, brand name: Epicoat YL 983U), 30 weight part of BPA-PO type epoxy resin (made by Asahi Denka Co., Ltd., brand name: EP-4000S), a modified aliphatic polyamine hardener (Asa Hidenka 110 weight part of product made by Corporation, brand name: EH-4357S, and 2 weight part of silane coupling agents (made by Nippon Unicar Company, brand name: A-187) were mixed, and the epoxy resin composition for liquid sealing was manufactured.
상기 실시예 1, 2 및 비교예 1, 2에서 제조된 액상 봉지용 에폭시 수지 조성물의 점도, 겔화 시간, 가사 시간 및 충진성을 하기 방법에 따라 측정하고, 그 결과를 하기 표 1에 나타내었다.The viscosity, gelation time, pot life and filling properties of the epoxy resin composition for liquid encapsulation prepared in Examples 1 and 2 and Comparative Examples 1 and 2 were measured according to the following methods, and the results are shown in Table 1 below.
1)점도: Cone & Plate형 Haake 점도계를 사용하여 25℃에서 측정. 1) Viscosity: Measured at 25 ° C using a Cone & Plate Haake Viscometer.
2)겔화 시간: 융점측정기(피셔사이언티픽사제)를 이용하여 마이크로슬라이드 글라스의 위에 조성물을 한방울 떨어뜨리고, 나무막대를 이용하여 조성물을 저었을 때 굳어져 저어지지 않는 시간을 100℃에서 측정.2) Gelation time: A drop of the composition on the microslide glass using a melting point measuring instrument (manufactured by Fisher Scientific), and the time that does not harden when the composition is stirred using a wooden bar at 100 ℃.
3)가사 시간: 25℃의 실온에 보관하면서, 초기 점도값의 1.3배가 되는 시간을 측정. 3) Addition time: The time which becomes 1.3 times the initial viscosity value is measured, keeping at 25 degreeC room temperature.
4)충진성: 80℃의 열판 위에 50㎛의 갭을 유지하도록 스페이서를 삽입시킨 10×10mm 크기의 유리판 2장을 위치시키고, 한 쪽에 에폭시 수지 조성물을 떨어뜨려, 반대편까지 채워지는 시간을 측정(충진 시간이 30초 이하인 경우 양호, 30초를 초과하면 불량으로 판정).4) Fillability: Place two 10 × 10 mm glass plates with spacers inserted on a hot plate at 80 ° C. to hold a 50 μm gap, drop the epoxy resin composition on one side, and measure the time to fill the other side. Good when filling time is 30 seconds or less, and defective when it exceeds 30 seconds).
상기 표 1로부터, 상기 실시예 1 및 2의 봉지용 액상 에폭시 수지 조성물은 상기 비교예 1 및 2의 봉지용 액상 에폭시 수지 조성물과 비교하여, 점도, 겔화 시간, 가사 시간 및 충진성이 전체적으로 우수함을 알 수 있다. From the above Table 1, the liquid epoxy resin compositions for encapsulation of Examples 1 and 2 were superior to the liquid epoxy resin compositions for encapsulation of Comparative Examples 1 and 2, and were generally excellent in viscosity, gelation time, pot life and fillability. Able to know.
이상 상술한 바와 같이, 본 발명에 따른 에폭시 수지 조성물은 인쇄회로기판과 IC 사이 갭으로의 침투성 및 충진성(언더필성)이 우수하고, 넓은 칩면의 전체 범위에 걸쳐 균일하게 경화될 수 있다. 또한 본 발명에 따른 조성물은 열경화 시간이 짧아 패키지 생산성이 우수하고, 경화중 휘발분 및 기포의 발생이 적어, 작업성이 우수할 뿐 만 아니라, 신뢰성이 높은 칩 패키지를 제조할 수 있는 장점이 있다. As described above, the epoxy resin composition according to the present invention is excellent in permeability and filling (underfill) into the gap between the printed circuit board and the IC, and can be uniformly cured over the entire range of the wide chip surface. In addition, the composition according to the present invention has a short heat curing time, excellent package productivity, less volatile matter and bubbles during curing, not only excellent workability, but also has the advantage of manufacturing a highly reliable chip package. .
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| JP2018184525A (en) * | 2017-04-26 | 2018-11-22 | 信越化学工業株式会社 | Low-temperature curable liquid epoxy resin composition |
| US10988646B2 (en) | 2015-12-18 | 2021-04-27 | Furukawa Electric Co., Ltd. | Adhesive composition, and method of bonding an adherend and method of producing a stack, each of which uses the same |
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| JP4019576B2 (en) | 1999-11-30 | 2007-12-12 | オムロン株式会社 | One-part epoxy resin composition adhesive |
| JP4037603B2 (en) | 2000-11-24 | 2008-01-23 | 株式会社リコー | Epoxy resin composition and method of manufacturing ink jet head using the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US10988646B2 (en) | 2015-12-18 | 2021-04-27 | Furukawa Electric Co., Ltd. | Adhesive composition, and method of bonding an adherend and method of producing a stack, each of which uses the same |
| JP2018184525A (en) * | 2017-04-26 | 2018-11-22 | 信越化学工業株式会社 | Low-temperature curable liquid epoxy resin composition |
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