KR20070060924A - 패럴린 마스크를 이용한 실리콘 습식 식각 방법 및 이방법을 이용한 잉크젯 프린트헤드의 노즐 플레이트 제조방법 - Google Patents

패럴린 마스크를 이용한 실리콘 습식 식각 방법 및 이방법을 이용한 잉크젯 프린트헤드의 노즐 플레이트 제조방법 Download PDF

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Publication number
KR20070060924A
KR20070060924A KR1020050121124A KR20050121124A KR20070060924A KR 20070060924 A KR20070060924 A KR 20070060924A KR 1020050121124 A KR1020050121124 A KR 1020050121124A KR 20050121124 A KR20050121124 A KR 20050121124A KR 20070060924 A KR20070060924 A KR 20070060924A
Authority
KR
South Korea
Prior art keywords
silicon substrate
forming
etching
silicon
photoresist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020050121124A
Other languages
English (en)
Korean (ko)
Inventor
이재창
이창승
정재우
김덕수
이교열
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR1020050121124A priority Critical patent/KR20070060924A/ko
Priority to US11/505,416 priority patent/US20070134928A1/en
Priority to JP2006282750A priority patent/JP2007160927A/ja
Publication of KR20070060924A publication Critical patent/KR20070060924A/ko
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14411—Groove in the nozzle plate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Weting (AREA)
KR1020050121124A 2005-12-09 2005-12-09 패럴린 마스크를 이용한 실리콘 습식 식각 방법 및 이방법을 이용한 잉크젯 프린트헤드의 노즐 플레이트 제조방법 Ceased KR20070060924A (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020050121124A KR20070060924A (ko) 2005-12-09 2005-12-09 패럴린 마스크를 이용한 실리콘 습식 식각 방법 및 이방법을 이용한 잉크젯 프린트헤드의 노즐 플레이트 제조방법
US11/505,416 US20070134928A1 (en) 2005-12-09 2006-08-17 Silicon wet etching method using parylene mask and method of manufacturing nozzle plate of inkjet printhead using the same
JP2006282750A JP2007160927A (ja) 2005-12-09 2006-10-17 パリレンマスクを用いたシリコン湿式エッチング方法及びこの方法を用いたインクジェットプリントヘッドのノズルプレートの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050121124A KR20070060924A (ko) 2005-12-09 2005-12-09 패럴린 마스크를 이용한 실리콘 습식 식각 방법 및 이방법을 이용한 잉크젯 프린트헤드의 노즐 플레이트 제조방법

Publications (1)

Publication Number Publication Date
KR20070060924A true KR20070060924A (ko) 2007-06-13

Family

ID=38139967

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050121124A Ceased KR20070060924A (ko) 2005-12-09 2005-12-09 패럴린 마스크를 이용한 실리콘 습식 식각 방법 및 이방법을 이용한 잉크젯 프린트헤드의 노즐 플레이트 제조방법

Country Status (3)

Country Link
US (1) US20070134928A1 (enExample)
JP (1) JP2007160927A (enExample)
KR (1) KR20070060924A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8556382B2 (en) 2008-11-27 2013-10-15 Samsung Electronics Co., Ltd. Nozzle plate and method of manufacturing the same
KR20210096891A (ko) * 2020-01-29 2021-08-06 주식회사 오럼머티리얼 마스크 및 마스크의 제조 방법

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008072165A1 (en) * 2006-12-12 2008-06-19 Nxp B.V. Method of manufacturing openings in a substrate, a via in a substrate, and a semiconductor device comprising such a via
US7531047B1 (en) * 2007-12-12 2009-05-12 Lexmark International, Inc. Method of removing residue from a substrate after a DRIE process

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5243756A (en) * 1991-06-28 1993-09-14 Digital Equipment Corporation Integrated circuit protection by liquid encapsulation
JPH09267472A (ja) * 1996-03-29 1997-10-14 Seiko Epson Corp インクジェットヘッド
JP2001189324A (ja) * 1999-12-28 2001-07-10 Ricoh Co Ltd 半導体装置
US6716661B2 (en) * 2002-05-16 2004-04-06 Institute Of Microelectronics Process to fabricate an integrated micro-fluidic system on a single wafer
JP4363150B2 (ja) * 2003-10-14 2009-11-11 セイコーエプソン株式会社 液滴吐出ヘッドの製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8556382B2 (en) 2008-11-27 2013-10-15 Samsung Electronics Co., Ltd. Nozzle plate and method of manufacturing the same
KR20210096891A (ko) * 2020-01-29 2021-08-06 주식회사 오럼머티리얼 마스크 및 마스크의 제조 방법

Also Published As

Publication number Publication date
US20070134928A1 (en) 2007-06-14
JP2007160927A (ja) 2007-06-28

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