KR20070052943A - 포토레지스트 제거용 씬너 조성물 - Google Patents
포토레지스트 제거용 씬너 조성물 Download PDFInfo
- Publication number
- KR20070052943A KR20070052943A KR1020050110764A KR20050110764A KR20070052943A KR 20070052943 A KR20070052943 A KR 20070052943A KR 1020050110764 A KR1020050110764 A KR 1020050110764A KR 20050110764 A KR20050110764 A KR 20050110764A KR 20070052943 A KR20070052943 A KR 20070052943A
- Authority
- KR
- South Korea
- Prior art keywords
- thinner
- weight
- thinner composition
- photoresist
- parts
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/044—Hydroxides or bases
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/264—Aldehydes; Ketones; Acetals or ketals
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5013—Organic solvents containing nitrogen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Inorganic Chemistry (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Materials For Photolithography (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050110764A KR20070052943A (ko) | 2005-11-18 | 2005-11-18 | 포토레지스트 제거용 씬너 조성물 |
PCT/KR2006/004638 WO2007058443A1 (en) | 2005-11-18 | 2006-11-07 | Thinner composition for removing photoresist |
CNA2006800410620A CN101300529A (zh) | 2005-11-18 | 2006-11-07 | 用于去除光刻胶的稀释剂组合物 |
TW095141773A TW200728939A (en) | 2005-11-18 | 2006-11-10 | Thinner composition for removing photoresist |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050110764A KR20070052943A (ko) | 2005-11-18 | 2005-11-18 | 포토레지스트 제거용 씬너 조성물 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20070052943A true KR20070052943A (ko) | 2007-05-23 |
Family
ID=38048803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050110764A KR20070052943A (ko) | 2005-11-18 | 2005-11-18 | 포토레지스트 제거용 씬너 조성물 |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR20070052943A (zh) |
CN (1) | CN101300529A (zh) |
TW (1) | TW200728939A (zh) |
WO (1) | WO2007058443A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014123318A1 (ko) * | 2013-02-08 | 2014-08-14 | 주식회사 동진쎄미켐 | 신너 조성물 및 이의 용도 |
KR20150088350A (ko) * | 2014-01-23 | 2015-08-03 | 동우 화인켐 주식회사 | 레지스트 도포성 개선용 및 제거용 신너 조성물 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI467349B (zh) * | 2008-11-19 | 2015-01-01 | Toagosei Co Ltd | 具有經圖案化的導電性高分子膜之基板的製造方法及具有經圖案化的導電性高分子膜之基板 |
US20120108067A1 (en) * | 2010-10-29 | 2012-05-03 | Neisser Mark O | Edge Bead Remover For Coatings |
CN103050394B (zh) * | 2011-10-13 | 2015-10-14 | 上海华虹宏力半导体制造有限公司 | 超厚光刻胶的刻蚀方法 |
JP6899220B2 (ja) * | 2017-01-11 | 2021-07-07 | 株式会社ダイセル | レジスト除去用組成物 |
WO2022032478A1 (en) * | 2020-08-11 | 2022-02-17 | Showa Denko K.K. | Solvent composition |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0721638B2 (ja) * | 1986-07-18 | 1995-03-08 | 東京応化工業株式会社 | 基板の処理方法 |
JP2001188358A (ja) * | 1999-12-28 | 2001-07-10 | Mitsubishi Gas Chem Co Inc | エッジビードリムーバ |
US7166419B2 (en) * | 2002-09-26 | 2007-01-23 | Air Products And Chemicals, Inc. | Compositions substrate for removing etching residue and use thereof |
US20050032657A1 (en) * | 2003-08-06 | 2005-02-10 | Kane Sean Michael | Stripping and cleaning compositions for microelectronics |
KR101213144B1 (ko) * | 2003-10-20 | 2012-12-17 | 주식회사 동진쎄미켐 | 포토레지스트 제거용 씬너 조성물 |
-
2005
- 2005-11-18 KR KR1020050110764A patent/KR20070052943A/ko not_active Application Discontinuation
-
2006
- 2006-11-07 WO PCT/KR2006/004638 patent/WO2007058443A1/en active Application Filing
- 2006-11-07 CN CNA2006800410620A patent/CN101300529A/zh active Pending
- 2006-11-10 TW TW095141773A patent/TW200728939A/zh unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014123318A1 (ko) * | 2013-02-08 | 2014-08-14 | 주식회사 동진쎄미켐 | 신너 조성물 및 이의 용도 |
KR20150088350A (ko) * | 2014-01-23 | 2015-08-03 | 동우 화인켐 주식회사 | 레지스트 도포성 개선용 및 제거용 신너 조성물 |
Also Published As
Publication number | Publication date |
---|---|
WO2007058443A1 (en) | 2007-05-24 |
CN101300529A (zh) | 2008-11-05 |
TW200728939A (en) | 2007-08-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |