KR20070046601A - Rigid-flexible print circuit board and method for manufacturing thereof, automatic bonding apparatus - Google Patents

Abstract

The present invention relates to a method for manufacturing a flexible printed circuit board, and more particularly, to fabricate a flexible printed circuit board, the polyimide improves the difficulty of the cost burden and the interfacial adhesion reliability due to heterogeneous materials. The present invention relates to a rigid flexible printed circuit board using no mid-copper laminate and a method of manufacturing the same, and an automatic partial welding device used therefor.

In addition, according to the present invention, (A) preparing a plurality of copper foil layer attached to one surface of the first protective film in a roll-to-roll method to a predetermined portion to constitute a flexible portion; (B) selecting a pair of copper foil layers from the plurality of copper foil layers prepared in step (A), inserting a first adhesive between the selected copper foil layers and allowing the first protective film to face each other to go in a roll-to-roll manner Contacting to prepare a pair of inner layer forming members; (C) forming circuit patterns on both copper foil layers of each of the pair of inner layer forming members prepared in step (B); (D) inserting a second adhesive between the pair of inner layer forming members in which the circuit pattern of step (C) is formed, and welding the first protective film to be aligned with each other to form an inner layer; And (E) laminating a third adhesive on both sides of the inner layer, and then laminating the copper foil layer having the second protective film on a predetermined portion on both sides so that the second protective film faces the inner layer, and forming a circuit pattern on the copper foil layer. And there is provided a method of manufacturing a rigid flexible printed circuit board comprising the step of attaching a third protective film to the corresponding portion of the flexible portion of the copper foil layer.

Rigid, Flexible, Polyimide, Prepreg, Bonding Sheets, Coverlays

Description

Rigid-flexible Printed Circuit Board and Method for Manufacturing Applications, Automatic Bonding Apparatus

1A to 1J are cross-sectional views showing the flow of a method for manufacturing a rigid flexible substrate according to the prior art.

2 is a cross-sectional view of a rigid flexible printed circuit board not using a polyimide copper foil laminate to which a manufacturing method according to the present invention is applied.

3A to 3R are flowcharts illustrating a method of manufacturing a rigid flexible printed circuit board without a polyimide copper foil laminate according to an embodiment of the present invention.

4 is a configuration diagram of an automatic partial welding apparatus of one side roll-to-roll method used in the present invention.

5 is a configuration diagram of a double-sided roll-to-roll type automatic partial welding device used in the present invention.

* Description of the symbols for the main parts of the drawings *

401, 501, 501 ': copper foil roll 402, 502: automatic partial fold

403, 507: Rolls of product 404, 504, 504 ': Copper foil layer

405, 505a, 505b: Coverlay 506: Prepreg Roll

508: prepreg

The present invention relates to a flexible printed circuit board, a method for manufacturing the same, and a device used therein, and more particularly, to fabrication of a flexible printed circuit board, cost burden according to the adoption of polyimide copper-clad laminate, and interfacial adhesion reliability due to dissimilar materials. The present invention relates to a rigid flexible printed circuit board that does not use a polyimide copper clad laminate, which improves the difficulty of the present invention, and a method of manufacturing the same, and an automatic partial welding device used therefor.

As the designs of mobile communication terminals have been diversified recently, applications of rigid flexible printed circuit boards have been amplified, and thus, development of rigid flexible printed circuit boards and electronic components have been accelerated.

Rigid flexible printed circuit board is a technology that combines multilayer printed circuit board technology and flexible printed circuit board technology together, and has high reliability of connection part of multilayer printed circuit board and flexible printed circuit board in electronic products, and surface mount density of rigid printed circuit board. It is a special printed circuit board which improves and enables three-dimensional wiring using various types of bending and three-dimensional space of a flexible substrate.

Such a rigid flexible board can combine multiple boards into one printed circuit board without a separate connector or cable between the boards, thereby reducing the delay or distortion of an electrical signal and reducing the mounting volume. However, the use of polyimide copper clad laminate material, which is an expensive flexible material, costs 3 to 4 times more than a rigid substrate based on a general rigid flexible substrate. In addition, the weak interfacial adhesion between prepreg (or bonding sheet) and polyimide, which is used as an interlayer adhesive layer for the multilayer implementation of a rigid part, has been pointed out as a difficulty in securing a substrate and securing long-term reliability. In particular, as the price of printed circuit boards has recently declined, the cost burden on polyimide materials has been increasing, and some companies are increasing the adoption of connectors and cables. Considering the tendency, the production of a low cost rigid flexible printed circuit board by a new construction method is required.

1A to 1J are cross-sectional views showing the flow of a method of manufacturing a rigid flexible substrate according to a first embodiment of the related art.

As shown in Fig. 1A, a prepreg 101 having a window A processed at a predetermined position is prepared.

As shown in FIG. 1B, polyimide copper clad laminates 102a and 102b are laminated on both sides of the prepreg 101.

As shown in Fig. 1C, copper plating layers 103a and 103b are laminated on both surfaces of the polyimide copper clad laminates 102a and 102b, respectively.

As shown in Fig. 1D, dry films 104a and 104b or photosensitive materials in a liquid state are applied to both surfaces of the copper plating layers 103a and 103b, respectively.

As shown in FIG. 1E, the artwork film having a predetermined pattern printed thereon is brought into close contact with the dry films 104a and 104b, and then a predetermined etching resist pattern is formed through an exposure and development process. Further, by using the dry films 104a and 104b as etching resists and immersing them in the etching liquid, the copper plating layers 103a and 103b of the remaining portions except for the portions corresponding to the predetermined patterns of the dry films 104a and 104b are removed. do.

As shown in Fig. 1F, the applied dry films 104a and 104b are removed using a stripping solution to form predetermined circuit layers 103a and 103b.

As shown in Fig. 1G, coverlays 105a and 105b are applied to both surfaces of the circuits 103a and 103b corresponding to the window A at a predetermined position, and then presses are applied.

As shown in FIG. 1H, prepregs 106a and 106b prepared in FIG. 1A on both sides of the polyimide copper clad laminates 102a and 102b including coverlays 105a and 105b and predetermined circuit patterns 104a and 104b. Lay again.

As shown in FIG. 1I, polyimide copper clad laminates 107a and 107b are laminated on both sides of the outermost prepregs 106a and 106b, and then a copper plating layer is formed and a predetermined circuit pattern is subjected to a photolithography process. And form 108a and 108b.

As shown in FIG. 1J, after performing the step of FIG. 1I once more and finally applying the coverlays 113a and 113b to both sides of the outermost circuits 112a and 112b corresponding to the window A at a predetermined position, Press to complete the rigid flexible printed circuit board.

U. S. Patent No. 6,745, 463 discloses a method of manufacturing a rigid flexible printed circuit board related thereto.

However, the printed circuit board according to the conventional method is composed of a polyimide copper clad laminated board and a prepreg of the heterogeneous material to configure the rigid portion has poor adhesion characteristics. In order to solve this problem, the polyimide copper clad laminate had a problem of surface treatment through plasma (or corona) treatment or mechanical brushing.

In addition, the unit cost of the polyimide copper clad laminate requires a high cost for the prepreg, and there is a problem in that a low-cost rigid flexible copper clad laminate cannot be formed.

In order to solve these problems, a rigid flexible printed circuit board has been developed, which has good adhesion reliability, flexural characteristics, no flexion, no inexpensive polyimide copper clad laminate, and developed rigid flexible printing. Development of a manufacturing method for a circuit board is required.

The technical problem of the present invention for meeting the above necessity is a rigid flexible printed circuit board using less process water as possible and shortening the manufacturing time required for the production of the product, without using a polyimide copper clad laminate at low cost and its A manufacturing method and an automatic partial welding device used therefor.

The present invention to solve the above technical problem, the first insulating layer forming a layer of an insulating material; A first circuit layer laminated on both sides of the first insulating layer, having a circuit pattern formed thereon, and made of a conductive material and having a window formed at a portion corresponding to the flexible part; A second insulating layer formed on a portion of the first circuit layer except for a window and protecting the first circuit layer; A first protective film for protecting the first insulating layer formed on the first insulating layer in the window region of the first circuit layer; A second circuit layer formed on the first protective film and having a circuit pattern formed thereon and a conductive material; And a second protective film formed on the second circuit layer to protect the second circuit layer.

The present invention also includes a first insulating layer, a first circuit layer formed on both sides of the first insulating layer and having a window formed on a portion corresponding to the flexible portion, and a window except the window of the first circuit layer. A second insulating layer for protecting the first insulating layer, a first protective film formed on the first insulating layer in the window region of the first circuit layer, a second circuit layer formed on the first protective film, and the first protective film. A pair of inner layer forming members including a second protective film formed on the second circuit layer; A third insulating layer formed between the pair of inner layer forming members and made of an insulating material; And a third circuit layer formed outside the inner layer forming member, a third circuit layer formed outside the fourth insulation layer and having a window formed at a portion corresponding to the flexible portion, and the third circuit layer. A fifth insulating layer for protecting portions excluding windows of the second insulating layer, a third protective film formed on the fourth insulating layer in the window region of the third circuit layer, and a fourth protective film formed on the third protective film And a pair of outer layers including a circuit layer and a fourth protective film formed on the fourth circuit layer, wherein the pair of inner layer forming members and the third insulating layer form an inner layer.

In addition, the present invention is a method of manufacturing a printed circuit board using no polyimide copper clad laminate according to the present invention, (A) a plurality of first protective film is attached to one surface by a roll-to-roll method to a predetermined portion to constitute a flexible portion. Preparing a copper foil layer; (B) selecting a pair of copper foil layers from the plurality of copper foil layers prepared in step (A), inserting a first adhesive between the selected copper foil layers and allowing the first protective film to face each other to go in a roll-to-roll manner Contacting to prepare a pair of inner layer forming members; (C) forming circuit patterns on both copper foil layers of each of the pair of inner layer forming members prepared in step (B); (D) inserting a second adhesive between the pair of inner layer forming members in which the circuit pattern of step (C) is formed, and welding the first protective film to be aligned with each other to form an inner layer; And (E) laminating a third adhesive on both sides of the inner layer, and then laminating the copper foil layer having the second protective film on a predetermined portion on both sides so that the second protective film faces the inner layer, and forming a circuit pattern on the copper foil layer. And attaching a third protective film to a corresponding portion of the flexible part of the copper foil layer.

Moreover, this invention is the copper foil roll by which the copper foil layer is wound; An automatic partial splicer for attaching and attaching a protective film to a predetermined portion to form the flexible portion of the copper foil layer when the copper foil layer wound on the copper foil roll passes; A product roll for winding and storing a copper foil layer having a protective film on a predetermined portion formed by the automatic partial splicer; And moving means for moving the copper foil layer wound on the copper foil roll to the product roll through the automatic partial foldable device.

In addition, the present invention, a pair of copper foil rolls each of the copper foil layer with a protective film attached to a predetermined portion; Adhesive rolls on which adhesive is wound; An automatic welding machine for forming an inner layer forming member by pressing an adhesive between the pair of copper foil layers and passing the pair of copper foil layers so that the protective film faces each other; A product roll for winding and storing the inner layer forming member formed by the automatic partial foldable device; And moving means for the copper foil layer wound around the pair of copper foil rolls to pass through the automatic partial fold so that the protective film faces each other to form the product roll, and to place an adhesive between the copper foil layers. Characterized in that made.

Hereinafter, a method of manufacturing a rigid flexible printed circuit board using no polyimide copper clad laminate according to the present invention will be described in detail with reference to the accompanying drawings.

2 is a cross-sectional view of a rigid flexible printed circuit board not using a polyimide copper foil laminate to which a manufacturing method according to the present invention is applied.

Referring to the drawings, a rigid flexible printed circuit board to which the manufacturing method according to the present invention is applied includes an inner layer 210 and an outer layer 230 and 230 '.

The inner layer 210 is provided with a pair of inner layer forming members 220 and 220 ′ on both sides of the first prepreg 215.

Here, the inner layer forming members 220 and 220 'include circuit layers 222 and 223 and 222' and 223 'having circuit patterns formed on both sides of the second prepregs 221 and 221', respectively. The first coverlays 225a and 225a 'are provided on both sides of the portion corresponding to the flexible portion, and the second coverlays 225b and 225b' are provided on the outer layer of the first coverlays 225a and 225a '. Equipped with.

Next, the outer layers 230 and 230 ′ are stacked on the inner layer 210, and the third prepreg 231 is formed closest to the inner layer 210, and the circuit outside the third prepreg 231. A circuit layer 234 and 236 having a pattern formed thereon, a third coverlay 232 provided at a portion corresponding to the flexible portion, and a fourth coverlay disposed on an outer layer of the third coverlay 232. 238 is provided.

In addition, as illustrated in the drawing, a through hole and a plurality of via holes penetrating through the inner layer 210 and the outer layers 230 and 230 ′ are further provided.

3A to 3R are flowcharts illustrating a method of manufacturing a rigid flexible printed circuit board without a polyimide copper foil laminate according to an embodiment of the present invention.

First, as shown in Figs. 3A and 3B, a pair of copper foil layers 303 and 303 'having coverlays 302a and 302b attached to a predetermined region are prepared. As shown in FIG. 4, the copper foil layers 303 and 303 ′ may be formed using an automatic partial welding apparatus of one surface roll-to-roll method. Here, the one-sided roll-to-roll type automatic partial welding device attaches the coverlay 405 to a predetermined portion of the copper foil roll 401 on which the copper foil 404 is wound and the copper foil 404 passing as shown in FIG. 4. An automatic partial splicer 402, a product roll 403 for winding the copper foil 404 having the coverlay 405 attached to a predetermined portion of one surface, and a moving means 406 for moving the copper foil 404. Equipped. The automatic partial splicer 402 covers the predetermined area shown in FIGS. 3A and 3B by passing the copper foil 404 after attaching the coverlay 405 to one surface when the copper foil 404 passes. The copper foil layers 303 and 303 'to which the ray 302a and 302b are attached can be formed.

Next, as shown in FIG. 3C, the prepreg 301 is inserted between the pair of copper foil layers 303 and 303 'having the coverlays 302a and 302b formed at a predetermined portion, and pressed from both sides. The copper foil layers 303 and 303 'are attached to each other with the prepreg 301 interposed therebetween. Such a pair of copper foil layers 303 and 303 'may be attached using an automatic partial welding device of a double-sided roll-to-roll method as shown in FIG. Here, the double-sided roll-to-roll automatic partial welding device includes a pair of copper foil rolls on which copper foils 504 and 504 'having the coverlays 505a and 505b attached to one surface of a predetermined portion are wound as shown in FIG. 501 and 501 ', the prepreg roll 506 on which the prepreg 508 is wound, the automatic partial splicer 502 which is attached to each other when the prepreg 508 passes through the copper foils 504 and 504', A pair of copper foils 504 and 504 'are attached with the prepreg 508 interposed therebetween to move the product roll 507, copper foils 504 and 504' and the prepreg 508 to wind the finished product. A moving means 509 is provided. The automatic partial splicer 502 presses and attaches the copper foils 504 and 504 'that pass through the prepreg 508 with the coverlays 505a and 505b facing each other. Then, the product roll 507 winds and stores the product with a pair of copper foils 504 and 504 'with the prepreg 508 therebetween.

Next, when the copper foil layers 303 and 303 'having the coverlays 303 and 303' attached thereto are attached to one surface by using the prepreg 301 as shown in FIG. As in 3d, an inner via hole M is formed.

As shown in FIG. 3E, a copper plating layer 304 is formed on the copper foil layers 303 and 303 ′ for the electrical connection between the layers in the inner via hole M. FIG. Here, the copper plating layer 304 is formed by performing electroless copper plating first after electroless copper plating because the inner wall of the via hole M is exposed with the first prepreg 301 which is an insulator.

In FIG. 3F, dry films 305 and 305 to be used as etching resists are applied on the copper plating layer 304. Instead of the dry films 305 and 305, other etching resist materials such as a liquid photosensitive material may be applied. Thereafter, the artwork film having a predetermined pattern printed thereon is brought into close contact with the dry films 305 and 305 ', and then a predetermined etching resist pattern is formed through an exposure and development process.

In FIG. 3G, the copper foil layers 303 and 303 ′ and the copper plating layer 304 of the remaining portions except for the portions corresponding to the predetermined patterns of the dry films 305 and 305 ′ are etched by immersing the substrate in the etching solution.

As shown in FIG. 3H, the applied dry films 305 and 305 are removed using a stripping solution to form a predetermined internal circuit pattern 304-1. Here, the stripping solution is removed using a stripping solution containing sodium hydroxide (NaOH) or potassium hydroxide (KOH).

As shown in FIG. 3I, the second coverlay 302b corresponding to the first coverlays 302a and 302a 'and protecting the internal circuit pattern 304-1 formed on the first coverlays 302a and 302a', 302b ') is apply | coated, respectively, and the circuit layer 300 (inner layer formation member) is formed. In this case, the second coverlays 302b and 302b 'may be coated on the entire surface of the substrate, according to an exemplary embodiment.

In addition, as illustrated in FIG. 3J, an insulating layer such as a second prepreg 310 or a bonding sheet having a window N corresponding to the window M of the first prepreg 301 is prepared. The second prepreg 310 and the first prepreg 301 may be made of the same material, but are shown by different hatching for explanation. In addition, the first or second name is used differently from FIG. 2, which is for convenience of writing.

It is preferable to use a thicker second prepreg 310 of FIG. 3J than the first prepreg 301. For example, it is preferable to use a material having a thickness of about 60 μm for the second prepreg 310 and about 40 μm for the first prepreg 301. In some embodiments, the thicknesses of the second prepreg 310 and the first prepreg 301 may be used in the same manner.

Thereafter, as illustrated in FIG. 3K, circuit layers 300 and 300 ′ are disposed on both sides of the second prepreg 310, and as shown in FIG. 3L, a substrate formed of four layers is formed by pressing by heating and pressing. do.

In addition, as in FIG. 3M, a third prepreg 315 is stacked on both sides of the substrate of FIG. 3K.

Thereafter, as shown in FIG. 3N, a window O corresponding to the window M of the first prepreg 301 and the window N of the second prepreg 310 is formed, and the window O is formed on one surface thereof. The third prepreg 321 and the copper foil layer 323 to which the third coverlay 322b including) is applied are laminated, and then pressed.

As shown in FIG. 3O, a through hole P for electrical connection of the entire substrate and a blind via hole Q for electrical connection between the two layers are formed.

Thereafter, as shown in FIG. 3P, a copper plating layer 324 is formed for electrical conduction of the inner wall of the hole. Here, since the first, second and third prepregs 301, 310, and 315, which are insulators, are exposed on the inner wall of the hole, the electroless copper plating is performed first, followed by the electrolytic copper plating having good physical properties. ).

Thereafter, as shown in FIG. 3Q, after forming an etching resist pattern (not shown) on the copper plating layer 324, an etching process is performed to form the outer circuit pattern 324-1.

Finally, as shown in FIG. 3R, the fourth coverlay 322a corresponding to the third coverlay 322b and protecting the outer circuit pattern 324-1 formed on the third coverlay 322b may be disposed. Apply to complete the outer layers 320 and 320 '.

In the method of manufacturing a rigid flexible printed circuit board according to an embodiment of the present invention, the first, second, third, and fourth coverlays used as the protective film may be a general film type, a liquid type, or a dry film type. It may include.

On the other hand, as shown in Figure 3r, the substrate according to an embodiment of the present invention has a form in which a pair of the double-sided circuit layer 300, the second prepreg 310 and the outer layer 320 is stacked. The number of circuit layers and additional prepregs to be stacked may vary depending on the embodiment.

The portions in which the first, second and third prepregs 301, 310, and 321 are inserted on both sides of the substrate of FIG. 3R form a rigid region, and the center where the windows M, N, and O are formed is flexible. Configure the area.

That is, the rigid region is composed of a plurality of circuit layers and a plurality of insulating layers stacked between the plurality of circuit layers, and the flexible region is composed of a plurality of circuit layers inserted between a pair of protective films.

A rigid flexible printed circuit board according to an embodiment of the present invention alternately stacks a pair of circuit layers 300 and a second prepreg 310, and includes a window O only on one surface thereof. The third prepreg 321 and the copper foil layer 323 coated with the third coverlay 322b may be formed by laminating and thermocompressing the outer shell and then performing the processes of FIGS. 3O to 3R.

Although the present invention has been described above by way of examples, the scope of the present invention is not limited to the above embodiments, and various modifications are possible within the scope of the present invention. It is intended that the scope of the invention only be limited by the following claims.

As described above, according to the present invention, since the expensive polyimide copper-clad laminate (PICCL) to which the copper foil and the polyimide film are adhered is not required, the manufacturing cost of the substrate is greatly reduced.

Further, according to the present invention, it is possible to produce a product having the same flexibility as that of the existing product because it is made of a coverlay instead of a prepreg at a low cost and a bent portion.

In addition, according to the present invention, since one-sided roll-to-roll method or double-sided roll-to-roll method can be used, the number of manufacturing steps can be reduced, and the cost can be reduced.

In addition, according to the present invention, since one-sided roll-to-roll method or double-sided roll-to-roll method can be used, manufacturing time can be shortened and cost reduction effect can be obtained.

Claims (25)

A first insulating layer forming a layer of an insulating material; A first circuit layer laminated on both sides of the first insulating layer, having a circuit pattern formed thereon, and made of a conductive material and having a window formed at a portion corresponding to the flexible part; A second insulating layer formed on a portion of the first circuit layer except for a window and protecting the first circuit layer; A first protective film for protecting the first insulating layer formed on the first insulating layer in the window region of the first circuit layer; A second circuit layer formed on the first protective film and having a circuit pattern formed thereon and a conductive material; And A rigid flexible printed circuit board formed on the second circuit layer and including a second protective film for protecting the second circuit layer. The method of claim 1, The first insulating layer and the second insulating layer is a rigid flexible printed circuit board, characterized in that the prepreg or bonding sheet. The rigid flexible printed circuit board as claimed in claim 1, wherein the first protective film and the second protective film are coverlays of a general-purpose film type, coverlays of a liquid type, or coverlays of a dry film type. The method according to any one of claims 1 to 3, A rigid flexible printed circuit board further comprising a through hole penetrating through the first circuit layer and the first insulating layer. A first insulating layer, a first circuit layer formed on both sides of the first insulating layer, and having a window formed in a portion corresponding to the flexible portion, and a second portion for protecting the window except the window of the first circuit layer An insulating layer, a first protective film formed on the first insulating layer in the window region of the first circuit layer, a second circuit layer formed on the first protective film and the second circuit layer; A pair of inner layer forming members including a second protective film therein; A third insulating layer formed between the pair of inner layer forming members and made of an insulating material; And A third circuit layer formed on an outer side of the inner layer forming member, a third circuit layer formed on an outer side of the fourth insulating layer, and having a window formed on a portion corresponding to the flexible portion, and the third circuit layer. A fifth insulating layer for protecting the portion excluding the window, a third protective film formed on the fourth insulating layer in the window region of the third circuit layer, and a fourth circuit formed on the third protective film A pair of outer layers including a layer and a fourth protective film formed on the fourth circuit layer, The pair of inner layer forming members and the third insulating layer form an inner layer. The method of claim 5, The first flexible layer, the second insulating layer, the third insulating layer, the fourth insulating layer, the fifth insulating layer is a rigid flexible printed circuit board, characterized in that the prepreg or bonding sheet. The method of claim 5, wherein the first protective film, the second protective film, the third protective film, the fourth protective film is a coverlay of the general film type, liquid type coverlay or dry film type coverlay, characterized in that Rigid flexible printed circuit board. The method according to any one of claims 5 to 7, A rigid flexible printed circuit board further comprising a through hole and a blind via hole penetrating the outer layer and the inner layer. (A) preparing a plurality of copper foil layers having a first protective film attached to one surface in a predetermined portion of the flexible portion; (B) selecting a pair of copper foil layers from each of the plurality of copper foil layers prepared in step (A) to insert a first adhesive between the selected copper foil layers and to weld the first protective film to face each other to form a pair of inner layers Preparing the member; (C) forming circuit patterns on both copper foil layers of each of the pair of inner layer forming members prepared in step (B); (D) inserting a second adhesive between the pair of inner layer forming members in which the circuit pattern of step (C) is formed, and welding the first protective film to be aligned with each other to form an inner layer; And (E) after the third adhesive is laminated on both sides of the inner layer, the copper foil layer having the second protective film attached to a predetermined portion is laminated on both sides so that the second protective film faces the inner layer, and a circuit pattern is formed on the copper foil layer. A method of manufacturing a rigid flexible printed circuit board comprising attaching a third protective film to a corresponding portion of the flexible portion of the copper foil layer. The method of claim 9, After the step (B), (F) a method of manufacturing a rigid flexible printed circuit board further comprising the step of processing a hole and forming a plating layer on the pair of inner layer forming members welded to face each other prepared in step (B). The method of claim 9, After laminating the third adhesive on both sides of the inner layer in the step (E), after laminating the copper foil layer having the second protective film on a predetermined portion on both sides such that the second protective film faces the inner layer, (G) manufacturing a rigid flexible printed circuit board further comprising the step of processing the through-hole or blind via hole and forming a plating layer. The method according to any one of claims 9 to 11, The method of attaching the first protective film of the step (A) to the copper foil layer is a roll-to-roll method of manufacturing a rigid flexible printed circuit board. The method of claim 12, Step (A) is, (A-1) driving the automatic partial welding device such that the copper foil layer wound on the copper foil roll of the roll-to-roll automatic partial welding device passes the automatic partial welding machine; (A-2) attaching the first protective film to a predetermined portion to form the flexible portion of the copper foil layer by the automatic partial splicer; And (A-3) The method of manufacturing a rigid flexible printed circuit board comprising the step of winding the copper foil layer with the first protective film on the product roll after the automatic partial foldable welding the protective film to the copper foil layer. . The method according to any one of claims 9 to 11, The method of contacting the pair of copper foil layers in the step (B) to face each other is a roll-to-roll method of manufacturing a rigid flexible printed circuit board, characterized in that the pair of copper foil layers to face each other. The method of claim 14, Step (B) is, (B-1) selecting a pair of copper foil layers from the plurality of copper foil layers prepared in step (A) and placing them on each of the pair of copper foil rolls of the roll-to-roll type automatic partial welding device; (B-2) A pair of copper foil layers wound on the respective copper foil rolls of the automatic partial welding device pass through the automatic partial welding machine so that the surfaces of the first adhesive and the second protective film face each other. To make it; And (B-3) The method of manufacturing a rigid flexible printed circuit board comprising the step of winding the inner layer forming member formed on a product roll after the automatic partial welder pressurizes the copper foil layer to form an inner layer forming member. The method according to any one of claims 9 to 11, Step (C) is, (C-1) forming an etching resist on the copper foil layers of the pair of inner layer forming members prepared in step (B); (C-2) forming a circuit pattern on the etching resist through an image forming process and forming a circuit according to the circuit pattern formed on the copper foil layer; And (C-3) A manufacturing method of a rigid flexible printed circuit board comprising the step of removing the etching resist laminated on the copper foil layer. The method according to any one of claims 9 to 11, Step (E), (E-1) laminating a second adhesive on both sides of the inner layer; (E-2) stacking the copper foil layer having the second protective film attached to a predetermined portion on both surfaces of the inner layer on which the second adhesive is laminated so that the portion where the second protective film is attached faces the inner layer; And (E-3) forming a circuit pattern on the copper foil layer, and attaching a third protective film to a corresponding portion of the flexible portion of the copper foil layer. The method of claim 17, Step (E-3), (E-3-1) forming an etching resist pattern on the copper foil layer; (E-3-2) forming an outer circuit pattern by performing an etching process on the copper foil layer; And (E-3-3) A method of manufacturing a rigid flexible printed circuit board comprising the step of applying a third protective film to protect the outer circuit pattern formed on the portion corresponding to the second protective film. The method of manufacturing a rigid flexible printed circuit board according to any one of claims 9 to 11, wherein the first adhesive, the second adhesive, and the third adhesive are a prepreg or a bonding sheet. The rigid of any one of claims 9 to 11, wherein the first, second, and third protective films are coverlays of a general-purpose film type, coverlays of a liquid type, or coverlays of a dry film type. Method of manufacturing a flexible printed circuit board. Copper foil roll in which the copper foil layer is wound; An automatic partial splicer for attaching and attaching a protective film to a predetermined portion to form the flexible portion of the copper foil layer when the copper foil layer wound on the copper foil roll passes; A product roll for winding and storing a copper foil layer having a protective film on a predetermined portion formed by the automatic partial splicer; And An automatic partial welding device for manufacturing a rigid flexible printed circuit board comprising a moving means for moving the copper foil layer wound on the copper foil roll to the product roll past the automatic partial welder. 22. The apparatus of claim 21, wherein the protective film is a coverlay of a general-purpose film type, a coverlay of a liquid type, or a coverlay of a dry film type. A pair of copper foil rolls on which each copper foil layer having a protective film attached thereto is wound; Adhesive rolls on which adhesive is wound; An automatic welding machine for forming an inner layer forming member by pressing an adhesive between the pair of copper foil layers and passing the pair of copper foil layers so that the protective film faces each other; A product roll for winding and storing the inner layer forming member formed by the automatic partial foldable device; And The copper foil layer wound around the pair of copper foil rolls pass through the automatic partial fold so that the protective film to face each other to achieve the product roll, and comprises a moving means for positioning the adhesive between the copper foil layer. Automatic partial welding device for manufacturing rigid flexible printed circuit boards. 24. The apparatus of claim 23, wherein the adhesive is a prepreg or bonding sheet. 24. The automatic partial welding device for manufacturing a rigid flexible printed circuit board according to claim 23, wherein the protective film is a coverlay of a general film type, a liquid coverlay or a dry film type coverlay.

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