KR20070040968A - Lcd driver circuit - Google Patents

Lcd driver circuit Download PDF

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Publication number
KR20070040968A
KR20070040968A KR1020050096577A KR20050096577A KR20070040968A KR 20070040968 A KR20070040968 A KR 20070040968A KR 1020050096577 A KR1020050096577 A KR 1020050096577A KR 20050096577 A KR20050096577 A KR 20050096577A KR 20070040968 A KR20070040968 A KR 20070040968A
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South Korea
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liquid crystal
crystal display
driving circuit
heat dissipation
bump
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KR1020050096577A
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Korean (ko)
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KR100726646B1 (en
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최진호
노상훈
장근진
김상석
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엘지전자 주식회사
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G02F1/1309—Repairing; Testing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means

Abstract

본 발명은 액정표시장치 구동 회로에 관한 것으로, 더욱 상세하게는 액정표시장치 구동 회로의 전력소모로 인한 구동 회로의 온도 상승을 억제하기 위한 회로에 관한 것이다.The present invention relates to a liquid crystal display driving circuit, and more particularly, to a circuit for suppressing a temperature rise of the driving circuit due to power consumption of the liquid crystal display driving circuit.

본 발명에 따른 액정표시장치 구동 회로는 액정표시장치 구동 회로에 있어서, 액정표시장치를 구동시키는 다수의 증폭기, 증폭기에 공통으로 전원을 공급하는 전원선, 및 전원선에 형성되어 열을 발산시키는 범프를 포함하는 것을 특징으로 이루어진다.The liquid crystal display driving circuit according to the present invention is a liquid crystal display driving circuit comprising: a plurality of amplifiers for driving the liquid crystal display, a power supply line for supplying power to the amplifier in common, and a bump formed on the power supply line to dissipate heat. It comprises a.

범프, 액정표시장치 구동 회로, 전원선, 증폭기, COF(chip-on-film) Bump, LCD driving circuit, power line, amplifier, chip-on-film

Description

액정표시장치 구동 회로.{LCD driver circuit}Liquid crystal display drive circuit. {LCD driver circuit}

도 1은 본 발명의 액정표시장치 구동 회로에 형성되는 다수의 증폭기와 증폭기를 구동하기 위한 공통으로 전원이 공급되어 액정표시장치를 구동하는 액정표시장치 구동 회로를 설명하기 위하여 도시한 것이다.FIG. 1 illustrates a plurality of amplifiers formed in a liquid crystal display driving circuit of the present invention and a liquid crystal display driving circuit for driving a liquid crystal display by supplying power in common.

도 2는 본 발명의 액정표시장치 구동 회로가 구동시 온도상승을 억제하기 위하여 다수의 범프가 액정표시장치 구동 회로에 형성되어 있는 것을 설명하기 위하여 도시한 것이다.FIG. 2 is a view for explaining that a plurality of bumps are formed in the liquid crystal display driver circuit in order to suppress the temperature rise during the driving of the liquid crystal display driver circuit of the present invention.

도 3은 액정표시장치 구동 회로의 동작 온도가 상승하는 것을 억제하기 위하여 칩-온-필름(chip-on-film; COF)상에 상술한 도 2의 범프 및 방열패턴이 형성되어 있는 것을 나타낸 것이다.FIG. 3 illustrates that the above bump and heat dissipation pattern of FIG. 2 is formed on a chip-on-film (COF) to suppress an increase in operating temperature of the liquid crystal display driving circuit. .

<도면의 주요 부분에 관한 부호의 설명><Explanation of symbols on main parts of the drawings>

100, 230, 320: 열발산용 범프 110, 120:전원선100, 230, 320: Heat dissipation bumps 110, 120: Power line

130: 증폭기 200: 베이스 필름130: amplifier 200: base film

210, 310: 배선패턴 220: 솔더레지스트210, 310: wiring pattern 220: solder resist

250: 입출력용 범프 240: 칩250: I / O bump 240: Chip

300: COF 310: 방열패턴300: COF 310: heat dissipation pattern

본 발명은 액정표시장치 구동 회로에 관한 것으로, 더욱 상세하게는 액정표시장치 구동 회로의 전력소모로 인한 구동 회로의 온도 상승을 억제하기 위한 회로에 관한 것이다.The present invention relates to a liquid crystal display driving circuit, and more particularly, to a circuit for suppressing a temperature rise of the driving circuit due to power consumption of the liquid crystal display driving circuit.

최근 몇 년 사이 디스플레이 시장에서 급격하게 성장하고 있는 액정표시장치(LCD; Liquid Crystal Display)는 저 소비 전력의 박형, 우수한 화질 등 여러 가지 장점으로 인하여 급속하게 기존의 음극선관(CRT; cathode-ray tube)을 대체해 나가고 있다. Liquid crystal displays (LCDs), which have grown rapidly in the display market in recent years, are rapidly becoming conventional cathode-ray tube (CRT) due to various advantages such as low power consumption, thinness and excellent image quality. I am replacing).

액정표시장치는 핸드폰의 소형 액정표시장치부터 노트북 및 데스크톱용 모니터와 디지털 TV용 대형 액정표시장치까지 다양한 분야에서 사용됨으로써 액정표시장치 패널을 구동하는 액정표시장치 구동 집적회로의 중요성이 점차 증가하고 있다.LCD displays are being used in various fields, from small LCD displays for mobile phones to large LCD displays for laptops and desktops, and large LCD displays for digital TVs. Therefore, the importance of LCD display driving integrated circuits driving LCD panels is increasing. .

액정표시장치 구동 집적회로는 액정표시장치를 구동시키기 위한 신호를 순차적으로 공급해주는 역할을 한다.The liquid crystal display driving integrated circuit serves to sequentially supply a signal for driving the liquid crystal display.

액정표시장치 패널의 고 해상도 및 대형화를 이루기 위해서는 구동 집적회로의 처리 가능한 데이터 수를 증가함에 따라 채널(Channel) 수를 증가시켜야 한다. In order to achieve high resolution and large size of the LCD panel, the number of channels should be increased as the number of data that can be processed in the driving integrated circuit increases.

즉, 채널 수가 점차 증가하여 액정표시장치 구동 집적회로에서 요구되는 구동 능력이 커지므로 소비되는 전력이 증가한다.That is, since the number of channels gradually increases and the driving capability required in the liquid crystal display driver integrated circuit increases, power consumption increases.

따라서 소비되는 전력의 증가는 구동 집적회로 온도가 상승하여 액정표시장치 구동 집적회로의 성능을 저하하고 원하는 출력을 얻을 수 없는 문제점이 있다.Therefore, the increase in power consumed has a problem that the temperature of the driving integrated circuit rises, thereby degrading the performance of the liquid crystal display driving integrated circuit and obtaining a desired output.

상술한 문제점을 해결하기 위한 본 발명의 목적은, 증폭기에 의하여 발생 되는 온도 상승을 억제하는 액정표시장치 구동 회로를 제공하는 데 있다.SUMMARY OF THE INVENTION An object of the present invention for solving the above problems is to provide a liquid crystal display device driving circuit which suppresses a temperature rise generated by an amplifier.

상술한 과제를 해결하기 위한 본 발명에 따른 액정표시장치 구동 회로는 액정표시장치 구동 회로에 있어서, 상기 액정표시장치를 구동시키는 다수의 증폭기; 상기 증폭기에 공통으로 전원을 공급하는 전원선; 및 상기 전원선에 형성되어 열을 발산시키는 범프(BUMP);를 포함하는 것을 특징으로 한다.According to an aspect of the present invention, there is provided a liquid crystal display device driving circuit comprising: a plurality of amplifiers for driving the liquid crystal display device; A power supply line for supplying power to the amplifier in common; And a bump formed on the power line to dissipate heat.

여기서, 상술한 범프는 금(Au) 또는 구리(Cu)를 포함하는 것이 바람직하다.Here, the bumps described above preferably contain gold (Au) or copper (Cu).

여기서, 상술한 범프는 방열패턴과 전기적으로 연결되는 것이 바람직하다.Here, the above-mentioned bumps are preferably electrically connected to the heat radiation pattern.

여기서, 상술한 방열패턴은 구리(Cu)를 포함하는 것이 바람직하다.Here, it is preferable that the above-mentioned heat radiation pattern contains copper (Cu).

기타 실시예들의 구체적인 사항들은 상세한 설명 및 도면들에 포함되어 있다.Specific details of other embodiments are included in the detailed description and the drawings.

본 발명의 이점 및 특징, 그리고 그것들을 달성하는 방법은 첨부되는 도면과 함께 상세하게 후술 되어 있는 실시예들을 참조하면 명확해질 것이다. 그러나 본 발명은 이하에서 개시되는 실시예들에 한정되는 것이 아니라 서로 다른 다양한 형태로 구현될 수 있으며, 단지 본 실시예들은 본 발명의 개시가 완전하도록 하고, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 발명의 범주를 완전하게 알려주기 위해 제공되는 것이며, 본 발명은 청구항의 범주에 의해 정의될 뿐이다. 명세서 전체에 걸쳐 동일 참조 부호는 동일 구성 요소를 지칭한다.Advantages and features of the present invention, and methods for achieving them will be apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, and only the embodiments make the disclosure of the present invention complete, and the general knowledge in the art to which the present invention belongs. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

이하, 첨부된 도면을 참조하여 본 발명의 액정표시장치 구동 회로를 설명하기로 한다.Hereinafter, a liquid crystal display driving circuit of the present invention will be described with reference to the accompanying drawings.

도 1은 본 발명의 액정표시장치 구동 회로에 형성되는 다수의 증폭기와 증폭기를 구동하기 위한 공통으로 전원이 공급되어 액정표시장치를 구동하는 액정표시장치 구동 회로를 설명하기 위하여 도시한 것이다.FIG. 1 illustrates a plurality of amplifiers formed in a liquid crystal display driving circuit of the present invention and a liquid crystal display driving circuit for driving a liquid crystal display by supplying power in common.

도시된 바와 같이, 액정표시장치 구동 회로는 열발산용 범프(100), 전원선(110, 120), 및 증폭기(130)를 포함한다.As shown, the liquid crystal display driving circuit includes a heat dissipation bump 100, power lines 110 and 120, and an amplifier 130.

범프는 반도체칩을 회로기판에 직접 접속하기 위한 전도성 돌기를 말한다. The bump refers to a conductive protrusion for directly connecting a semiconductor chip to a circuit board.

여기서, 범프는 회로기판에 테이프 자동 본딩(Tape Automated Bonding), 플립-칩(Flip-Chip), 볼 그리드 어레이(Ball Grid Array), 또는 칩-스케일-패키지(Chip Scale Package)에 사용된다.Here, bumps are used for tape automating bonding, flip-chip, ball grid array, or chip scale package to a circuit board.

열발산용 범프(100)는 전극의 높이를 높이거나 전극재료를 외부전극과 접속이 용이한 재료로 교체한다.The heat dissipation bump 100 increases the height of the electrode or replaces the electrode material with a material that is easily connected to the external electrode.

여기서, 범프의 재질로는 금(Au), 땜납(Solder), 또는 구리(Cu)와 같은 재료 중 하나로 된다.Here, the material of the bump is one of materials such as gold (Au), solder (Solder), or copper (Cu).

증폭기(130)는 액정표시장치를 구동한다.The amplifier 130 drives the liquid crystal display.

여기서, 증폭기(130)는 액정표시장치의 채널에 해당하는 수만큼 다수로 구비된다.Here, the amplifier 130 is provided as many as the number corresponding to the channel of the liquid crystal display device.

전원선(110, 120)은 액정표시장치를 구동하는 증폭기(130)에 전원을 공급한다.The power lines 110 and 120 supply power to the amplifier 130 driving the liquid crystal display.

전원선(110, 120)은 드레인 전압이 인가되는 드레인 전원선(110)과 소오스 전압이 인가되는 소오스 전원선(120)으로 구성된다.The power lines 110 and 120 may include a drain power line 110 to which a drain voltage is applied and a source power line 120 to which a source voltage is applied.

액정표시장치의 채널에 해당하는 수만큼 다수로 증폭기(130)가 구비되기 때문에 증폭기(130)의 소비전력이 증가 되어 회로의 온도가 상승 된다.Since the amplifier 130 is provided in as many channels as the channels of the liquid crystal display, the power consumption of the amplifier 130 is increased to increase the temperature of the circuit.

즉, 전원선(110, 120)에 다수의 범프를 형성하여 전원선(110, 120)의 면적을 넓히는 것으로 전원선(110, 120)에서 발생 되는 열을 발산시켜 온도 상승을 억제하는 것이다.That is, by forming a plurality of bumps on the power lines 110 and 120 to increase the area of the power lines 110 and 120 to dissipate heat generated from the power lines 110 and 120 to suppress the temperature rise.

도 2는 본 발명의 액정표시장치 구동 회로가 구동시 온도상승을 억제하기 위하여 다수의 범프가 액정표시장치 구동 회로에 형성되어 있는 것을 설명하기 위하여 도시한 것이다.FIG. 2 is a view for explaining that a plurality of bumps are formed in the liquid crystal display driver circuit in order to suppress the temperature rise during the driving of the liquid crystal display driver circuit of the present invention.

도시된 바와 같이, 액정표시장치 구동 회로는 베이스필름(200), 배선패턴(210), 솔더레지스트(220), 열발산용 범프(230), 칩(240), 및 입출력용 범프(250)를 포함한다.As shown, the liquid crystal display driving circuit includes a base film 200, a wiring pattern 210, a solder resist 220, a heat dissipation bump 230, a chip 240, and an input / output bump 250. Include.

베이스필름(200)은 절연성 물질이다.The base film 200 is an insulating material.

여기서, 절연성 물질은 폴리이미드 수지 또는 폴리에스테르 수지와 같은 절연재료가 사용된다.Here, an insulating material such as polyimide resin or polyester resin is used as the insulating material.

배선패턴(210)은 10㎛ ~ 20㎛ 정도의 두께로 도전성 물질로 형성된다.The wiring pattern 210 is formed of a conductive material with a thickness of about 10 μm to 20 μm.

여기서, 도전성 물질은 구리(Cu), 주석, 금, 니켈 또는 땜납과 같은 도전 재료가 사용된다.Here, a conductive material such as copper (Cu), tin, gold, nickel or solder is used as the conductive material.

여기서, 배선패턴(210)을 형성하는 방법은 캐스팅(casting), 라미네이팅(laminating), 전기도금(electroplating) 등이 있다. The wiring pattern 210 may be formed by casting, laminating, electroplating, or the like.

솔더레지스트(220)는 절연성 재료로 형성되어 있고 배선패턴(210)이 외부로 노출되지 않도록 베이스필름(200)의 상부를 전체적으로 절연된다.The solder resist 220 is formed of an insulating material, and the upper portion of the base film 200 is entirely insulated so that the wiring pattern 210 is not exposed to the outside.

여기서, 반도체 칩(240)과 전기적으로 연결되는 부분은 절연되지 않는다.Here, the portion electrically connected to the semiconductor chip 240 is not insulated.

입출력용 범프(250)는 다른 반도체와 전기적 연결을 위해서 배선패턴(210) 상측의 전기적으로 연결되는 부분에 형성된다.The input / output bump 250 is formed at an electrically connected portion above the wiring pattern 210 for electrical connection with another semiconductor.

즉, 열발산용 범프(230)는 증폭기(미도시)를 구동하는 전원이 공급되는 배선패턴(210)에 형성되는 것으로 액정표시장치를 구동하기 위하여 다수의 증폭기(미도시)가 동시에 많은 양의 정적 및 동적 전류가 흐르게 된다. That is, the heat dissipation bump 230 is formed in the wiring pattern 210 to which the power for driving the amplifier (not shown) is supplied. In order to drive the liquid crystal display, a plurality of amplifiers (not shown) are simultaneously used. Static and dynamic currents flow.

이러한 작용에 의하여 액정표시장치 구동 회로의 온도가 상승하며 액정표시장치 구동 회로의 수명이 단축된다.By this action, the temperature of the liquid crystal display driving circuit is increased and the life of the liquid crystal display driving circuit is shortened.

따라서 전원이 인가되는 배선패턴(210)에 열발산용 범프(230)를 형성하고, 열발산용 범프(230)에 의하여 형성되는 전원이 인가되는 배선패턴(210)의 발열 면적을 넓혀 액정표시장치 구동 회로의 온도상승을 억제하는 것이다.Therefore, the heat dissipation bumps 230 are formed on the wiring patterns 210 to which power is applied, and the heat generating area of the wiring patterns 210 to which power is applied by the heat dissipation bumps 230 is widened to increase the heat generation area. It is to suppress the temperature rise of the driving circuit.

여기서, 열발산용 범프(230)는 비열이 작거나 또는 열전도율이 높은 금속성 물질로 형성하며, 바람직하게는 금(Au) 또는 구리(Cu)를 사용한다.Here, the heat dissipation bump 230 is formed of a metallic material having a low specific heat or high thermal conductivity, and preferably, gold (Au) or copper (Cu) is used.

여기서, 배선패턴(210)은 전원이 인가되는 본 발명에 따른 전원선(미도시)을 의미하는 것은 당업자라면 용이하게 이해할 수 있을 것이다.Here, it will be readily understood by those skilled in the art that the wiring pattern 210 means a power line (not shown) according to the present invention to which power is applied.

도 3은 액정표시장치 구동 회로의 동작 온도가 상승하는 것을 억제하기 위하여 칩-온-필름(chip-on-film; COF)상에 상술한 도 2의 범프 및 방열패턴이 형성되어 있는 것을 나타낸 것이다.FIG. 3 illustrates that the above bump and heat dissipation pattern of FIG. 2 is formed on a chip-on-film (COF) to suppress an increase in operating temperature of the liquid crystal display driving circuit. .

도시된 바와 같이, COF(300) 상에는 열발산용 범프(320) 및 방열패턴(310)이 포함된다.As illustrated, the heat dissipation bump 320 and the heat dissipation pattern 310 are included on the COF 300.

COF(300)는 폴리이미드(Polyimide)의 기판상에 범핑(Bumping)된 반도체 칩을 접착하는 방식을 말한다. The COF 300 refers to a method of bonding a bumped semiconductor chip onto a substrate of polyimide.

즉, COF(300)는 "Chip On Flexible Printed Circuit"의 약어로 연성 인쇄 회로(Flexible Printed Circuit)가 발전하여 필름타입이 개발되면서 "Chip On Film"의 약어로 혼용되고 있으며, FCOF(Flip Chip on Flexible Printed Circuit)라고도 한다.In other words, the COF 300 is an abbreviation of "Chip On Flexible Printed Circuit" and as the flexible printed circuit is developed, the film type is developed and is used as an abbreviation of "Chip On Film". Also known as Flexible Printed Circuit.

COF(200)기술은 통신기기의 경박단소화 추세와 함께 액정표시장치 구동 집적회로(LCD Driver IC)에서 이에 대응하기 위해 개발된 새로운 형태의 패키지이다.COF (200) technology is a new type of package developed to cope with the trend of light and short and short of the communication device in the LCD driver IC (LCD Driver IC).

열발산용 범프(320)는 액정표시장치 구동시 증폭기(미도시)의 전원선과 연결된다.The heat dissipation bump 320 is connected to a power line of an amplifier (not shown) when the liquid crystal display is driven.

여기서, 증폭기(미도시)는 액정표시장치에서 다수개의 채널역할을 하여 동시에 구동된다.In this case, the amplifier (not shown) serves as a plurality of channels in the liquid crystal display and is driven simultaneously.

이러한 구조에 의하여 정적 및 동적 전류가 증폭기의 전원선(미도시)을 따라 도통되기에 온도를 상승한다.This structure raises the temperature as the static and dynamic currents are conducted along the power line (not shown) of the amplifier.

방열패턴(310)은 열발산용 범프(320)와 전기적으로 연결된다.The heat dissipation pattern 310 is electrically connected to the heat dissipation bump 320.

여기서, 방열패턴(310)는 금속재료로써 구리(Cu)가 사용된다.Here, copper (Cu) is used as the heat radiation pattern 310 as a metal material.

즉, 열발산용 범프(320)의 열 발산 정도를 더욱더 극대화시키기 위해서 방열패턴(310)을 형성한다.That is, the heat dissipation pattern 310 is formed to further maximize the heat dissipation degree of the heat dissipation bump 320.

이러한 구조에 의하여 COF(300)의 온도를 열발산용 범프(320)를 이용하여 냉각하며, 냉각의 효과를 극대화하기 위하여 방열패턴(310)을 열발산용 범프(320)에 부가하는 것이다.By this structure, the temperature of the COF 300 is cooled using the heat dissipation bump 320, and in order to maximize the cooling effect, the heat dissipation pattern 310 is added to the heat dissipation bump 320.

이상 첨부된 도면을 참조하여 본 발명의 실시예를 설명하였지만, 상술한 본 발명의 기술적 구성은 본 발명이 속하는 기술 분야의 당업자가 본 발명의 그 기술적 사상이나 필수적 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적인 것이 아닌 것으로서 이해되어야 하고, 본 발명의 범위는 상기 상세한 설명보다는 후술하는 특허청구범위에 의하여 나타내어지며, 특허청구범위의 의미 및 범위 그리고 그 등가개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다.Although the embodiments of the present invention have been described above with reference to the accompanying drawings, the technical configuration of the present invention described above may be modified in other specific forms by those skilled in the art to which the present invention pertains without changing its technical spirit or essential features. It will be appreciated that it may be practiced. Therefore, the above-described embodiments are to be understood as illustrative and not restrictive in all respects, and the scope of the present invention is indicated by the appended claims rather than the detailed description, and the meaning and scope of the claims and All changes or modifications derived from the equivalent concept should be interpreted as being included in the scope of the present invention.

상술한 본 발명의 구성에 따르면, 액정표시장치 구동 회로의 증폭기에 의하여 발생 되는 온도상승을 감소하는데 그 효과가 있다.According to the configuration of the present invention described above, there is an effect in reducing the temperature rise caused by the amplifier of the liquid crystal display driving circuit.

Claims (4)

액정표시장치 구동 집적회로에 있어서,In a liquid crystal display driving integrated circuit, 상기 액정표시장치를 구동시키는 다수의 증폭기;A plurality of amplifiers for driving the liquid crystal display; 상기 증폭기에 공통으로 전원을 공급하는 전원선; 및A power supply line for supplying power to the amplifier in common; And 상기 전원선에 형성되어 열을 발산시키는 범프;A bump formed on the power line to dissipate heat; 를 포함하는 것을 특징으로 하는, 액정표시장치 구동 회로.Liquid crystal display device driving circuit comprising a. 제1항에 있어서,The method of claim 1, 상기 범프는 금(Au) 또는 구리(Cu)를 포함하는 것을 특징으로 하는, 액정표시장치 구동 회로.And wherein the bump comprises gold (Au) or copper (Cu). 제1항에 있어서,The method of claim 1, 상기 범프는 방열패턴과 전기적으로 연결되는 것을 특징으로 하는, 액정표시장치 구동 회로.And the bumps are electrically connected to the heat dissipation pattern. 제3항에 있어서,The method of claim 3, 상기 방열패턴은 구리(Cu)를 포함하는 것을 특징으로 하는, 액정표시장치 구동 회로.The heat dissipation pattern comprises copper (Cu), the liquid crystal display driving circuit.
KR1020050096577A 2005-10-13 2005-10-13 LCD driver circuit KR100726646B1 (en)

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