KR20070030087A - Vacuum deposition apparatus for oled manufacturing - Google Patents

Abstract

A vacuum deposition device for manufacturing an OLED(Organic Light Emitting Diode) is provided to improve a characteristic of the OLED by uniformly adjusting a deposition thickness of an organic material deposited on a central part and a border part of a substrate. A vacuum deposition device for manufacturing an OLED includes a chamber(200), a melting pot(230), a substrate holder(220), a heating line unit(207), and a shutter unit. The melting pot(230) is installed at a lower part within the chamber(200), and evaporates a predetermined organic material. The substrate holder(220) is installed at an upper part within the chamber(200), and holds an object to be deposited. The heating line unit(207) is installed on a boarder unit of the chamber(200). The heating line unit(207) is used for adjusting an evaporation speed of the organic material evaporated by the melting pot(230), and is installed in the border part of the chamber(200). The heating line unit(207) is formed on the whole surface or a part of an inner border of the chamber(200). The shutter unit adjusts a flowing quantity of the organic material evaporated in the melting pot(230) to the substrate holder(220).

Description

Vacuum deposition apparatus for OLED manufacturing {Vacuum deposition apparatus for OLED manufacturing}

1 is a view showing a conventional vacuum evaporation equipment for ODL production.

Figure 2 is a view showing a vacuum deposition equipment for producing an LED according to an embodiment of the present invention.

3A to 3B are enlarged cross-sectional views enlarging the hot wire portion in FIG. 2.

<Explanation of symbols for the main parts of the drawings>

200: chamber 205: substrate

207: hot wire portion 208: shutter portion

210: power supply 220: substrate holder

230: crucible 235: crucible heating wire

240: evaporation source 250: exhaust device

The present invention relates to a vacuum deposition apparatus for manufacturing ODL, and more particularly, to a vacuum deposition apparatus for manufacturing an LED that can adjust the deposition rate of the edge portion by installing a heating wire on the chamber edge for organic material deposition.

The organic light emitting device is one of the representative flat panel display devices and has a structure in which an organic thin film layer including an organic light emitting layer is inserted between the positive electrode layer and the negative electrode layer. Therefore, in manufacturing such an organic light emitting device, a process of depositing an organic material is required to form an organic thin film layer such as the organic light emitting layer.

By the way, organic matter, unlike inorganic matter, is a group of atoms connected to each other, and each organic molecule is much heavier than single or single molecule inorganic matters, and bonds are easily broken by high thermal energy such as electron beam or ion plasma from the outside. As it loses, organics tend to lose their original properties relatively easily compared to inorganics. For this reason, in the process of depositing an organic substance, a method of vacuum sublimation or evaporation of the organic substance is applied by applying relatively small thermal energy, rather than using an electron beam or plasma.

In particular, in the process of depositing the organic material, a method of depositing on a deposition substrate such as an organic light emitting device by using an organic vacuum evaporation device to heat the organic material by applying heat in the vacuum chamber of the device.

1 is a view showing a conventional vacuum evaporation equipment for ODL production.

As shown in FIG. 1, a conventional vacuum deposition apparatus 10 for manufacturing an LED is largely comprised of a chamber 100 and a power source 110. 105 is loaded into the substrate holder 120.

In addition, a shutter 108 is provided at the lower portion of the substrate 105 to control the deposition rate of the organic material deposited on the substrate 105. The organic material is disposed in the lower portion of the chamber 100. The crucible (crucible) 130 and surrounding the crucible 130 accommodates the crucible heating wire 135 for evaporating the crucible 130 is applied to the crucible 130 by applying heat to the crucible 130 is formed.

The crucible 130 and the crucible heating wire 135 form an evaporation source 140 for evaporating the organic material to the substrate 105. In addition, an exhaust device 150 for discharging the gas in the chamber 100 is installed at one side of the chamber 100.

A brief review of a conventional organic material deposition method using the organic material vacuum deposition equipment 10 is as follows.

In order to deposit an organic material using the vacuum deposition equipment 10, first, the crucible heating wire 135 is heated to a temperature at which the organic material may be evaporated by applying heat to the crucible 130 containing the organic material. When the amount and speed at which the organic matter evaporates from the crucible 130 is uniform or stabilized by continuously applying heat at a predetermined temperature, the organic matter evaporated from the crucible 130 is opened by opening the shutter unit 108. Through the opening of 108, it reaches the substrate 105 which is a vapor-deposited body. Then, the organic material is deposited on a predetermined portion of the substrate 105 to form an organic thin film. Thereafter, in the deposition process of the organic material, the exhaust gas is discharged through the exhaust device 150, thereby maintaining the vacuum chamber 11 in a vacuum state.

What is important in depositing the organic material on the substrate 105 by using the vacuum deposition apparatus 10 as described above is how uniformly the pinhole-free film is formed because the entire organic film forms a very thin film, such as 100 to 200 nm. (Less than 5%)

However, it is very difficult to make the organic film uniform by using the vacuum deposition equipment 10. In particular, as the size of the substrate 105 increases, it becomes more difficult to control the film thickness according to the substrate 105. That is, since the center portion of the substrate 105 is thickened and the edge is thinned, it is difficult to obtain a uniform film.

The technical problem to be achieved by the present invention is to provide a vacuum deposition apparatus for manufacturing an LED to obtain an organic film having a uniform thickness in the central portion and the edge portion of the substrate.

Technical problems to be achieved by the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

In order to solve the above technical problem, the vacuum deposition apparatus for manufacturing ODL according to an embodiment of the present invention is installed in a chamber, a lower part of the chamber, an evaporation source for evaporating a predetermined organic matter, an upper part of the chamber, and holding a vapor deposited body And a substrate holder, and a heating wire for adjusting the evaporation rate at the edge of the chamber, the organic material being evaporated by the evaporation source.

Specific details of other embodiments are included in the detailed description and the accompanying drawings.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, only the present embodiments to make the disclosure of the present invention complete, and common knowledge in the art to which the present invention pertains. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

In addition, the size of the components constituting the invention in the drawings are exaggerated for clarity of the specification, when any component is described as "exists inside, or is installed in connection with" other components, any of the above configuration An element may be installed in contact with the other component, or may be installed at a predetermined distance from the other component, and when installed at a distance, a third element for fixing or connecting the component to the other component The description of the means of may be omitted.

Figure 2 is a view showing a vacuum deposition equipment for producing an LED according to an embodiment of the present invention.

As shown in FIG. 2, the vacuum deposition apparatus 20 for manufacturing an LED according to an embodiment of the present invention includes a chamber 200, a substrate holder 220, an evaporation source 240, a shutter unit 208, and a hot wire unit ( 207, a power supply 210, and an exhaust device 250.

The chamber 200 is mainly made of a material of sus (SUS) material, and is a place where deposition of organic matter occurs, and generally increases the mean free path of evaporated organic matter and is not affected by moisture or other gases. The inside is in a vacuum state.

The substrate holder 220 is a means for holding the substrate 205, which is a deposition material on which the organic material is deposited, during the vacuum deposition process. The substrate holder 220 holds the substrate 205 thereunder. There is a downhold type (FIG. 2 is a downhold type) and an uphold type for holding the substrate 205 thereon, but the present invention is not limited thereto.

The evaporation source 240 includes a crucible 230 and a crucible hot wire 235 as a means for evaporating organic matter.

The crucible 230 has a low molecular weight organic material contained therein, considering that organic materials, generally low molecular weight organic materials, use a vacuum deposition method.

The crucible 230 is a crucible made of platinum (Pt) is generally used, considering that chemical stability is very important and thermal change should be small.

The crucible heating wire 235 wraps around the crucible 230 and is a means for inducing evaporation of the organic material by applying a temperature above the boiling point of the organic material contained in the crucible 230 to the crucible 230.

The shutter unit 208 is installed inside the chamber 200 between the evaporation source 240 and the substrate 205 to be deposited, and opens and closes the space between the evaporation source 240 and the substrate 205. Make it possible.

That is, the organic matter evaporated from the evaporation source 240 serves to control whether the substrate 205 reaches the amount and the amount reached.

The hot wire portion 207 is formed of the substrate 205 that is closest to the evaporation source when the organic material evaporated by heating in the evaporation source 240 is deposited on the substrate 205 which is a vapor deposition body through the shutter portion 208. In the center, deposition is actively performed, so that the thickness of the surface to be deposited is formed thick, whereas the edge portion of the substrate 205 relatively far from the evaporation source 240 is deposited slowly, so that the thickness of the surface to be deposited is relatively small. 205 is a means for preventing the phenomenon of becoming thinner than the thickness of the surface to be deposited deposited on the center portion.

3A to 3B are enlarged cross-sectional views enlarging the hot wire portion 207 in FIG. 2.

As shown in FIG. 3A, the hot wire part 207 may be installed inside the sidewall of the chamber 200 or may be installed on a surface of the inside of the chamber 200.

The installation of such hot wires 207 generally results in that the evaporated organic gas has a specific kinetic energy under the Maxwell-Boltsmann distribution, i.e., a gas with a sufficiently high temperature and a sufficiently low density. Probability distribution to have " P = e ^{-ε / kT} According to the space arrangement, the higher the temperature, the faster the movement speed. Therefore, the temperature of the organic evaporated inside the chamber 200 approaches the substrate 205 at a slower speed. By providing a means for providing the same, the problem that the thickness of the deposited film becomes thin at the edge of the substrate 205, which is the above-described vapor deposition, can be solved.

It is preferable to use a nickel-chromium (Ni-Cr) wire which is generally used as the hot wire part 207, but it is not limited thereto as long as it is a means capable of heating the heated object.

Referring back to FIG. 2, the power supply 210 is electrically connected to the crucible heating wire 235 constituting the evaporation source 240 and the heating wire portion 207 of the chamber 200, so that the crucible heating wire 235 and the heating wire portion are provided. It serves to heat 207. However, although the power source 210 for the crucible heating wire 235 and the heating wire portion 207 is represented as using the same power source 210 in FIG. 2, the power source 210 may be separately provided without being limited thereto. In addition, the controller 210 may be separately mounted on the power supply 210 to adjust the amount of power supplied to the crucible heating wire 235 and the heating wire portion 207.

The exhaust device 250 is connected to an apparatus such as a pump (not shown) as a means for maintaining the inside of the chamber 200 in a vacuum state by discharging the gas unnecessary for deposition during completion of the deposition process or during the deposition process. have.

 Although the embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to the above embodiments but may be manufactured in various forms, and having ordinary skill in the art to which the present invention pertains. It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without changing the technical spirit or essential features of the present invention. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

According to the vacuum deposition apparatus for manufacturing ODL according to the embodiment of the present invention it is possible to uniformly control the deposition thickness of the organic material deposited on the center portion and the edge portion of the substrate to be deposited. As a result, it is possible to manufacture an OLED display device having better properties.

Claims (6)

chamber; A crucible installed at a lower portion of the chamber to evaporate a predetermined organic substance; A substrate holder installed in the chamber and holding the deposition target; And It is installed on the rim of the chamber, the organic vaporized by the crucible comprises a heating wire for adjusting the evaporation rate in the vicinity of the rim of the chamber vacuum deposition equipment for LED manufacturing. The method of claim 1, The heating wire portion is a vacuum deposition equipment for producing ODL, characterized in that formed on the entire surface or only part of the inner rim of the chamber. The method of claim 1, The inside of the chamber further comprises a shutter unit capable of controlling the amount of the organic matter evaporated from the crucible proceeds to the substrate holder vacuum deposition equipment for producing an LED. The method of claim 1, And a shutter unit capable of controlling the deposition amount of the evaporated organic material in the chamber between the substrate holder and the crucible. The method of claim 1, The evaporation source is a crucible for receiving organic matter; And And a crucible heating wire for heating the crucible by heating the crucible and heating the organic material to a predetermined temperature to evaporate the crucible. The method of claim 1, The side of the chamber is a vacuum deposition equipment for producing ODL, characterized in that it further comprises a discharge device for discharging the residual gas in the chamber to the outside.

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